WO2010066296A1 - Corps soumis à la déformation pour détecteur de couple - Google Patents

Corps soumis à la déformation pour détecteur de couple Download PDF

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Publication number
WO2010066296A1
WO2010066296A1 PCT/EP2008/067265 EP2008067265W WO2010066296A1 WO 2010066296 A1 WO2010066296 A1 WO 2010066296A1 EP 2008067265 W EP2008067265 W EP 2008067265W WO 2010066296 A1 WO2010066296 A1 WO 2010066296A1
Authority
WO
WIPO (PCT)
Prior art keywords
deformation body
body according
deformation
strain gauge
layer
Prior art date
Application number
PCT/EP2008/067265
Other languages
German (de)
English (en)
Inventor
Karsten Weiss
Hans Weiss
Original Assignee
Karsten Weiss
Hans Weiss
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Karsten Weiss, Hans Weiss filed Critical Karsten Weiss
Priority to PCT/EP2008/067265 priority Critical patent/WO2010066296A1/fr
Priority to EP08875441A priority patent/EP2376885A1/fr
Publication of WO2010066296A1 publication Critical patent/WO2010066296A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2206—Special supports with preselected places to mount the resistance strain gauges; Mounting of supports
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/16—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
    • G01L5/161—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance
    • G01L5/1627—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance of strain gauges

