WO2010062127A2 - Nanoparticle assembly-based switching device - Google Patents
Nanoparticle assembly-based switching device Download PDFInfo
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- WO2010062127A2 WO2010062127A2 PCT/KR2009/007026 KR2009007026W WO2010062127A2 WO 2010062127 A2 WO2010062127 A2 WO 2010062127A2 KR 2009007026 W KR2009007026 W KR 2009007026W WO 2010062127 A2 WO2010062127 A2 WO 2010062127A2
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- elements
- switching device
- nanoparticles
- transition metal
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- 239000002105 nanoparticle Substances 0.000 title claims abstract description 172
- 230000002441 reversible effect Effects 0.000 claims abstract description 13
- 150000001875 compounds Chemical class 0.000 claims description 43
- 229910052723 transition metal Inorganic materials 0.000 claims description 41
- 229910052751 metal Inorganic materials 0.000 claims description 40
- 230000000694 effects Effects 0.000 claims description 38
- 150000001255 actinides Chemical group 0.000 claims description 37
- 150000002602 lanthanoids Chemical group 0.000 claims description 37
- 239000002184 metal Substances 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 30
- -1 Group 13-15 elements Inorganic materials 0.000 claims description 26
- 239000011258 core-shell material Substances 0.000 claims description 19
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 18
- 239000004094 surface-active agent Substances 0.000 claims description 13
- 238000009966 trimming Methods 0.000 claims description 12
- 229910052799 carbon Inorganic materials 0.000 claims description 11
- 239000002243 precursor Substances 0.000 claims description 11
- 239000003513 alkali Substances 0.000 claims description 9
- 229910052795 boron group element Inorganic materials 0.000 claims description 9
- 229910052796 boron Inorganic materials 0.000 claims description 8
- 229910052800 carbon group element Inorganic materials 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 229910052742 iron Inorganic materials 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 7
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 125000005210 alkyl ammonium group Chemical group 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 229910052748 manganese Inorganic materials 0.000 claims description 6
- 150000002739 metals Chemical class 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 238000000197 pyrolysis Methods 0.000 claims description 6
- 229910052736 halogen Inorganic materials 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 150000001412 amines Chemical class 0.000 claims description 4
- 150000007524 organic acids Chemical group 0.000 claims description 4
- 239000011368 organic material Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 239000012071 phase Substances 0.000 claims description 4
- 239000011541 reaction mixture Substances 0.000 claims description 4
- 238000000527 sonication Methods 0.000 claims description 4
- 229910019142 PO4 Inorganic materials 0.000 claims description 3
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims description 3
- 150000008051 alkyl sulfates Chemical class 0.000 claims description 3
- 229910052787 antimony Inorganic materials 0.000 claims description 3
- 229910052785 arsenic Inorganic materials 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 239000010452 phosphate Substances 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 229910052699 polonium Inorganic materials 0.000 claims description 3
- 229910052711 selenium Inorganic materials 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- 229910052714 tellurium Inorganic materials 0.000 claims description 3
- 150000003624 transition metals Chemical class 0.000 claims description 3
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 claims description 3
- ZMBHCYHQLYEYDV-UHFFFAOYSA-N trioctylphosphine oxide Chemical compound CCCCCCCCP(=O)(CCCCCCCC)CCCCCCCC ZMBHCYHQLYEYDV-UHFFFAOYSA-N 0.000 claims description 3
- 239000004215 Carbon black (E152) Substances 0.000 claims description 2
- 229910052783 alkali metal Inorganic materials 0.000 claims description 2
- 150000001340 alkali metals Chemical class 0.000 claims description 2
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 claims description 2
- 210000001787 dendrite Anatomy 0.000 claims description 2
- 238000001704 evaporation Methods 0.000 claims description 2
- 230000008020 evaporation Effects 0.000 claims description 2
- 229910052733 gallium Inorganic materials 0.000 claims description 2
- 229910052732 germanium Inorganic materials 0.000 claims description 2
- 150000004820 halides Chemical class 0.000 claims description 2
- 229930195733 hydrocarbon Natural products 0.000 claims description 2
- 150000002430 hydrocarbons Chemical class 0.000 claims description 2
- 229910052745 lead Inorganic materials 0.000 claims description 2
- 239000007791 liquid phase Substances 0.000 claims description 2
- 230000035484 reaction time Effects 0.000 claims description 2
- 238000001338 self-assembly Methods 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 229910052716 thallium Inorganic materials 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 125000001033 ether group Chemical group 0.000 claims 1
- 238000000429 assembly Methods 0.000 abstract description 30
- 230000000712 assembly Effects 0.000 abstract description 30
- 239000000203 mixture Substances 0.000 abstract description 13
- 238000002360 preparation method Methods 0.000 abstract description 9
- 239000000126 substance Substances 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- SZVJSHCCFOBDDC-UHFFFAOYSA-N ferrosoferric oxide Chemical compound O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 78
- 230000006399 behavior Effects 0.000 description 33
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 28
- 229910002518 CoFe2O4 Inorganic materials 0.000 description 20
- 229910017163 MnFe2O4 Inorganic materials 0.000 description 15
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 12
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 11
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 10
- QGLWBTPVKHMVHM-KTKRTIGZSA-N (z)-octadec-9-en-1-amine Chemical compound CCCCCCCC\C=C/CCCCCCCCN QGLWBTPVKHMVHM-KTKRTIGZSA-N 0.000 description 10
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 10
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 10
- 239000005642 Oleic acid Substances 0.000 description 10
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 10
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 10
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 10
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid group Chemical group C(CCCCCCC\C=C/CCCCCCCC)(=O)O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 10
- 239000008188 pellet Substances 0.000 description 10
- 230000036962 time dependent Effects 0.000 description 10
- 239000011572 manganese Substances 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 229910003264 NiFe2O4 Inorganic materials 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- NQNBVCBUOCNRFZ-UHFFFAOYSA-N nickel ferrite Chemical compound [Ni]=O.O=[Fe]O[Fe]=O NQNBVCBUOCNRFZ-UHFFFAOYSA-N 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 229910000708 MFe2O4 Inorganic materials 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000003917 TEM image Methods 0.000 description 5
- 230000001419 dependent effect Effects 0.000 description 5
- 230000015654 memory Effects 0.000 description 5
- XTAZYLNFDRKIHJ-UHFFFAOYSA-N n,n-dioctyloctan-1-amine Chemical compound CCCCCCCCN(CCCCCCCC)CCCCCCCC XTAZYLNFDRKIHJ-UHFFFAOYSA-N 0.000 description 5
- 239000002086 nanomaterial Substances 0.000 description 5
- 239000000523 sample Substances 0.000 description 5
- NDJKXXJCMXVBJW-UHFFFAOYSA-N Heptadecane Natural products CCCCCCCCCCCCCCCCC NDJKXXJCMXVBJW-UHFFFAOYSA-N 0.000 description 4
- 238000002441 X-ray diffraction Methods 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 239000002800 charge carrier Substances 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 4
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 4
- 238000004626 scanning electron microscopy Methods 0.000 description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 238000004627 transmission electron microscopy Methods 0.000 description 4
- 230000005641 tunneling Effects 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 238000002173 high-resolution transmission electron microscopy Methods 0.000 description 3
- LZKLAOYSENRNKR-LNTINUHCSA-N iron;(z)-4-oxoniumylidenepent-2-en-2-olate Chemical compound [Fe].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O LZKLAOYSENRNKR-LNTINUHCSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 230000037230 mobility Effects 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000002798 polar solvent Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 239000004408 titanium dioxide Substances 0.000 description 3
- FJLUATLTXUNBOT-UHFFFAOYSA-N 1-Hexadecylamine Chemical compound CCCCCCCCCCCCCCCCN FJLUATLTXUNBOT-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910052695 Americium Inorganic materials 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- 229910052692 Dysprosium Inorganic materials 0.000 description 2
- 229910052691 Erbium Inorganic materials 0.000 description 2
- 229910052693 Europium Inorganic materials 0.000 description 2
- 229910052688 Gadolinium Inorganic materials 0.000 description 2
- 229910052689 Holmium Inorganic materials 0.000 description 2
- 239000005639 Lauric acid Substances 0.000 description 2
- 229910052766 Lawrencium Inorganic materials 0.000 description 2
- 229910052764 Mendelevium Inorganic materials 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 229910052779 Neodymium Inorganic materials 0.000 description 2
- 229910052781 Neptunium Inorganic materials 0.000 description 2
- 235000021314 Palmitic acid Nutrition 0.000 description 2
- 229910052778 Plutonium Inorganic materials 0.000 description 2
- 229910052777 Praseodymium Inorganic materials 0.000 description 2
- 229910052774 Proactinium Inorganic materials 0.000 description 2
- 229910052772 Samarium Inorganic materials 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- 229910052771 Terbium Inorganic materials 0.000 description 2
- 229910052776 Thorium Inorganic materials 0.000 description 2
- 229910052775 Thulium Inorganic materials 0.000 description 2
- 229910052770 Uranium Inorganic materials 0.000 description 2
- 229910052769 Ytterbium Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000011162 core material Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- LAWOZCWGWDVVSG-UHFFFAOYSA-N dioctylamine Chemical compound CCCCCCCCNCCCCCCCC LAWOZCWGWDVVSG-UHFFFAOYSA-N 0.000 description 2
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- DCAYPVUWAIABOU-UHFFFAOYSA-N hexadecane Chemical compound CCCCCCCCCCCCCCCC DCAYPVUWAIABOU-UHFFFAOYSA-N 0.000 description 2
- ORTRWBYBJVGVQC-UHFFFAOYSA-N hexadecane-1-thiol Chemical compound CCCCCCCCCCCCCCCCS ORTRWBYBJVGVQC-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000003446 ligand Substances 0.000 description 2
- 239000002069 magnetite nanoparticle Substances 0.000 description 2
- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 2
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 2
- RZJRJXONCZWCBN-UHFFFAOYSA-N octadecane Chemical compound CCCCCCCCCCCCCCCCCC RZJRJXONCZWCBN-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- 239000013110 organic ligand Substances 0.000 description 2
- 150000002902 organometallic compounds Chemical class 0.000 description 2
- 239000011941 photocatalyst Substances 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910001930 tungsten oxide Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 1
- NKJOXAZJBOMXID-UHFFFAOYSA-N 1,1'-Oxybisoctane Chemical group CCCCCCCCOCCCCCCCC NKJOXAZJBOMXID-UHFFFAOYSA-N 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
- 229910052765 Lutetium Inorganic materials 0.000 description 1
- 229910021380 Manganese Chloride Inorganic materials 0.000 description 1
- GLFNIEUTAYBVOC-UHFFFAOYSA-L Manganese chloride Chemical compound Cl[Mn]Cl GLFNIEUTAYBVOC-UHFFFAOYSA-L 0.000 description 1
- XOJVVFBFDXDTEG-UHFFFAOYSA-N Norphytane Natural products CC(C)CCCC(C)CCCC(C)CCCC(C)C XOJVVFBFDXDTEG-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- YOUIDGQAIILFBW-UHFFFAOYSA-J Tungsten(IV) chloride Inorganic materials Cl[W](Cl)(Cl)Cl YOUIDGQAIILFBW-UHFFFAOYSA-J 0.000 description 1
- 229910052768 actinide Inorganic materials 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000006477 desulfuration reaction Methods 0.000 description 1
- 230000023556 desulfurization Effects 0.000 description 1
- MHDVGSVTJDSBDK-UHFFFAOYSA-N dibenzyl ether Chemical compound C=1C=CC=CC=1COCC1=CC=CC=C1 MHDVGSVTJDSBDK-UHFFFAOYSA-N 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000833 heterodimer Substances 0.000 description 1
- 238000002017 high-resolution X-ray diffraction Methods 0.000 description 1
- 238000000024 high-resolution transmission electron micrograph Methods 0.000 description 1
- 239000012216 imaging agent Substances 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000002595 magnetic resonance imaging Methods 0.000 description 1
- 229940099607 manganese chloride Drugs 0.000 description 1
- 235000002867 manganese chloride Nutrition 0.000 description 1
- 239000011565 manganese chloride Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910001960 metal nitrate Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229940031182 nanoparticles iron oxide Drugs 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 229940038384 octadecane Drugs 0.000 description 1
- FTMKAMVLFVRZQX-UHFFFAOYSA-N octadecylphosphonic acid Chemical compound CCCCCCCCCCCCCCCCCCP(O)(O)=O FTMKAMVLFVRZQX-UHFFFAOYSA-N 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000001935 peptisation Methods 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- BGRYSGVIVVUJHH-UHFFFAOYSA-N prop-2-ynyl propanoate Chemical compound CCC(=O)OCC#C BGRYSGVIVVUJHH-UHFFFAOYSA-N 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000011257 shell material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002594 sorbent Substances 0.000 description 1
- 238000002798 spectrophotometry method Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229940114926 stearate Drugs 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- MDDUHVRJJAFRAU-YZNNVMRBSA-N tert-butyl-[(1r,3s,5z)-3-[tert-butyl(dimethyl)silyl]oxy-5-(2-diphenylphosphorylethylidene)-4-methylidenecyclohexyl]oxy-dimethylsilane Chemical compound C1[C@@H](O[Si](C)(C)C(C)(C)C)C[C@H](O[Si](C)(C)C(C)(C)C)C(=C)\C1=C/CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MDDUHVRJJAFRAU-YZNNVMRBSA-N 0.000 description 1
- BVQJQTMSTANITJ-UHFFFAOYSA-N tetradecylphosphonic acid Chemical compound CCCCCCCCCCCCCCP(O)(O)=O BVQJQTMSTANITJ-UHFFFAOYSA-N 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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Definitions
- the present invention relates to a switching device comprising a nanoparticle assembly fabricated by using nanoparticles and a preparation method thereof.
