WO2010066065A1

WO2010066065A1 - Image picking module

Info

Publication number: WO2010066065A1
Application number: PCT/CN2008/001992
Authority: WO
Inventors: 简硕宏; 何容纬
Original assignee: 长绩科技股份有限公司
Priority date: 2008-12-11
Filing date: 2008-12-11
Publication date: 2010-06-17

Abstract

An image picking module comprises a circuit board (30) and an image picking device (40). The circuit board is arranged a plurality of lines (31), and provided an accommodating section (32) to accommodate at least a part of the image picking device. The image picking device is electrically connected with the lines. The image picking module is small in whole size.

Description

Image capture module

The present invention relates to an image capture module, and more particularly to an image capture module that reduces overall size to facilitate assembly into a thinner and lighter electronic product. Background technique

With the development of image digitization technology and the improvement of image capture and data processing performance, the image capture module is installed on a computer to capture images, and the image signals are processed and transmitted to others via the Internet simultaneously, and This technology can be used to derive different types of applications such as video chat, video conferencing, etc., so that through the Internet transmission, people from all over the world can communicate and exchange feelings in person.

As the current computer is becoming more and more demanding, the components that are integrated into the computer must gradually move toward a miniaturized route improvement. The image capture module is currently more common, and an externally externally attached to the computer. For use, it is convenient to load and unload as desired, but if you forget to carry it out, you lose this function. The other implementation is directly on the screen of the computer, usually more on the screen of the notebook, although it is no longer necessary to consider whether to forget to carry the problem, but how to narrow it The size to follow the trend of miniaturization is the goal of the current related component manufacturers to develop and design.

A commonly used image capturing module is as shown in FIG. 1 , which is mainly composed of a circuit board 10 and an image capturing lens 20 . A controller 11 is additionally disposed on the circuit board 10 as a control image capturing lens 20 . And the image capturing lens 20 is directly soldered on the surface of the circuit board 10 by surface adhesion technology (SMT), and is electrically connected to the controller 11 through a plurality of pre-formed wires 12 formed on the circuit board 10, thereby making the image After taking the image signal of the taking lens 20, it is necessary to perform t-processing by the control 11.1 and transmit the digital signal of the image to the computer.

The image board 10 of the above-mentioned conventional image capture module is usually implemented by using a printed circuit board (PCB), and the design is usually between 0. 5mm and 1. 0mm, and image pickup. The image capturing lens 20 in the module is usually a charge coupled device (CCD) lens or a complementary metal oxide semiconductor (CMOS) lens. For example, a megapixel CMOS lens has a height design of about 3. 1⁄2 m or more, and a height of 1300 megapixel CMOS lens is about 4. 3 mm or more, that is, if the image capturing module is set at On the computer screen, then the height is at least between 3. 9mm ~ 4. 8mm, but the consumer's image number requirements for the lens will only get higher and higher, but for the height (or thickness) of the screen. It will only get smaller and smaller. Under the two-phase conflict, how to further reduce the height of the image capture module has become a problem that has to be changed. Good goal. Summary of the invention

The object of the present invention is to overcome the defects of the existing image capturing module and provide a novel structure of the image capturing module. The technical problem to be solved is to reduce the thickness of the image capturing module to facilitate integration into a computer or the like. When it comes to electronics, it can meet the needs of its thin and light.

The object of the present invention and solving the technical problems thereof are achieved by the following technical solutions. An image capturing module according to the present invention includes: a circuit board having a plurality of wires disposed thereon, and the circuit board having a receiving portion; and an image pickup device having at least a portion disposed therein And electrically connected to the wires of the circuit board.

The object of the present invention and solving the technical problems thereof can be further achieved by the following technical measures. In the above image capturing module, the receiving portion is a groove or a through hole. The image capturing module, wherein the receiving portion has an opening, the wire is distributed to the periphery of the opening, and the periphery of the image picker is correspondingly provided with at least one contact member electrically connected to the wire, wherein The wire is connected to the contact member by a soldering method or a tight fit. The wire is electrically connected to the contact member through a connecting member disposed on the periphery of the opening of the receiving portion. The connecting member and the contact member are combined in a welding manner or a tight fitting manner.

