WO2010043540A1 - Procédé de production d'un substrat ductile muni d'éléments électriques - Google Patents
Procédé de production d'un substrat ductile muni d'éléments électriques Download PDFInfo
- Publication number
- WO2010043540A1 WO2010043540A1 PCT/EP2009/063110 EP2009063110W WO2010043540A1 WO 2010043540 A1 WO2010043540 A1 WO 2010043540A1 EP 2009063110 W EP2009063110 W EP 2009063110W WO 2010043540 A1 WO2010043540 A1 WO 2010043540A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- electrical elements
- ductile
- electrical
- producing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
Definitions
- the invention relates to a method for producing a substrate provided with electrical elements.
- the connecting sections must have certain minimum dimensions in order, for example, to be able to achieve certain curve radii without breakage of the connecting pieces or without undesirable stress cracks. As a result, a design extension and an inhibition of electrical conductors is caused in an undesirable manner.
- the object of the invention is to provide a method for producing a substrate provided with electrical elements, which is the avoid mentioned disadvantages and to bring to a great extent in desired shapes.
- a method for producing a substrate provided with electrical elements. It is provided that a ductile, ie expandable, stretchable or moldable and / or deformable substrate is used as the substrate, which is formed after the placement of the electrical elements in a 3D structure.
- the substrate used in this case is a ductile substrate, that is to say one which, owing to its material properties, can already be stretched and stretched (at least within certain limits).
- this substrate is preferably plastically deformable without too great a force, that is to say in such a manner that it retains its thus-formed shape after the forming process. Forming happens after loading with electrical elements.
- the ductile substrate is brought into a 3D structure, ie in such a way that gives a desired extension of the substrate in space.
- the substrate provided with the electrical elements it is possible to adapt the substrate provided with the electrical elements to given space requirements, in particular to bring the substrate into, for example, predetermined housing dimensions for the connection of electronic arrangements, such as, for example, light-emitting diodes in headlight housings, as used, for example, in design moldings for headlights, Daytime running lights and taillights are used.
- a full-surface application of formable, electrical insulation material is sometimes possible and sometimes desirable before the forming process.
- the use of space for electronic circuits can be extended into the room, ie in three dimensions.
- the substrate with the electrical elements arranged thereon retains its electrical properties unchanged after the forming.
- the electrical elements are formed as a 2D structure. 2D structures are understood to mean, in the first place, planar electrical elements.
- conductor tracks, dielectric layers, insulating layers, resistors, capacitors, connections and / or coils are used as electrical elements. These are applied to the ductile substrate before the forming process and optionally applied with a deformable electrical insulation material.
- the electrical elements are arranged on the substrate by means of liquid deposition, in particular by inkjet and / or microdispensing and / or other printing methods, such as laser printing.
- the electrical elements which are understood to be electronic elements, in a kind of printing process by depositing suitable material on the substrate form and arrange.
- the formation of the electrical elements is done even by the described method by means of liquid deposition, such as inkjet or microdispensing;
- existing elements are arranged by microdiposition on the substrate, that is, for example, connected to the substrate and there already existing other electrical elements such as interconnects.
- sheet metal is used as the substrate.
- Sheet metal is ductile to a very high degree, in particular namely ductile, ductile and malleable. It is mechanically deformable without great effort, in particular cold deformable.
- a corresponding insulation of the same relative to the electrically conductive substrate must be taken into account. This can happen, in particular when the electrical elements are applied by means of liquid deposition, by the application of at least one non-conductive layer between the substrate and the electrical element. In this way, a very stable, easy to produce and inexpensive formable three-dimensional Form substrate structure, which is ready to install with the electrical elements.
- the electrical structures can be formed as a 2D structure or as a three-dimensional structure in the manner of a layer structure, that is to say already with an extent extending into the space, in particular into the height.
- a substrate provided with electrical elements is proposed, in particular produced as described above, wherein the substrate is formed as a ductile, deformable substrate and is formed together with the electrical elements in a 3D structure.
- Figure 1 is a two-dimensionally extended, stamped substrate
- FIG. 2 shows the same substrate with applied electrical elements
- Figure 3 shows the same substrate after the forming process in three-dimensional structure.
- Embodiment (s) of the invention Figure 1 shows a two-dimensionally extended substrate 1, which is made of a deformable material 2, in particular punched.
- the material 2 is in this case a ductile substrate 3, ie one which can be deformed by application of force.
- the embodiment shown shows by way of example a flatly extended basic shape of the substrate 1 before assembly and forming.