Definitions

  • the invention relates to a deformation element for a force-moment sensor having a printed circuit board which has at least one first strain gauge structure in the form of a first printed conductor and a second strain gauge structure in the form of a second printed conductor.
  • a deformation body of the aforementioned type is known from EP 1 278 052 A2.
  • an electric window lifting device for a motor vehicle.
  • This sensor unit has a deformation body.
  • the deformation body is a printed circuit board with Dehnmess Modellen.
  • torque is introduced into the circuit board and shear forces occur.
  • the printed circuit board is then deformed with the strain gauges. From the electrical resistance of these strain gauge structures can be concluded on a force stress of the circuit board.
  • a printed circuit board also called a printed circuit board, is a carrier with a carrier structure to which conductive connections are adhesively bonded in electrically insulating material.
  • a circuit board is used to receive and carry electrical components. These can be contacted via the conductive connections on the printed circuit board.
  • the materials used for the support structure of a printed circuit board are usually the substances FR2, FR3, CEM1, CEM3 or FR4.
  • the support structure of a printed circuit board is coated with a metal lamination, ie with a thin conductive layer, usually copper. To produce printed conductors in the conductive layer of a printed circuit board, this is coated with a photoresist by a Mask is exposed. The exposed printed circuit board is then chemically processed in an etching solution. In this case, either the exposed or unexposed regions of the conductive layer are removed below the photoresist.
  • a printed circuit board can be designed with several superimposed interconnect layers. Insulation layers, e.g. in the form of epoxy resin, applied to the photolithographically processed conductor track layer. The insulating layer is then again coated with a conductive layer which can be photolithographically processed, and so on.
  • a force-torque sensor for robot technology which can be used for example in the control of a robot hand.
  • This force-moment sensor has a deformation body with a first, inner portion and a second, outer peripheral portion.
  • the first section is connected to the peripheral section via three spoke-shaped webs.
  • the second section has a three section perimeter area surrounding the first section.
  • Strain gauges are flat transducers that contain a meandering wire applied to a film carrier. This wire changes its electrical resistance when stretched or compressed. The resistance of the strain gauges is evaluated via a bridge circuit.
  • strain gauges By means of the strain gauges, a deformation of the deformation body can be detected, if in these forces or moments are introduced. This makes it possible to deduce the amount and direction of the forces.
  • Deformation bodies which are used in force-moment sensors in robot technology, are usually equipped with strain gauges by hand. This inevitably results in positioning inaccuracies. Deformation bodies with manually mounted strain gages must therefore be calibrated extensively to compensate for the manufacturing inaccuracies.
  • the object of the invention is to provide a deformation body, which is suitable for use in a force-moment sensor for robot technology, and on which deformations can be detected precisely in a small space.
  • strain measurement structures can be implemented on a deformation body for force-moment sensors in such a way that the electrical resistance of the measurement structures can be set in a defined manner and also an adaptation of the measurement structure on complicated geometries of the deformation is kung body possible.
  • the invention is based, in particular, on the knowledge that the production methods known for printed circuit boards are known from electrical engineering Strain measurement structures defined on a deformation body can be arranged above and below one another in a very small space.
  • a finding of the invention is also that the materials used in the field of printed circuit boards as a support structure are ideal for deformation body of force-moment sensors in robotics.
  • a further finding of the invention is that it is possible in printed circuit board technology to produce deformation bodies for force-moment sensors in virtually any complicated geometry with a multiplicity of strain gauging structures.
  • first and the second conductor track as a first and a second measuring grid with meandering conductor loops in the deformation body
  • a strain gauge structure with high sensitivity can be produced. If in this case the second measuring grid is arranged obliquely to the conductor track loops of the first measuring grid, preferably at an angle of 45 °, it is possible to simultaneously detect bending and shearing forces in the smallest space. It is favorable to associate with the second measuring grid a third measuring grid with a third conductor track as a third rotary measuring structure, which is located in the second conductor layer and forms a herringbone structure with the second measuring grid. This makes it possible to measure shear stresses in the deformation body. For this purpose, a bridge circuit can be provided, which compares the electrical resistance of the third strain-measuring structure with the electrical resistance of the second strain-measuring structure.
  • a deformation body By providing a compensation area in the deformation body, on which a third conductor track is located as a strain gauge structure and which, upon introduction of a force of a moment, enters the deformation body not deformed or only slightly deformed, a deformation body is created with an integrated strain gauge standard for comparison. It is advantageous in this case to arrange the third printed conductor in the same printed conductor layer as the first or the second printed conductor. This is because the tolerance of the layer thicknesses of printed conductor layers in circuit boards does not affect differences in the electrical resistance of the corresponding strain measuring structures produced by photolithographic structuring.
