WO2010050679A2 - Imprinting apparatus - Google Patents

Imprinting apparatus Download PDF

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Publication number
WO2010050679A2
WO2010050679A2 PCT/KR2009/005687 KR2009005687W WO2010050679A2 WO 2010050679 A2 WO2010050679 A2 WO 2010050679A2 KR 2009005687 W KR2009005687 W KR 2009005687W WO 2010050679 A2 WO2010050679 A2 WO 2010050679A2
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WO
WIPO (PCT)
Prior art keywords
substrate
housing
stamp
compression
imprinting apparatus
Prior art date
Application number
PCT/KR2009/005687
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French (fr)
Korean (ko)
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WO2010050679A3 (en
Inventor
곽신웅
Original Assignee
에이피시스템 주식회사
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Publication of WO2010050679A2 publication Critical patent/WO2010050679A2/en
Publication of WO2010050679A3 publication Critical patent/WO2010050679A3/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/003Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/36Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/3642Bags, bleeder sheets or cauls for isostatic pressing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B29C2043/023Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
    • B29C2043/025Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C2043/3205Particular pressure exerting means for making definite articles
    • B29C2043/3222Particular pressure exerting means for making definite articles pressurized gas, e.g. air
    • B29C2043/3233Particular pressure exerting means for making definite articles pressurized gas, e.g. air exerting pressure on mould parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/36Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/3642Bags, bleeder sheets or cauls for isostatic pressing
    • B29C2043/3647Membranes, diaphragms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/36Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/3642Bags, bleeder sheets or cauls for isostatic pressing
    • B29C2043/3652Elastic moulds or mould parts, e.g. cores or inserts

Definitions

  • the present invention relates to an imprinting apparatus for imprinting a pattern on a substrate by using a stamp.
  • the present invention relates to imprinting a substrate by applying a pressure to the laminated stamp and the substrate to prevent slipping and to apply a uniform pressure.
  • the present invention relates to an imprinting apparatus capable of improving the characteristics of a pattern.
  • Nanotechnology is a technology that produces and utilizes nanometer-sized materials, structures, instruments, machines and devices.
  • Nanotechnology is a basic technology that realizes information technology (IT) and biotechnology (BT). Applied technology is closely related to nanotechnology.
  • a key technology in nanotechnology with the above meaning is nanoprocess technology that enables the production and utilization of nanometer-sized materials and devices, and lithography technology that forms nanometer-sized ultra-fine patterns. Yes.
  • Optical lithography techniques have been mainly used as lithography techniques for forming fine patterns.
  • the optical lithography technique is excellent for forming micron-sized patterns having a size of 100 nm or more, but has a limitation in forming ultra-fine nanopatterns having a size of less than that.
  • X-ray lithography electron beam lithography, proximal lithography, nanoimprinting lithography, and the like have been proposed as an alternative to optical lithography.
  • nano-imprinting lithography technology can easily form nano-patterns, can be mass-produced, and can be used to form micrometer-sized patterns as well as advantages of high process yield. It is in the limelight as an alternative lithography technology.
  • the stamp 10 is placed on the upper side of the substrate 20 in the state where the stamp 10 is placed on the substrate ( After pressing the upper surface of 20), as shown in (b) of Figure 1 includes the step of separating the stamp 10 from the substrate 20.
  • the stamp 10 includes a substrate 11 for a stamp and a pattern structure 12 having a nanometer or micrometer size formed under the stamp 11, and the substrate 20 has a base substrate 21 and a polymer formed thereon. (22).
  • the pattern structure 12 generally uses silicon oxide (SiOx), and the polymer 22 is made of polymethyl meta.
  • SiOx silicon oxide
  • the pattern 23 corresponding to the pattern structure 12 of the stamp 10 is formed on the polymer 22 formed on the upper surface of the substrate 20.
  • the base substrate 21 is etched using the cured polymer 22 as a mask by irradiating light such as ultraviolet rays to the polymer 22 in which the pattern 23 is imprinted and thus imprinted. To be able.
  • the upper surface is provided with a transparent plate 120, the lower surface is an elastic plate 130 is formed, and the substrate supporting assembly structure 100 on which the exhaust pipe 111 is formed is presented.
  • the elastic plate 130 is elastically bent as shown in FIG. 2 (b), and the stamp 10 placed on the upper portion of the elastic plate 130 and The substrate 20 is pressed together by the stamp 10 and the transparent plate 120, so that the stamp 10 and the substrate 20 can be stably squeezed in a state aligned in position.
  • the ultraviolet light emitted from the outside by using the stamp substrate 11 as a transparent material sequentially passes through the transparent plate 120 and the stamp substrate 11 to be irradiated to the polymer 22 having the pattern 23 formed thereon. By doing so, the polymer 22 is cured.
  • the present invention has been proposed to solve the problems described above, by applying a pressure to the laminated stamp and the substrate to prevent the slip, as well as to apply a uniform pressure, the characteristics of the pattern imprinted on the substrate It is an object of the present invention to provide an imprinting apparatus that can be improved.
  • the imprinting apparatus comprises: an imprinting apparatus for imprinting a pattern on a substrate by using a stamp, the imprinting apparatus comprising: a crimp housing having an opening formed at a bottom thereof; A compression elastic plate which is installed to seal the opening and is made of an elastic material; An auxiliary pressing plate fixed to an upper side of the pressing elastic plate and placed in a state where the stamp and the substrate are stacked, and made of a hard material; An exhaust pipe installed on a side of the compression housing to discharge air inside the compression housing to the outside; And an exhaust pump connected to the exhaust pipe, wherein when the air inside the compression housing is discharged to the outside, the compression elastic plate rises, such that the stamp and the substrate are formed on the auxiliary compression plate and the compression housing. It is characterized by being pressed to each other by the surface.
  • the auxiliary pressing plate is preferably made of a ceramic material.
  • the auxiliary pressing plate is preferably made of a metal material.
  • the upper surface of the crimp housing is preferably made of a transparent plate through which light is transmitted.
  • the pressure chamber may further include a pressure chamber coupled to a lower side of the compression chamber, the pressure chamber including: a pressure housing having an opening formed on an upper surface thereof to expose a compression elastic plate installed on a bottom surface of the compression housing; A supply pipe installed at a side of the pressure housing so that outside air is supplied into the pressure housing; And a supply pump installed in the supply pipe, it is preferable that the outside air supplied into the pressure housing presses the compression elastic plate from the bottom up.
  • the imprinting apparatus of the present invention applies pressure to the stacked stamp and the substrate, thereby compressing the stamp and the substrate by the auxiliary pressing plate, thereby preventing slip and of course uniform pressure. Therefore, it is possible to improve the characteristics of the pattern imprinted on the substrate.
  • 1 is an operational state diagram showing an imprinting lithography process using a general stamp and substrate.
  • Figure 2 is a schematic configuration diagram showing an imprinting apparatus according to the prior art.
  • FIG 3 is a view showing a pattern produced by the imprinting apparatus according to the prior art.
