WO2010067368A3 - Structures thermoélectriques servant à refroidir ou à chauffer un objet ou à générer un courant électrique - Google Patents
Structures thermoélectriques servant à refroidir ou à chauffer un objet ou à générer un courant électrique Download PDFInfo
- Publication number
- WO2010067368A3 WO2010067368A3 PCT/IL2009/001179 IL2009001179W WO2010067368A3 WO 2010067368 A3 WO2010067368 A3 WO 2010067368A3 IL 2009001179 W IL2009001179 W IL 2009001179W WO 2010067368 A3 WO2010067368 A3 WO 2010067368A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electric
- thermo
- heat
- cooling
- heating
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title abstract 2
- 238000010438 heat treatment Methods 0.000 title abstract 2
- 239000002305 electric material Substances 0.000 abstract 2
- 238000010248 power generation Methods 0.000 abstract 1
- 230000000087 stabilizing effect Effects 0.000 abstract 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Hybrid Cells (AREA)
Abstract
L'invention concerne de nouveaux types de structures thermoélectriques divisées servant à refroidir, à chauffer, ou à stabiliser la température d'un objet ou à générer de la puissance électrique. Dans un premier type de structure, le transport du courant électrique entre le côté d'absorption de chaleur et le côté de dispersion de chaleur de la structure s'effectue indépendamment du flux de chaleur circulant entre les côtés de la structure thermoélectrique. Dans un second type de structure, une couche de matière thermoélectrique située du côté d'absorption de chaleur de la structure est reliée, par des couches de connexion, à deux ou à plusieurs couches de matière thermoélectrique situées du côté de dispersion de chaleur de la structure. Dans un troisième type de structure, les éléments constituant la structure sont disposés de manière à faire circuler des courants électriques présentant des valeurs différentes du côté d'absorption de chaleur et du côté de dispersion de chaleur de la structure et dans différents éléments situés à l'intérieur de la structure.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG2011041100A SG171983A1 (en) | 2008-12-11 | 2009-12-10 | Thermo-electric structures for cooling, heating, and electric current generation |
US13/132,652 US20120042661A1 (en) | 2008-12-11 | 2009-12-10 | Split thermo-electric cycles for simultaneous cooling, heating, and temperature control |
EP09804337A EP2370754A2 (fr) | 2008-12-11 | 2009-12-10 | Structures thermoélectriques servant à refroidir ou à chauffer un objet ou à générer un courant électrique |
US13/153,689 US20120047912A1 (en) | 2008-12-11 | 2011-06-06 | Split thermo-electric cycles for simultaneous cooling, heating, and temperature control |
US13/153,740 US20120048321A1 (en) | 2008-12-11 | 2011-06-06 | Split thermo-electric cycles for simultaneous cooling, heating, and temperature control |
IL213469A IL213469A0 (en) | 2008-12-11 | 2011-06-09 | Split thermo-electric cycles for simultaneous cooling, heating, and temperature control |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IL195902A IL195902A0 (en) | 2008-12-11 | 2008-12-11 | Split-thermo-electric devices based on successive layers of thermo-electric materials |
IL195902 | 2008-12-11 | ||
IL196753 | 2009-01-27 | ||
IL196753A IL196753A0 (en) | 2009-01-27 | 2009-01-27 | One-type thermo-electric devices for cooling, heating, and current generation |
IL200317 | 2009-08-10 | ||
