WO2010091779A3 - Heat transfer conductor - Google Patents

Heat transfer conductor Download PDF

Info

Publication number
WO2010091779A3
WO2010091779A3 PCT/EP2010/000423 EP2010000423W WO2010091779A3 WO 2010091779 A3 WO2010091779 A3 WO 2010091779A3 EP 2010000423 W EP2010000423 W EP 2010000423W WO 2010091779 A3 WO2010091779 A3 WO 2010091779A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat
heat transfer
transfer device
transfer conductor
sink
Prior art date
Application number
PCT/EP2010/000423
Other languages
German (de)
French (fr)
Other versions
WO2010091779A2 (en
Inventor
Tobias Engert
Ivan Kojouharov
Jürgen GERL
Original Assignee
Gsi Helmholtzzentrum Für Schwerionenforschung Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gsi Helmholtzzentrum Für Schwerionenforschung Gmbh filed Critical Gsi Helmholtzzentrum Für Schwerionenforschung Gmbh
Priority to EP10703225A priority Critical patent/EP2396611A2/en
Publication of WO2010091779A2 publication Critical patent/WO2010091779A2/en
Publication of WO2010091779A3 publication Critical patent/WO2010091779A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F25D19/006—Thermal coupling structure or interface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/024—Arrangements for cooling, heating, ventilating or temperature compensation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
    • G01J5/061—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by controlling the temperature of the apparatus or parts thereof, e.g. using cooling means or thermostats

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention relates to a heat transfer device (1) for transferring heat from a heat source (20) to a heat sink (16). The heat transfer device (1) has contacting means (3) for establishing a thermal contact between the heat transfer device (1) and the heat source (20) as well as the heat sink (16). Furthermore, the heat transfer device (1) has heat conducting means (2) for transferring thermal energy between the heat source (20) and the heat sink (16). The heat conducting means (2) and the contacting means (3) are at least partly connected to one another by an ultrasonic welding operation.
PCT/EP2010/000423 2009-02-14 2010-01-26 Heat transfer conductor WO2010091779A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP10703225A EP2396611A2 (en) 2009-02-14 2010-01-26 Heat transfer conductor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009009001.0 2009-02-14
DE102009009001A DE102009009001A1 (en) 2009-02-14 2009-02-14 Heat transfer manager

Publications (2)

Publication Number Publication Date
WO2010091779A2 WO2010091779A2 (en) 2010-08-19
WO2010091779A3 true WO2010091779A3 (en) 2010-12-09

Family

ID=42356549

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2010/000423 WO2010091779A2 (en) 2009-02-14 2010-01-26 Heat transfer conductor

Country Status (3)

Country Link
EP (1) EP2396611A2 (en)
DE (1) DE102009009001A1 (en)
WO (1) WO2010091779A2 (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1006233A (en) * 1962-05-08 1965-09-29 Ass Elect Ind Improvements relating to solid state radiation detectors
GB1278444A (en) * 1969-06-23 1972-06-21 Philips Nv Improvements in or relating to a radiation detector comprising a semiconductor device
US4344302A (en) * 1981-06-08 1982-08-17 Hughes Aircraft Company Thermal coupling structure for cryogenic refrigeration
US4952810A (en) * 1989-08-23 1990-08-28 Santa Barbara Research Center Distortion free dewar/coldfinger assembly
EP0585001A2 (en) * 1992-08-28 1994-03-02 Oxford Analytical Instruments Limited X-ray spectrometry detector
WO2005022057A2 (en) * 2003-08-21 2005-03-10 E.I. Dupont De Nemours And Company Use of welds for thermal and mechanical connections in cryogenic vacuum vessels
WO2005041268A2 (en) * 2003-10-24 2005-05-06 Crydom Technologies Aluminum heat sink for a solid state relay having ultrasonically welded copper foil
EP1906113A1 (en) * 2006-09-29 2008-04-02 Vestel Beyaz Esya Sanayi Ve Ticaret A.S. Production method of evaporator

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3363207A (en) * 1966-09-19 1968-01-09 Atomic Energy Commission Usa Combined insulating and cryogen circulating means for a superconductive solenoid
DE10258705A1 (en) * 2002-12-11 2004-07-15 Sai Automotive Sal Gmbh Wall structure and process for its manufacture

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1006233A (en) * 1962-05-08 1965-09-29 Ass Elect Ind Improvements relating to solid state radiation detectors
GB1278444A (en) * 1969-06-23 1972-06-21 Philips Nv Improvements in or relating to a radiation detector comprising a semiconductor device
US4344302A (en) * 1981-06-08 1982-08-17 Hughes Aircraft Company Thermal coupling structure for cryogenic refrigeration
US4952810A (en) * 1989-08-23 1990-08-28 Santa Barbara Research Center Distortion free dewar/coldfinger assembly
EP0585001A2 (en) * 1992-08-28 1994-03-02 Oxford Analytical Instruments Limited X-ray spectrometry detector
WO2005022057A2 (en) * 2003-08-21 2005-03-10 E.I. Dupont De Nemours And Company Use of welds for thermal and mechanical connections in cryogenic vacuum vessels
WO2005041268A2 (en) * 2003-10-24 2005-05-06 Crydom Technologies Aluminum heat sink for a solid state relay having ultrasonically welded copper foil
EP1906113A1 (en) * 2006-09-29 2008-04-02 Vestel Beyaz Esya Sanayi Ve Ticaret A.S. Production method of evaporator

Also Published As

Publication number Publication date
DE102009009001A1 (en) 2010-08-26
EP2396611A2 (en) 2011-12-21
WO2010091779A2 (en) 2010-08-19

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