- Williams et a/ were the first to demonstrate the realization of a memristor composed of a thin (5 nm) titanium dioxide film between Pt electrodes(2). The device uses neither magnetic flux, as the theoretical memristor model suggests, nor does it store charges, like a capacitor does. Instead the new memristor was found to achieve a resistance that is dependent on a time-varying current by using a chemical mechanism.
- memristic systems are limited to thin film devices or if they can be comprised of different kinds of nanostructured systems including nanoparticles.
- the present inventors have made intensive researches to develop a switching device comprising a nanoparticle assembly with reversible switching effects in a reproducible manner.
- Fig. 1 schematically represents a four probe configuration for measuring current induced switching effects of nanoparticle assemblies.
- Hg. 2 represents procedures for preparing the switching device of the present invention.
- Hg. 3 shows TEM (Transmission Electron Microscopy) images of nanoparticles for switching devices prepared by pyrolysis.
- a-d 7 nm, 9 nm, 12 nm and 15 nm MnFe 2 O 4 nanoparticles
- e-h 7 nm, 9 nm, 12 nm and 15 nm Fe 3 O 4 nanoparticles
- i-l 7 nm, 9 nm, 12 nm and 15 nm Fe 3 O 4 nanoparticles
- Hg. 4 shows a High-resolution (HR) TEM image and X-ray diffraction (XRD) analysis of 12 nm Fe 3 O 4 nanoparticles. a) HR-TEM image; and b) XRD patterns of 12 nm Fe 3 O 4 nanoparticles.
- the HR-TEM image shows that Fe 3 O 4 nanoparticles have single crystallinity.
- Fe 3 O 4 nanoparticles black line
- have well matched XRD patterns to bulk Fe 3 O 4 red line).
- Figs. 6a-6b is TEM images of nanoparticles having heterostructures (core- shell) for switching devices, a) CoFe 2 O 4 (S ) Fe 3 O 4 , b) CoFe 2 O 4 @ N JFe 2 O 4 , c) CoFe 2 O 4 @MnFe 2 O 4 , d) CoFe 2 O 4 @Zn 0 . 4 Mn 0 . 6 Fe 2 O 4 , e) CoFe 2 0 4 @Zn o . 4 Fe 2 .
- Hg. 7 shows TEM images of nanoparticles having one-dimensional structure for switching devices, a) TiO 2 , b) Wi 8 O 49 , and c) Mn 3 O 4 .
- TMAOH tetramethylammonium hydroxide
- Fig. 9 represents a SEM (scanning electron microscopy) image (a) and a photograph (b) of the 7 nm Fe 3 O 4 nanopartide assembly pellet formed by pressing.
- Fig. 10 represents results of the current induced switching (CIS) effect analysis of the Fe 3 O 4 nanopartide assembly not surface-trimmed.
- the nanopartide assembly containing 15 nm or 12 nm Fe 3 O 4 nanoparticles not surface-trimmed shows no the current induced hysteric (switching) behavior.
- Fig. 12 shows V-I characteristics (CIS effect) measured for 12nm Fe 3 O 4 nanopartide assemblies.
- Fe 3 O 4 nanoparticles represented the switching effect at room temperature and those with 15 nm Fe 3 O 4 nanoparticles at 200 K.
- Fig. 14 represents temperature-dependent resistivity of 15 nm, 12 nm and 9 nm Fe 3 O 4 nanopartide assemblies. It is observed that p increases with decreasing T
- Rg. 15 represents V-I characteristics (CIS effect) measured for 12 nm MnFe 2 O 4 , 7 nm CoFe 2 O 4 and 7 nm NiFe 2 O 4 nanopartide assemblies.
- the nanopartide assemblies containing 12 nm MnFe 2 O 4 , 7 nm CoFe 2 O 4 and 7 nm NiFe 2 O 4 exhibited current induced switching effects at 220 K, 265 K and 270 K, respectively.
- Fig. 16 represents V-I characteristics (CIS effect) measured for heterostructured (core-shell) napopartide assemblies.
- the heterostructured (core- shell structure) 12 nm CoFe 2 O 4 (S ) Fe 3 O 4 , 12 nm CoFe 2 O 4 @ Mn Fe 2 O 4 and 12 nm CoFe 2 O 4 (S ) NiFe 2 O 4 were analyzed to show current induced switching effects at 240 K, 235 K and 175 K, respectively.
- Fig. 17 represents V-I characteristics (CIS effect) measured for Fe 3 O 4 nanopartide assemblies with applying external magnetic field (7 kG). It could be appreciated on the basis of these results that controlling the strength and direction of external magnetic field may permit to control resistivity and current at which a switching behavior occurs.
- Fig. 18 represents simulation of a memristive device which has both time- dependent resistance (/?) and capacitance (Q.
- the shaded areas indicate the low resistance state (R 0N ) of the device when the charge saturation is established, labeled 1 and 4.
- the voltage remains almost constant while the current varies in a sinusoidal manner during that process.
- the other areas (labeled 3 and 6) are related to the high resistance state (R OFF ) during the refresh charge process,
- Numbers of 1-6 are corresponding each other through out figures 18a, 18b, and 18c.
- the hysteresis loop is perfectly symmetric when q 0 is zero.
- switching device which comprises a nanoparticle assembly containing a plurality of nanoparticles.
- switching device means a device exhibiting a switching effect (behavior) by applying a current, voltage or magnetic field.
- the switching device has a R 0N (resistance at ON state) or R 0FF (a resistance at OFF state) state at certain current or voltage value.
- the present switching device exhibits a reversible switching behavior by applying current of less than 1 A, more preferably less than 1 mA, still more preferably less than 100 nA.
- the present switching device exhibits a reversible switching behavior by applying current of 1 A-IOO nA.
- the present switching device has a R OFF /R ON value of more than 1, more preferably more than 5 and still more preferably more than 10, most preferably more than 20. Specifically, the present switching device has a R OFF /R ON value of 5-30. In considering time-dependent changes, the R OFF /R ON value of the present switching device is much more meaningful, as indicated in Further Discussion.
- the reversible switching behavior of the present switching device may be shown at a wide range of temperature.
- the temperature at which the reversible switching behavior is exhibited may be controlled by controlling either the size or the composition of nanoparticles embodied in the switching device.
- the reversible switching behavior of the switching device is exhibited at room temperature (25 0 C) ⁇ 250 0 C, more preferably at room temperature ⁇ 100 0 C, still more preferably at room temperature ⁇ 50 0 C, most preferably at room temperature.
- room temperature 25 0 C
- room temperature ⁇ 100 0 C room temperature
- room temperature ⁇ 50 0 C room temperature
- the nanoparticle assembly is constructed by aggregation or arrangement of nanoparticles.
- the nanoparticles are not needed to be arranged with a specific distance (space).
- the nanoparticles are required to be arranged with a space as close as for allowing current flow.
- the nanoparticle assembly has a plurality of nanoparticles that are arranged with a space of no more than 10 nm, more preferably no more than 5 nm, most preferably no more than 2 nm.
- the nanoparticles useful in the present switching device are chalcogen-type compounds, pnicogen-type compounds, carbon Group-type compounds, boron Group-type compounds, metals, alloys or multi-component hybrid structured nanoparticles thereof.
- the chalcogen-type compound is M a x A z , M a x M b y A z
- M a is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 13 elements, Group 14 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements
- M b is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 13-15 elements, Group 17 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements
- A is one or more elements selected from the group consisting of O, S, Se, Te and Po; 0 ⁇ x ⁇ 16, 0 ⁇ y ⁇ 16, 0 ⁇ z ⁇ 8), or a multi-component hybrid structure thereof.
- the chalcogen-type compound is M a x A z , M a x M b y A z
- M a is one or more elements selected from the group consisting of transition metal elements, Lanthanide Group elements and Actinide Group elements
- M b is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 13-15 elements, Group 17 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements
- A is one or more elements selected from the group consisting of O, S, Se, Te and Po; 0 ⁇ x ⁇ 16, 0 ⁇ y ⁇ 16, 0 ⁇ z ⁇ 8), or a multi-component hybrid structure thereof.
- the pnicogen-type compound is M C X A 2 , M c x M d y A z
- M c is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 13 elements, Group 14 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements
- M d is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 13-14 elements, Group 16-17 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements
- A is one or more elements selected from the group consisting of N, P, As, Sb and Bi; 0 ⁇ x ⁇ 24, 0 ⁇ y ⁇ 24, 0 ⁇ z ⁇ 8), or a multi-component hybrid structure thereof.
- the pnicogen-type compound is M C X A 2 , M c x M d y A z
- M c is one or more elements selected from the group consisting of transition metal elements, Lanthanide Group elements and Actinide Group elements
- M d is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 13-14 elements, Group 16-17 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements
- A is one or more elements selected from the group consisting of N, P, As, Sb and Bi; 0 ⁇ x ⁇ 24, 0 ⁇ y ⁇ 24, 0 ⁇ z ⁇ 8), or a multi-component hybrid structure thereof.
- the carbon Group-type compound is M e x A z , M e x M f y A z
- M e is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 13 elements, Group 14 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements
- M f is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 13 elements, Group 15-17 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements
- A is one or more elements selected from the group consisting of C, Si, Ge, Sn and Pb; 0 ⁇ x ⁇ 32, 0 ⁇ y ⁇ 32, 0 ⁇ z ⁇ 8), or a multi-component hybrid structure thereof.
- the boron Group-type compound is M 9 X A Z , M 9 x M h y A z
- M 3 is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 13 elements, Group 14 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements
- M h is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 14-17 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements
- A is one or more elements selected from the group consisting of B, Al, Ga, In and Tl; 0 ⁇ x ⁇ 40, 0 ⁇ y ⁇ 40, 0 ⁇ z ⁇ 8), or a multi-component hybrid structure thereof.