  • FIG. 4 is a schematic configuration diagram showing an imprinting apparatus according to the present invention.
  • the coupling structure of the pressing chamber itself, the coupling structure of the pressing chamber itself, or the coupling structure of the pressing chamber and the pressing chamber (such as a fastening bolt or a connecting frame) and a transfer device for a stamp and a substrate will be described below. Omit it.
  • Figure 4 is a schematic configuration diagram showing an imprinting apparatus according to the present invention
  • Figure 4 is an operating state diagram of the imprinting apparatus according to the present invention.
  • the stamp 10 and the substrate 20 as shown in Figure 1 is placed largely and the stamp 10 and the substrate 20 is crimped
  • the pressing chamber 200 and the pressure chamber 300 coupled to the lower portion of the pressing chamber 200 to assist the pressing of the stamp 10 and the substrate 20 is included.
  • the crimp housing 210 constituting the body of the crimping chamber 200 has an opening formed on the bottom surface, the hollow portion in which the stamp 10 and the substrate 20 of FIG. It is.
  • the opening formed on the bottom surface of the crimping housing 210 is provided with a crimp elastic plate 230 made of an elastic material to seal the opening.
  • auxiliary pressing plate 240 is fixed to the upper side of the pressing elastic plate 230, the auxiliary pressing plate 240 is coupled horizontally with the pressing elastic plate 230.
  • the auxiliary pressing plate 240 is to prevent slipping with the substrate 20 and the stamp 10 that are placed on the upper portion of the auxiliary pressing plate 240 and to uniformly compress the entire bottom surface of the substrate 20. Is done.
  • a ceramic material such as silicon, a metal material such as nickel or stainless may be used as a hard material used as the material of the auxiliary pressing plate 240.
  • an exhaust pipe 211 is installed at a side of the crimping housing 210, and the exhaust pipe 211 has one end side of the crimping housing 210 to provide a passage through which air inside the crimping housing 210 is discharged to the outside. It is installed in communication with.
  • the other end of the exhaust pipe 211 is connected to an exhaust pump (not shown) so as to forcibly suck air in the compression housing 210 and discharge it to the outside.
  • the upper surface of the crimping housing 210 is composed of a transparent plate 220 through which light is transmitted, which is a curing light irradiated from an ultraviolet or infrared lamp (L) installed on the outside formed on the upper surface of the substrate 20.
  • L ultraviolet or infrared lamp
  • the stamp substrate 11 constituting the stamp 10 also serves as a transparent substrate so that the curing light can reach the substrate 20 arranged under the stamp 10.
  • the compression elastic plate 230 is raised to align and stack by the auxiliary compression plate 240 and the upper surface of the compression housing 210.
  • the stamp 10 and the substrate 20 can be pressed against each other.
  • the substrate 20 and the stamp 10 in the pressing of the stamp 10 and the substrate 20 as described above, by further providing an auxiliary pressing plate 240 between the substrate 20 and the pressing elastic plate 230, the substrate as in the prior art In addition to preventing slip between the 20 and the elastic plate (see 130 of FIG. 2), the slip between the substrate 20 and the stamp 10 can be prevented accordingly.
  • auxiliary pressing plate 240 made of a cured material such as ceramic or metal uniformly compresses the entire lower surface of the substrate 20, it is possible to prevent a defect of the pattern 23 as described with reference to FIG. 3. do.
  • the present invention further includes a pressing chamber 300 coupled to the lower portion of the pressing housing 210 to assist the pressing of the stamp 10 and the substrate 20. That is, in addition to the method of discharging the air in the compression housing 210 to the outside by an exhaust pipe 211 and an exhaust pump (not shown) installed in the compression housing 210 is further provided with an auxiliary compression means.
  • an opening is formed on an upper surface of the pressure housing 310 constituting the body of the pressure chamber 300. Therefore, the compression elastic plate 230 installed on the bottom surface of the compression housing 210 is exposed to the inside of the pressure housing 310.
  • the supply pipe 310 is installed on the side of the pressure housing 310, the supply pipe 310 has one end connected to the side of the pressure housing 310 so as to provide a passage through which the outside air is sucked into the pressure housing 310. It is installed through.
  • the other end of the supply pipe 310 is installed in connection with a supply pump (not shown) for forcibly supplying outside air into the pressure housing 310.
  • the pressure chamber 300 is an example of being coupled to the lower part of the compression chamber 200, the compression chamber 200, even when installed so as to be located inside the pressure chamber 300, It will be apparent that the compression of the stamp 10 and the substrate 20 can be assisted as well.
  • the auxiliary press plate 240 installed on the lower portion of the crimp housing 210 by transferring the stamp 10 on which the pattern structure 12 is formed and the substrate 20 on which the polymer 22 is formed. Put on top.
  • the stamp 10 and the substrate 20 are stacked and aligned with each other such that the pattern structure 12 faces the polymer 22.
  • an exhaust pump (not shown) is operated to allow air inside the compression housing 210 to be discharged to the outside through the exhaust pipe 211.
  • the stamp 10 and the substrate 20 are compressed to each other by the upper surface of the elastically elevated auxiliary pressing plate 240 and the fixed pressing housing 210, that is, the transparent plate 220.
  • the pattern 23 is carved out by the polymer 22 of.
  • the present invention compared to the prior art directly press the stamp 10 and the substrate 20 by the elastic body plate (see 130 of FIG. 1), the auxiliary pressing plate of a hard material provided on the pressing elastic plate 230 Since the stamp 10 compresses the stamp 10 and the substrate 20 by using the 240, the accurate pattern 23 may be imprinted on the accurate substrate 20 by uniformly compressing the entire substrate 20 as well as preventing slip. Make sure
  • a supply pump (not shown) installed in the pressure housing 310 is also operated.
  • the outside air is forcibly supplied by the feed pump, the pressure inside the pressurized housing 310 is increased by the outside air forced into the pressurized housing 310 through the supply pipe 310, and the exposed pressure is exposed through the opening.
  • the elastic plate 230 is pushed upward from the bottom.
  • the ultraviolet lamp L installed outside is turned on.
  • the substrate 20 is transferred to a dry etching apparatus, a wet etching apparatus, or other etching apparatus using a transfer apparatus, and the etching process is completed, thereby completing the process.
  • Imprinting apparatus of the present invention by applying a pressure to the laminated stamp and the substrate to prevent the slip during compression, as well as to apply a uniform pressure, thereby improving the characteristics of the pattern imprinted on the substrate, nanometer or It enables the development of the micrometer industry.

Abstract

The present invention relates to an imprinting apparatus for imprinting a pattern on a substrate using a stamp. More particularly, the present invention relates to an imprinting apparatus which prevents slippage and enables pressure to be uniformly applied when the stamp and the substrate are stacked into a layer and pressed, thereby improving the characteristics of the pattern imprinted on the substrate. To this end, the imprinting apparatus according to the present invention comprises a press housing having a bottom surface with an opening, an elastic press plate arranged to seal the opening, and made of an elastic material, an assistant press plate which is fixed onto an upper surface of the elastic press plate, and which has an upper surface on which the stamp and the substrate are stacked, and which is made of a hard material, and a press chamber which includes an exhaust pipe arranged at a side surface of the press housing, and an exhaust pump connected to the exhaust pipe, to discharge air from the inside of the press housing to the outside. The elastic press plate moves upward when air is discharged from the inside of the press housing to the outside, to thereby enable the stamp and the substrate to be tightly pressed against each other by the assistant press plate and an upper surface of the press housing.