  • the electrical resistance of the further strain-measuring structure can thus be adapted very exactly to the resistance of the first or second strain-measuring structure.
  • the deformation body can be manufactured in particular from a printed circuit board. Alternatively, it is possible to process a support structure by means of printed circuit board technology.
  • the strain gage structure may consist, for example, of a conductor track structure which is produced by photolithographic structuring of a metal layer made of copper, of constantan, of isotan or of a nickel alloy.
  • the strain gauge structure can be formed in a wiring layer which is a composite of a highly conductive layer and a less conductive layer.
  • This conductive layer is photolithographically patterned so that the strain gauge only consists of material of the less conductive layer and the leads for these Dehnmess MUSTen is constructed of material of highly conductive layer and optionally consists of both the highly conductive layer and the less conductive layer.
  • the composite layer must be photolithographically structured so that in regions where the strain gauge is formed, the highly conductive layer is removed from the less conductive layer, so that the largest possible inner resistance for the Dehnmess Modellen sets.
  • the insulation material used in the deformation body is particularly suitable for the material FR4 used in printed circuit board production. For an insulation layer but also the material FR5 or the material Kapton can be used.
  • materials for the support structure of the deformation body z. As aluminum, FR4, steel or titanium suitable.
  • evaluation circuits with a half-bridge or full-bridge circuit are particularly suitable.
  • the corresponding evaluation circuits can be mounted directly on the deformation body by means of printed circuit board technology, preferably in a region of the deformation body which is not deformed under the effect of force and moment.
  • FIG. 1 shows a first deformation body for use in a force-moment sensor.
  • FIG. 2 shows a layer structure of the first deformation body
  • FIG. 3 shows strain measurement structures in different layers of the first deformation body
  • FIG. 5 shows a first bridge circuit for detecting longitudinal mechanical stresses on the first deformation body
  • FIG. 6 shows a second bridge circuit for detecting mechanical transverse stresses on the deformation body
  • FIG. 8 shows a section of a force-moment sensor with the first deformation body;
  • FIG. 9 shows a further view of the force / torque sensor of FIG. 8;
  • 13 is a partial view of the second deformation body.
  • 14 and 15 and 16 are partial views of a third, fourth and fifth deformation body.
  • the deformation body 1000 shown in FIG. 1 is designed for use in a force-moment sensor for robotics.
  • the deformation body 1000 has a first connection region 1002 with bores 1004, 1006, 1008 and a second connection region 1010 with bores 1012, 1014 and 1016, which serve to fix the deformation element in the housing of a force-moment sensor.
  • the deformation body 1000 has six deformation regions 1018, 1020, 1022, 1024, 1026, 1028 and three compensation regions 1030, 1032 and 1034.
  • the deformation body 1000 is manufactured using printed circuit board technology. It is constructed as a laminated body and carries on its surface electrical components 1040, 1042, 1044, which contain operational amplifiers. The electrical components serve to determine the electrical resistance of strain gauge structures formed in the deformation body 1000.
  • FIG. 2 illustrates the layer structure 2000 of the deformation body 1000.
  • the deformation element has a support structure 2002, which consists of a 3 mm thick plate of aluminum. This plate is coated on both sides with 200 ⁇ m thick layers 2004,2006, made of the epoxy glass fiber substance FR4.
  • interconnect layers 2008,2010,2012,2014,2016,2018,2020 made of copper.
  • interconnect layers are over 100 ⁇ m thick insulation layers
  • a 100 ⁇ m thick insulation layer 2040 or 2042 of FR4 is provided on the interconnect layers 2014 and 2022, respectively.
  • an electrically conductive 32 microns thick copper layer 2036.3038 which is coated with an insulating varnish.
  • FIG. 3 shows the printed circuit board layers 2008,2010,2012,2016,2018,2020 of the deformation body 1000 from FIG. 1.
  • strain measuring structures 3002-3013 are arranged in the deformation regions of the deformation body in the form of finely structured, meandering conductor tracks 3014 which form a measuring grid.
  • the tracks have a width of about 50 microns.
  • a portion of the tracks 3802 and 3804 in the strain gauges are shown at reference numeral 3014.
  • the printed circuit board layer 2016 corresponds in its construction to the circuit board layer 2008. In it there are strain gauge structures 3022-3033.
  • Strain measurement structures 3032, 3036, 3040 which are located in the deformation regions of the deformation body, are provided in the circuit board layer 2010.
  • strain measurement structures 3044, 3046, 3048 are formed in the compensation regions of the deformation body in the printed circuit board layer 2010.
  • the structure of the printed circuit board layers 2012, 20120 and 2020 corresponds to that of the printed circuit board layer 2010: Strain gauge structures 3052, 3056, 3060, 3072, 3076, 3080, 3092, 3096, 3100 are respectively provided in the deformation areas of the deformation body. Strain gauge structures 3064, 3066, 3068, 3084, 3086, 3088, 3104, 3106 and 3108 are provided in the compensation areas, respectively. A portion of the trace 3806 in the strain gauge 3074 is shown at 3902. At reference numeral 3904, a portion of the trace 3808 in the strain gauge structure is enlarged.
  • the strain gauge structures lie exactly above one another.
  • the tracks of the strain gauge structures in the track layers 2008 and 2016 meander and form a measuring grid in herringbone geometry.
