WO2021036155A8 - Bessel beam with axicon for cutting transparent material - Google Patents

Bessel beam with axicon for cutting transparent material Download PDF

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Publication number
WO2021036155A8
WO2021036155A8 PCT/CN2020/070126 CN2020070126W WO2021036155A8 WO 2021036155 A8 WO2021036155 A8 WO 2021036155A8 CN 2020070126 W CN2020070126 W CN 2020070126W WO 2021036155 A8 WO2021036155 A8 WO 2021036155A8
Authority
WO
WIPO (PCT)
Prior art keywords
axicon
transparent material
lens
bessel beam
bessel
Prior art date
Application number
PCT/CN2020/070126
Other languages
French (fr)
Other versions
WO2021036155A1 (en
Inventor
Long Zhang
Andreas Oehler
Jan-Willem Pieterse
Original Assignee
Lumentum Operations Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lumentum Operations Llc filed Critical Lumentum Operations Llc
Priority to US16/915,373 priority Critical patent/US20210060707A1/en
Priority to CN202010616737.1A priority patent/CN112440005A/en
Publication of WO2021036155A1 publication Critical patent/WO2021036155A1/en
Publication of WO2021036155A8 publication Critical patent/WO2021036155A8/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0905—Dividing and/or superposing multiple light beams
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0972—Prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/001—Axicons, waxicons, reflaxicons

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

A Bessel beam laser-cutting system (100) may comprise an ultrafast laser light source (102), an axicon (104), a first lens (106), and a second lens (108). The ultrafast light source (102) may be configured to emit a beam into the axicon (104). The axicon (104) may be configured to diffract the beam into a first/primary Bessel beam in a near field (110) of the axicon (104) and an annular beam in a far field (112) of the axicon (104). The first lens (106) may be configured to focus the annular beam. The second lens (108) may be configured to converge the focused annular beam into a second/secondary Bessel beam to modify a transparent material, wherein a modification depth of the modification generated by the second/secondary Bessel beam is to be within a range of tens of micrometers to several millimeters inside the transparent material.
PCT/CN2020/070126 2019-08-28 2020-01-02 Bessel beam with axicon for cutting transparent material WO2021036155A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US16/915,373 US20210060707A1 (en) 2019-08-28 2020-06-29 Bessel beam with axicon for cutting transparent material
CN202010616737.1A CN112440005A (en) 2019-08-28 2020-06-30 Bessel beam with axicon for cutting transparent materials

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNPCT/CN2019/102977 2019-08-28
PCT/CN2019/102977 WO2021035565A1 (en) 2019-08-28 2019-08-28 Bessel beam with axicon for glass cutting

Publications (2)

Publication Number Publication Date
WO2021036155A1 WO2021036155A1 (en) 2021-03-04
WO2021036155A8 true WO2021036155A8 (en) 2021-04-15

Family

ID=74683492

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/CN2019/102977 WO2021035565A1 (en) 2019-08-28 2019-08-28 Bessel beam with axicon for glass cutting
PCT/CN2020/070126 WO2021036155A1 (en) 2019-08-28 2020-01-02 Bessel beam with axicon for cutting transparent material

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/102977 WO2021035565A1 (en) 2019-08-28 2019-08-28 Bessel beam with axicon for glass cutting

Country Status (2)

Country Link
CN (1) CN112440005A (en)
WO (2) WO2021035565A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112975171B (en) * 2021-03-25 2021-11-02 清华大学 Ultrafast laser micropore rotary-cut processingequipment
CN113828912A (en) * 2021-08-29 2021-12-24 深圳市鼎鑫盛光学科技有限公司 Bessel glass cutting lens capable of adjusting focal depth and spot size
CN116931286B (en) * 2023-09-15 2023-11-24 成都莱普科技股份有限公司 Beam shaping module, method and device

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CN102495472B (en) * 2011-11-29 2013-10-30 中国科学院上海光学精密机械研究所 Bessel beam generator based on annular Dammann gratings
CN107073642B (en) * 2014-07-14 2020-07-28 康宁股份有限公司 System and method for processing transparent materials using laser beam focal lines with adjustable length and diameter
US9757815B2 (en) * 2014-07-21 2017-09-12 Rofin-Sinar Technologies Inc. Method and apparatus for performing laser curved filamentation within transparent materials
US10047001B2 (en) * 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
CN204975690U (en) * 2015-07-15 2016-01-20 武汉华工激光工程有限责任公司 Produce device of bezier laser beam
US10730783B2 (en) * 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
TWI604907B (en) * 2016-10-11 2017-11-11 財團法人工業技術研究院 Laser homogeneous machining apparatus and method thereof
CN106994564B (en) * 2017-04-27 2019-11-26 东莞市盛雄激光先进装备股份有限公司 A kind of laser cutting device and its cutting method
CN106891096B (en) * 2017-04-27 2019-11-26 东莞市盛雄激光先进装备股份有限公司 A kind of laser cutting device and cutting method
CN107030397A (en) * 2017-05-19 2017-08-11 东莞市盛雄激光设备有限公司 The cutter device and cutting method of a kind of composite substrate
CN109590618B (en) * 2017-09-28 2021-02-12 上海微电子装备（集团）股份有限公司 Laser cutting system and method
CN109570781A (en) * 2017-09-28 2019-04-05 上海微电子装备（集团）股份有限公司 A kind of microwell array processing unit (plant) and method
CN107807451B (en) * 2017-11-15 2024-05-07 广东韵腾激光科技有限公司 Portable variable focal length optical system
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Also Published As

Publication number Publication date
WO2021035565A1 (en) 2021-03-04
CN112440005A (en) 2021-03-05
WO2021036155A1 (en) 2021-03-04

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