Description

[규칙 제26조에 의한 보정 21.10.2009] 임프린팅 장치[Correction according to Rule 26. 21.10.2009] Imprinting device
본 발명은 스탬프를 이용하여 기판에 패턴을 임프린트하는 임프린팅 장치에 관한 것으로, 특히 적층된 스탬프와 기판에 압력을 가하여 압착시, 슬립을 방지함은 물론 균일한 압력이 가해지도록 함으로써, 기판에 임프린트된 패턴의 특성을 향상시킬 수 있는 임프린팅 장치에 관한 것이다.The present invention relates to an imprinting apparatus for imprinting a pattern on a substrate by using a stamp. In particular, the present invention relates to imprinting a substrate by applying a pressure to the laminated stamp and the substrate to prevent slipping and to apply a uniform pressure. The present invention relates to an imprinting apparatus capable of improving the characteristics of a pattern.
나노미터 크기의 패턴을 형성하기 위한 기술은 흔히 나노기술(nano technology : NT)이라고 일컬어진다. 나노기술은 나노미터 크기의 소재, 구조, 기구, 기계 및 소자 등을 생산하고 활용하는 기술이다. The technique for forming nanometer-sized patterns is often referred to as nanotechnology (NT). Nanotechnology is a technology that produces and utilizes nanometer-sized materials, structures, instruments, machines and devices.
일반적으로 100㎚ 이하의 크기를 가지는 소재나 소자 등이 나노기술의 범주에 속하게 되는데, 나노기술은 정보기술(IT)과 생명공학기술(BT)을 실현시키는 기초기반기술로서 대부분의 생산, 가공 및 응용기술은 나노기술과 밀접한 관계를 가지고 있다.In general, materials and devices having a size of 100 nm or less fall into the category of nanotechnology. Nanotechnology is a basic technology that realizes information technology (IT) and biotechnology (BT). Applied technology is closely related to nanotechnology.
위와 같은 의미를 가지는 나노기술에 있어서 핵심적인 기술은 나노미터 크기의 소재나 소자 등을 생산하고 활용할 수 있도록 하는 나노공정기술로서, 나노미터 크기의 초극미세 패턴을 형성하는 리소그라피(lithography) 기술이 그에 해당된다.A key technology in nanotechnology with the above meaning is nanoprocess technology that enables the production and utilization of nanometer-sized materials and devices, and lithography technology that forms nanometer-sized ultra-fine patterns. Yes.
미세패턴을 형성하기 위한 리소그라피 기술로서 광학적 리소그라피 기술이 주로 사용되어 왔다. 그러나, 광학적 리소그라피 기술은 100㎚ 크기 이상의 마이크론 크기의 미세패턴 형성에는 탁월하나, 그 이하의 크기를 갖는 초극미세의 나노패턴 형성에는 한계가 있었다.Optical lithography techniques have been mainly used as lithography techniques for forming fine patterns. However, the optical lithography technique is excellent for forming micron-sized patterns having a size of 100 nm or more, but has a limitation in forming ultra-fine nanopatterns having a size of less than that.
이에, 광학적 리소그라피 기술을 대신하여 엑스선 리소그라피 기술, 전자빔 리소그라피 기술, 프락시멀 리소그라피 기술 및 나노 임프린팅 리소그라피 기술 등이 광학적 리소그라피 기술의 대안으로 제시되고 있다.Accordingly, X-ray lithography, electron beam lithography, proximal lithography, nanoimprinting lithography, and the like have been proposed as an alternative to optical lithography.
이 중 나노 임프린팅 리소그라피 기술은 나노 패턴을 용이하게 형성할 수 있고, 대량 생산이 가능하여 공정 수율이 높은 장점이 있음은 물론 마이크로미터 크기의 패턴을 형성하기 위해 사용될 수도 있어서, 최근 광학적 리소그라피 기술을 대신할 리소그라피 기술로서 각광을 받고 있다.Among these, nano-imprinting lithography technology can easily form nano-patterns, can be mass-produced, and can be used to form micrometer-sized patterns as well as advantages of high process yield. It is in the limelight as an alternative lithography technology.
즉, 임프린팅 리소그라피 공정은, 도 1의 (a)를 통해 알 수 있는 바와 같이, 스탬프(stamp, 10)를 기판(20)의 상부측에 위치시킨 상태에서, 상기 스탬프(10)가 기판(20)의 상부면을 압착한 다음, 도 1의 (b)와 같이 스탬프(10)를 기판(20)으로부터 분리하는 공정을 포함한다.That is, in the imprinting lithography process, as can be seen through (a) of FIG. 1, the stamp 10 is placed on the upper side of the substrate 20 in the state where the stamp 10 is placed on the substrate ( After pressing the upper surface of 20), as shown in (b) of Figure 1 includes the step of separating the stamp 10 from the substrate 20.
이때, 스탬프(10)는 스탬프용 기판(11)과 그 하부에 형성된 나노미터 혹은 마이크로미터 크기의 패턴 구조(12)를 포함하고, 기판(20)은 베이스 기판(21)과 그 상부에 형성된 폴리머(22)를 포함한다.In this case, the stamp 10 includes a substrate 11 for a stamp and a pattern structure 12 having a nanometer or micrometer size formed under the stamp 11, and the substrate 20 has a base substrate 21 and a polymer formed thereon. (22).
또한, 스탬프용 기판(11)과 베이스 기판(21)은 가공이 용이한 실리콘 기판이 많이 사용되고, 패턴 구조(12)는 일반적으로 실리콘 산화물(SiOx)이 사용되며, 폴리머(22)는 폴리메틸메타크릴레이트(PMMA)나, 열가소성 수지 혹은 그외 자외선에 의해 폴리머화되는 각종 수지 등이 사용된다.In the stamp substrate 11 and the base substrate 21, a silicon substrate which is easy to process is used a lot, and the pattern structure 12 generally uses silicon oxide (SiOx), and the polymer 22 is made of polymethyl meta. A methacrylate (PMMA), a thermoplastic resin, various resins polymerized by ultraviolet rays, etc. are used.
따라서, 이상과 같이 스탬프(10)를 이용하여 기판(20)을 압착하면, 기판(20)의 상면에 형성된 폴리머(22)에 스탬프(10)의 패턴 구조(12)에 대응하는 패턴(23)이 각인되고, 이와 같이 패턴(23)이 각인된 폴리머(22)에 자외선 등의 빛을 조사하여 경화시킴으로써, 경화된 폴리머(22)를 마스크(mask)로 이용하여 베이스 기판(21)을 식각할 수 있게 한다.Therefore, when the substrate 20 is pressed using the stamp 10 as described above, the pattern 23 corresponding to the pattern structure 12 of the stamp 10 is formed on the polymer 22 formed on the upper surface of the substrate 20. The base substrate 21 is etched using the cured polymer 22 as a mask by irradiating light such as ultraviolet rays to the polymer 22 in which the pattern 23 is imprinted and thus imprinted. To be able.