- FIG. 2 shows the substrate 1 according to the assembly made by printing, in which electrical elements 4 have been applied, namely conductor tracks 5 and electronic components 6.
- the substrate 1 was printed with an insulating layer 7 prior to the application of the electrical elements 4 in order to apply the insulation layer 7 to the insulation layer 7 allow direct application of the interconnects 5 and the electrical elements 4, even if the substrate 1 itself is conductive, for example, consists of a sheet 8.
- electronic components for example, highly efficient light-emitting diodes 9 come into consideration, as they are used to form daytime running lights on modern motor vehicles.
- the substrate 1 After being fitted with the electrical elements 4, the substrate 1 is in an elongated form 10, ie substantially flat. In this case, it is possible to differentiate between the assembly islands 11 formed by the stamping process (see FIG. 1), and the narrower strip segments 12 connecting them to one another and narrowing them.
- FIG. 3 shows the substrate 1 after the forming process, in which the conductor track segments 12 between the assembly islands 11 have been angled twice in succession at an approximately right angle .alpha
- Placement islands 11 are aligned in the same direction substantially parallel to each other. In this way, in particular for daytime running light applications in motor vehicles, directing light emitting diodes 9 can be applied in a design adapted to the design and shape of the headlight, not shown.
- the substrate 1 may have further, in particular also other electrical and electronic components, in particular those for the connection of the arrangement of light-emitting diodes 9 illustrated here by way of example.
- the 3D structure 13 of the substrate 1 formed in this way can be provided with a protective lacquer or a similar, insulating and corrosion-inhibiting substance in order to obtain a particularly long-lived, reliable and space-saving arrangement.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Structure Of Printed Boards (AREA)
Abstract
L'invention concerne un procédé de production d'un substrat muni d'éléments électriques. L'invention est caractérisée en ce qu'on utilise comme substrat, un substrat ductile déformable qui, après avoir été garni des éléments électriques, est transformé en une structure 3D. L'invention concerne en outre un substrat (1) muni d'éléments électriques (4), caractérisé en ce que le substrat (1) est configuré en tant que substrat ductile déformable (3) et est transformé, garni des éléments électriques (4), en une structure 3D (13).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008042810.8 | 2008-10-14 | ||
DE200810042810 DE102008042810A1 (de) | 2008-10-14 | 2008-10-14 | Verfahren zur Herstellung eines mit elektrischen Elementen versehenen Substrats |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010043540A1 true WO2010043540A1 (fr) | 2010-04-22 |
Family
ID=41402521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2009/063110 WO2010043540A1 (fr) | 2008-10-14 | 2009-10-08 | Procédé de production d'un substrat ductile muni d'éléments électriques |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102008042810A1 (fr) |
WO (1) | WO2010043540A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10257935B2 (en) | 2013-07-09 | 2019-04-09 | Signify Holding B.V. | Method for manufacturing a printed circuit board assembly based on printed electronics |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010025591A1 (de) * | 2010-06-29 | 2011-12-29 | Conti Temic Microelectronic Gmbh | Sensorträger sowie Sensormodul insbesondere zum Einsatz in einem Kraftfahrzeugvorortsteuergerät |
DE102010027149A1 (de) * | 2010-07-14 | 2012-01-19 | Fela Hilzinger Gmbh | Verbiegbare Metallkernleiterplatte |
JP6178877B2 (ja) | 2014-01-02 | 2017-08-09 | フィリップス ライティング ホールディング ビー ヴィ | 非平面印刷回路基板アセンブリを製造するための方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4074419A (en) * | 1976-03-16 | 1978-02-21 | Texas Instruments Incorporated | Printed wiring board with angled portion and its method of manufacture |
GB2131233A (en) * | 1982-11-29 | 1984-06-13 | Gen Electric | Fabricating shaped printed circuit boards |
GB2133934A (en) * | 1983-01-17 | 1984-08-01 | Plessey Co Plc | Improvements relating to thick film circuits |