IL200317A IL200317A0 (en) | 2009-08-10 | 2009-08-10 | Split thermo-electric cycles for simultaneous cooling, heating, and temperature control |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/132,652 A-371-Of-International US20120042661A1 (en) | 2008-12-11 | 2009-12-10 | Split thermo-electric cycles for simultaneous cooling, heating, and temperature control |
US13/153,689 Continuation US20120047912A1 (en) | 2008-12-11 | 2011-06-06 | Split thermo-electric cycles for simultaneous cooling, heating, and temperature control |
US13/153,740 Continuation US20120048321A1 (en) | 2008-12-11 | 2011-06-06 | Split thermo-electric cycles for simultaneous cooling, heating, and temperature control |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010067368A2 WO2010067368A2 (fr) | 2010-06-17 |
WO2010067368A3 true WO2010067368A3 (fr) | 2010-12-02 |
Family
ID=42243137
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IL2009/001179 WO2010067368A2 (fr) | 2008-12-11 | 2009-12-10 | Structures thermoélectriques servant à refroidir ou à chauffer un objet ou à générer un courant électrique |
PCT/IL2009/001178 WO2010067367A2 (fr) | 2008-12-11 | 2009-12-10 | Structures thermoélectriques divisées |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IL2009/001178 WO2010067367A2 (fr) | 2008-12-11 | 2009-12-10 | Structures thermoélectriques divisées |
Country Status (6)
Country | Link |
---|---|
US (2) | US20120042661A1 (fr) |
EP (5) | EP2375191A1 (fr) |
IL (2) | IL213469A0 (fr) |
SG (2) | SG171984A1 (fr) |
TW (2) | TW201041195A (fr) |
WO (2) | WO2010067368A2 (fr) |
Families Citing this family (31)
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JP5640800B2 (ja) * | 2011-02-21 | 2014-12-17 | ソニー株式会社 | 無線電力供給装置及び無線電力供給方法 |
IL212261A0 (en) * | 2011-04-11 | 2011-07-31 | Lamos Inc | Anodized aluminum substrate |
EP2807682A1 (fr) | 2012-01-25 | 2014-12-03 | Alphabet Energy, Inc. | Unités thermoélectriques modulaires destinées à des systèmes de récupération de chaleur et leurs procédés |
JP5662490B2 (ja) * | 2012-03-07 | 2015-01-28 | パナソニックIpマネジメント株式会社 | 熱電変換装置 |
US9257627B2 (en) | 2012-07-23 | 2016-02-09 | Alphabet Energy, Inc. | Method and structure for thermoelectric unicouple assembly |
TWI481086B (zh) * | 2012-09-19 | 2015-04-11 | Nat Inst Chung Shan Science & Technology | 一種用於電子元件的散熱裝置 |
US20140182644A1 (en) * | 2012-10-15 | 2014-07-03 | Alphabet Energy, Inc. | Structures and methods for multi-leg package thermoelectric devices |
KR101438949B1 (ko) * | 2012-12-14 | 2014-09-11 | 현대자동차주식회사 | 전기차량의 공조장치 |
US20140278699A1 (en) * | 2013-03-15 | 2014-09-18 | Honeywell International Inc. | Modeling energy conversion in systems |
US9065017B2 (en) | 2013-09-01 | 2015-06-23 | Alphabet Energy, Inc. | Thermoelectric devices having reduced thermal stress and contact resistance, and methods of forming and using the same |
US9506675B1 (en) | 2013-09-23 | 2016-11-29 | Geoffrey O. Campbell | Thermoelectric coolers with asymmetric conductance |
GB2521353A (en) | 2013-12-17 | 2015-06-24 | Ibm | Thermoelectric device |
US10982883B1 (en) * | 2014-08-06 | 2021-04-20 | Ambassador Asset Management Limited Partnership | Portable active temperature controlled container comprising a cool sink |
US20160094258A1 (en) * | 2014-09-25 | 2016-03-31 | Electronics And Telecommunications Research Institute | Transceiver module and communication apparatus including the same |
GB2531260B (en) * | 2014-10-13 | 2019-08-14 | Bae Systems Plc | Peltier effect heat transfer system |