한편, 이상과 같이 스탬프(10)를 이용해 기판(20)을 압착시, 스탬프(10)와 기판(20)의 위치가 정확히 정렬된 상태로 압착하지 않으면, 나노미터 혹은 마이크로미터 단위의 패턴(23)을 요구하는 임프린팅 리소그라피 공정에 있어서 치명적인 결함으로 작용한다. On the other hand, when pressing the substrate 20 using the stamp 10 as described above, if the stamp 10 and the position of the substrate 20 is not crimped in a precisely aligned state, the pattern in nanometer or micrometer unit 23 It is a fatal defect in an imprinting lithography process that requires
이에, 공개특허 제2005-49302호 '임프린팅 장치 및 기판 지지장치'에서는 도 2의 (a)를 통해 알 수 있는 바와 같이, 상부면에는 투명판(120)이 설치되고, 하부면에는 탄성체판(130)이 형성되며, 측면에는 배기관(111)이 형성된 기판지지 어샘블리 구조(100)를 제시하고 있다.Thus, in Patent Publication No. 2005-49302 'Imprinting apparatus and substrate support device', as can be seen through Figure 2 (a), the upper surface is provided with a transparent plate 120, the lower surface is an elastic plate 130 is formed, and the substrate supporting assembly structure 100 on which the exhaust pipe 111 is formed is presented.
따라서, 배기관(111)을 통해 내부의 공기를 외부로 배출시키면, 도 2의 (b)와 같이 탄성체판(130)이 탄력적으로 휘면서, 탄성체판(130)의 상부에 놓인 스탬프(10)와 기판(20)이 상기 스탬프(10)와 투명판(120)에 의해 서로 압착되도록 함으로써, 스탬프(10)와 기판(20)이 정위치에 정렬된 상태에서 안정적으로 압착될 수 있도록 하고 있다.Therefore, when the internal air is discharged to the outside through the exhaust pipe 111, the elastic plate 130 is elastically bent as shown in FIG. 2 (b), and the stamp 10 placed on the upper portion of the elastic plate 130 and The substrate 20 is pressed together by the stamp 10 and the transparent plate 120, so that the stamp 10 and the substrate 20 can be stably squeezed in a state aligned in position.
또한, 스탬프용 기판(11)을 투명한 재질로 하여 외부로부터 조사된 자외선 빛이 투명판(120) 및 스탬프용 기판(11)을 순차적으로 통과해서 패턴(23)이 형성된 폴리머(22)에 조사되도록 함으로써 상기 폴리머(22)가 경화되도록 하고 있다.In addition, the ultraviolet light emitted from the outside by using the stamp substrate 11 as a transparent material sequentially passes through the transparent plate 120 and the stamp substrate 11 to be irradiated to the polymer 22 having the pattern 23 formed thereon. By doing so, the polymer 22 is cured.
그러나, 이상과 같은 구성에 의하면, 실제로는 탄성체판(130)이 탄력적으로 휘면서 스탬프(10)와 기판(20)을 압착하므로, 탄성체판(130)과 기판(20)사이에 슬립(slip)이 발생함은 물론, 그에 따라 자연히 스탬프(10)와 기판(20) 사이에도 슬립이 발생하여 패턴(23)이 정확하게 형성되지 않는다는 문제점이 있었다.However, according to the above configuration, since the elastic plate 130 is elastically bent, the stamp 10 and the substrate 20 are squeezed and thus, a slip is formed between the elastic plate 130 and the substrate 20. This, of course, naturally caused a slip between the stamp 10 and the substrate 20, thereby causing a problem that the pattern 23 was not accurately formed.
또한, 도 3의 (a)를 통해 알 수 있는 바와 같이, 탄성체판(130)이 탄력적으로 휘는 과정에서 당해 탄성체판(130) 전체가 균일하게 휘지 않고 일정 경사(S)를 가지고 휘어서, 베이스 기판(21) 상부의 폴리머(22)에 형성된 패턴(23)도 일정 경사를 따라 형성된다는 문제점이 있었다.In addition, as can be seen through (a) of Figure 3, in the process of elastic bending of the elastic plate 130, the entire elastic plate 130 is not uniformly bent with a predetermined slope (S), the base substrate (21) There was a problem that the pattern 23 formed on the polymer 22 on the upper side was also formed along a predetermined slope.
나아가, 도 3의 (b)를 통해 알 수 있는 바와 같이, 탄성체판(130)이 일정 경사를 가지고 휘지 않는다 하여도, 탄성체판(130) 자체의 돌기나 첨두부 혹은 탄성체판(130)이 탄력적으로 휘는 과정에서 국부적인 부분이 더 휨에 따라, 패턴(23)에 있어서는 안되는 요철부(24)가 발생한다는 문제점이 있었다.Furthermore, as can be seen through (b) of Figure 3, even if the elastic plate 130 does not bend with a certain inclination, the projections or peaks of the elastic plate 130 itself or the elastic plate 130 is elastic There was a problem that the uneven portion 24, which should not be in the pattern 23, occurred as the local portion was bent further in the bending process.
본 발명은 전술한 바와 같은 문제점을 해결하기 위해 제안된 것으로, 적층된 스탬프와 기판에 압력을 가하여 압착시, 슬립을 방지함은 물론 균일한 압력이 가해지도록 함으로써, 기판에 임프린트된 패턴의 특성을 향상시킬 수 있는 임프린팅 장치를 제공하고자 한다.The present invention has been proposed to solve the problems described above, by applying a pressure to the laminated stamp and the substrate to prevent the slip, as well as to apply a uniform pressure, the characteristics of the pattern imprinted on the substrate It is an object of the present invention to provide an imprinting apparatus that can be improved.
이를 위해, 본 발명에 따른 임프린팅 장치는, 스탬프를 이용하여 기판에 패턴을 임프린트하는 임프린팅 장치에 있어서, 바닥면에 개방부가 형성된 압착 하우징과; 상기 개방부를 밀폐시키도록 설치되며, 탄성 재질로 이루어진 압착 탄성판과; 상기 압착 탄성판의 상측면에 고정되고, 상기 스탬프와 기판이 적층된 상태로 놓여지며, 경질 소재로 이루어진 보조 압착판과; 상기 압착 하우징 내부의 공기를 외부로 배출하도록, 상기 압착 하우징의 측면에 설치된 배기관; 및 상기 배기관에 연결된 배기 펌프;로 이루어진 압착챔버를 포함하여, 상기 압착 하우징 내부의 공기가 외부로 배출시, 상기 압착 탄성판이 상승함으로써, 상기 스탬프와 기판이 상기 보조 압착판과 상기 압착 하우징의 상부면에 의해 서로 압착되는 것을 특징으로 한다.To this end, the imprinting apparatus according to the present invention comprises: an imprinting apparatus for imprinting a pattern on a substrate by using a stamp, the imprinting apparatus comprising: a crimp housing having an opening formed at a bottom thereof; A compression elastic plate which is installed to seal the opening and is made of an elastic material; An auxiliary pressing plate fixed to an upper side of the pressing elastic plate and placed in a state where the stamp and the substrate are stacked, and made of a hard material; An exhaust pipe installed on a side of the compression housing to discharge air inside the compression housing to the outside; And an exhaust pump connected to the exhaust pipe, wherein when the air inside the compression housing is discharged to the outside, the compression elastic plate rises, such that the stamp and the substrate are formed on the auxiliary compression plate and the compression housing. It is characterized by being pressed to each other by the surface.