- the metal for nanoparticles is alkali metal, alkaline earth metal, transition metal, Lanthanide Group metal and Actinide Group metal or a multi-component hybrid structure thereof. More preferably, the metal is transition metal (Ti, V, Cr, Mn, Fe, Co, Ni, Cu, or Ru), Lanthanide Group metal (Ce, Pr, Nd, Pm, Sm, Gd, Eu, Tb, Dy, Ho, Er, Tm, Yb, or Lu), Actinide Group metal (Th, Pa, U, Np, Pu, Am, Dm, Bk, Cf, Es, Fm, Md, No or Lr) or a multi- component hybrid structure thereof. According to a preferred embodiment, the alloy for nanoparticles is M e x M f y ,
- M e is one or more elements selected from the group consisting of transition metal elements, Lanthanide Group elements and Actinide Group elements
- M f and M 9 are one or more elements selected from the group consisting of Group 1 metal elements, Group 2 metal elements, Group 13-17 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements; 0 ⁇ x ⁇ 20, 0 ⁇ y ⁇ 20, 0 ⁇ z ⁇ 20), or a multi-component hybrid structure thereof.
- the alloy for nanoparticles is M e x M f y , M e x M f y M 9 z
- M e is one or more elements selected from the group consisting of transition metal elements (Ba, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Zr, Te, W, Pd, Ag, Pt and Au), Lanthanide Group elements (Ce, Pr, Nd, Pm, Sm, Gd, Eu, Tb, Dy, Ho, Er, Tm, Yb, and Lu) and Actinide Group elements (Th, Pa, U, Np, Pu, Am, Dm, Bk, Cf, Es, Fm, Md, No, and Lr); M f and M 9 are one or more elements selected from the group consisting of Group 1 metal elements, Group 2 metal elements, Group 13-17 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements; 0 ⁇ x ⁇ 20, 0 ⁇ y ⁇ 20, 0 ⁇ z ⁇ 20
- the nanoparticles for the switching device are M a x O z , M a x M b y O z
- M a is one or more elements selected from the group consisting of transition metal elements, Lanthanide Group elements and Actinide Group elements
- M b is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 13-15 elements, Group 17 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements; 0 ⁇ x ⁇ 16, 0 ⁇ y ⁇ 16, 0 ⁇ z ⁇ 8), or a multi-component hybrid structure thereof; most preferably M x Fe y O z (M is one or more transition metal elements selected from the group consisting of Zn, Mn, Fe, Co and Ni; 0 ⁇ x ⁇ 8, 0 ⁇ y ⁇ 8, 0 ⁇ z ⁇ 8), Zn w M x Fe y O z (M is one or more transition metal elements selected from the group consisting of Zn, Mn, Fe, Co and Ni; 0 ⁇ w ⁇ 8,
- the multi-component hybrid structure for the switching device comprises at least two materials selected from the group consisting of chalcogen-type compounds, pnicogen-type compounds, carbon Group-type compounds, boron Group-type compounds, metals and alloys.
- the multi-component hybrid structure comprises at least one material selected from the group consisting of chalcogen-type compounds, pnicogen-type compounds, carbon Group-type compounds, boron Group-type compounds, metals and alloys, and other materials.
- the form of the multi-component hybrid structure may be core-shell, core-multi shell, heterodimer, trimer, multimer, bar code or co-axial rod, but not limited to.
- the multi- component hybrid structure comprises at least one of chalcogen-type compounds or pnicogen-type compounds.
- the nanoparticle for the switching device is at least one of metals having an oxidation number of no less than 1.
- the nanoparticle is in a size of 1-1000 nm, more preferably 2-500 nm, still more preferably 5-50 nm.
- the nanoparticle for the switching device may be in any form.
- the nanoparticle has (i) a zero-dimensional structure selected from the group consisting of a sphere, a core-shell and a multi-core shell structure; (ii) a one-dimensional structure selected from the group consisting of a rod, a barcode, a core-shell coaxial rod and a multi-core shell coaxial rod structure; (iii) a two-dimensional structure selected from the group consisting of a sheet, a layer and a multi-component sheet structure; or (iv) a three-dimensional structure selected from the group consisting of a branched structure, a dendrite structure, a dumbbell and a multi-pod structure.
- the nanoparticle has a surface trimmed to remove organic materials attached thereon.
- the switching device of the present invention may be used to a wide variety of applications, for example, DRAM (Dynamic Random Access Memory), EEPROM (Electrically Erasable Programmable Read-only Memory), SRAM (Static Random Access Memory), PRAM (Phase change Random Access Memory), RRAM (Resistance Random Access Memory), MRAM (Magnetoresistive Random Access Memory), FRAM(Ferroelectric Random Access Memory), CBRAM (Conductive Bridging Random Access Memory), memristor and spintronics devices. Most preferably, the switching device of the present invention is a memristor.
- a method for preparing a switching device which comprises the steps of: (a) preparing nanoparticles; (b) forming a nanoparticle assembly using the nanoparticles; and (c) connecting to the nanoparticle assembly a means for applying a current, voltage or magnetic field.
- the step (a) for preparing nanoparticles is carried out in a gas phase or a liquid phase (e.g., aqueous solution, organic solvent and multi-solution system), more preferably organic solvent.
- reaction mixture containing a metal precursor and a surfactant or a surfactant-containing solvent are prepared and subjected to pyrolysis at 50-600 0 C.
- the metal precursor includes any metal precursor known to one of skill in the art, preferably a metal precursor having oxidation number of more than 0.
- the metal precursor comprises at least one metal element selected from the group consisting of transition metal elements, Lanthanide Group elements, Actinide
- Group elements and Group 13-14 elements preferably a metal nitrate-based compound, a metal sulfate-based compound, a metal fluoroacetoacetate-based compound, a metal acetylacetonate, a metal halide-based compound (MX a , where M is at least one selected from the group consisting of transition metal elements, Lanthanide Group elements, Actinide Group elements and Group 13-14 elements; X
- a metal perchlorate-based compound F, Cl, Br, or I, and 0 ⁇ a ⁇ 5), a metal perchlorate-based compound, a metal sulfamate-based compound, a metal carboxylate, a metal stea rate-based compound, an organometallic compound, or a multi-component hybrid structure thereof.
- the organometallic compound is M x L y (M is at least one selected from the group consisting of transition metal elements, Lanthanide Group elements, Actinide Group elements and Group 13-14 elements; L is at least one ligand to coordinate with metals; 0 ⁇ x ⁇ 10, 0 ⁇ y ⁇ 120), or a multi-component hybrid structure thereof.
- the surfactant useful in the synthesis of the nanoparticle is an organic acid, an organic amine, alkane thiol, phosphonic acid, trioctylphosphine oxide, tributyl phosphine, alkyl phosphate, alkyl sulfate or tetraalkylammonium halide.
- the surfactant is oleic acid, lauric acid, stearic acid, mysteric acid, hexadecanoic acid, oleyl amine, lauryl amine, trioctyl amine, dioctyl amine, hexadecyl amine, dodecane thiol, hexadecane thiol, heptadecane thiol, tetradecyl phosphonic acid, octadecyl phosphonic acid or trioctylphosphine oxide.
- the solvent useful in the synthesis of the nanoparticle is an ether-based compound, hydrocarbon, organic acid, organic amine, alkane thiol, phosphonic acid, alkyl phosphine oxide, tributyl phosphine, alkyl sulfate, alkyl phosphate or tetraalkyl ammonium halide.
- the solvent is octyl ether, benzyl ether, phenyl ether, hexadecane, heptadecane, octadecane, oleic acid, lauric acid, stearic acid, mysteric acid, hexadecanoic acid, oleyl amine, trioctyl amine, dioctyl amine, hexadecyl amine, dodecane thiol hexadecane thiol or heptadecane thiol.
- the size of the nanoparticles is controlled by adjusting a concentration of the surfactant, an amount of the solvent, a reaction temperature or a reaction time.
- the surfactant and the solvent are introduced into the reaction mixture in the amount 1-100 fold higher than the metal precursor.
- the step (a) is performed with no use of oxidants or reductants.
- the nanoparticles synthesized may be applicable to various fields such as magnetic resonance imaging agents and data storage (iron oxide nanoparticles), photocatalyst and sensor (titanium oxide nanoparticles), photocatalyst and desulfurization sorbents (tungsten oxide nanoparticles) and ceramic condenser electrode, chemical catalyst and soft magnet (manganese oxide nanoparticles).
- the nanoparticles synthesized in step (a) may be further surface-treated to improve their switching effects.
- the surface treatment includes a removal of organic ligands (e.g., surfactants) on the surface of nanoparticles (i.e., trimming the surface of nanoparticles) or an additional coating.
- the preferable surface treatment is to treat with an alkali solution to remove surfactants on the surface of nanoparticles.
- the alkali solution for the surface treatment includes a alkali compound selected from the group consisting of alkylammonium, alkylammonium hydroxide, alkylammonium halide, alkylphosphine, alkylphosphine hydroxide and alkylphosphine halide [wherein alkyl is C n H 2n+I (0 ⁇ n ⁇ 5)], more preferably alkylammonium and alkylammonium hydroxide, still more preferably tetramethylammonium hydroxide and tetraethylammonium hydroxide.
- the alkali compound may be used in a polar solvent such as alcohols, dimethyl sulfoxide, dimethyl formamide and water.
- a polar solvent such as alcohols, dimethyl sulfoxide, dimethyl formamide and water.
- the most preferable polar solvent is alcohols.
- the alkali compound may be dissolved in the polar solvent with a concentration of 0.001-10 M, preferably 0.1-5 M.
- the method further comprises the step of (a ⁇ trimming a surface of nanoparticles to remove organic materials attached thereon, such that a switching effect of the switching device is enhanced. More preferably, the trimming is carried out in the presence of an alkali solution. Most preferably, the trimming is carried out by sonication.
- the formation of the nanoparticle assembly in the step (b) is carried out by pressing, LB (Langmuir Blodgett), LBL (layer by layer), print, self-assembly or solution evaporation.
- the nanoparticles are assembled under pressure not to induce deformation of the nanoparticles.
- the formation of the nanoparticle assembly is carried out by pressing under a pressure of more than 100 Pa, still more preferably 140-180 Pa.
- the period of time for pressing is not specifically limited; preferably more than 1 min, more preferably more than 5 min.
- the nanoparticle assembly is connected to a means for applying a current, voltage or magnetic field. It is noteworthy that the switching device requires no electrodes. Examples of means for applying a current and/or voltage include a power supply known to one of skill in the art. Examples of means for applying magnetic field include electromagnetic devices known to one of skill in the art.
- the method of the switching device provides a large number of passages for electric flow by increasing the contact surface area between nanoparticles with no influence on electrical characteristics of nanoparticle surface via nanoparticle assembly (e.g., peptization).
- the switching device prepared by the present invention shows a dramatically enhanced switching behavior (specifically, reversible switching behavior).
- the present invention ensures the mass production of switching devices (e.g., memristor) by use of nanoparticles that exhibits reversible switching behavior at current of less than mA and at room temperature ⁇ 250°C in a more convenient and economical manner.
- the present invention enables realization of memories with no requirement of electricity and computer booting. Predictions of the high potential of memristors based on nanoparticle assemblies are supported by the tremendous versatility to tune the electrical behavior of nanoparticles by controlling their nanoscale characteristics such as size, composition, dimension, surface area, and chemical potential, as demonstrated in Examples.
- the present invention will now be described in further detail by examples. It would be obvious to those skilled in the art that these examples are intended to be more concretely illustrative and the scope of the present invention as set forth in the appended claims is not limited to or by the examples.
- M Mn 2+ , Fe 2+ , Co 2+ , Ni 2+
- the isolated nanoparticles were observed to have a sphere shape with a homogeneous size of 7 nm.
- the size of nanoparticles was further controlled by employing varying growth conditions including the amount of reactants (e.g., oleic acid and oleylamine).
- the size of Fe 3 O 4 nanoparticles was tuned from 7-15 nm by varying the ratio of oleic acid and oleylamine.
- the characteristics of nanoparticles were analyzed by transmission electron microscopy (TEM), high-resolution transmission electron microscopy and x-ray diffraction. As shown in Figs.
- nanoparticle precipitate was resuspended in toluene, yielding a colloidal solution.
