WO2010079889A3 - Method for etching molding compound of led and etching pattern according to the same - Google Patents

Method for etching molding compound of led and etching pattern according to the same Download PDF

Info

Publication number
WO2010079889A3
WO2010079889A3 PCT/KR2009/006885 KR2009006885W WO2010079889A3 WO 2010079889 A3 WO2010079889 A3 WO 2010079889A3 KR 2009006885 W KR2009006885 W KR 2009006885W WO 2010079889 A3 WO2010079889 A3 WO 2010079889A3
Authority
WO
WIPO (PCT)
Prior art keywords
etching
laser beam
molding compound
pattern
led
Prior art date
Application number
PCT/KR2009/006885
Other languages
French (fr)
Korean (ko)
Other versions
WO2010079889A2 (en
Inventor
이종명
Original Assignee
주식회사 아이엠티
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 아이엠티 filed Critical 주식회사 아이엠티
Publication of WO2010079889A2 publication Critical patent/WO2010079889A2/en
Publication of WO2010079889A3 publication Critical patent/WO2010079889A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

Provided are a method for etching a molding compound of an LED and an etching pattern according to the same. The etching method is implemented by an etching apparatus which includes: a laser beam generating unit for generating a laser beam, a laser beam scanning unit for scanning the laser beam; a focus lens unit for creating a laser spot; and a stage unit for loading an LED in a working area. The etching method comprises the steps of: loading the LED in the working area on the stage unit; and etching the molding compound while controlling the laser beam with the laser beam scanning unit according to a preset etching pattern by oscillating the laser beam, wherein the etching pattern may be a dot pattern, grid pattern, or ring pattern. When the molding compound is patterned in plural concentric circles, the upper side of the etching pattern on the molding compound may be formed in a concave, convex, or non-spherical shape.
PCT/KR2009/006885 2009-01-08 2009-11-23 Method for etching molding compound of led and etching pattern according to the same WO2010079889A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090001652A KR101051140B1 (en) 2009-01-08 2009-01-08 LED encapsulant etching method and etching pattern accordingly
KR10-2009-0001652 2009-01-08

Publications (2)

Publication Number Publication Date
WO2010079889A2 WO2010079889A2 (en) 2010-07-15
WO2010079889A3 true WO2010079889A3 (en) 2010-09-02

Family

ID=42316935

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/006885 WO2010079889A2 (en) 2009-01-08 2009-11-23 Method for etching molding compound of led and etching pattern according to the same

Country Status (2)

Country Link
KR (1) KR101051140B1 (en)
WO (1) WO2010079889A2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100669080B1 (en) * 2005-05-04 2007-01-15 주식회사 아이엠티 Laser patterning apparatus for manufacturing oled display
KR20070013292A (en) * 2004-04-01 2007-01-30 크리 인코포레이티드 Laser patterning of light emitting devices and patterned light emitting devices
KR100703216B1 (en) * 2006-02-21 2007-04-09 삼성전기주식회사 Method for manufacturing light emitting diode package
JP2008016647A (en) * 2006-07-06 2008-01-24 Sanyo Electric Co Ltd Light-emitting device and manufacturing method therefor

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100793333B1 (en) 2006-04-21 2008-01-11 삼성전기주식회사 Fabrication method for surface mounting light emitting diode device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070013292A (en) * 2004-04-01 2007-01-30 크리 인코포레이티드 Laser patterning of light emitting devices and patterned light emitting devices
KR100669080B1 (en) * 2005-05-04 2007-01-15 주식회사 아이엠티 Laser patterning apparatus for manufacturing oled display
KR100703216B1 (en) * 2006-02-21 2007-04-09 삼성전기주식회사 Method for manufacturing light emitting diode package
JP2008016647A (en) * 2006-07-06 2008-01-24 Sanyo Electric Co Ltd Light-emitting device and manufacturing method therefor

Also Published As

Publication number Publication date
WO2010079889A2 (en) 2010-07-15
KR101051140B1 (en) 2011-07-22
KR20100082251A (en) 2010-07-16

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