이때, 상기 보조 압착판은 세라믹 재질로 이루어져 있는 것이 바람직하다.At this time, the auxiliary pressing plate is preferably made of a ceramic material.
또한, 상기 보조 압착판은 금속 재질로 이루어져 있는 것이 바람직하다.In addition, the auxiliary pressing plate is preferably made of a metal material.
또한, 상기 압착 하우징의 상부면은 빛이 투과되는 투명판으로 이루어져 있는 것이 바람직하다.In addition, the upper surface of the crimp housing is preferably made of a transparent plate through which light is transmitted.
또한, 상기 압착 챔버의 하측에 결합된 가압 챔버를 더 포함하되, 상기 가압 챔버는, 상기 압착 하우징의 바닥면에 설치된 압착 탄성판이 노출되도록, 상부면에 개방부가 형성되어 있는 가압 하우징과; 상기 가압 하우징 내부로 외기가 공급되도록, 상기 가압 하우징의 측면에 설치된 공급관; 및 상기 공급관에 설치된 공급 펌프를 포함하여, 상기 가압 하우징 내부로 공급된 외기가 상기 압착 탄성판을 아래에서 위로 가압하는 것이 바람직하다.The pressure chamber may further include a pressure chamber coupled to a lower side of the compression chamber, the pressure chamber including: a pressure housing having an opening formed on an upper surface thereof to expose a compression elastic plate installed on a bottom surface of the compression housing; A supply pipe installed at a side of the pressure housing so that outside air is supplied into the pressure housing; And a supply pump installed in the supply pipe, it is preferable that the outside air supplied into the pressure housing presses the compression elastic plate from the bottom up.
이상과 같은 본 발명의 임프린팅 장치는 적층된 스탬프와 기판에 압력을 가하여 압착시, 보조 압착판에 의해 스탬프와 기판을 압착함으로써, 슬립을 방지함은 물론 균일한 압력이 가해지도록 한다. 따라서, 기판에 임프린트된 패턴의 특성을 향상시킬 수 있게 한다.As described above, the imprinting apparatus of the present invention applies pressure to the stacked stamp and the substrate, thereby compressing the stamp and the substrate by the auxiliary pressing plate, thereby preventing slip and of course uniform pressure. Therefore, it is possible to improve the characteristics of the pattern imprinted on the substrate.
도 1은 일반적인 스탬프 및 기판을 사용한 임프린팅 리소그라피 공정을 나타낸 동작 상태도이다.1 is an operational state diagram showing an imprinting lithography process using a general stamp and substrate.
도 2는 종래 기술에 따른 임프린팅 장치를 나타낸 개략 구성도이다.Figure 2 is a schematic configuration diagram showing an imprinting apparatus according to the prior art.
도 3은 종래 기술에 따른 임프린팅 장치를 통해 제작된 패턴을 나타낸 도이다.3 is a view showing a pattern produced by the imprinting apparatus according to the prior art.
도 4는 본 발명에 따른 임프린팅 장치를 나타낸 개략 구성도이다.4 is a schematic configuration diagram showing an imprinting apparatus according to the present invention.
[규칙 제91조에 의한 정정 11.11.2009] 
도 5는 본 발명에 따른 임프린팅 장치의 동작 상태도이다.
[Correction under Rule 91 11.11.2009]
5 is an operational state diagram of the imprinting apparatus according to the present invention.
이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예에 따른 임프린팅 장치에 대해 상세히 설명하도록 한다.Hereinafter, an imprinting apparatus according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.
단, 이하에서는 후술할 압착 챔버 자체의 결합구조, 가압 챔버 자체의 결합구조, 혹은 압착 챔버와 가압 챔버의 결합구조(체결 볼트 혹은 연결 프레임 등) 및 스탬프와 기판을 위한 이송장치 등에 대한 구체적인 설명은 생략하도록 한다.However, hereinafter, the coupling structure of the pressing chamber itself, the coupling structure of the pressing chamber itself, or the coupling structure of the pressing chamber and the pressing chamber (such as a fastening bolt or a connecting frame) and a transfer device for a stamp and a substrate will be described below. Omit it.
즉, 이러한 구조들은 구체적인 설명이 없어도 당업자 수준에서 극히 용이하게 실시할 수 있는 것임은 물론, 상술한 공개특허 제2005-49302호 등에 자세히 기재되어 있으므로 그에 대한 구체적인 설명은 생략하도록 한다.That is, these structures can be carried out at the level of ordinary skill in the art even without a detailed description, and are described in detail in the aforementioned Patent Publication No. 2005-49302 and the like, and thus detailed description thereof will be omitted.
도 4는 본 발명에 따른 임프린팅 장치를 나타낸 개략 구성도이고, 도 4는 본 발명에 따른 임프린팅 장치의 동작 상태도이다.Figure 4 is a schematic configuration diagram showing an imprinting apparatus according to the present invention, Figure 4 is an operating state diagram of the imprinting apparatus according to the present invention.
먼저, 도 4를 통해 알 수 있는 바와 같이, 본 발명에 따른 임프린팅 장치는, 크게 도 1과 같은 스탬프(10)와 기판(20)이 놓여지며 당해 스탬프(10)와 기판(20)의 압착이 이루어지는 압착 챔버(200) 및 상기 압착 챔버(200)의 하부에 결합되어 상기 스탬프(10)와 기판(20)의 압착을 보조하는 가압 챔버(300)를 포함한다.First, as can be seen through Figure 4, in the imprinting apparatus according to the present invention, the stamp 10 and the substrate 20 as shown in Figure 1 is placed largely and the stamp 10 and the substrate 20 is crimped The pressing chamber 200 and the pressure chamber 300 coupled to the lower portion of the pressing chamber 200 to assist the pressing of the stamp 10 and the substrate 20 is included.
이때, 압착 챔버(200)의 몸체를 구성하는 압착 하우징(210)은 바닥면에 개방부가 형성되어 있으며, 내부 중심측에는 도 1의 스탬프(10) 및 기판(20)이 수납될 수 있는 중공부가 형성되어 있다. At this time, the crimp housing 210 constituting the body of the crimping chamber 200 has an opening formed on the bottom surface, the hollow portion in which the stamp 10 and the substrate 20 of FIG. It is.
