WO2010043540A1 - Procédé de production d'un substrat ductile muni d'éléments électriques - Google Patents

Procédé de production d'un substrat ductile muni d'éléments électriques Download PDF

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Publication number
WO2010043540A1
WO2010043540A1 PCT/EP2009/063110 EP2009063110W WO2010043540A1 WO 2010043540 A1 WO2010043540 A1 WO 2010043540A1 EP 2009063110 W EP2009063110 W EP 2009063110W WO 2010043540 A1 WO2010043540 A1 WO 2010043540A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
electrical elements
ductile
electrical
producing
Prior art date
Application number
PCT/EP2009/063110
Other languages
German (de)
English (en)
Inventor
Josef Richter
Joerg Schaefer
Walter Roethlingshoefer
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2010043540A1 publication Critical patent/WO2010043540A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing

Definitions

  • the invention relates to a method for producing a substrate provided with electrical elements.
  • the connecting sections must have certain minimum dimensions in order, for example, to be able to achieve certain curve radii without breakage of the connecting pieces or without undesirable stress cracks. As a result, a design extension and an inhibition of electrical conductors is caused in an undesirable manner.
  • the object of the invention is to provide a method for producing a substrate provided with electrical elements, which is the avoid mentioned disadvantages and to bring to a great extent in desired shapes.
  • a method for producing a substrate provided with electrical elements. It is provided that a ductile, ie expandable, stretchable or moldable and / or deformable substrate is used as the substrate, which is formed after the placement of the electrical elements in a 3D structure.
  • the substrate used in this case is a ductile substrate, that is to say one which, owing to its material properties, can already be stretched and stretched (at least within certain limits).
  • this substrate is preferably plastically deformable without too great a force, that is to say in such a manner that it retains its thus-formed shape after the forming process. Forming happens after loading with electrical elements.
  • the ductile substrate is brought into a 3D structure, ie in such a way that gives a desired extension of the substrate in space.
  • the substrate provided with the electrical elements it is possible to adapt the substrate provided with the electrical elements to given space requirements, in particular to bring the substrate into, for example, predetermined housing dimensions for the connection of electronic arrangements, such as, for example, light-emitting diodes in headlight housings, as used, for example, in design moldings for headlights, Daytime running lights and taillights are used.
  • a full-surface application of formable, electrical insulation material is sometimes possible and sometimes desirable before the forming process.
  • the use of space for electronic circuits can be extended into the room, ie in three dimensions.
  • the substrate with the electrical elements arranged thereon retains its electrical properties unchanged after the forming.
  • the electrical elements are formed as a 2D structure. 2D structures are understood to mean, in the first place, planar electrical elements.
  • conductor tracks, dielectric layers, insulating layers, resistors, capacitors, connections and / or coils are used as electrical elements. These are applied to the ductile substrate before the forming process and optionally applied with a deformable electrical insulation material.
  • the electrical elements are arranged on the substrate by means of liquid deposition, in particular by inkjet and / or microdispensing and / or other printing methods, such as laser printing.
  • the electrical elements which are understood to be electronic elements, in a kind of printing process by depositing suitable material on the substrate form and arrange.
  • the formation of the electrical elements is done even by the described method by means of liquid deposition, such as inkjet or microdispensing;
  • existing elements are arranged by microdiposition on the substrate, that is, for example, connected to the substrate and there already existing other electrical elements such as interconnects.
  • sheet metal is used as the substrate.
  • Sheet metal is ductile to a very high degree, in particular namely ductile, ductile and malleable. It is mechanically deformable without great effort, in particular cold deformable.
  • a corresponding insulation of the same relative to the electrically conductive substrate must be taken into account. This can happen, in particular when the electrical elements are applied by means of liquid deposition, by the application of at least one non-conductive layer between the substrate and the electrical element. In this way, a very stable, easy to produce and inexpensive formable three-dimensional Form substrate structure, which is ready to install with the electrical elements.
  • the electrical structures can be formed as a 2D structure or as a three-dimensional structure in the manner of a layer structure, that is to say already with an extent extending into the space, in particular into the height.
  • a substrate provided with electrical elements is proposed, in particular produced as described above, wherein the substrate is formed as a ductile, deformable substrate and is formed together with the electrical elements in a 3D structure.
  • Figure 1 is a two-dimensionally extended, stamped substrate
  • FIG. 2 shows the same substrate with applied electrical elements
  • Figure 3 shows the same substrate after the forming process in three-dimensional structure.
  • Embodiment (s) of the invention Figure 1 shows a two-dimensionally extended substrate 1, which is made of a deformable material 2, in particular punched.
  • the material 2 is in this case a ductile substrate 3, ie one which can be deformed by application of force.
  • the embodiment shown shows by way of example a flatly extended basic shape of the substrate 1 before assembly and forming.
  • FIG. 2 shows the substrate 1 according to the assembly made by printing, in which electrical elements 4 have been applied, namely conductor tracks 5 and electronic components 6.
  • the substrate 1 was printed with an insulating layer 7 prior to the application of the electrical elements 4 in order to apply the insulation layer 7 to the insulation layer 7 allow direct application of the interconnects 5 and the electrical elements 4, even if the substrate 1 itself is conductive, for example, consists of a sheet 8.
  • electronic components for example, highly efficient light-emitting diodes 9 come into consideration, as they are used to form daytime running lights on modern motor vehicles.
  • the substrate 1 After being fitted with the electrical elements 4, the substrate 1 is in an elongated form 10, ie substantially flat. In this case, it is possible to differentiate between the assembly islands 11 formed by the stamping process (see FIG. 1), and the narrower strip segments 12 connecting them to one another and narrowing them.
  • FIG. 3 shows the substrate 1 after the forming process, in which the conductor track segments 12 between the assembly islands 11 have been angled twice in succession at an approximately right angle .alpha
  • Placement islands 11 are aligned in the same direction substantially parallel to each other. In this way, in particular for daytime running light applications in motor vehicles, directing light emitting diodes 9 can be applied in a design adapted to the design and shape of the headlight, not shown.
  • the substrate 1 may have further, in particular also other electrical and electronic components, in particular those for the connection of the arrangement of light-emitting diodes 9 illustrated here by way of example.
  • the 3D structure 13 of the substrate 1 formed in this way can be provided with a protective lacquer or a similar, insulating and corrosion-inhibiting substance in order to obtain a particularly long-lived, reliable and space-saving arrangement.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne un procédé de production d'un substrat muni d'éléments électriques. L'invention est caractérisée en ce qu'on utilise comme substrat, un substrat ductile déformable qui, après avoir été garni des éléments électriques, est transformé en une structure 3D. L'invention concerne en outre un substrat (1) muni d'éléments électriques (4), caractérisé en ce que le substrat (1) est configuré en tant que substrat ductile déformable (3) et est transformé, garni des  éléments électriques (4), en une structure 3D (13).
PCT/EP2009/063110 2008-10-14 2009-10-08 Procédé de production d'un substrat ductile muni d'éléments électriques WO2010043540A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008042810.8 2008-10-14
DE200810042810 DE102008042810A1 (de) 2008-10-14 2008-10-14 Verfahren zur Herstellung eines mit elektrischen Elementen versehenen Substrats

