WO2010050679A3 - Imprinting apparatus - Google Patents
Imprinting apparatus Download PDFInfo
- Publication number
- WO2010050679A3 WO2010050679A3 PCT/KR2009/005687 KR2009005687W WO2010050679A3 WO 2010050679 A3 WO2010050679 A3 WO 2010050679A3 KR 2009005687 W KR2009005687 W KR 2009005687W WO 2010050679 A3 WO2010050679 A3 WO 2010050679A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- press
- substrate
- stamp
- press plate
- elastic
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C43/3642—Bags, bleeder sheets or cauls for isostatic pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
- B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
- B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C2043/3205—Particular pressure exerting means for making definite articles
- B29C2043/3222—Particular pressure exerting means for making definite articles pressurized gas, e.g. air
- B29C2043/3233—Particular pressure exerting means for making definite articles pressurized gas, e.g. air exerting pressure on mould parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C43/3642—Bags, bleeder sheets or cauls for isostatic pressing
- B29C2043/3647—Membranes, diaphragms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C43/3642—Bags, bleeder sheets or cauls for isostatic pressing
- B29C2043/3652—Elastic moulds or mould parts, e.g. cores or inserts
Landscapes
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Abstract
The present invention relates to an imprinting apparatus for imprinting a pattern on a substrate using a stamp. More particularly, the present invention relates to an imprinting apparatus which prevents slippage and enables pressure to be uniformly applied when the stamp and the substrate are stacked into a layer and pressed, thereby improving the characteristics of the pattern imprinted on the substrate. To this end, the imprinting apparatus according to the present invention comprises a press housing having a bottom surface with an opening, an elastic press plate arranged to seal the opening, and made of an elastic material, an assistant press plate which is fixed onto an upper surface of the elastic press plate, and which has an upper surface on which the stamp and the substrate are stacked, and which is made of a hard material, and a press chamber which includes an exhaust pipe arranged at a side surface of the press housing, and an exhaust pump connected to the exhaust pipe, to discharge air from the inside of the press housing to the outside. The elastic press plate moves upward when air is discharged from the inside of the press housing to the outside, to thereby enable the stamp and the substrate to be tightly pressed against each other by the assistant press plate and an upper surface of the press housing.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080106293A KR101023440B1 (en) | 2008-10-29 | 2008-10-29 | Imprinting apparatus |
KR10-2008-0106293 | 2008-10-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010050679A2 WO2010050679A2 (en) | 2010-05-06 |
WO2010050679A3 true WO2010050679A3 (en) | 2010-07-22 |
Family
ID=42129411
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2009/005687 WO2010050679A2 (en) | 2008-10-29 | 2009-10-06 | Imprinting apparatus |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101023440B1 (en) |
WO (1) | WO2010050679A2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102441988B (en) * | 2010-10-14 | 2015-09-09 | 晟铭电子科技股份有限公司 | Multiple field isostactic pressing mould and isostactic pressing method thereof |
CN106094429B (en) * | 2016-08-19 | 2019-11-05 | 京东方科技集团股份有限公司 | Imprinting apparatus and its working method |
WO2021197640A1 (en) * | 2020-04-03 | 2021-10-07 | Astraveus | Molding apparatus and method for embossing a raw material |
KR102637392B1 (en) * | 2020-10-01 | 2024-02-15 | 신에츠 엔지니어링 가부시키가이샤 | Microstructure manufacturing apparatus and microstructure manufacturing method |
KR102693286B1 (en) * | 2021-11-16 | 2024-08-08 | 주식회사 세이텍스 | Normal pressure exposure apparatus of material for secondary battery |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050049302A (en) * | 2003-11-19 | 2005-05-25 | 엔엔디 주식회사 | Imprinting device and substrate holding device thereof |
KR20080046474A (en) * | 2006-11-22 | 2008-05-27 | 주식회사 에이디피엔지니어링 | Apparatus for forming a nano-pattern and method using the same |
KR20080088238A (en) * | 2007-03-29 | 2008-10-02 | 삼성전자주식회사 | Mold and apparatus for forming a pattern, and method for forming the pattern |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100544603B1 (en) | 2003-07-24 | 2006-01-23 | 엔엔디 주식회사 | imprinting substrate holding device and imprinting device |
US7695667B2 (en) * | 2006-03-01 | 2010-04-13 | Hitachi Global Storage Technologies Netherlands B.V. | Method and apparatus for separating a stamper from a patterned substrate |
-
2008
- 2008-10-29 KR KR1020080106293A patent/KR101023440B1/en not_active IP Right Cessation
-
2009
- 2009-10-06 WO PCT/KR2009/005687 patent/WO2010050679A2/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050049302A (en) * | 2003-11-19 | 2005-05-25 | 엔엔디 주식회사 | Imprinting device and substrate holding device thereof |
KR20080046474A (en) * | 2006-11-22 | 2008-05-27 | 주식회사 에이디피엔지니어링 | Apparatus for forming a nano-pattern and method using the same |
KR20080088238A (en) * | 2007-03-29 | 2008-10-02 | 삼성전자주식회사 | Mold and apparatus for forming a pattern, and method for forming the pattern |
Also Published As
Publication number | Publication date |
---|---|
KR101023440B1 (en) | 2011-03-24 |
WO2010050679A2 (en) | 2010-05-06 |
KR20100047416A (en) | 2010-05-10 |
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