또한, 압착 하우징(210)의 바닥면에 형성된 개방부에는 탄성 재질로 이루어진 압착 탄성판(230)이 설치되어 상기 개방부를 밀폐시킬 수 있도록 한다.In addition, the opening formed on the bottom surface of the crimping housing 210 is provided with a crimp elastic plate 230 made of an elastic material to seal the opening.
*또한, 압착 탄성판(230)의 상측면에는 보조 압착판(240)이 고정되는데, 보조 압착판(240)은 상기 압착 탄성판(230)과 수평하게 결합된다.In addition, the auxiliary pressing plate 240 is fixed to the upper side of the pressing elastic plate 230, the auxiliary pressing plate 240 is coupled horizontally with the pressing elastic plate 230.
보조 압착판(240)은 그 상부에 놓여져 압착되는 기판(20) 및 스탬프(10)와의 슬립(slip)을 방지함은 물론 기판(20)의 저면을 전체적으로 균일하게 압착하기 위한 것으로, 경질 소재로 이루어진다.The auxiliary pressing plate 240 is to prevent slipping with the substrate 20 and the stamp 10 that are placed on the upper portion of the auxiliary pressing plate 240 and to uniformly compress the entire bottom surface of the substrate 20. Is done.
보조 압착판(240)의 재질로서 사용되는 경질 소재로는 실리콘과 같은 세라믹 재질이나, 니켈 또는 스테인레스와 같은 금속 재질 등이 사용될 수 있다.As a hard material used as the material of the auxiliary pressing plate 240, a ceramic material such as silicon, a metal material such as nickel or stainless may be used.
또한, 압착 하우징(210)의 측면에는 배기관(211)이 설치되며, 배기관(211)은 압착 하우징(210) 내부의 공기가 외부로 배출되는 통로를 제공하도록, 일단이 압착 하우징(210)의 측면과 연통하여 설치된다.In addition, an exhaust pipe 211 is installed at a side of the crimping housing 210, and the exhaust pipe 211 has one end side of the crimping housing 210 to provide a passage through which air inside the crimping housing 210 is discharged to the outside. It is installed in communication with.
그리고, 이러한 배기관(211)의 타단은 압착 하우징(210) 내부의 공기를 강제로 흡입하여 외부로 배출할 수 있도록 배기 펌프(미도시)가 연결 설치된다. The other end of the exhaust pipe 211 is connected to an exhaust pump (not shown) so as to forcibly suck air in the compression housing 210 and discharge it to the outside.
또한, 압착 하우징(210)의 상부면은 빛이 투과되는 투명판(220)으로 이루어져 있는데, 이는 외부에 설치된 자외선 혹은 적외선 램프(L)로부터 조사된 경화용 빛이 기판(20)의 상면에 형성된 나노미터 혹은 마이크로미터 단위의 패턴(23)이 형성된 폴리머(22)에 조사되도록 하기 위한 것이다.In addition, the upper surface of the crimping housing 210 is composed of a transparent plate 220 through which light is transmitted, which is a curing light irradiated from an ultraviolet or infrared lamp (L) installed on the outside formed on the upper surface of the substrate 20. In order to irradiate the polymer 22 formed with a pattern 23 in nanometer or micrometer units.
물론, 이러한 경우에는 스탬프(10)를 구성하는 스탬프용 기판(11) 역시 투명기판으로 하여 그 하부에 정렬된 기판(20)까지 경화용 빛이 도달할 수 있도록 한다.Of course, in this case, the stamp substrate 11 constituting the stamp 10 also serves as a transparent substrate so that the curing light can reach the substrate 20 arranged under the stamp 10.
따라서, 본 발명은 압착 하우징(210) 내부의 공기가 외부로 배출됨에 따라 압착 탄성판(230)이 상승하여, 보조 압착판(240)과 상기 압착 하우징(210)의 상부면에 의해서 정렬 및 적층된 스탬프(10)와 기판(20)을 서로 압착할 수 있게 한다.Therefore, in the present invention, as the air inside the compression housing 210 is discharged to the outside, the compression elastic plate 230 is raised to align and stack by the auxiliary compression plate 240 and the upper surface of the compression housing 210. The stamp 10 and the substrate 20 can be pressed against each other.
특히, 본 발명은 이상과 같이 스탬프(10)와 기판(20)을 압착함에 있어서, 기판(20)과 압착 탄성판(230) 사이에 보조 압착판(240)을 더 구비함으로써, 종래와 같은 기판(20)과 탄성체판(도 2의 130 참조) 사이의 슬립을 방지함은 물론, 그에 따라 기판(20)과 스탬프(10) 사이의 슬립 역시 방지할 수 있게 한다.In particular, in the present invention, in the pressing of the stamp 10 and the substrate 20 as described above, by further providing an auxiliary pressing plate 240 between the substrate 20 and the pressing elastic plate 230, the substrate as in the prior art In addition to preventing slip between the 20 and the elastic plate (see 130 of FIG. 2), the slip between the substrate 20 and the stamp 10 can be prevented accordingly.
또한, 세라믹이나 금속 등의 경화 재질로 이루어진 보조 압착판(240)이 기판(20)의 하부면 전체를 균일하게 압착하므로, 도 3을 통해 설명한 바와 같은 패턴(23)의 불량을 방지할 수 있게 한다.In addition, since the auxiliary pressing plate 240 made of a cured material such as ceramic or metal uniformly compresses the entire lower surface of the substrate 20, it is possible to prevent a defect of the pattern 23 as described with reference to FIG. 3. do.
한편, 본 발명은 압착 하우징(210)의 하부에 결합되어 스탬프(10)와 기판(20)의 압착을 보조하는 가압 챔버(300)를 더 포함한다. 즉, 압착 하우징(210)에 설치된 배기관(211) 및 배기 펌프(미도시)에 의해 당해 압착 하우징(210) 내부의 공기를 외부로 배출하는 방식 이외에 보조적인 압축 수단을 더 구비한다.On the other hand, the present invention further includes a pressing chamber 300 coupled to the lower portion of the pressing housing 210 to assist the pressing of the stamp 10 and the substrate 20. That is, in addition to the method of discharging the air in the compression housing 210 to the outside by an exhaust pipe 211 and an exhaust pump (not shown) installed in the compression housing 210 is further provided with an auxiliary compression means.
이를 위해서, 가압 챔버(300)의 몸체를 구성하는 가압 하우징(310)의 상부면에는 개방부가 형성되어 있다. 따라서, 압착 하우징(210)의 바닥면에 설치된 압착 탄성판(230)이 당해 가압 하우징(310)의 내부를 향해 노출되도록 한다.To this end, an opening is formed on an upper surface of the pressure housing 310 constituting the body of the pressure chamber 300. Therefore, the compression elastic plate 230 installed on the bottom surface of the compression housing 210 is exposed to the inside of the pressure housing 310.