  • the tracks 3802, 3804 of immediately adjacent strain gauges 3002, 3003 form a right angle 3900.
  • strain gauges of the layers 2010,2012,2018,2020 are included
  • Layers 2008 and 2016 are at an angle of 45 ° enlarged representation of printed conductors at reference numerals 3014 and 3902, the flank 3904 of the conductor 3804 extends at an angle of 45 ° to the flank 3906 of the conductor 3806.
  • the strain gauges 3002-3013 and 3022-3033 Quertial. Shearing stresses on the deformation body 1000 are detected.
  • the strain gauges 3032-3040, 3052-3060, 3072-3080, 3092-3100 are intended for the measurement of longitudinal or bending stresses in the deformation areas of the deformation body.
  • the strain measuring structures are arranged symmetrically in the deformation body to both sides of the support structure made of aluminum.
  • FIG. 4 shows the deformation body 1000 in a deformed state when the deformation body 1000 is introduced via the connection area 1010 with a force F and a moment M, with the deformation body being retained at the connection area 1002.
  • the six deformation areas of the deformation body 1018-1028 become strong here the three compensation areas 1030,2032,1034 little deformed.
  • the bridge circuit 5000 compares the electrical resistors R3072 and R3106 of the strain gauge structures 3072, 3106 and the electrical resistors R 3044 and R 30 S 4 of the strain gauge structures 3044 and 3052 with the electrical resistances R 30 86 and R 3092 of the strain gauge structures 3086 and 3092 and the electrical resistances R 3032 and R 306 6 of the strain gauges 3032 and 3066.
  • the bridge circuit 5000 includes an operational amplifier 5100 which acts as a differential amplifier and provides an output voltage U A , which is a measure of the bending stress of the deformation portion 1020 of the deformation body 1000 of Fig. 1, where the strain gauge structures are located.
  • Strain measurement structures from the four different interconnect layers 2010, 2012, 2018 and 2020 are interconnected in the bridge circuit 5000.
  • the bridge circuit 5000 makes use of the fact that, when the deformation section 1020 of the deformation body 1000 of FIG. 1 is bent, an increase or decrease in the electrical resistance of the expansion structure 3032 is associated with an increase or decrease in the electrical resistance of the strain measurement structure 3072 the electrical resistances of the strain gauges 3052 and 3092 sets a decrease or increase in the resistance.
  • the electrical resistance R 30 Se of the strain gauge structure 3086 corresponds to the electrical resistance R 3072 of the strain gauge structure 3072.
  • the electrical resistance R 3042 of the strain gauge structure 3042 corresponds to the electrical resistance R 3032 of the strain gauge structure 3032.
  • the track width and the track length can be precisely adjusted for a strain gauge structure.
  • the thickness of a conductor layer also depends from the thickness of printed circuit board technology by means of photolithographically structured interconnect layer.
  • the strain gauge structure 3044 or 3086 or 3066 or 3106 has the same trace length, the same trace width and the same trace thickness as the strain gauge structure 3032 or 3072 or 3052 or 3092.
  • the thickness of Tracks are kept constant with great accuracy.
  • the arrangement of the resistors of Dehnmess Modellen corresponding to the bridge circuit 5000 thus allows the compensation of tolerance-related fluctuations in the resistances of Dehnmess Modellen. This causes the bridge circuit 5000 is not detuned by resistance variations, which have their cause in the tolerance of the thickness of conductor tracks in different layers.
  • a bridge circuit 6000 shown in FIG. 6 is provided in the electrical assembly on the deformation body.
  • strain gauge structures of the two different interconnect layers 2008 and 2016 are interconnected.
  • the strain measurement structures of the two respectively adjacent deformation regions 1018 and 1020, 1022 and 1024, and 1026 and 1028 of the deformation body 1000 from FIG. 1 are connected in series, resulting in an increased sensitivity of the circuit arrangement.
  • the bridge circuit 6000 compares the electrical resistors R3002 + R 30 O 4 and R3003 + R3005 of Dehnmess füren 3002, 3003, 3004 and 3005 with the electrical resistors R3022 + R302 4 and R3023 + R3025 of strain measurement structures 3022, 3023, 3024 and 3025th
  • the bridge circuit 6000 includes an operational amplifier 6100 designed as a differential amplifier, which outputs a voltage U A as a measure of a shear stress of the deformation body.
  • the bridge circuits 5000 and 6000 corresponding bridge circuits are in the deformation body 1000 of Figure 1 for all deformation sections 1018, 1020; 1022, 1024 and 1026, 1028 provided.
  • FIG. 7 shows a further, alternative bridge circuit 7000, which is designed as a half-bridge circuit and makes it possible to detect a bending stress of a deformation section on the deformation body 1000 from FIG. 1.
  • the bridge circuit 7000 compares the electrical resistances R 30 So and R3100 of the strain gauge structures 3080 and 3100 from a deformation range of the deformation body with the electrical resistances R 3084 and R 3 -I 04 of the strain gauge structures 3084 and 3104 located in a compensation area of the deformation body , In the bridge circuit 7000 are thus connected Dehnmess füren from two different interconnect layers of the deformation body.
  • the bridge circuit 7000 is an operational amplifier 7100 provided, which in turn generates an output voltage U A as a measure of a bending stress of a deformation section of the deformation body.
  • the bridge circuit 7000 corresponds functionally to the bridge circuit 5000 from FIG. 5, with the difference that here in a half-bridge circuit, strain measurement structures are interconnected with interconnects in four different interconnect layers, but only strain measurement structures of two different interconnect layers.
  • FIG. 8 shows a force / torque sensor 8000 which has a housing body 8002 on which the deformation body 8004 is fixed in a first connection region 8006. In a second connection region 8008, the deformation element 8004 is connected to a mounting flange 8010.