- MCI 2 Mn 2+ , Fe 2+ , Co 2+ , Ni 2+
- the nanoparticles synthesized were analyzed to have a sphere shape with well-controlled size monodispersity as represented in TEM images of Fig. 5.
- Metal oxides-containing nanoparticles with heterostructure (15 nm sized core- shell ferrite) were prepared by a seed-medicated growth method according to previously reported methods described in Korean Pat. No. 0604975 and PCT/KR2004/003088 filed by the present inventors.
- the core materials with a size of 7 nm were synthesized as procedures described in .Example 1 and heterostructured core-shell nanomaterials with a size of 15 nm were then synthesized using them.
- the nanomaterials synthesized have core-shell structure with a size of 15 nm.
- the isolation of nanomaterials was performed as Example 1.
- a variety of nanomaterials with core-shell typed heterostructure were yielded by varying compositions of metal precursors.
- CoFe 2 O 4 @ Fe 3 O 4 CoFe 2 O 4 @MnFe 2 O 4
- Metal oxide nanoparticles were synthesized according to previously reported methods described in Korean Pat. No. 0604975 and PCT/KR2004/003088 filed by the present inventors.
- 0.5 mmole of titanium tetrachloride (Aldrich, USA) was mixed with 0.28 g of oleic acid and 1.7 g of oleylamine and allowed to undergo pyrolysis for 2 min at 290 0 C, finally yielding titanium oxide (TiO 2 ) nanoparticles.
- tungsten tetrachloride (Aldrich, USA) was mixed with 1.63 g of oleic acid and 0.54 g of oleylamine and allowed to undergo pyrolysis for 1 hr at 350 0 C, giving tungsten oxide (Wi 8 O 49 ) nanoparticles.
- 0.1 mmole of manganese chloride (Aldrich, USA) was mixed with 0.15 g of oleic acid and 1.94 g of oleylamine and allowed to undergo pyrolysis for 1 hr at 350 0 C, giving manganese oxide (Mn 3 O 4 ) nanoparticles.
- the isolation of nanoparticles was carried out as Example 1.
- the TEM images of TiO 2 , Wi 8 O 49 and Mn 3 O 4 were shown in Rg. 7.
- nanoparticles for switching devices prepared in Examples 1-4 were trimmed.
- Organic ligands on the nanoparticles were removed by sonication in 1 M tetramethylammonium hydroxide (TMAOH) in butanol. After 15 min sonication in TMAOH solution, the nanoparticles were isolated by centrifugation and washed sequentially with hexane, acetone, and ethanol. Isolated nanoparticles were dried under vacuum at room temperature before nanoparticle assembly pellet preparation.
- the surface-trimmed nanoparticles were analyzed by Infrared Radiation (IR) spectrophotometry.
- IR Infrared Radiation
- EXAMPLE 6 Nanoparticle assembly pellet preparation and measurement of current induced switching (CIS) effect
- the nanoparticle assemblies in the form of the compact pellets (0.5 ⁇ l ⁇ 4 mm) were produced using the surface-trimmed nanoparticles by cold-pressing in a die under 160 Pa for 15 min. In order to avoid alteration of the surface properties of the nanoparticles, no heat-treatment step was used in the preparation of the pellets.
- the shape of the nanoparticle assembly pellets was rectangular: 4 mm long, 1 mm wide and 0.5 mm thick. Their SEM (scanning electron microscopy) image and photographs are shown in Hg. 9.
- the current induced switching (CIS) effect of the nanoparticle assembly pellets was measured using the circuit shown in Fig. 1.
- the electrical characteristics were measured by the conventional four-probe configuration with a Keithley 2182 nanovoltmeter and a Keithley 6220 current source. An electrode (for current injection) was made at each end of the pellet (using indium contact) so that current flow was as uniform as possible. The voltage drop across the sample was observed using two other electrodes attached to the surface.
- the current induced switching (CIS) effect of the Fe 3 O 4 nanoparticle assembly not surface-trimmed was measured at different temperatures.
- the Fe 3 CX ? nanoparticles not surface-trimmed were revealed to show no switching effect in all temperature conditions and to show a typical tunneling conductance behavior.
- Fig. 10 represents that the nanoparticle assembly containing 15 nm or 12 nm Fe 3 O 4 nanoparticles not surface-trimmed shows no the current induced hysteric (switching) behavior.
- EXAMPLE 8 Current induced switching effect of nanoparticle assembly surface-trimmed
- the current induced switching (CIS) effect of nanoparticle assemblies fabricated with surface-trimmed Fe 3 O 4 nanoparticles in a 7-nm size was analyzed.
- D diameter
- RT room temperature
- the bistable V-I characteristics, observed in the sample of D 7 nm, illustrate that the switching properties are directly related to the existence of hysteretic behavior as the current is swept in steps 1 to 6 (corresponding 0 ⁇ +I max ⁇ 0 ⁇ -I max ⁇ 0).
- nano-size effects associated with increased surface to volume ratios (in the case of 7 nm Fe 3 O 4 nanoparticles, resistivity is too high to be measured).
- temperature and size for the switching effect of nanoparticle assemblies may be controlled.
- the heterostructured (core-shell structure) 12 nm CoFe 2 O 4 (O ) Fe 3 O 4 , 12 nm CoFe 2 O 4 (S ) MnFe 2 O 4 and 12 nm CoFe 2 O 4 (O ) NiFe 2 O 4 were analyzed to show current induced switching effects at 240 K, 235 K and 175 K, respectively (Fig. 16).
- EXAMPLE 10 Current induced switching effect of surface-trimmed nanoparticle assemblies with applying external magnetic field
- controlling the strength and direction of external magnetic field may permit to control resistivity and current at which a switching behavior occurs.
- V-I hysteresis observed for nanoparticle assemblies is based on an extended model for the memristor.
- the nanoparticle assembly is simply represented by a 1-dimensional repeating nanoparticle array of Fe 3 O 4 , which have doped and undoped charge carrier regions separated by a moving boundary. Since this system has almost infinitely alternating repetition of the conducting and insulating parts, the time-dependent capacitance Q ⁇ as well as the time-dependent resistance is considered in the model.
- Another feature of this system is that it is comprised of two charge carriers, Fe 3+ and Fe 2+ ions that have different mobilities in the nanoparticle lattices.
- the initial memristor model proposed in reference 2 consists of a single type of charge carrier drifting in the insulator and requires consideration of only the time dependent resistance.
- the time-dependent change of w and associated change of voltage for the model nanoparticle system in response to injection of an alternating current can be simulated by using the following mathematical treatment.
- the voltage drop v( ⁇ ) is then given by equation 1,
- R 0n (RO FF ) is the resistance of the doped (undoped) region
- ⁇ is the average carrier mobility
- the zt ⁇ is assumed to be proportional to the total charge q with a dimensionless proportion coefficient x, which is material and geometry dependent. As the current direction is reversed, the phase of ⁇ q is shifted by ⁇ because the sign of charge accumulation also depends on the current direction. Based on equations 1-4, the voltage drop can be given by using equation 5.
- Figures 18a and b are shown the time-dependent changes of w and associated changes of voltage, obtained by simulation using equation 5, when an alternating current is injected.
- the model shows that this unusual hysteresis originates from abrupt changes of w ( Figures 18a and 18b).
- nanoparticle assemblies serve as the framework for devising new applications to a wide range of electronic devices. Predictions of the high potential of memristors based on nanoparticle assemblies are supported by the tremendous versatility to tune the electrical behavior of nanoparticles by controlling their nanoscale characteristics such as size, composition, dimension, surface area, and chemical potential. It is clear that nanoparticles will serve as key materials for exploring memristic behavior and, perhaps for the fabrication of new devices.
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Abstract
The present invention relates to a switching device fabricated by using nanoparticles and a preparation method thereof. The present invention ensures the mass production of switching devices (e.g., memristor) by use of nanoparticles that exhibits reversible switching behavior at current of less than mA and at room temperature (25°C) 〧 250°C in a more convenient and economical manner. Predictions of the high potential of memristors based on nanoparticle assemblies are supported by the tremendous versatility to tune the electrical behavior of nanoparticles by controlling their nanoscale characteristics such as size, composition, dimension, surface area, and chemical potential.
Description
NANOPARTICLE ASSEMBLY-BASED SWITCHING DEVICE
BACKGROUND OF THE INVENTION FIELD OF THE INVENTION
The present invention relates to a switching device comprising a nanoparticle assembly fabricated by using nanoparticles and a preparation method thereof.
DESCRIPTION OF THE RELATED ART The recent reports on the use of memristors, a contraction of "memory resistors", have opened up new possibilities in the development of computer systems that would have non-volatile random access memory (1. Chua, L. O. IEEE Trans. Circuit Theory 1971, 18, 507; Strukov, D. B., Snider, G. S., Stewart, D. R., Williams, R. S. Nature 2008, 453, 80; Yang, J. J., Pickett, M. D., Li, X., Ohlberg, D. A. A., Stewart, D. R., Williams, R. S. Nat. Nanotechnol. 2008, 3, 429). The reason that the memristor differs from other circuit elements is that it carries a memory of its past. Based on this unique characteristic of memristors, one would expect this to lead to the enhancement of emerging memory technologies that would minimize the time for boot-up processes and, consequently, energy consumption. Williams et a/, were the first to demonstrate the realization of a memristor composed of a thin (5 nm) titanium dioxide film between Pt electrodes(2). The device uses neither magnetic flux, as the theoretical memristor model suggests, nor does it store charges, like a capacitor does. Instead the new memristor was found to achieve a resistance that is dependent on a time-varying current by using a chemical mechanism. When an electric field is applied, a charge-carrier drift arises on a nanometer scale caused by changing the boundary between the high-resistance layer of pure titanium dioxide and the low-resistance layer of titanium oxide via positively charged oxygen holes. The on and off states can be maintained much longer if the voltage does not exceed a specific threshold.
The titanium dioxide based system, discovered by Williams et ai, serves as a genera model for memristive electrical switching in nanoscale thin film oxide devices. Nevertheless, the underlying physical details of memristors are still being debated.
Moreover, several issues, including the design strategies and requirements of new nanodevices based on the memristic concept, have not been fully answered.
Another important question in this area is whether memristic systems are limited to thin film devices or if they can be comprised of different kinds of nanostructured systems including nanoparticles.
Throughout this application, various publications and patents are referred and citations are provided in parentheses. The disclosures of these publications and patents in their entities are hereby incorporated by references into this application in order to fully describe this invention and the state of the art to which this invention pertains.
SUMMARY OF THE INVENTION
The present inventors have made intensive researches to develop a switching device comprising a nanoparticle assembly with reversible switching effects in a reproducible manner.
Accordingly, it is an object of this invention to provide a switching device. It is another object of this invention to provide a method for preparing a switching device.
Other objects and advantages of the present invention will become apparent from the following detailed description together with the appended claims and drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 schematically represents a four probe configuration for measuring current induced switching effects of nanoparticle assemblies.
Hg. 2 represents procedures for preparing the switching device of the present invention.
Hg. 3 shows TEM (Transmission Electron Microscopy) images of nanoparticles for switching devices prepared by pyrolysis. a-d) 7 nm, 9 nm, 12 nm and 15 nm MnFe2O4 nanoparticles; e-h) 7 nm, 9 nm, 12 nm and 15 nm Fe3O4 nanoparticles; i-l)
7 nm, 9 nm, 12 nm and 15 nm CoFe2O4 nanoparticles; m-p) 7 nm, 9 nm, 12 nm and
15 nm NiFe2O4 nanoparticles.
Hg. 4 shows a High-resolution (HR) TEM image and X-ray diffraction (XRD) analysis of 12 nm Fe3O4 nanoparticles. a) HR-TEM image; and b) XRD patterns of 12 nm Fe3O4 nanoparticles. The HR-TEM image shows that Fe3O4 nanoparticles have single crystallinity. Fe3O4 nanoparticles (black line) have well matched XRD patterns to bulk Fe3O4 (red line).