또한, 가압 하우징(310)의 측면에는 공급관(310)이 설치되며, 공급관(310)은 외기가 가압 하우징(310) 내부로 흡입되는 통로를 제공하도록, 일단이 가압 하우징(310)의 측면과 연통하여 설치된다.In addition, the supply pipe 310 is installed on the side of the pressure housing 310, the supply pipe 310 has one end connected to the side of the pressure housing 310 so as to provide a passage through which the outside air is sucked into the pressure housing 310. It is installed through.
그리고, 이러한 공급관(310)의 타단은 가압 하우징(310) 내부로 외기를 강제로 공급하는 공급 펌프(미도시)와 연결 설치된다. The other end of the supply pipe 310 is installed in connection with a supply pump (not shown) for forcibly supplying outside air into the pressure housing 310.
따라서, 공급 펌프가 동작하여 외기가 가압 하우징(310) 내부로 공급되면, 당해 강제 공급된 외기가 개방부를 통해 압착 탄성판(230)을 아래에서 위로 밀어올리도록 함으로써, 스탬프(10)와 기판(20)의 압축을 보조할 수 있도록 한다.Therefore, when the supply pump is operated and the outside air is supplied into the pressure housing 310, the forced supply of the outside air pushes the compression elastic plate 230 upward from the bottom through the opening portion, whereby the stamp 10 and the substrate ( 20) to aid in compression.
단, 이상에서는 가압 챔버(300)가 압착 챔버(200)의 하부에 결합되어 있는 것을 일 예로 들었으나, 압착 챔버(200) 전체가 가압 챔버(300) 내부에 위치하도록 설치하는 경우에도, 이상과 같이 스탬프(10)와 기판(20)의 압축을 보조할 수 있음은 자명할 것이다.However, in the above, although the pressure chamber 300 is an example of being coupled to the lower part of the compression chamber 200, the compression chamber 200, even when installed so as to be located inside the pressure chamber 300, It will be apparent that the compression of the stamp 10 and the substrate 20 can be assisted as well.
이하, 도 4 및 도 5를 참조하여 본 발명의 바람직한 실시예에 따른 임프린팅 장치의 동작에 대해 설명하도록 한다.Hereinafter, the operation of the imprinting apparatus according to the preferred embodiment of the present invention will be described with reference to FIGS. 4 and 5.
먼저, 도 4와 같이 패턴 구조(12)가 형성되어 있는 스탬프(10) 및 폴리머(22)가 형성되어 있는 기판(20)을 이송하여 압착 하우징(210)의 하부에 설치된 보조 압착판(240) 위에 올려 놓는다. 이때, 스탬프(10)와 기판(20)은 패턴 구조(12)가 폴리머(22)를 향하도록 서로 적층 및 정렬된 상태이다.First, as shown in FIG. 4, the auxiliary press plate 240 installed on the lower portion of the crimp housing 210 by transferring the stamp 10 on which the pattern structure 12 is formed and the substrate 20 on which the polymer 22 is formed. Put on top. In this case, the stamp 10 and the substrate 20 are stacked and aligned with each other such that the pattern structure 12 faces the polymer 22.
스탬프(10)와 기판(20)이 공급되어 압착을 위한 준비가 마쳐지면, 배기 펌프(미도시)를 동작시킴으로써, 배기관(211)을 통해 압착 하우징(210) 내부의 공기가 외부로 배출되도록 한다.When the stamp 10 and the substrate 20 are supplied and ready for compression, an exhaust pump (not shown) is operated to allow air inside the compression housing 210 to be discharged to the outside through the exhaust pipe 211. .
그러면, 도 5와 같이 압착 하우징(210) 내부의 기압이 낮아지면서 탄성 재질로 이루어진 압착 탄성판(230)이 위쪽으로 탄력 상승하고, 그에 따라 압착 탄성판(230) 위에 고정된 보조 압착판(240) 역시 상승하면서, 적층된 스탬프(10)와 기판(20)을 상승시킨다.Then, as shown in FIG. 5, as the pressure inside the compression housing 210 decreases, the compression elastic plate 230 made of an elastic material elastically rises upwards, and thus the auxiliary compression plate 240 fixed on the compression elastic plate 230. ) Also rises, raising the laminated stamp 10 and the substrate 20.
따라서, 탄력적으로 상승된 보조 압착판(240)과 고정된 압착 하우징(210)의 상측면 즉, 투명판(220)에 의해 스탬프(10)와 기판(20)이 서로 압착됨으로써, 기판(20)의 폴리머(22)에 패턴(23)이 각인된다.Accordingly, the stamp 10 and the substrate 20 are compressed to each other by the upper surface of the elastically elevated auxiliary pressing plate 240 and the fixed pressing housing 210, that is, the transparent plate 220. The pattern 23 is carved out by the polymer 22 of.
이때, 본 발명은, 종래 기술이 탄성체판(도 1의 130 참조)에 의해 직접 스탬프(10)와 기판(20)을 압착하였음에 비해, 압착 탄성판(230) 위에 설치된 경질 소재의 보조 압착판(240)에 의해 스탬프(10)와 기판(20)을 압착하므로, 슬립을 방지함은 물론 기판(20) 전체를 균일하게 압착하여 정확한 기판(20)상에 정확한 패턴(23)이 각인될 수 있도록 한다.At this time, the present invention, compared to the prior art directly press the stamp 10 and the substrate 20 by the elastic body plate (see 130 of FIG. 1), the auxiliary pressing plate of a hard material provided on the pressing elastic plate 230 Since the stamp 10 compresses the stamp 10 and the substrate 20 by using the 240, the accurate pattern 23 may be imprinted on the accurate substrate 20 by uniformly compressing the entire substrate 20 as well as preventing slip. Make sure
한편, 이상과 같이 배기 펌프를 동작시켜 압착 하우징(210) 내부의 공기를 흡입시, 가압 하우징(310)에 설치된 공급 펌프(미도시) 역시 동작된다.Meanwhile, when the exhaust pump is operated to suck air in the compression housing 210 as described above, a supply pump (not shown) installed in the pressure housing 310 is also operated.
따라서, 공급 펌프에 의해 외기가 강제로 공급되고, 공급관(310)을 통해 가압 하우징(310) 내부로 강제 유입된 외기에 의해 당해 가압 하우징(310) 내부의 압력이 올라가고, 개방부를 통해 노출된 압착 탄성판(230)을 아래에서 위쪽으로 밀어올린다.Therefore, the outside air is forcibly supplied by the feed pump, the pressure inside the pressurized housing 310 is increased by the outside air forced into the pressurized housing 310 through the supply pipe 310, and the exposed pressure is exposed through the opening. The elastic plate 230 is pushed upward from the bottom.
즉, 압착 챔버(200)에서 스탬프(10)와 기판(20)을 압착시, 가압 챔버(300)에 서 스탬프(10)와 기판(20)의 압착을 보조할 수 있도록 한다.That is, when pressing the stamp 10 and the substrate 20 in the pressing chamber 200, it is possible to assist the pressing of the stamp 10 and the substrate 20 in the pressing chamber 300.