US9685598B2 (en) * | 2014-11-05 | 2017-06-20 | Novation Iq Llc | Thermoelectric device |
CN104797077B (zh) * | 2015-04-09 | 2017-07-11 | 哈尔滨工程大学 | 一种井下配水器的电路板散热装置 |
US10845375B2 (en) * | 2016-02-19 | 2020-11-24 | Agjunction Llc | Thermal stabilization of inertial measurement units |
CN108226574B (zh) * | 2016-12-14 | 2019-10-18 | 中国科学院上海硅酸盐研究所 | 一种热电优值因子行为显微成像的扫描热电显微术装置 |
TWI641167B (zh) * | 2016-12-21 | 2018-11-11 | 中國鋼鐵股份有限公司 | Thermoelectric module |
EP3591723B1 (fr) * | 2017-03-28 | 2024-05-22 | National Institute for Materials Science | Cellule et module de génération d'énergie thermoélectrique |
CN107482743A (zh) * | 2017-09-13 | 2017-12-15 | 华北电力大学 | 一种发电装置和自发电式剃须刀 |
WO2019073426A1 (fr) * | 2017-10-12 | 2019-04-18 | Amit Garg | Appareil flexible et modulaire de transfert de chaleur thermoélectrique |
FR3076395B1 (fr) * | 2017-12-28 | 2020-01-17 | Thales | Dispositif de controle thermique d'un composant, systeme electronique et plate-forme associes |
CN110260911A (zh) * | 2018-03-12 | 2019-09-20 | 中国电力科学研究院有限公司 | 一种大截面导线弧垂在线监测系统 |
CN108981225B (zh) * | 2018-07-27 | 2021-01-01 | 王雪格 | 一种半导体制冷制热用保温装置及方法 |
DE102019113976A1 (de) * | 2019-05-24 | 2020-11-26 | Dr. Neumann Peltier-Technik Gmbh | Thermoelektrisches Element |
US10978630B1 (en) * | 2019-10-01 | 2021-04-13 | GM Global Technology Operations LLC | System for controlling localized heating and cooling |
KR20220012447A (ko) * | 2020-07-22 | 2022-02-04 | 삼성디스플레이 주식회사 | 방열 복합체, 하부 패널 시트, 및 이를 포함하는 표시 장치 |
US12029123B2 (en) * | 2021-01-29 | 2024-07-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor structure and method of manufacturing a semiconductor structure |
CN116007224B (zh) * | 2023-02-01 | 2024-06-11 | 山东大学 | 一种基于热电制冷的便携式冷热一体机及方法 |
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US3208835A (en) * | 1961-04-27 | 1965-09-28 | Westinghouse Electric Corp | Thermoelectric members |
EP0339715A1 (fr) * | 1988-04-27 | 1989-11-02 | Theodorus Bijvoets | Dispositif thermo-électrique |
US5385022A (en) * | 1993-09-09 | 1995-01-31 | Kornblit; Levy | Apparatus and method for deep thermoelectric refrigeration |
US5884485A (en) * | 1994-11-21 | 1999-03-23 | Yamaguchi; Sataro | Power lead for electrically connecting a superconducting coil to a power supply |
US5966939A (en) * | 1997-02-28 | 1999-10-19 | Aisin Seiki Kabushiki Kaisha | Multistage thermoelectric cooling device |
US6164076A (en) * | 1999-08-05 | 2000-12-26 | International Business Machines Corporation | Thermoelectric cooling assembly with thermal space transformer interposed between cascaded thermoelectric stages for improved thermal performance |
WO2005001946A1 (fr) * | 2003-06-30 | 2005-01-06 | Da Vinci Co., Ltd. | Element peltier et son procede de fabrication |
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US3051767A (en) * | 1958-11-21 | 1962-08-28 | Minnesota Mining & Mfg | Thermoelectric devices and thermoelements |
US3564860A (en) * | 1966-10-13 | 1971-02-23 | Borg Warner | Thermoelectric elements utilizing distributed peltier effect |
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JPH05168846A (ja) * | 1990-10-30 | 1993-07-02 | Nippondenso Co Ltd | 除湿装置 |
JP3951315B2 (ja) * | 1995-05-26 | 2007-08-01 | 松下電工株式会社 | ペルチェモジュール |
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US6679064B2 (en) * | 2002-05-13 | 2004-01-20 | Taiwan Semiconductor Manufacturing Co., Ltd | Wafer transfer system with temperature control apparatus |