Hg. 5 shows TEM images of ZnxM1-xFe204 (M = Mn2+, Fe2+, Co2+, Ni2+) nanoparticles for switching devices, a) ZnxMni.xFe204 (x = 0, 0.1, 0.2, 0.3, 0.4, 0.8); b) ZnxFe2-x04 (x = 0, 0.1, 0.2, 0.3, 0.4, 0.8); c) Zn0 3Co0 7Fe2O4; and d) Zn03Ni0-7Fe2O4.
Figs. 6a-6b is TEM images of nanoparticles having heterostructures (core- shell) for switching devices, a) CoFe2O4(S)Fe3O4, b) CoFe2O4@ N JFe2O4, c) CoFe2O4@MnFe2O4, d) CoFe2O4@Zn0.4Mn0.6Fe2O4, e) CoFe204@Zno.4Fe2.604, f) MnFe2O4(S)CoFe2O4, g) MnFe2O4(S)Fe3O4, h) Fe3O4(S)NiFe2O4, i) MnFe2O4@Zn0.4Mn0.6Fe2O4, j) MnFe2O4@Zn0.4Fe2.5O4, k) Zno.4Mno.6Fe204@CoFe204, I) Zno.4Fe2.604(S)Fe304( and m) Fe3O4@Zn0.4Fe2.6O4.
Hg. 7 shows TEM images of nanoparticles having one-dimensional structure for switching devices, a) TiO2, b) Wi8O49, and c) Mn3O4. Rg. 8 represents Infrared Radiation (IR) spectroscopy results of nanoparticles for switching devices that were surface-trimmed in tetramethylammonium hydroxide (TMAOH) solution (red peaks, before surface trimming; black peaks, after surface trimming). After surface trimming, the strength of -CH2- stretching peaks at 2900
cm"1 and -C=O stretching peaks at 1700-1500 cm"1 was greatly decreased, demonstrating that the surface of nanoparticles was trimmed.
Fig. 9 represents a SEM (scanning electron microscopy) image (a) and a photograph (b) of the 7 nm Fe3O4 nanopartide assembly pellet formed by pressing. Fig. 10 represents results of the current induced switching (CIS) effect analysis of the Fe3O4 nanopartide assembly not surface-trimmed. The nanopartide assembly containing 15 nm or 12 nm Fe3O4 nanoparticles not surface-trimmed shows no the current induced hysteric (switching) behavior.
Fig. 11 shows V-I characteristics (CIS effect) measured at RT (295 K) for 7 nm Fe3O4 nanopartide assemblies. Transition from low (RON) to high (ROFF) resistance with (ROFF/RON = ca. 20) occurred by applying dc current-bias sweeping toward positive (0 A → +2OxIO"9 A), numbered 1-2, 6, and toward negative current
(+2OxIO"9 A → -2OxIO"9 A), numbered 3-5.
Fig. 12 shows V-I characteristics (CIS effect) measured for 12nm Fe3O4 nanopartide assemblies. The current induced hysteric behavior of 12 nm Fe3O4 nanopartide assemblies in the form of pellets appears only at lower temperatures. At
210 K, the switching transition of 12 nm Fe3O4 nanopartide assemblies appears at a current of ±7χ lO"9 A. In contrast, at RT (295 K) this material shows a typical tunneling conductance behavior. Fig. 13 shows V-I characteristics (CIS effect) measured for 9 nm and 15 nm
Fe3O4 nanopartide assemblies, respectively. The nanopartide assemblies with 9 nm
Fe3O4 nanoparticles represented the switching effect at room temperature and those with 15 nm Fe3O4 nanoparticles at 200 K.
Fig. 14 represents temperature-dependent resistivity of 15 nm, 12 nm and 9 nm Fe3O4 nanopartide assemblies. It is observed that p increases with decreasing T
1/ /*r and log p is approximately proportional to v . According to the results, resistive switching appears in the shaded region where p > 50 M Ω *cm. Due to the measurement limitation (Keithley 2182 nanovoltmeter), the resistivity of the 7 nm
Fe3O4 nanopartide assemblies was not obtainable. It is likely that the increased resistivity of smaller particles is a result of "nano-size" effects associated with increased surface to volume ratios.
Rg. 15 represents V-I characteristics (CIS effect) measured for 12 nm MnFe2O4, 7 nm CoFe2O4 and 7 nm NiFe2O4 nanopartide assemblies. The nanopartide assemblies containing 12 nm MnFe2O4, 7 nm CoFe2O4 and 7 nm NiFe2O4 exhibited current induced switching effects at 220 K, 265 K and 270 K, respectively.
Fig. 16 represents V-I characteristics (CIS effect) measured for heterostructured (core-shell) napopartide assemblies. The heterostructured (core- shell structure) 12 nm CoFe2O4(S)Fe3O4, 12 nm CoFe2O4@ Mn Fe2O4 and 12 nm CoFe2O4(S)NiFe2O4 were analyzed to show current induced switching effects at 240 K, 235 K and 175 K, respectively.
Fig. 17 represents V-I characteristics (CIS effect) measured for Fe3O4 nanopartide assemblies with applying external magnetic field (7 kG). It could be appreciated on the basis of these results that controlling the strength and direction of external magnetic field may permit to control resistivity and current at which a switching behavior occurs.
Fig. 18 represents simulation of a memristive device which has both time- dependent resistance (/?) and capacitance (Q. (a) The doped region ( IΨ) / grain boundary (Z.) as a function of time, (b) Current (red line) and voltage (blue line) as a function of time. The shaded areas indicate the low resistance state (R0N) of the device when the charge saturation is established, labeled 1 and 4. The voltage remains almost constant while the current varies in a sinusoidal manner during that process. On the other hand, the other areas (labeled 3 and 6) are related to the high resistance state (ROFF) during the refresh charge process, (c) V-I hysteresis obtained from the simulation of equation 5. Numbers of 1-6 are corresponding each other through out figures 18a, 18b, and 18c. The applied current is
All the axes are dimensionless with current, voltage, and time expressed in units of i0 = 12Ox IO"9
A, V0 = 1 V, and t0 = 2 n/ω0 = 0.01 s. Other parameters are; R0N = 107 2 , ROFF/RON
εΛ = 50, A = 10"7 cm2 where ε0 is the permittivity of vacuum. In c, a slightly asymmetric shape of hysteresis is caused by non-zero initial charge accumulation Δ #<= -0.1/O/ω0). The hysteresis loop is perfectly symmetric when q0 is zero.
DETAILED DESCRIPTION OF THIS INVETNION
In one aspect of this invention, there is provided a switching device, which comprises a nanoparticle assembly containing a plurality of nanoparticles. The term used herein "switching device" means a device exhibiting a switching effect (behavior) by applying a current, voltage or magnetic field.
The switching device has a R0N (resistance at ON state) or R0FF (a resistance at OFF state) state at certain current or voltage value. Preferably, the present switching device exhibits a reversible switching behavior by applying current of less than 1 A, more preferably less than 1 mA, still more preferably less than 100 nA. Specifically, the present switching device exhibits a reversible switching behavior by applying current of 1 A-IOO nA.
According to a preferred embodiment, the present switching device has a ROFF/RON value of more than 1, more preferably more than 5 and still more preferably more than 10, most preferably more than 20. Specifically, the present switching device has a ROFF/RON value of 5-30. In considering time-dependent changes, the ROFF/RON value of the present switching device is much more meaningful, as indicated in Further Discussion.
The reversible switching behavior of the present switching device may be shown at a wide range of temperature. According to the present invention, the temperature at which the reversible switching behavior is exhibited may be controlled by controlling either the size or the composition of nanoparticles embodied in the switching device.
According to a preferred embodiment, the reversible switching behavior of the
switching device is exhibited at room temperature (25 0C) ± 250 0C, more preferably at room temperature ± 100 0C, still more preferably at room temperature ± 50 0C, most preferably at room temperature. To the best of our knowledge, this is the first room temperature observation of reversible switching behavior in a nanoparticle system.
The nanoparticle assembly is constructed by aggregation or arrangement of nanoparticles. In the nanoparticle assembly, the nanoparticles are not needed to be arranged with a specific distance (space). The nanoparticles are required to be arranged with a space as close as for allowing current flow. Preferably, the nanoparticle assembly has a plurality of nanoparticles that are arranged with a space of no more than 10 nm, more preferably no more than 5 nm, most preferably no more than 2 nm.
The nanoparticles useful in the present switching device are chalcogen-type compounds, pnicogen-type compounds, carbon Group-type compounds, boron Group-type compounds, metals, alloys or multi-component hybrid structured nanoparticles thereof.
Preferably, the chalcogen-type compound is Ma xAz, Ma xMb yAz (Ma is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 13 elements, Group 14 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements; Mb is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 13-15 elements, Group 17 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements; A is one or more elements selected from the group consisting of O, S, Se, Te and Po; 0<x<16, 0<y<16, 0<z<8), or a multi-component hybrid structure thereof.
More preferably, the chalcogen-type compound is Ma xAz, Ma xMb yAz (Ma is one or more elements selected from the group consisting of transition metal elements, Lanthanide Group elements and Actinide Group elements; Mb is one or more
elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 13-15 elements, Group 17 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements; A is one or more elements selected from the group consisting of O, S, Se, Te and Po; 0<x<16, 0<y<16, 0<z<8), or a multi-component hybrid structure thereof.
Preferably, the pnicogen-type compound is MC XA2, Mc xMd yAz (Mc is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 13 elements, Group 14 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements; Md is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 13-14 elements, Group 16-17 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements; A is one or more elements selected from the group consisting of N, P, As, Sb and Bi; 0<x<24, 0<y<24, 0<z<8), or a multi-component hybrid structure thereof. More preferably, the pnicogen-type compound is MC XA2, Mc xMd yAz (Mc is one or more elements selected from the group consisting of transition metal elements, Lanthanide Group elements and Actinide Group elements; Md is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 13-14 elements, Group 16-17 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements; A is one or more elements selected from the group consisting of N, P, As, Sb and Bi; 0<x<24, 0<y<24, 0<z<8), or a multi-component hybrid structure thereof.
Preferably, the carbon Group-type compound is Me xAz, Me xMf yAz (Me is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 13 elements, Group 14 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements; Mf is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 13 elements, Group 15-17 elements, transition metal elements, Lanthanide
Group elements and Actinide Group elements; A is one or more elements selected from the group consisting of C, Si, Ge, Sn and Pb; 0<x<32, 0<y<32, 0<z<8), or a multi-component hybrid structure thereof.
Preferably, the boron Group-type compound is M9 XAZ, M9 xMh yAz (M3 is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 13 elements, Group 14 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements; Mh is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 14-17 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements; A is one or more elements selected from the group consisting of B, Al, Ga, In and Tl; 0<x<40, 0<y<40, 0<z<8), or a multi-component hybrid structure thereof.
According to a preferred embodiment, the metal for nanoparticles is alkali metal, alkaline earth metal, transition metal, Lanthanide Group metal and Actinide Group metal or a multi-component hybrid structure thereof. More preferably, the metal is transition metal (Ti, V, Cr, Mn, Fe, Co, Ni, Cu, or Ru), Lanthanide Group metal (Ce, Pr, Nd, Pm, Sm, Gd, Eu, Tb, Dy, Ho, Er, Tm, Yb, or Lu), Actinide Group metal (Th, Pa, U, Np, Pu, Am, Dm, Bk, Cf, Es, Fm, Md, No or Lr) or a multi- component hybrid structure thereof. According to a preferred embodiment, the alloy for nanoparticles is Me xMf y,
Me xMfyM9 z (Me is one or more elements selected from the group consisting of transition metal elements, Lanthanide Group elements and Actinide Group elements; Mf and M9 are one or more elements selected from the group consisting of Group 1 metal elements, Group 2 metal elements, Group 13-17 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements; 0<x<20, 0<y<20, 0<z<20), or a multi-component hybrid structure thereof.