  • FIG. 9 shows a section of the force / torque sensor 8000 from FIG. 8 along the line IX-IX.
  • the housing body 8002 and the mounting flange 8010 are designed for connection to a robot arm or for receiving a robot tool. Housing body 8002 and mounting flange 8010 correspond in this respect to the standard flange for industrial robots according to DIN ISO 9409.
  • FIG. 10 shows a robot 10000 with a robot tool 10002, which is received by the force / torque sensor 8000 on a robot arm 10004.
  • FIG. 11 shows a force-moment sensor deformation body 11000 designed to detect bending forces F, shear forces Q acting according to arrow 11016, and torsional moments M to axis 11012.
  • This deformation body is a printed circuit board 11002, which contains an electrical assembly 11004 for the evaluation of strain gauge structures, which are formed in the form of printed conductors in layers of the printed circuit board.
  • the circuit board 11002 has a bending area 11006, which can also be performed with reduced material thickness. In the bending region 11006, lateral recesses 11008 and 11010 are formed. This measure causes a very uniform stress distribution in the deformation body.
  • the deformation body 11000 is received on a holding unit 12002 and adapted to detect forces F acting according to the arrow 12004, and to detect torques M corresponding to the arrow 12006 and shear forces Q, respectively the direction 12008.
  • the deformation body 11000 has a layer structure, which is explained with reference to FIG. 13.
  • a support structure 13002 made of steel is provided in the deformation body. Over and under this support structure there are interconnect layers 13004, 13006, 13008 and 13010 with strain measurement structures 13012, 13014, 13016, 13018, 13020 and 13022.
  • the strain measurement structures 13016 and 13022 serve to detect bending stresses in the support structure 13002.
  • the strain measurement structures 13012 and 13014 are at a right angle 13500 to each other. They are oriented to the strain gauge structures 13016, 13022 at an angle of 45 °. The same applies to the strain gauges 13018 and 13020.
  • either transverse forces Q or torsional moments M can be measured.
  • FIG. 14 shows an alternative layer structure of a deformation body which is used for detecting shear and bending moments and longitudinal forces.
  • the deformation body has two support structures 14002 and 14004, which are made of titanium, between which conductor track layers 14006 and 14008 with differently oriented strain gauge structures are provided. Above and below the support structures 14002 and 14004 there are interconnect layers 14010, 14012 and 14014 and 14016, in which there are strain gauges of different orientation.
  • FIG. 15 shows a deformation body 15000 in which three conductor layers 15002, 15004 and 15006 are provided. These conductor layers are accommodated on two support structures 15010 and 15012 made of aluminum. On the wiring layers 15004 and 15006, there are aluminum plates 15018 and 15020 bonded to the wiring layers via insulating prepreg layers 15014 and 15016. The additional aluminum plates 15018 and 15020 serve to strengthen the deformation body mechanically and cause a very good drift or hysteresis behavior.
  • the deformation body 15000 is designed for bending about the axis 15100, with the conductor layer 15002 forming a neutral fiber that does not undergo mechanical deformation under such bending stress. In the wiring layer 15002, there are therefore strain gauges with traces designed to sense shear forces. On the other hand, the wiring layers 15004 and 15006 include strain gauges for detecting bending stresses.
  • a deformation body 16000 is shown with a first portion 16001 and a second portion 16002.
  • Support structures 16004, 166006, 16008, 16010 made of aluminum are provided in the first and second sections.
  • the deformation body 16000 has a core 16012 made of polyamide and includes wiring layers 16014, 16016, 16018, 16020, 16022 and 16024.
  • the deformation body 16000 is connected to a unit 16026.
  • the described deformation body for a force-torque sensor can be produced inexpensively, in particular even in small batches, by processing in a batch. Since the production methods established in printed circuit board technology are technically very well mastered, it is possible to produce fine printed conductors as strain measuring structures in almost any desired geometry.
  • strain measuring structures made of constantan (Cu 5 SNi 44 ), manganin (Co 8 6Mn 12 Ni 2 ) or isotane (Cu 5 SNi 44 Mn 1 ) or tungsten can be produced in particular. It is advantageous if the lines to and from the strain gauge structures are made in copper (Cu), since copper has a comparatively small specific resistance.
  • Cu copper
  • the partial layers of the multilayer conductor foil are conductively connected to each other over their entire surface.
  • Corresponding multilayer conductor foils can be produced, for example, by electroplating.
  • deformation bodies in the form of printed circuit boards make it possible to provide intelligent measuring modules in which signal processing of digitization of measured values directly on the deformation element is possible, since it is equipped with corresponding intelligent modules can be.
  • communication interfaces are provided for operation in industrial applications, which, for example, enable connection to a CAN bus system or Industhal Ethernet.
  • a deformation body for a force / torque sensor with a printed circuit board which has at least one first measuring structure 3002 in the form of a first conductor track and at least one second strain gauge structure 3032 in the form of a second conductor track.
  • the printed circuit board has at least a first interconnect layer 2008 and a second interconnect layer 2010.
  • the first interconnect 3002 of the first interconnect layer 2008 is formed.
  • the second interconnect 3032 is located in the second interconnect layer 2010.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)