이상과 같이, 압착과정을 통해 기판(20)의 폴리머(22)에 패턴(23)이 각인되면, 외부에 설치된 자외선 램프(L)를 점등시킨다.As described above, when the pattern 23 is imprinted on the polymer 22 of the substrate 20 through the pressing process, the ultraviolet lamp L installed outside is turned on.
그러면, 자외선 램프(L)에서 조사된 빛이 압착 하우징(210)의 투명판(220) 및 투명재질로 이루어진 스탬프(10)를 통해 패턴(23)이 각인된 기판(20)의 폴리머(22)까지 전달되고, 그 전달된 빛에 의해 당해 폴리머(22)가 경화된다.Then, the polymer 22 of the substrate 20 in which the light irradiated from the ultraviolet lamp L is imprinted with the pattern 23 through the transparent plate 220 of the crimping housing 210 and the stamp 10 made of a transparent material. Up to which the polymer 22 is cured by the transmitted light.
그러면, 이송장치를 이용해 기판(20)을 건식 식각(dry etching)장치, 습식 식각(wet etching) 장치 혹은 그 외 식각장치로 이송하고, 식각공정이 이루어지도록 함으로써, 공정을 마친다.Then, the substrate 20 is transferred to a dry etching apparatus, a wet etching apparatus, or other etching apparatus using a transfer apparatus, and the etching process is completed, thereby completing the process.
이상, 본 발명의 특정 실시예에 대하여 상술하였다. 그러나, 본 발명의 사상 및 범위는 이러한 특정 실시예에 한정되는 것이 아니라, 본 발명의 요지를 변경하지 않는 범위 내에서 다양하게 수정 및 변형이 가능하다는 것을 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자라면 이해할 것이다. In the above, the specific Example of this invention was described above. However, the spirit and scope of the present invention is not limited to these specific embodiments, and various changes and modifications can be made without departing from the spirit of the present invention. Those who have it will understand.
따라서, 이상에서 기술한 실시예들은 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자에게 발명의 범주를 완전하게 알려주기 위해 제공되는 것이므로, 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 하며, 본 발명은 청구항의 범주에 의해 정의될 뿐이다.Therefore, since the embodiments described above are provided to completely inform the scope of the invention to those skilled in the art, it should be understood that they are exemplary in all respects and not limited. The invention is only defined by the scope of the claims.
본 발명의 임프린팅 장치는 적층된 스탬프와 기판에 압력을 가하여 압착시, 슬립을 방지함은 물론 균일한 압력이 가해지도록 하여, 기판에 임프린트된 패턴의 특성을 향상시킬 수 있도록 함으로써, 나노미터 혹은 마이크로미터 산업분야의 발전을 가져올 수 있게 한다.Imprinting apparatus of the present invention by applying a pressure to the laminated stamp and the substrate to prevent the slip during compression, as well as to apply a uniform pressure, thereby improving the characteristics of the pattern imprinted on the substrate, nanometer or It enables the development of the micrometer industry.

Claims (5)

  1. 스탬프(stamp)를 이용하여 기판에 패턴을 임프린트(imprint)하는 임프린팅 장치에 있어서,An imprinting apparatus for imprinting a pattern on a substrate using a stamp,
    바닥면에 개방부가 형성된 압착 하우징과;A crimp housing having an opening formed at a bottom thereof;
    상기 개방부를 밀폐시키도록 설치되며, 탄성 재질로 이루어진 압착 탄성판과;A compression elastic plate which is installed to seal the opening and is made of an elastic material;
    상기 압착 탄성판의 상측면에 고정되고, 상기 스탬프와 기판이 적층된 상태로 놓여지며, 경질 소재로 이루어진 보조 압착판과;An auxiliary pressing plate fixed to an upper side of the pressing elastic plate and placed in a state where the stamp and the substrate are stacked, and made of a hard material;
    상기 압착 하우징 내부의 공기를 외부로 배출하도록, 상기 압착 하우징의 측면에 설치된 배기관; 및An exhaust pipe installed on a side of the compression housing to discharge air inside the compression housing to the outside; And
    상기 배기관에 연결된 배기 펌프;로 이루어진 압착챔버를 포함하여,Including a compression chamber consisting of; an exhaust pump connected to the exhaust pipe,
    상기 압착 하우징 내부의 공기가 외부로 배출시, 상기 압착 탄성판이 상승함으로써, 상기 스탬프와 기판이 상기 보조 압착판과 상기 압착 하우징의 상부면에 의해 서로 압착되는 것을 특징으로 하는 임프린팅 장치.And the stamp and the substrate are pressed together by the auxiliary pressing plate and the upper surface of the pressing housing when air inside the pressing housing is discharged to the outside.
  2. 제1항에 있어서,The method of claim 1,
    상기 보조 압착판은 세라믹 재질로 이루어져 있는 것을 특징으로 하는 임프린팅 장치.The auxiliary pressing plate is an imprinting apparatus, characterized in that made of a ceramic material.
  3. 제1항에 있어서,The method of claim 1,
    상기 보조 압착판은 금속 재질로 이루어져 있는 것을 특징으로 하는 임프린팅 장치.The auxiliary pressing plate is an imprinting apparatus, characterized in that made of a metal material.
  4. 제1항 내지 제3항 중 어느 하나의 항에 있어서,The method according to any one of claims 1 to 3,
    상기 압착 하우징의 상부면은 빛이 투과되는 투명판으로 이루어져 있는 것을 특징으로 하는 임프린팅 장치.Imprinting apparatus, characterized in that the upper surface of the pressing housing is made of a transparent plate through which light is transmitted.
  5. 제1항 내지 제3항 중 어느 하나의 항에 있어서,The method according to any one of claims 1 to 3,
    상기 압착 챔버의 하측에 결합된 가압 챔버를 더 포함하되,Further comprising a pressure chamber coupled to the lower side of the compression chamber,
    상기 가압 챔버는,The pressurization chamber,
    상기 압착 하우징의 바닥면에 설치된 압착 탄성판이 노출되도록, 상부면에 개방부가 형성되어 있는 가압 하우징과;A pressurized housing having an open portion formed at an upper surface thereof so that a crimp elastic plate installed on the bottom surface of the crimp housing is exposed;
    상기 가압 하우징 내부로 외기가 공급되도록, 상기 가압 하우징의 측면에 설치된 공급관; 및A supply pipe installed at a side of the pressure housing so that outside air is supplied into the pressure housing; And
    상기 공급관에 설치된 공급 펌프;를 포함하여,Including; supply pump installed in the supply pipe;
    상기 가압 하우징 내부로 공급된 외기가 상기 압착 탄성판을 아래에서 위로 가압하는 것을 특징으로 하는 임프린팅 장치.Imprinting apparatus, characterized in that the outside air supplied into the pressure housing to press the compression elastic plate from the bottom up.
PCT/KR2009/005687 2008-10-29 2009-10-06 Imprinting apparatus WO2010050679A2 (en)

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KR1020080106293A KR101023440B1 (en) 2008-10-29 2008-10-29 Imprinting apparatus
KR10-2008-0106293 2008-10-29

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