More preferably, the alloy for nanoparticles is Me xMf y, Me xMf yM9 z (Me is one or more elements selected from the group consisting of transition metal elements (Ba,
Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Zr, Te, W, Pd, Ag, Pt and Au), Lanthanide Group elements (Ce, Pr, Nd, Pm, Sm, Gd, Eu, Tb, Dy, Ho, Er, Tm, Yb, and Lu) and Actinide Group elements (Th, Pa, U, Np, Pu, Am, Dm, Bk, Cf, Es, Fm, Md, No, and Lr); Mf and M9 are one or more elements selected from the group consisting of Group 1 metal elements, Group 2 metal elements, Group 13-17 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements; 0<x<20, 0<y<20, 0<z<20), or a multi-component hybrid structure thereof.
More preferably, the nanoparticles for the switching device are Ma xOz, Ma xMb yOz (Ma is one or more elements selected from the group consisting of transition metal elements, Lanthanide Group elements and Actinide Group elements; Mb is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 13-15 elements, Group 17 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements; 0<x<16, 0<y<16, 0<z<8), or a multi-component hybrid structure thereof; most preferably MxFeyOz (M is one or more transition metal elements selected from the group consisting of Zn, Mn, Fe, Co and Ni; 0<x<8, 0<y<8, 0<z<8), ZnwMxFeyOz (M is one or more transition metal elements selected from the group consisting of Zn, Mn, Fe, Co and Ni; 0<w<8, 0<x<8, 0<y<8, 0<z<8) , or a multi-component hybrid structure thereof.
The multi-component hybrid structure for the switching device comprises at least two materials selected from the group consisting of chalcogen-type compounds, pnicogen-type compounds, carbon Group-type compounds, boron Group-type compounds, metals and alloys. Alternatively, the multi-component hybrid structure comprises at least one material selected from the group consisting of chalcogen-type compounds, pnicogen-type compounds, carbon Group-type compounds, boron Group-type compounds, metals and alloys, and other materials. The form of the multi-component hybrid structure may be core-shell, core-multi shell, heterodimer, trimer, multimer, bar code or co-axial rod, but not limited to. Preferably, the multi- component hybrid structure comprises at least one of chalcogen-type compounds or
pnicogen-type compounds.
According to a preferred embodiment, the nanoparticle for the switching device is at least one of metals having an oxidation number of no less than 1.
According to a preferred embodiment, the nanoparticle is in a size of 1-1000 nm, more preferably 2-500 nm, still more preferably 5-50 nm.
The nanoparticle for the switching device may be in any form. Preferably, the nanoparticle has (i) a zero-dimensional structure selected from the group consisting of a sphere, a core-shell and a multi-core shell structure; (ii) a one-dimensional structure selected from the group consisting of a rod, a barcode, a core-shell coaxial rod and a multi-core shell coaxial rod structure; (iii) a two-dimensional structure selected from the group consisting of a sheet, a layer and a multi-component sheet structure; or (iv) a three-dimensional structure selected from the group consisting of a branched structure, a dendrite structure, a dumbbell and a multi-pod structure.
According to a preferred embodiment, the nanoparticle has a surface trimmed to remove organic materials attached thereon.
The switching device of the present invention may be used to a wide variety of applications, for example, DRAM (Dynamic Random Access Memory), EEPROM (Electrically Erasable Programmable Read-only Memory), SRAM (Static Random Access Memory), PRAM (Phase change Random Access Memory), RRAM (Resistance Random Access Memory), MRAM (Magnetoresistive Random Access Memory), FRAM(Ferroelectric Random Access Memory), CBRAM (Conductive Bridging Random Access Memory), memristor and spintronics devices. Most preferably, the switching device of the present invention is a memristor.
In another aspect of this invention, there is provided a method for preparing a switching device, which comprises the steps of: (a) preparing nanoparticles; (b) forming a nanoparticle assembly using the nanoparticles; and (c) connecting to the nanoparticle assembly a means for applying a current, voltage or magnetic field.
Preferably, the step (a) for preparing nanoparticles is carried out in a gas phase or a liquid phase (e.g., aqueous solution, organic solvent and multi-solution system), more preferably organic solvent.
In the case of using organic solvent, a reaction mixture containing a metal precursor and a surfactant or a surfactant-containing solvent are prepared and subjected to pyrolysis at 50-6000C.
The metal precursor includes any metal precursor known to one of skill in the art, preferably a metal precursor having oxidation number of more than 0.
The metal precursor comprises at least one metal element selected from the group consisting of transition metal elements, Lanthanide Group elements, Actinide
Group elements and Group 13-14 elements, preferably a metal nitrate-based compound, a metal sulfate-based compound, a metal fluoroacetoacetate-based compound, a metal acetylacetonate, a metal halide-based compound (MXa, where M is at least one selected from the group consisting of transition metal elements, Lanthanide Group elements, Actinide Group elements and Group 13-14 elements; X
= F, Cl, Br, or I, and 0<a<5), a metal perchlorate-based compound, a metal sulfamate-based compound, a metal carboxylate, a metal stea rate-based compound, an organometallic compound, or a multi-component hybrid structure thereof.
The organometallic compound is MxLy (M is at least one selected from the group consisting of transition metal elements, Lanthanide Group elements, Actinide Group elements and Group 13-14 elements; L is at least one ligand to coordinate with metals; 0<x<10, 0<y<120), or a multi-component hybrid structure thereof.
The surfactant useful in the synthesis of the nanoparticle is an organic acid, an organic amine, alkane thiol, phosphonic acid, trioctylphosphine oxide, tributyl phosphine, alkyl phosphate, alkyl sulfate or tetraalkylammonium halide. More preferably, the surfactant is oleic acid, lauric acid, stearic acid, mysteric acid, hexadecanoic acid, oleyl amine, lauryl amine, trioctyl amine, dioctyl amine, hexadecyl amine, dodecane thiol, hexadecane thiol, heptadecane thiol, tetradecyl
phosphonic acid, octadecyl phosphonic acid or trioctylphosphine oxide.
The solvent useful in the synthesis of the nanoparticle is an ether-based compound, hydrocarbon, organic acid, organic amine, alkane thiol, phosphonic acid, alkyl phosphine oxide, tributyl phosphine, alkyl sulfate, alkyl phosphate or tetraalkyl ammonium halide. More preferably, the solvent is octyl ether, benzyl ether, phenyl ether, hexadecane, heptadecane, octadecane, oleic acid, lauric acid, stearic acid, mysteric acid, hexadecanoic acid, oleyl amine, trioctyl amine, dioctyl amine, hexadecyl amine, dodecane thiol hexadecane thiol or heptadecane thiol.
According to the present invention, it is possible that the size of the nanoparticles is controlled by adjusting a concentration of the surfactant, an amount of the solvent, a reaction temperature or a reaction time. The surfactant and the solvent are introduced into the reaction mixture in the amount 1-100 fold higher than the metal precursor.
According to a preferred embodiment, the step (a) is performed with no use of oxidants or reductants. The nanoparticles synthesized may be applicable to various fields such as magnetic resonance imaging agents and data storage (iron oxide nanoparticles), photocatalyst and sensor (titanium oxide nanoparticles), photocatalyst and desulfurization sorbents (tungsten oxide nanoparticles) and ceramic condenser electrode, chemical catalyst and soft magnet (manganese oxide nanoparticles).
The nanoparticles synthesized in step (a) may be further surface-treated to improve their switching effects. The surface treatment includes a removal of organic ligands (e.g., surfactants) on the surface of nanoparticles (i.e., trimming the surface of nanoparticles) or an additional coating. The preferable surface treatment is to treat with an alkali solution to remove surfactants on the surface of nanoparticles. Preferably, the alkali solution for the surface treatment includes a alkali compound selected from the group consisting of alkylammonium, alkylammonium hydroxide, alkylammonium halide, alkylphosphine,
alkylphosphine hydroxide and alkylphosphine halide [wherein alkyl is CnH2n+I (0<n<5)], more preferably alkylammonium and alkylammonium hydroxide, still more preferably tetramethylammonium hydroxide and tetraethylammonium hydroxide.
The alkali compound may be used in a polar solvent such as alcohols, dimethyl sulfoxide, dimethyl formamide and water. The most preferable polar solvent is alcohols. The alkali compound may be dissolved in the polar solvent with a concentration of 0.001-10 M, preferably 0.1-5 M.
According to a preferred embodiment, the method further comprises the step of (aθ trimming a surface of nanoparticles to remove organic materials attached thereon, such that a switching effect of the switching device is enhanced. More preferably, the trimming is carried out in the presence of an alkali solution. Most preferably, the trimming is carried out by sonication.
According to the present method, the formation of the nanoparticle assembly in the step (b) is carried out by pressing, LB (Langmuir Blodgett), LBL (layer by layer), print, self-assembly or solution evaporation. Preferably, the nanoparticles are assembled under pressure not to induce deformation of the nanoparticles. More preferably, the formation of the nanoparticle assembly is carried out by pressing under a pressure of more than 100 Pa, still more preferably 140-180 Pa. The period of time for pressing is not specifically limited; preferably more than 1 min, more preferably more than 5 min.
The nanoparticle assembly is connected to a means for applying a current, voltage or magnetic field. It is noteworthy that the switching device requires no electrodes. Examples of means for applying a current and/or voltage include a power supply known to one of skill in the art. Examples of means for applying magnetic field include electromagnetic devices known to one of skill in the art.
The method of the switching device provides a large number of passages for electric flow by increasing the contact surface area between nanoparticles with no influence on electrical characteristics of nanoparticle surface via nanoparticle
assembly (e.g., peptization). In this regard, the switching device prepared by the present invention shows a dramatically enhanced switching behavior (specifically, reversible switching behavior).
Unlike the conventional switching devices operable at lower temperature, the present invention ensures the mass production of switching devices (e.g., memristor) by use of nanoparticles that exhibits reversible switching behavior at current of less than mA and at room temperature±250°C in a more convenient and economical manner. The present invention enables realization of memories with no requirement of electricity and computer booting. Predictions of the high potential of memristors based on nanoparticle assemblies are supported by the tremendous versatility to tune the electrical behavior of nanoparticles by controlling their nanoscale characteristics such as size, composition, dimension, surface area, and chemical potential, as demonstrated in Examples. The present invention will now be described in further detail by examples. It would be obvious to those skilled in the art that these examples are intended to be more concretely illustrative and the scope of the present invention as set forth in the appended claims is not limited to or by the examples.
EXAMPLES
EXAMPLE 1: Size and composition controlled preparation of metal ferrite (MFe2O4, M = Mn2+, Fe2+, Co2+, Ni2+) nanoparticles for switching devices
MFe2O4 (M = Mn2+, Fe2+, Co2+, Ni2+) napoparticles were obtained according to previously suggested methods described in Korean Pat. No. 0604975 and PCT/KR2004/003088 filed by the present inventors. MCI2 (M = Mn2+, Fe2+, Co2+, Ni2+; Aldrich, USA) and Fe(acac)3 (iron tris-2,4-pentadionate, Aldrich, USA) as precursors of nanoparticles were added to 4 mmol oleic acid (Aldrich, USA) and 4 mmol oleylamine (Aldrich, USA) as capping molecules in trioctylamine (Aldrich, USA).
The mixture was incubated at 200 0C and in turn at 300 0C under an argon gas atmosphere, and was then cooled to room temperature. Upon the addition of excess ethanol, the resulting nanoparticle precipitate was resuspended in toluene, yielding a colloidal solution of MFe2O4 (M = Mn2+, Fe2+, Co2+, Ni2+) napoparticles. The isolated nanoparticles were observed to have a sphere shape with a homogeneous size of 7 nm.
The size of nanoparticles was further controlled by employing varying growth conditions including the amount of reactants (e.g., oleic acid and oleylamine). For example, the size of Fe3O4 nanoparticles was tuned from 7-15 nm by varying the ratio of oleic acid and oleylamine. The characteristics of nanoparticles were analyzed by transmission electron microscopy (TEM), high-resolution transmission electron microscopy and x-ray diffraction. As shown in Figs. 3 and 4 representing results of transmission electron microscopy and x-ray diffraction, MFe2O4 (M = Mn2+, Fe2+, Co2+, Ni2+) napoparticles synthesized have well-controlled size monodispersity (σ < 5 %) and higher crystallinity.