US7205675B2 (en) * | 2003-01-29 | 2007-04-17 | Hewlett-Packard Development Company, L.P. | Micro-fabricated device with thermoelectric device and method of making |
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CN101044638B (zh) * | 2004-10-18 | 2012-05-09 | 株式会社明电舍 | 帕尔帖元件或塞贝克元件的结构及其制造方法 |
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US20080229759A1 (en) * | 2007-03-21 | 2008-09-25 | Chien Ouyang | Method and apparatus for cooling integrated circuit chips using recycled power |
-
2009
- 2009-12-10 EP EP11172248A patent/EP2375191A1/fr not_active Withdrawn
- 2009-12-10 EP EP09804337A patent/EP2370754A2/fr not_active Withdrawn
- 2009-12-10 US US13/132,652 patent/US20120042661A1/en not_active Abandoned
- 2009-12-10 EP EP09805957A patent/EP2370755A2/fr not_active Withdrawn
- 2009-12-10 EP EP11172236A patent/EP2375190A1/fr not_active Withdrawn
- 2009-12-10 US US13/132,441 patent/US20120067064A1/en not_active Abandoned
- 2009-12-10 WO PCT/IL2009/001179 patent/WO2010067368A2/fr active Application Filing
- 2009-12-10 WO PCT/IL2009/001178 patent/WO2010067367A2/fr active Application Filing
- 2009-12-10 SG SG2011041118A patent/SG171984A1/en unknown
- 2009-12-10 SG SG2011041100A patent/SG171983A1/en unknown
- 2009-12-10 EP EP11172224A patent/EP2375189A1/fr not_active Withdrawn
- 2009-12-11 TW TW098142447A patent/TW201041195A/zh unknown
- 2009-12-11 TW TW098142443A patent/TW201041194A/zh unknown
-
2011
- 2011-06-09 IL IL213469A patent/IL213469A0/en unknown
- 2011-06-09 IL IL213468A patent/IL213468A0/en unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3208835A (en) * | 1961-04-27 | 1965-09-28 | Westinghouse Electric Corp | Thermoelectric members |
EP0339715A1 (fr) * | 1988-04-27 | 1989-11-02 | Theodorus Bijvoets | Dispositif thermo-électrique |
US5385022A (en) * | 1993-09-09 | 1995-01-31 | Kornblit; Levy | Apparatus and method for deep thermoelectric refrigeration |
US5884485A (en) * | 1994-11-21 | 1999-03-23 | Yamaguchi; Sataro | Power lead for electrically connecting a superconducting coil to a power supply |
US5966939A (en) * | 1997-02-28 | 1999-10-19 | Aisin Seiki Kabushiki Kaisha | Multistage thermoelectric cooling device |
US6164076A (en) * | 1999-08-05 | 2000-12-26 | International Business Machines Corporation | Thermoelectric cooling assembly with thermal space transformer interposed between cascaded thermoelectric stages for improved thermal performance |
WO2005001946A1 (fr) * | 2003-06-30 | 2005-01-06 | Da Vinci Co., Ltd. | Element peltier et son procede de fabrication |
Non-Patent Citations (1)
Title |
---|
"INSIDE STORY ON SOLID-STATE COOLERS", MACHINE DESIGN, PENTON MEDIA, CLEVELAND, OH, US, vol. 67, no. 19, 26 October 1995 (1995-10-26), pages 108, XP000545883, ISSN: 0024-9114 * |
Also Published As
Publication number | Publication date |
---|---|
EP2370755A2 (fr) | 2011-10-05 |
WO2010067367A3 (fr) | 2010-09-10 |
EP2375190A1 (fr) | 2011-10-12 |
IL213468A0 (en) | 2011-07-31 |
US20120067064A1 (en) | 2012-03-22 |
EP2370754A2 (fr) | 2011-10-05 |
IL213469A0 (en) | 2011-07-31 |
EP2375191A1 (fr) | 2011-10-12 |
TW201041195A (en) | 2010-11-16 |
US20120042661A1 (en) | 2012-02-23 |
WO2010067367A2 (fr) | 2010-06-17 |
EP2375189A1 (fr) | 2011-10-12 |
SG171984A1 (en) | 2011-07-28 |
SG171983A1 (en) | 2011-07-28 |
TW201041194A (en) | 2010-11-16 |
WO2010067368A2 (fr) | 2010-06-17 |
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