In the above image capturing module, the image capturing device is provided with at least two arms extending as an electrical connection between the wire or the connecting member.

In the above image pickup module, the wire or the connecting member extends to the periphery of the inner wall of the accommodating portion, and the contact member is disposed at a periphery of the outer wall of the portion where the image pickup device is placed in the accommodating portion.

In the above image capturing module, the receiving portion is a W slot, and the wire or the connecting member extends the inner wall periphery and the bottom edge of the groove, and the contact member is disposed in the image ingestor. The outer and outer edges of the outer wall of the 1⁄2 recessed portion.

In the foregoing image capturing module, the circuit board is a printed circuit board.

In the above image capturing module, a controller is disposed on the circuit board, which is electrically connected to the image picker through the wire and controls image capturing thereof.

In the above image capturing module, the image capturing device is a CMOS lens or a CCD lens.

The aforementioned image capture module is assembled on a computer, a screen of a computer or a mobile phone.

The present invention has significant advantages and benefits compared to the prior art. As can be seen from the above, in order to achieve the above object, the present invention provides an image capturing module, which is mainly composed of a circuit board and an image pickup device, wherein a plurality of wires are disposed on the circuit board, and the circuit board has a capacity. Set The portion is provided for at least a portion of the image ingestor to be electrically connected to the wire when combined. In a preferred embodiment of the present invention, the accommodating portion may be a groove or a through hole for accommodating the image pickup device to different degrees, and the wires on the circuit board may be distributed to the accommodating portion. The periphery of the opening or the periphery of the inner wall, and the image ingestor is correspondingly provided with a contact member for electrically connecting with the wire.

With the above technical solution, the image capturing module of the present invention has at least the following advantages and advantages: The present invention adopts a structure in which a receiving portion is disposed on a circuit board for at least a portion of the image ingestor to be received therein. Therefore, the thickness of the overall image capturing module is greatly reduced. Regardless of the lens size to be selected, the depth of the recess of the receiving portion of the circuit board is designed in advance, or even a perforation is reduced to a certain extent. The thickness allows the image capture module to contribute to thinness and lightness when applied to electronic products such as computers or mobile phones.

In summary, the present invention is an image capture module that can be reduced in overall size to facilitate assembly into a thinner and lighter electronic product. The invention has significant advances in technology and has obvious positive effects, and is a novel, progressive and practical new design.

The above description is merely an overview of the technical solutions of the present invention, and the technical means of the present invention can be more clearly understood, and can be implemented according to the contents of the specification, and the above and other objects, V features and points of the present invention can be made more obvious. In the following, the preferred embodiments are described in detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

1 is a perspective view of a conventional image capturing module.

2A is an exploded perspective view of a first preferred embodiment of the image capture module of the present invention.

Fig. 2B is a cross-sectional view of Fig. 2A.

3 is a cross-sectional view showing a second preferred embodiment of the image pickup module of the present invention.

4 is a cross-sectional view showing a third preferred embodiment of the image pickup module of the present invention.

FIG. 5A is an exploded perspective view of a fourth preferred embodiment of the image capturing module of the present invention.

Figure 5B is a cross-sectional view of Figure 5-8.

Figure 6 is a cross-sectional view showing a fifth preferred embodiment of the image pickup module of the present invention.

10 board 11 : controller

20 Image capture lens 30: Board

31 Guide 3⁄4 32: Housing

33 Controller 40: Image Ingestor

41 Contact The best way to achieve the invention

In order to further explain the technical means and work taken by the present invention for achieving the intended purpose of the invention DETAILED DESCRIPTION OF THE INVENTION The specific embodiments, structures, features and functions of the image capturing module according to the present invention will be described in detail below with reference to the accompanying drawings and preferred embodiments.