EXAMPLE 2: Size and composition controlled preparation of ZnxM1 xFe2O4 (M = Mn2+, Fe2+, Co2+, Ni2+) nanoparticles for switching devices
Zn2+ ion doped ZnxM1-XFe2O4 (M = Mn2+, Fe2+, Co2+, Ni2+) nanoparticles were obtained according to previously suggested methods described in Korean Pat. No.
0604975, PCT/KR2004/003088 and Korean Pat. Appln. No. 2006-0018921 filed by the present inventors. ZnCI2, MCI2 (M = Mn2+, Fe2+, Co2+, Ni2+) and Fe(acac)3 as precursors of nanoparticles were added to 20 mmol oleic acid and 20 mmol oleylamine as capping molecules in trioctylamine. The mixture was incubated at 200 0C and in turn at 300 0C under an argon gas atmosphere, and was then cooled to room temperature. Upon the addition of excess ethanol, the resulting nanoparticle precipitate was resuspended in toluene, yielding a colloidal solution. The isolated nanoparticles were shown to have a composition of Zn0 4Mc6Fe2O4 (M = Mn2+, Fe2+,
Co2+, Ni2+) with a homogeneous size of 15 nm. We also verified that the change in the relative mole ratios of materials of MCI2 (M = Mn2+, Fe2+, Co2+, Ni2+) permits the composition of nanoparticles synthesized to be conveniently controlled. The nanoparticles synthesized were analyzed to have a sphere shape with well-controlled size monodispersity as represented in TEM images of Fig. 5.
EXAMPLE 3: Preparation of nanoparticles with heterostructure (core-shell structure) for switching devices
Metal oxides-containing nanoparticles with heterostructure (15 nm sized core- shell ferrite) were prepared by a seed-medicated growth method according to previously reported methods described in Korean Pat. No. 0604975 and PCT/KR2004/003088 filed by the present inventors.
The core materials with a size of 7 nm were synthesized as procedures described in .Example 1 and heterostructured core-shell nanomaterials with a size of 15 nm were then synthesized using them. The reaction mixture composed of the core materials, MCI2 (M = Mn2+, Fe2+, Co2+, Ni2+), Fe(acac)3, 4 mmol oleic acid and 4 mmol oleylamine in trioctylamine was incubated at 200 0C and in turn at 300 0C under an argon gas atmosphere. The nanomaterials synthesized have core-shell structure with a size of 15 nm. The isolation of nanomaterials was performed as Example 1.
A variety of nanomaterials with core-shell typed heterostructure were yielded by varying compositions of metal precursors. For example, CoFe2O4@ Fe3O4, CoFe2O4@MnFe2O4, CoFe2O4(SNiFe2O, MnFe2O4@CoFe2O4, MnFe2O4@Fe3O4, Fe3O4@NiFe2O4, MnFe2O4@Zn0.4Mn0.6Fe2O4, MnFe2O4(O)Zn0 4Fe2 6O4, Zn0.4Mn0.6Fe2O4@CoFe2O4, Zn0.4Fe2.6O4@ Fe3O4 and Fe3O4@Zn0.4Fe2.6O4 in a size of 15 nm were successfully synthesized. The nanomaterials synthesized have a sphere shape with a size monodispersity (σ < 10%) as shown in Fig. 6.
EXAMPLE 4: Preparation of metal oxide nanoparticles for switching devices
Metal oxide nanoparticles were synthesized according to previously reported methods described in Korean Pat. No. 0604975 and PCT/KR2004/003088 filed by the present inventors. 0.5 mmole of titanium tetrachloride (Aldrich, USA) was mixed with 0.28 g of oleic acid and 1.7 g of oleylamine and allowed to undergo pyrolysis for 2 min at 2900C, finally yielding titanium oxide (TiO2) nanoparticles. 0.1 mmole of tungsten tetrachloride (Aldrich, USA) was mixed with 1.63 g of oleic acid and 0.54 g of oleylamine and allowed to undergo pyrolysis for 1 hr at 350 0C, giving tungsten oxide (Wi8O49) nanoparticles. 0.1 mmole of manganese chloride (Aldrich, USA) was mixed with 0.15 g of oleic acid and 1.94 g of oleylamine and allowed to undergo pyrolysis for 1 hr at 350 0C, giving manganese oxide (Mn3O4) nanoparticles. The isolation of nanoparticles was carried out as Example 1. The TEM images of TiO2, Wi8O49 and Mn3O4 were shown in Rg. 7.
EXAMPLE 5: Surface trimming of nanoparticles for switching devices
The surface of nanoparticles for switching devices prepared in Examples 1-4 was trimmed. Organic ligands on the nanoparticles were removed by sonication in 1 M tetramethylammonium hydroxide (TMAOH) in butanol. After 15 min sonication in TMAOH solution, the nanoparticles were isolated by centrifugation and washed sequentially with hexane, acetone, and ethanol. Isolated nanoparticles were dried under vacuum at room temperature before nanoparticle assembly pellet preparation. The surface-trimmed nanoparticles were analyzed by Infrared Radiation (IR) spectrophotometry. The nanoparticles not surface-trimmed were measured to show peaks corresponding to long alkyl chains of surfactants surrounding nanoparticles, e.g., -CH2- stretching peaks at 2900 cm"1 and -C=O stretching peaks at 1700-1500 cm'1 (red peaks in Fig. 8). After surface trimming, the strength of -CH2- stretching peaks at 2900 cm"1 and -C=O stretching peaks at 1700-1500 cm"1 was greatly
decreased, demonstrating that the surface of nanoparticles was trimmed.
EXAMPLE 6: Nanoparticle assembly pellet preparation and measurement of current induced switching (CIS) effect The nanoparticle assemblies in the form of the compact pellets (0.5χ lχ4 mm) were produced using the surface-trimmed nanoparticles by cold-pressing in a die under 160 Pa for 15 min. In order to avoid alteration of the surface properties of the nanoparticles, no heat-treatment step was used in the preparation of the pellets. The shape of the nanoparticle assembly pellets was rectangular: 4 mm long, 1 mm wide and 0.5 mm thick. Their SEM (scanning electron microscopy) image and photographs are shown in Hg. 9. The current induced switching (CIS) effect of the nanoparticle assembly pellets was measured using the circuit shown in Fig. 1. The electrical characteristics were measured by the conventional four-probe configuration with a Keithley 2182 nanovoltmeter and a Keithley 6220 current source. An electrode (for current injection) was made at each end of the pellet (using indium contact) so that current flow was as uniform as possible. The voltage drop across the sample was observed using two other electrodes attached to the surface.
EXAMPLE 7: Current induced switching effect of nanoparticle assembly not surface-trimmed
The current induced switching (CIS) effect of the Fe3O4 nanoparticle assembly not surface-trimmed was measured at different temperatures. The Fe3CX? nanoparticles not surface-trimmed were revealed to show no switching effect in all temperature conditions and to show a typical tunneling conductance behavior. Fig. 10 represents that the nanoparticle assembly containing 15 nm or 12 nm Fe3O4 nanoparticles not surface-trimmed shows no the current induced hysteric (switching) behavior.
EXAMPLE 8: Current induced switching effect of nanoparticle assembly surface-trimmed
The current induced switching (CIS) effect of nanoparticle assemblies fabricated with surface-trimmed Fe3O4 nanoparticles in a 7-nm size was analyzed. In the case of nanoparticles with a diameter (D) of 7 nm (Rg. 11), a new type of hysteresis is observed at room temperature (RT), as shown in Figure 11. The bistable V-I characteristics, observed in the sample of D = 7 nm, illustrate that the switching properties are directly related to the existence of hysteretic behavior as the current is swept in steps 1 to 6 (corresponding 0 → +Imax → 0 → -Imax → 0). As the current increases from 0 to +Imax, the switching between the low-resistance state (R0N ~ 2χlO7 Ω) and the high resistance state (R0FF ~ 4χlO8 Ω) occurs at I = +16χlO"9 A. In contrast, ohmic behavior is seen when the current decreases from +Imax to 0. The same behavior is observed when the current direction is reversed. This type of instantaneous switching from the low-resistance (i.e. on-state) to the high-resistance (i.e. off-state) occurs in a typical ROFF/RON ratio of 20:1. It is remarkable that when sweeps are carried out repeatedly, no damage or breakdown of the sample occurs. To the best of our knowledge, this is the first room temperature observation of reversible switching behavior in a nanoparticle system.
It is interesting to observe that the V-I hysteresis behavior described above is dependent on the size of the nanoparticle. For example, the current induced hysteric behavior of nanoparticle assembly pellets of D = 12 nm appears only at lower temperatures (Fig. 12). As the data in Figure 12 show, at 210 K, the switching transition of the D = 12 nm assembly appears at a current of ±7χlO*9 A. In contrast, at RT (295 K) this material shows a typical tunneling conductance behavior (Fig. 12). Furthermore, Fe3O4 nanoparticle assemblies with a diameter (D) of 9 nm and
15 nm were also analyzed to show a similar switching effect (Fig. 13). The nanoparticle assemblies with 9 nm Fe3O4 nanoparticles represented the switching effect at room temperature and those with 15 nm Fe3O4 nanoparticles at 200 K.
Based on the results of temperature-dependent resistivity (p(T)) measurements for the magnetite nanoparticles with different diameters, it appears that the switching behavior dominates when p value is higher than ca. 50 MΩ *cm (the shaded area of Hg. 14). An increase of p is observed with decreasing D. It is likely that the increased resistivity of smaller particles is a result of "nano-size" effects associated with increased surface to volume ratios (in the case of 7 nm Fe3O4 nanoparticles, resistivity is too high to be measured). In other words, by controlling the size of nanoparticles in nanoparticle assemblies, temperature and size for the switching effect of nanoparticle assemblies may be controlled.
EXAMPLE 9: Current induced switching effect of nanoparticle assemblies containing surface-trimmed different types of MFe2O4 (M = Mn2+, Fe2+, Co2+, Ni2+) or heterostructured (core-shell) nanoparticles
The nanoparticle assemblies containing surface-trimmed MFe2O4 (M = Mn2+, Fe2+, Co2+, Ni2+) nanoparticles were analyzed for current induced switching effect. As results, it was revealed that the nanoparticle assemblies containing 12 nm MnFe2O4, 7 nm CoFe2O4 and 7 nm NiFe2O4 exhibited current induced switching effects at 220 K, 265 K and 270 K, respectively (Fig. 15). The heterostructured (core-shell structure) 12 nm CoFe2O4(O)Fe3O4, 12 nm CoFe2O4(S)MnFe2O4 and 12 nm CoFe2O4(O)NiFe2O4 were analyzed to show current induced switching effects at 240 K, 235 K and 175 K, respectively (Fig. 16).
These results urge us to reason that not only nanoparticle systems with different compositions but also heterostructured nanoparticle systems may give current induced switching effects, and the control of nanoparticle compositions allows for controlling temperature and size for the switching effect of nanoparticle assemblies.
EXAMPLE 10: Current induced switching effect of surface-trimmed
nanoparticle assemblies with applying external magnetic field
The current induced switching effect of the surface-trimmed Fe3O4 nanoparticles with a 7-nm size was analyzed with applying external magnetic field (7 kG). As represented in Fig. 17, the V-I hysteresis behavior at low resistivity was measured to be similar to that of the case with no external magnetic field; however, the V-I hysteresis behavior at high resistivity was clearly affected by external magnetic field. The external magnetic field was analyzed to give rise to decrease in resistivity.
It could be appreciated on the basis of these results that controlling the strength and direction of external magnetic field may permit to control resistivity and current at which a switching behavior occurs.