Publications (1)

Publication Number Publication Date
WO2010043540A1 true WO2010043540A1 (fr) 2010-04-22

Family

ID=41402521

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/063110 WO2010043540A1 (fr) 2008-10-14 2009-10-08 Procédé de production d'un substrat ductile muni d'éléments électriques

Country Status (2)

Country Link
DE (1) DE102008042810A1 (fr)
WO (1) WO2010043540A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10257935B2 (en) 2013-07-09 2019-04-09 Signify Holding B.V. Method for manufacturing a printed circuit board assembly based on printed electronics

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010025591A1 (de) * 2010-06-29 2011-12-29 Conti Temic Microelectronic Gmbh Sensorträger sowie Sensormodul insbesondere zum Einsatz in einem Kraftfahrzeugvorortsteuergerät
DE102010027149A1 (de) * 2010-07-14 2012-01-19 Fela Hilzinger Gmbh Verbiegbare Metallkernleiterplatte
JP6178877B2 (ja) 2014-01-02 2017-08-09 フィリップス ライティング ホールディング ビー ヴィ 非平面印刷回路基板アセンブリを製造するための方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4074419A (en) * 1976-03-16 1978-02-21 Texas Instruments Incorporated Printed wiring board with angled portion and its method of manufacture
GB2131233A (en) * 1982-11-29 1984-06-13 Gen Electric Fabricating shaped printed circuit boards
GB2133934A (en) * 1983-01-17 1984-08-01 Plessey Co Plc Improvements relating to thick film circuits
EP0651598A1 (fr) * 1993-11-02 1995-05-03 Philips Patentverwaltung GmbH Module de circuit électronique
EP1091625A2 (fr) * 1999-10-08 2001-04-11 Auxilium S.r.l. Circuit imprimé à haute capacité de dissipation thermique
DE102004053958B3 (de) * 2004-11-09 2005-09-01 Behr Hella Thermocontrol Gmbh Vorrichtung zur Erfassung von elektromagnetischer Strahlung, insbesondere Sonnenlicht, zur Verwendung bei einem Fahrzeug

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4774979B2 (ja) 2005-12-19 2011-09-21 村田機械株式会社 板金モデル作成システム、板金モデル作成方法、及び板金モデル作成プログラム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4074419A (en) * 1976-03-16 1978-02-21 Texas Instruments Incorporated Printed wiring board with angled portion and its method of manufacture
GB2131233A (en) * 1982-11-29 1984-06-13 Gen Electric Fabricating shaped printed circuit boards
GB2133934A (en) * 1983-01-17 1984-08-01 Plessey Co Plc Improvements relating to thick film circuits
EP0651598A1 (fr) * 1993-11-02 1995-05-03 Philips Patentverwaltung GmbH Module de circuit électronique
EP1091625A2 (fr) * 1999-10-08 2001-04-11 Auxilium S.r.l. Circuit imprimé à haute capacité de dissipation thermique
DE102004053958B3 (de) * 2004-11-09 2005-09-01 Behr Hella Thermocontrol Gmbh Vorrichtung zur Erfassung von elektromagnetischer Strahlung, insbesondere Sonnenlicht, zur Verwendung bei einem Fahrzeug

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10257935B2 (en) 2013-07-09 2019-04-09 Signify Holding B.V. Method for manufacturing a printed circuit board assembly based on printed electronics

Also Published As

Publication number Publication date
DE102008042810A1 (de) 2010-04-15

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