Abstract

L'invention concerne un corps soumis à la déformation pour un détecteur de couple, présentant une plaquette à circuit imprimé qui comprend au moins une première structure de mesure d'extensibilité sous forme d'une première piste conductrice (3002), et au moins une seconde structure de mesure d'extensibilité sous forme d'une seconde piste conductrice (3032). L'invention est caractérisée en ce que la plaquette à circuit imprimé présente au moins une première et au moins une seconde couche de piste conductrice (2008, 2010), et en ce que la première piste conductrice (3002) est située dans la première couche de piste conductrice (2008), et la seconde piste conductrice (3032) est située dans la seconde couche de piste conductrice (2010).
PCT/EP2008/067265 2008-12-10 2008-12-10 Corps soumis à la déformation pour détecteur de couple WO2010066296A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/EP2008/067265 WO2010066296A1 (fr) 2008-12-10 2008-12-10 Corps soumis à la déformation pour détecteur de couple
EP08875441A EP2376885A1 (fr) 2008-12-10 2008-12-10 Corps soumis à la déformation pour détecteur de couple

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2008/067265 WO2010066296A1 (fr) 2008-12-10 2008-12-10 Corps soumis à la déformation pour détecteur de couple

Publications (1)

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WO2010066296A1 true WO2010066296A1 (fr) 2010-06-17

