WO2010067159A3 - Integration of a processing bench in an inline coating system - Google Patents

Integration of a processing bench in an inline coating system Download PDF

Info

Publication number
WO2010067159A3
WO2010067159A3 PCT/IB2009/007615 IB2009007615W WO2010067159A3 WO 2010067159 A3 WO2010067159 A3 WO 2010067159A3 IB 2009007615 W IB2009007615 W IB 2009007615W WO 2010067159 A3 WO2010067159 A3 WO 2010067159A3
Authority
WO
WIPO (PCT)
Prior art keywords
coating system
insert element
integration
processing bench
insert
Prior art date
Application number
PCT/IB2009/007615
Other languages
French (fr)
Other versions
WO2010067159A2 (en
Inventor
Edgar Haberkorn
Philipp Maurer
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP08171573A external-priority patent/EP2197026A1/en
Priority claimed from US12/334,198 external-priority patent/US20100147217A1/en
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to CN2009801500613A priority Critical patent/CN102246263A/en
Publication of WO2010067159A2 publication Critical patent/WO2010067159A2/en
Publication of WO2010067159A3 publication Critical patent/WO2010067159A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

An insert apparatus for a substrate coating system, the insert apparatus including: an insert element 100 for being operated within a coating system, the insert element including a processing bench, said processing bench being adapted for receiving a coating tool for applying a coating to a substrate, a carrier 1 10 for carrying the insert element 100, a first positioner 130 collaborating with the carrier 110 for inserting said insert element 100 into a processing chamber 150 of the coating system and/or retracting said insert element 100 from said processing chamber 150, and a second positioner 140 for fine positioning of said insert element 100 within said processing chamber 150.
PCT/IB2009/007615 2008-12-12 2009-11-30 Integration of a processing bench in an inline coating system WO2010067159A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009801500613A CN102246263A (en) 2008-12-12 2009-11-30 Integration of a processing bench in an inline coating system

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP08171573.2 2008-12-12
US12/334,198 2008-12-12
EP08171573A EP2197026A1 (en) 2008-12-12 2008-12-12 Integration of a processing bench in an inline coating system
US12/334,198 US20100147217A1 (en) 2008-12-12 2008-12-12 Integration of a processing bench in an inline coating system

Publications (2)

Publication Number Publication Date
WO2010067159A2 WO2010067159A2 (en) 2010-06-17
WO2010067159A3 true WO2010067159A3 (en) 2010-09-10

Family

ID=42243125

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2009/007615 WO2010067159A2 (en) 2008-12-12 2009-11-30 Integration of a processing bench in an inline coating system

Country Status (4)

Country Link
KR (1) KR20110096152A (en)
CN (1) CN102246263A (en)
TW (1) TW201030162A (en)
WO (1) WO2010067159A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10770338B2 (en) * 2018-12-19 2020-09-08 Globalfoundries Inc. System comprising a single wafer, reduced volume process chamber

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5948704A (en) * 1996-06-05 1999-09-07 Lam Research Corporation High flow vacuum chamber including equipment modules such as a plasma generating source, vacuum pumping arrangement and/or cantilevered substrate support
US6273955B1 (en) * 1995-08-28 2001-08-14 Canon Kabushiki Kaisha Film forming apparatus
US20030168948A1 (en) * 2002-02-21 2003-09-11 Takayuki Yamagishi Semiconductor manufacturing equipment and maintenance method
JP2006114461A (en) * 2004-10-18 2006-04-27 Sekisui Chem Co Ltd Atmospheric pressure plasma surface treatment apparatus

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8408023D0 (en) * 1984-03-28 1984-05-10 Gen Eng Radcliffe Ltd Vacuum coating apparatus
US6503379B1 (en) * 2000-05-22 2003-01-07 Basic Research, Inc. Mobile plating system and method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6273955B1 (en) * 1995-08-28 2001-08-14 Canon Kabushiki Kaisha Film forming apparatus
US5948704A (en) * 1996-06-05 1999-09-07 Lam Research Corporation High flow vacuum chamber including equipment modules such as a plasma generating source, vacuum pumping arrangement and/or cantilevered substrate support
US20030168948A1 (en) * 2002-02-21 2003-09-11 Takayuki Yamagishi Semiconductor manufacturing equipment and maintenance method
JP2006114461A (en) * 2004-10-18 2006-04-27 Sekisui Chem Co Ltd Atmospheric pressure plasma surface treatment apparatus

Also Published As

Publication number Publication date
TW201030162A (en) 2010-08-16
WO2010067159A2 (en) 2010-06-17
KR20110096152A (en) 2011-08-29
CN102246263A (en) 2011-11-16

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