Further Discussion
A plausible explanation for the V-I hysteresis observed for nanoparticle assemblies is based on an extended model for the memristor. In this model, the nanoparticle assembly is simply represented by a 1-dimensional repeating nanoparticle array of Fe3O4, which have doped and undoped charge carrier regions separated by a moving boundary. Since this system has almost infinitely alternating repetition of the conducting and insulating parts, the time-dependent capacitance Qή as well as the time-dependent resistance is considered in the model. Another feature of this system is that it is comprised of two charge carriers, Fe3+ and Fe2+ ions that have different mobilities in the nanoparticle lattices. This results in a different distribution of each carrier and thus an additional time-dependent capacitance ΔQt) across the particle boundaries. In contrast, the initial memristor model proposed in reference 2 consists of a single type of charge carrier drifting in the insulator and requires consideration of only the time dependent resistance.
The time-dependent change of w and associated change of voltage for the model nanoparticle system in response to injection of an alternating current can be
simulated by using the following mathematical treatment. In the model, the time- dependent state variable wis the length of the doped region, bounded between zero and L which is the full length of grain boundary region. The voltage drop v(ή is then given by equation 1,
v(t) = R(w,t)i(t) +
C(w,t)
(1) where /is the current and q is the charge. R(w,1) and (\w,t) are the resistance and the capacitance respectively, and they are given by the relationships in equations 2- 4.
where R0n (ROFF) is the resistance of the doped (undoped) region, CON is the capacitance at w = 0, μ is the average carrier mobility, and ΔC{ή is the additional capacitance caused by the different mobilities of the two carriers and proportional to the imbalanced charge accumulation Δq (= + + - 2 3 Fe Fe Q Q ) around the undoped region. The ztø is assumed to be proportional to the total charge q with a dimensionless proportion coefficient x, which is material and geometry dependent. As the current direction is reversed, the phase of Δq is shifted by π because the sign of charge accumulation also depends on the current direction. Based on equations 1-4, the voltage drop can be given by using equation 5.
In Figures 18a and b are shown the time-dependent changes of w and
associated changes of voltage, obtained by simulation using equation 5, when an alternating current is injected. The consistency between the results of V-I hysteresis modeling and the experimental observations (Figure 11) is clearly shown. The model shows that this unusual hysteresis originates from abrupt changes of w (Figures 18a and 18b). When {ή = 0 and n<0 = L1 the nanopartide assembly is in the low resistance state. As the current becomes increasingly larger, more charge accumulates until it reaches a critical value. At that point, the boundary abruptly moves back to w = 0 in order to relax the charge accumulation and then the resistance is high. It should be noted that the experimentally observed chirality of hysteresis in both bias polarities is counter-clockwise (Figure 18c), whereas the chirality in the previously studied memristor with only time-dependent resistance changes depends on the bias polarity. The difference in the chirality of hysteresis between the two systems can be explained only when the capacitance part in the equation 5 is properly taken into account. The nanopartide system described above is unique in terms of the size of the monodispersity and the mild conditions required for preparing pristine nanopartide surfaces. In previous work on magnetite nanoparticles for which ligand eliminations were performed using high temperature thermal treatment procedures, in contrast to our observations, either only tunneling behavior was shown or the resistive switching was found to appear only at very low temperatures below 120 K. In the latter case, the switching was explained as a bulk effect in the context of the Verwey transition, which is not the case in this work since the hysteresis was observed at much higher temperature (i.e. RT) than Tv.
The approach described above for the development of memristors based on nanopartide assemblies is innovative. The observed memristic effects in resistive switching behavior are nicely accounted for by using a model composed of both resistance and capacitance.
The observations presented above regarding the switching behavior of
nanoparticle assemblies serve as the framework for devising new applications to a wide range of electronic devices. Predictions of the high potential of memristors based on nanoparticle assemblies are supported by the tremendous versatility to tune the electrical behavior of nanoparticles by controlling their nanoscale characteristics such as size, composition, dimension, surface area, and chemical potential. It is clear that nanoparticles will serve as key materials for exploring memristic behavior and, perhaps for the fabrication of new devices.
Having described a preferred embodiment of the present invention, it is to be understood that variants and modifications thereof falling within the spirit of the invention may become apparent to those skilled in this art, and the scope of this invention is to be determined by appended claims and their equivalents.
Claims
1. A switching device, which comprises a nanoparticle assembly containing a plurality of nanopartides.
2. The switching device according to claim 1, wherein the switching device exhibits a current-, a voltage- or a magnetic field-induced switching behavior.
3. The switching device according to claim 1, wherein the switching device has an operation temperature of room temperature (250C) ± 2500C for a reversible switching behavior.
4. The switching device according to claim 1, wherein the switching device shows a reversible switching behavior at a current of less than 1 mA.
5. The switching device according to claim 1, wherein the switching device has a ROFF/RON value of more than 1 (wherein RoFF is a resistance at OFF state and R0N is a resistance at ON state).
6. The switching device according to claim 1, wherein the nanoparticle assembly has a plurality of nanopartides that are arranged with a space of no more than 10 nm.
7. The switching device according to claim 1, wherein the nanopartides are chalcogen-type compounds, pnicogen-type compounds, carbon Group-type compounds, boron Group-type compounds, metals, alloys or multi-component hybrid structured nanopartides thereof.
8. The switching device according to claim 7, wherein the chalcogen-type compound is Ma xAz, M3 xMb yAz (Ma is one or more elements selected from the group consisting of Group 13 elements, Group 14 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements; Mb is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 13-15 elements, Group 17 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements; A is one or more elements selected from the group consisting of O, S, Se, Te and Po; 0<x<16, 0<y<16, 0<z<8), or a multi-component hybrid structure thereof.
9. The switching device according to claim 7, wherein the pnicogen-type compound is MCA, Mc xMd yAz (Mc is one or more elements selected from the group consisting of Group 13 elements, Group 14 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements; Md is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 13-14 elements, Group 16-17 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements; A is one or more elements selected from the group consisting of N, P, As, Sb and Bi; 0<x<24, 0<y<24, 0<z<8), or a multi- component hybrid structure thereof.
10. The switching device according to claim 7, wherein the carbon Group-type compound is Me xAz, Me xMf yAz (Me is one or more elements selected from the group consisting of Group 13 elements, Group 14 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements; Mf is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 13-14 elements, Group 16-17 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements; A is one or more elements selected from the group consisting of C, Si, Ge, Sn and Pb; 0<x<32, 0<y<32, 0<z<8), or a multi-component hybrid structure thereof.
11. The switching device according to claim 7, wherein the boron Group-type compound is M9 XAZ, M9 xMh yAz (M9 is one or more elements selected from the group consisting of Group 13 elements, Group 14 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements; Mh is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 13-14 elements, Group 16-17 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements; A is one or more elements selected from the group consisting of B, Al, Ga, In and Tl; 0<x<40, 0<y<40, 0<z<8), or a multi-component hybrid structure thereof.
12. The switching device according to claim 7, wherein the metal is alkali metal, alkaline earth metal, transition metal, Lanthanide Group metal and Actinide Group metal or a multi-component hybrid structure thereof.
13. The switching device according to claim 7, wherein the alloy is M ee x MMf
V
Me xMf yM9 2 (Me is one or more elements selected from the group consisting of transition metal elements, Lanthanide Group elements and Actinide Group elements; Mf and M9 are one or more elements selected from the group consisting of Group 1 metal elements, Group 2 metal elements, Group 13-17 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements; 0<x<20, 0<y<20, 0<z<20), or a multi-component hybrid structure thereof.
14. The switching device according to claim 7, wherein the multi-component hybrid structure comprises at least one of chalcogen-type compounds or pnicogen-type compounds.
15. The switching device according to claim 1, wherein the nanoparticle is at least one of elements having an oxidation number of no less than 1.
16. The switching device according to claim 1, wherein the nanoparticle is Ma xOz, Ma xMbyOz (Ma is one or more elements selected from the group consisting of transition metal elements, Lanthanide Group elements and Actinide Group elements; Mb is one or more elements selected from the group consisting of Group 1 elements, Group 2 elements, Group 13-15 elements, Group 17 elements, transition metal elements, Lanthanide Group elements and Actinide Group elements; 0<x<16, 0<y<16, 0<z<8), or a multi-component hybrid structure thereof.
17. The switching device according to claim 1, wherein the nanoparticle is MxFeyOz (M is one or more transition metal elements selected from the group consisting of Zn,
Mn, Fe, Co and Ni; 0<x<8, 0<y<8, 0<z<8), ZnwMxFeyOz (M is one or more transition metal elements selected from the group consisting of Zn, Mn, Fe, Co and Ni; 0<w<8, 0<x<8, 0<y<8, 0<z<8) , or a multi-component hybrid structure thereof.
18. The switching device according to claim 1, wherein the nanoparticle has (i) a zero-dimensional structure selected from the group consisting of a sphere, a core- shell and a multi-core shell structure; (ii) a one-dimensional structure selected from the group consisting of a rod, a barcode, a core-shell coaxial rod and a multi-core shell coaxial rod structure; (iii) a two-dimensional structure selected from the group consisting of a sheet, a layer and a multi-component sheet structure; or (iv) a three- dimensional structure selected from the group consisting of a branched structure, a dendrite structure, a dumbbell and a multi-pod structure.
19. The switching device according to claim 1, wherein the nanoparticle is in a size of 2-500 nm.
20. The switching device according to claim 1, wherein the nanoparticle has a surface trimmed to remove organic materials attached thereon.
21. The switching device according to claim 1, wherein the switching device is a memristor.
22. A method for preparing a switching device, which comprises the steps of:
(a) preparing nanoparticles;
(b) forming a nanopartide assembly using the nanoparticles; and
(c) connecting to the nanopartide assembly a means for applying a current, voltage or magnetic field.
23. The method according to claim 22, wherein the step (a) for preparing nanoparticles is carried out in a gas phase or a liquid phase
24. The method according to claim 22, wherein the step (a) for preparing nanoparticles is carried out by pyrolysis of a reaction mixture containing a metal precursor and a surfactant or a surfactant-containing solvent at 50-6000C.
25. The method according to claim 24, wherein the metal precursor comprises at least one metal element selected from the group consisting of transition metal elements, Lanthanide Group elements, Actinide Group elements and Group 13-14 elements.
26. The method according to claim 24, wherein the surfactant is an organic acid, an organic amine, alkane thiol, phosphonic acid, trioctylphosphine oxide, tributyl phosphine, alkyl phosphate, alkyl sulfate or tetraalkylammonium halide.
27. The method according to claim 24, wherein the solvent is an ether-based compound, hydrocarbon, organic acid, organic amine or alkane thiol.
28. The method according to claim 24, wherein the nanoparticles are size- controlled by adjusting a concentration of the surfactant, an amount of the solvent, a reaction temperature or a reaction time.
29. The method according to claim 24, wherein the method further comprises the step of (a7) trimming a surface of nanoparticles to remove organic materials attached thereon, such that a switching effect of the switching device is enhanced.
30. The method according to claim 29, wherein the trimming is carried out in the presence of an alkali solution.
31. The method according to claim 30, wherein the alkali solution comprises a alkali compound selected from the group consisting of alkylammonium, alkylammonium hydroxide, alkylammonium halide, alkylphosphine, alkylphosphine hydroxide and alkylphosphine halide [wherein alkyl is CnH2n+I (0<n<5)].
32. The method according to claim 29, wherein the trimming is carried out by sonication.
33. The method according to claim 22, wherein the formation of the nanoparticle assembly is carried out by pressing, LB (Langmuir Blodgett), LBL (layer by layer), print, self-assembly or solution evaporation.
34. The method according to claim 33, wherein the formation of the nanoparticle assembly is carried out by pressing under a pressure of more than 100 Pa.
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US20140184380A1 (en) * | 2010-11-26 | 2014-07-03 | Varun Aggarwal | Multi-state memory resistor device and methods for making thereof |
WO2017069837A3 (en) * | 2015-08-14 | 2017-07-13 | Washington University | Engineered nanoparticles for aqueous applications |
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