WO2010090488A2 - 도전성 패턴 및 이의 제조 방법 - Google Patents

도전성 패턴 및 이의 제조 방법 Download PDF

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Publication number
WO2010090488A2
WO2010090488A2 PCT/KR2010/000763 KR2010000763W WO2010090488A2 WO 2010090488 A2 WO2010090488 A2 WO 2010090488A2 KR 2010000763 W KR2010000763 W KR 2010000763W WO 2010090488 A2 WO2010090488 A2 WO 2010090488A2
Authority
WO
WIPO (PCT)
Prior art keywords
conductive pattern
manufacturing
pattern
conductive
etching resist
Prior art date
Application number
PCT/KR2010/000763
Other languages
English (en)
French (fr)
Other versions
WO2010090488A3 (ko
Inventor
황지영
황인석
이동욱
박민춘
이승헌
전상기
손용구
구범모
Original Assignee
주식회사 엘지화학
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020090127756A external-priority patent/KR20100090628A/ko
Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to EP10738772.2A priority Critical patent/EP2395541B1/en
Priority to JP2011549071A priority patent/JP5486019B2/ja
Priority to CN201080007007.6A priority patent/CN102308365B/zh
Priority to US13/148,251 priority patent/US8637776B2/en
Publication of WO2010090488A2 publication Critical patent/WO2010090488A2/ko
Publication of WO2010090488A3 publication Critical patent/WO2010090488A3/ko
Priority to US14/080,980 priority patent/US9615450B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Sustainable Energy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Sustainable Development (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Electric Cables (AREA)

Abstract

본 발명은 a) 기판상에 도전성 막을 형성하는 단계; b) 상기 도전성 막 상에 에칭 레지스트 패턴을 형성하는 단계; 및 c) 상기 에칭 레지스트 패턴을 이용하여 상기 도전성 막을 오버 에칭(over-etching)함으로써 상기 에칭 레지스트 패턴의 폭보다 작은 선폭을 갖는 도전성 패턴을 형성하는 단계를 포함하는 도전성 패턴의 제조방법, 이에 의하여 제조된 도전성 패턴을 제공한다. 본 발명에 따르면, 초미세 선폭을 갖는 도전성 패턴을 효율적이고 경제적으로 제공할 수 있다.
PCT/KR2010/000763 2009-02-06 2010-02-08 도전성 패턴 및 이의 제조 방법 WO2010090488A2 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP10738772.2A EP2395541B1 (en) 2009-02-06 2010-02-08 Manufacturing method for conductive pattern
JP2011549071A JP5486019B2 (ja) 2009-02-06 2010-02-08 導電性パターンおよびその製造方法
CN201080007007.6A CN102308365B (zh) 2009-02-06 2010-02-08 导电图形及其制造方法
US13/148,251 US8637776B2 (en) 2009-02-06 2010-02-08 Conductive pattern and manufacturing method thereof
US14/080,980 US9615450B2 (en) 2009-02-06 2013-11-15 Conductive pattern and manufacturing method thereof

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20090009750 2009-02-06
KR10-2009-0009750 2009-02-06
KR1020090127756A KR20100090628A (ko) 2009-02-06 2009-12-21 절연된 도전성 패턴의 제조 방법
KR10-2009-0127756 2009-12-21

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US13/148,251 A-371-Of-International US8637776B2 (en) 2009-02-06 2010-02-08 Conductive pattern and manufacturing method thereof
US14/080,980 Continuation US9615450B2 (en) 2009-02-06 2013-11-15 Conductive pattern and manufacturing method thereof

Publications (2)

Publication Number Publication Date
WO2010090488A2 true WO2010090488A2 (ko) 2010-08-12
WO2010090488A3 WO2010090488A3 (ko) 2010-11-18

Family

ID=42542532

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/000763 WO2010090488A2 (ko) 2009-02-06 2010-02-08 도전성 패턴 및 이의 제조 방법

Country Status (1)

Country Link
WO (1) WO2010090488A2 (ko)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090009750A (ko) 2007-07-20 2009-01-23 후프 휠스벡 운트 퓌르스트 게엠베하 운트 콤파니 카게 억류부를 구비한 쇄정 장치
KR20090127756A (ko) 2008-06-09 2009-12-14 주식회사 삼양옵틱스 하이브리드 렌즈 제조 방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100269520B1 (ko) * 1997-07-29 2000-10-16 구본준 박막트랜지스터, 액정표시장치와 그 제조방법
JP3854889B2 (ja) * 2001-04-19 2006-12-06 キヤノン株式会社 金属または金属化合物パターンの製造方法および電子源の製造方法
KR101192746B1 (ko) * 2004-11-12 2012-10-18 엘지디스플레이 주식회사 폴리형 박막 트랜지스터 기판의 제조방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090009750A (ko) 2007-07-20 2009-01-23 후프 휠스벡 운트 퓌르스트 게엠베하 운트 콤파니 카게 억류부를 구비한 쇄정 장치
KR20090127756A (ko) 2008-06-09 2009-12-14 주식회사 삼양옵틱스 하이브리드 렌즈 제조 방법

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2395541A4

Also Published As

Publication number Publication date
WO2010090488A3 (ko) 2010-11-18

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