^2A and 2B are exploded cross-sectional views showing a first preferred embodiment of the image capturing module of the present invention. The image capture module of the first preferred embodiment of the present invention includes a circuit board 30 and an image capture device 40.

The circuit board 30 is provided with a plurality of wires 31, and the circuit board 30 is provided with an appropriate position and a receiving portion 32;

At least a portion of the image pickup device 40 is disposed in the accommodating portion 32 and electrically connected to the wires 31.

In this embodiment, the accommodating portion 32 of the circuit board 30 is a recess, and the wire 31 is distributed to the periphery of the opening of the groove, and the image pickup 40 is correspondingly provided with a contact member 41, in this embodiment. The middle portion has two arms extending on both sides. When a portion of the image pickup unit 40 is incorporated into the recess, the extension arm thereof will be in contact with the wire 31 extending to the periphery of the opening, and the electrical connection is made. The effect.

In addition, a controller 33 is further disposed on the circuit board 30, which is electrically connected to the image pickup device 40 through the wire 31, and thus controls the image pickup device 40 to take image signals, and digitally processes the image signals and transmits them to the image device. The electronic product used in the image capture module.

Referring to FIG. 3, it is a cross-sectional view of a second preferred embodiment of the image capturing module of the present invention. In the image capturing module of the second preferred embodiment of the present invention, in this example, the wire 31 of the circuit board 30 extends to the periphery of the inner wall of the groove, so that the contact member 41 correspondingly extends to the image of the image pickup device 40 coupled to the groove The outer peripheral wall of the portion of the inner portion is such that they are in contact with each other for electrical connection.

Please refer to FIG. 4, which is a cross-sectional view showing a third preferred embodiment of the image capturing module of the present invention. In the image capturing module of the third preferred embodiment of the present invention, the wire 31 of the circuit board 30 extends to the bottom edge of the groove, so that the contact member 41 has to be correspondingly compared with the second preferred embodiment. Extending to the periphery of the outer wall of the portion of the image ingestor 40 that is bonded to the recess and its bottom edge, such that electrical connection is achieved.

It must be additionally noted that the accommodating portion 32 on the circuit board 30 may be additionally formed at the wire 31, so that the wire 31 may not be distributed to the periphery of the accommodating portion 原 as originally designed. In order to achieve the effect of electrical connection, a connecting member (not shown) may be additionally disposed between the contact member 41 of the image ingestor 40 and the wire 31 to fill the gap between the contact member 41 and the wire 31. The connector can replace the shape of the contact member 41 in the foregoing embodiments. The original contact member 41 can be a solder joint or a contact point. Further, the wire, the contact member 41 and the connector can be selected to be the same. The metal material is made of, for example, gold or copper; in addition, the contact between the wire 31 of the circuit board 30 and the contact 41 of the image pickup 40, or the contact between the wire 31 and the contact member 41 and the connector, It is combined by welding, or it can be combined by tight fitting. Please refer to FIG. ^5A and FIG. 5B, which are exploded and cross-sectional views of a fourth preferred embodiment of the image capturing module of the present invention. The image capturing module of the fourth preferred embodiment of the present invention differs from the first embodiment mainly in that the receiving portion 32 on the circuit board 30 is a perforation in this example, which will make the image ingestor 40 more Deeply buried, the overall thickness of the image capture module is further reduced.

In this example, the wires 31 of the circuit board 30 are also distributed around the periphery of the opening of the perforation, and the contact member 41 of the image ingestor 40 also has two arms extending on both sides, when the image ingestor 40 is bonded to the perforated inner elbow. , the extension arm will be in contact with the wire 31 extending to the periphery of the perforation opening, and the electrical connection is effective. ^:

In addition, a controller 33 is also disposed on the circuit board 30, which is electrically connected to the image pickup device 40 through the wire 31, and has the same function as the controller 33 in the first preferred embodiment. Let me repeat.