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2631624A3 (fr) * 2012-02-27 2014-06-18 Deutsches Zentrum für Luft- und Raumfahrt e.V. Capteur force-moment destiné à la mesure de forces et de moments
US9038484B2 (en) 2011-03-15 2015-05-26 Deutsches Zentrum Fur Luft-Und Raumfahrt E.V. Force/moment sensor for measurement of forces and moments
WO2015185494A1 (fr) * 2014-06-02 2015-12-10 Kuka Roboter Gmbh Capteur de couple et procédé pour détecter des couples s'exerçant sur une articulation d'un robot à bras articulé ou dans cette articulation
EP3387367A4 (fr) * 2016-01-12 2019-01-23 Demas, Nickolas Peter Description de capteur de force de faible déplacement multidirectionnelle
CN113167670A (zh) * 2019-01-28 2021-07-23 日本电产科宝电子株式会社 弹性体和使用了该弹性体的力传感器
EP4227656A1 (fr) * 2022-02-14 2023-08-16 TE Connectivity Sensors France Système de détection de couple

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10217019C1 (de) * 2002-04-12 2003-07-03 Deutsch Zentr Luft & Raumfahrt Kraft-Moment-Sensoren
DE10217017C1 (de) * 2002-04-12 2003-07-17 Deutsch Zentr Luft & Raumfahrt Kraft-Moment-Sensor
US20070234818A1 (en) * 2006-04-06 2007-10-11 Sauer-Danfoss Aps Object having a layer of conducting material forming a sensing device
DE102007026827A1 (de) * 2007-06-06 2009-01-22 Weiss, Hans Aufnehmer zur Messung mechanischer Kräfte und Momente

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10217019C1 (de) * 2002-04-12 2003-07-03 Deutsch Zentr Luft & Raumfahrt Kraft-Moment-Sensoren
DE10217017C1 (de) * 2002-04-12 2003-07-17 Deutsch Zentr Luft & Raumfahrt Kraft-Moment-Sensor
US20070234818A1 (en) * 2006-04-06 2007-10-11 Sauer-Danfoss Aps Object having a layer of conducting material forming a sensing device
DE102007026827A1 (de) * 2007-06-06 2009-01-22 Weiss, Hans Aufnehmer zur Messung mechanischer Kräfte und Momente

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9038484B2 (en) 2011-03-15 2015-05-26 Deutsches Zentrum Fur Luft-Und Raumfahrt E.V. Force/moment sensor for measurement of forces and moments
EP2631624A3 (fr) * 2012-02-27 2014-06-18 Deutsches Zentrum für Luft- und Raumfahrt e.V. Capteur force-moment destiné à la mesure de forces et de moments
WO2015185494A1 (fr) * 2014-06-02 2015-12-10 Kuka Roboter Gmbh Capteur de couple et procédé pour détecter des couples s'exerçant sur une articulation d'un robot à bras articulé ou dans cette articulation
KR20160147035A (ko) * 2014-06-02 2016-12-21 쿠카 로보테르 게엠베하 토크 센서 및 관절식 암 로봇의 관절에서 또는 관절 안에서 발생하는 토크를 검출하기 위한 방법
CN106415227A (zh) * 2014-06-02 2017-02-15 库卡罗伯特有限公司 检测关节臂机器人的关节上或关节中所产生转矩的转矩传感器和方法
US20170153156A1 (en) * 2014-06-02 2017-06-01 Kuka Roboter Gmbh Torque sensor and method for detecting torques occurring on or in a joint of an articulated arm robot
US10352793B2 (en) 2014-06-02 2019-07-16 Kuka Roboter Gmbh Torque sensor and method for detecting torques occurring on or in a joint of an articulated arm robot
KR102045612B1 (ko) * 2014-06-02 2019-11-15 쿠카 도이칠란트 게엠베하 토크 센서, 관절식 암 로봇의 관절에서 또는 관절 안에서 발생하는 토크를 검출하기 위한 방법 및 관절식 암 로봇
EP3387367A4 (fr) * 2016-01-12 2019-01-23 Demas, Nickolas Peter Description de capteur de force de faible déplacement multidirectionnelle
CN113167670A (zh) * 2019-01-28 2021-07-23 日本电产科宝电子株式会社 弹性体和使用了该弹性体的力传感器
CN113167670B (zh) * 2019-01-28 2023-02-17 日本电产科宝电子株式会社 弹性体和使用了该弹性体的力传感器
EP4227656A1 (fr) * 2022-02-14 2023-08-16 TE Connectivity Sensors France Système de détection de couple

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