EP0651598A1 (fr) * | 1993-11-02 | 1995-05-03 | Philips Patentverwaltung GmbH | Module de circuit électronique |
EP1091625A2 (fr) * | 1999-10-08 | 2001-04-11 | Auxilium S.r.l. | Circuit imprimé à haute capacité de dissipation thermique |
DE102004053958B3 (de) * | 2004-11-09 | 2005-09-01 | Behr Hella Thermocontrol Gmbh | Vorrichtung zur Erfassung von elektromagnetischer Strahlung, insbesondere Sonnenlicht, zur Verwendung bei einem Fahrzeug |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4774979B2 (ja) | 2005-12-19 | 2011-09-21 | 村田機械株式会社 | 板金モデル作成システム、板金モデル作成方法、及び板金モデル作成プログラム |
-
2008
- 2008-10-14 DE DE200810042810 patent/DE102008042810A1/de not_active Withdrawn
-
2009
- 2009-10-08 WO PCT/EP2009/063110 patent/WO2010043540A1/fr active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4074419A (en) * | 1976-03-16 | 1978-02-21 | Texas Instruments Incorporated | Printed wiring board with angled portion and its method of manufacture |
GB2131233A (en) * | 1982-11-29 | 1984-06-13 | Gen Electric | Fabricating shaped printed circuit boards |
GB2133934A (en) * | 1983-01-17 | 1984-08-01 | Plessey Co Plc | Improvements relating to thick film circuits |
EP0651598A1 (fr) * | 1993-11-02 | 1995-05-03 | Philips Patentverwaltung GmbH | Module de circuit électronique |
EP1091625A2 (fr) * | 1999-10-08 | 2001-04-11 | Auxilium S.r.l. | Circuit imprimé à haute capacité de dissipation thermique |
DE102004053958B3 (de) * | 2004-11-09 | 2005-09-01 | Behr Hella Thermocontrol Gmbh | Vorrichtung zur Erfassung von elektromagnetischer Strahlung, insbesondere Sonnenlicht, zur Verwendung bei einem Fahrzeug |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10257935B2 (en) | 2013-07-09 | 2019-04-09 | Signify Holding B.V. | Method for manufacturing a printed circuit board assembly based on printed electronics |
Also Published As
Publication number | Publication date |
---|---|
DE102008042810A1 (de) | 2010-04-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE102009042600B4 (de) | Herstellungsverfahren für ein Leistungshalbleitermodul | |
DE10109087A1 (de) | Verfahren zum Herstellen eines Formbauteils mit einer integrierten Leiterbahn | |
DE102009044659A1 (de) | Leistungshalbleitermodul | |
DE102018121403A1 (de) | Verfahren zur Herstellung einer stabilisierten Platine | |
DE102016124963A1 (de) | Stromtransporteinrichtung, insbesondere elektrische oder elektromechanische Stromschiene | |
WO2010043540A1 (fr) | Procédé de production d'un substrat ductile muni d'éléments électriques | |
EP1733599A2 (fr) | Systeme de diode electroluminescente et son procede de production | |
EP1326275A2 (fr) | Module électronique de puissance | |
DE102019204639A1 (de) | Luftspaltbildung in einer elektrischen Kontaktierung einer Leiterplatte | |
DE102014008853A1 (de) | Kunststoffumspritzte Leiterbahnstruktur sowie Verfahren zur Herstellung der kunststoffumspritzten Leiterbahnstruktur | |
DE102013016073B4 (de) | Vorrichtung zur Signalübertragung in einem Fahrzeug | |
DE102010007108A1 (de) | Bordnetz | |
DE102013219992A1 (de) | Schaltungsvorrichtung und Verfahren zu deren Herstellung | |
EP1659837B1 (fr) | Contact entre un composant et un réseau de barres conductrices | |
WO2022069293A1 (fr) | Connexion de ligne électrique pour réaliser un contact électrique avec une électrode de surface | |
WO2017001108A1 (fr) | Porte-circuits pour un circuit électronique et procédé de fabrication d'un porte-circuits de ce type | |
WO2021170351A1 (fr) | Carte de circuit imprimé avec un point de contact | |
DE102010017711A1 (de) | Dreidimensionales LED-Trägerelement mit thermischer Leitfähigkeit | |
DE102015216380A1 (de) | Elektrische Kontaktiereinrichtung sowie Verfahren zum Kontaktieren eines Flachleiters | |
DE102020100742A1 (de) | Leiterplatte, Lichtmodul, Beleuchtungseinrichtung und Kraftfahrzeug | |
DE10109086C2 (de) | Formbauteil | |
DE10230712B4 (de) | Elektronikeinheit mit einem niedrigschmelzenden metallischen Träger | |
DE102012108859B4 (de) | Elektronikmodul | |
WO2023217580A1 (fr) | Module lumineux pour un dispositif d'éclairage de véhicule automobile et procédé de fabrication d'un module lumineux | |
DE10308663A1 (de) | Flachbandleitung mit Metall beschichten |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 09747801 Country of ref document: EP Kind code of ref document: A1 |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 09747801 Country of ref document: EP Kind code of ref document: A1 |