Please refer to FIG. 6, which is a cross-sectional view of a fifth preferred embodiment of the image capturing module of the present invention. The image capturing module of the fifth preferred embodiment of the present invention, in this example, the wire 31 of the circuit board 30 extends further to the periphery of the inner wall of the perforation, so that the contact member 41 must also extend correspondingly to the image ingestor 4.0 to be integrated into the perforation. The outer peripheral wall of the portion of the portion is such that they are in contact with each other for electrical connection.

Similarly, in order to ensure the electrical connection between the wire 31 and the contact member 41, a connector can be disposed between the two, and the connector can replace the fourth preferred embodiment and the fifth preferred embodiment. In the example, the shape of the contact member 41, and the original contact member 41 can be changed to retain a solder joint or a contact point; further, the wire 31, the contact member 41 and the connecting member can be selected from the same metal material, for example. gold or copper; Further, the contact between the wire 41 and the speed of the circuit board 30 of the image pickup device ⁴⁰ of the contact member, the contact between the wire 31 and the contact member 41 and the connecting member or may be by soldering The combination may also be combined by a tight fit.

Finally, it must be additionally noted that all of the image ingestors 40 may be a CCD (Carbon Coupled Dev Ice) lens or a CMOS (Complementary Meta l Oxide Semiconductor) lens, and all of the circuit boards 30 may be a printed circuit board (PCB). All of the image capture modules can be implemented on a computer or a mobile phone, for example, on the screen of a notebook or above the screen of a mobile phone.

In summary, the image capturing module of the present invention has an accommodating portion disposed on the circuit board for at least a portion of the image capturing device to be accommodated therein, that is, the image capturing device is originally occupied by the image capturing device. The thickness overlaps with the thickness of the circuit board, so that the thickness of the overall image capturing module is greatly reduced. Regardless of the lens size to be selected, the depth of the recess of the receiving portion of the circuit board is designed in advance, or even formed into a Perforation can reduce the thickness to a certain extent, so that the image capture module can contribute a little to thinness when applied to electronic products such as computers or mobile phones. The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention. The skilled person can make some modifications or modifications to the equivalent embodiments by using the above-disclosed technical contents without departing from the technical scope of the present invention. It is still within the scope of the technical solution of the present invention to make any simple modifications, equivalent changes and modifications to the above embodiments.

Claims

Rights request

1. An image capture module, characterized in that it comprises:

a circuit board having a plurality of wires disposed thereon, and the circuit board has a receiving portion; at least a portion of the image pickup device is disposed in the receiving portion and electrically connected to the wire of the circuit board .

2. The image capture module of claim 1, wherein the receiving portion is a W slot or a through hole.

The image capturing module of claim 1 , wherein the receiving portion has an opening, the wire is distributed to the periphery of the opening, and the periphery of the image receiving device is correspondingly provided with at least one contact. The device is electrically connected to the wire, wherein the wire and the contact member are combined in a welding manner or a tight fit manner, and the wire is passed through a connecting member disposed on a periphery of the opening of the receiving portion. The electrical connection is made to the contact member, wherein the connecting member and the contact member are combined in a welding manner or a tight fit manner.

4. The image capture module of claim 3, wherein the image capture device is provided with at least two arms extending as the contact member for electrical connection with the wire or the connector.

The image capturing module according to claim 3, wherein the wire or the connecting member extends to a periphery of the inner wall of the receiving portion, and the contact member is disposed in the image capturing device. The outer wall of the part of the part.

The image capturing module according to claim 3, wherein the receiving portion is a groove, and the wire or the connecting member extends to a periphery and a bottom edge of the inner wall of the four grooves, and the wire The contact member is a peripheral wall and a bottom edge of the outer wall of the portion where the image pickup device is placed in the recess.

7. The image capture module of claim 1 wherein said circuit board is a printed circuit board. ,

8. The image capture module of claim 1, wherein the circuit board is provided with a controller electrically connected to the image capture device via the wire and controlling image capture.

9. The image capture module of claim 1 wherein said image capture device is a complementary metal oxide semiconductor lens or a charge coupled device lens.

10. The image capture module of claim 1, wherein the image capture module is disposed on a computer, a screen of a computer, or a mobile phone.