WO2010043540A1 - Method for producing a ductile substrate provided with electrical elements - Google Patents
Method for producing a ductile substrate provided with electrical elements Download PDFInfo
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- WO2010043540A1 WO2010043540A1 PCT/EP2009/063110 EP2009063110W WO2010043540A1 WO 2010043540 A1 WO2010043540 A1 WO 2010043540A1 EP 2009063110 W EP2009063110 W EP 2009063110W WO 2010043540 A1 WO2010043540 A1 WO 2010043540A1
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- substrate
- electrical elements
- ductile
- electrical
- producing
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
Definitions
- the invention relates to a method for producing a substrate provided with electrical elements.
- the connecting sections must have certain minimum dimensions in order, for example, to be able to achieve certain curve radii without breakage of the connecting pieces or without undesirable stress cracks. As a result, a design extension and an inhibition of electrical conductors is caused in an undesirable manner.
- the object of the invention is to provide a method for producing a substrate provided with electrical elements, which is the avoid mentioned disadvantages and to bring to a great extent in desired shapes.
- a method for producing a substrate provided with electrical elements. It is provided that a ductile, ie expandable, stretchable or moldable and / or deformable substrate is used as the substrate, which is formed after the placement of the electrical elements in a 3D structure.
- the substrate used in this case is a ductile substrate, that is to say one which, owing to its material properties, can already be stretched and stretched (at least within certain limits).
- this substrate is preferably plastically deformable without too great a force, that is to say in such a manner that it retains its thus-formed shape after the forming process. Forming happens after loading with electrical elements.
- the ductile substrate is brought into a 3D structure, ie in such a way that gives a desired extension of the substrate in space.
- the substrate provided with the electrical elements it is possible to adapt the substrate provided with the electrical elements to given space requirements, in particular to bring the substrate into, for example, predetermined housing dimensions for the connection of electronic arrangements, such as, for example, light-emitting diodes in headlight housings, as used, for example, in design moldings for headlights, Daytime running lights and taillights are used.
- a full-surface application of formable, electrical insulation material is sometimes possible and sometimes desirable before the forming process.
- the use of space for electronic circuits can be extended into the room, ie in three dimensions.
- the substrate with the electrical elements arranged thereon retains its electrical properties unchanged after the forming.
- the electrical elements are formed as a 2D structure. 2D structures are understood to mean, in the first place, planar electrical elements.
- conductor tracks, dielectric layers, insulating layers, resistors, capacitors, connections and / or coils are used as electrical elements. These are applied to the ductile substrate before the forming process and optionally applied with a deformable electrical insulation material.
- the electrical elements are arranged on the substrate by means of liquid deposition, in particular by inkjet and / or microdispensing and / or other printing methods, such as laser printing.
- the electrical elements which are understood to be electronic elements, in a kind of printing process by depositing suitable material on the substrate form and arrange.
- the formation of the electrical elements is done even by the described method by means of liquid deposition, such as inkjet or microdispensing;
- existing elements are arranged by microdiposition on the substrate, that is, for example, connected to the substrate and there already existing other electrical elements such as interconnects.
- sheet metal is used as the substrate.
- Sheet metal is ductile to a very high degree, in particular namely ductile, ductile and malleable. It is mechanically deformable without great effort, in particular cold deformable.
- a corresponding insulation of the same relative to the electrically conductive substrate must be taken into account. This can happen, in particular when the electrical elements are applied by means of liquid deposition, by the application of at least one non-conductive layer between the substrate and the electrical element. In this way, a very stable, easy to produce and inexpensive formable three-dimensional Form substrate structure, which is ready to install with the electrical elements.
- the electrical structures can be formed as a 2D structure or as a three-dimensional structure in the manner of a layer structure, that is to say already with an extent extending into the space, in particular into the height.
- a substrate provided with electrical elements is proposed, in particular produced as described above, wherein the substrate is formed as a ductile, deformable substrate and is formed together with the electrical elements in a 3D structure.
- Figure 1 is a two-dimensionally extended, stamped substrate
- FIG. 2 shows the same substrate with applied electrical elements
- Figure 3 shows the same substrate after the forming process in three-dimensional structure.
- Embodiment (s) of the invention Figure 1 shows a two-dimensionally extended substrate 1, which is made of a deformable material 2, in particular punched.
- the material 2 is in this case a ductile substrate 3, ie one which can be deformed by application of force.
- the embodiment shown shows by way of example a flatly extended basic shape of the substrate 1 before assembly and forming.
- FIG. 2 shows the substrate 1 according to the assembly made by printing, in which electrical elements 4 have been applied, namely conductor tracks 5 and electronic components 6.
- the substrate 1 was printed with an insulating layer 7 prior to the application of the electrical elements 4 in order to apply the insulation layer 7 to the insulation layer 7 allow direct application of the interconnects 5 and the electrical elements 4, even if the substrate 1 itself is conductive, for example, consists of a sheet 8.
- electronic components for example, highly efficient light-emitting diodes 9 come into consideration, as they are used to form daytime running lights on modern motor vehicles.
- the substrate 1 After being fitted with the electrical elements 4, the substrate 1 is in an elongated form 10, ie substantially flat. In this case, it is possible to differentiate between the assembly islands 11 formed by the stamping process (see FIG. 1), and the narrower strip segments 12 connecting them to one another and narrowing them.
- FIG. 3 shows the substrate 1 after the forming process, in which the conductor track segments 12 between the assembly islands 11 have been angled twice in succession at an approximately right angle .alpha
- Placement islands 11 are aligned in the same direction substantially parallel to each other. In this way, in particular for daytime running light applications in motor vehicles, directing light emitting diodes 9 can be applied in a design adapted to the design and shape of the headlight, not shown.
- the substrate 1 may have further, in particular also other electrical and electronic components, in particular those for the connection of the arrangement of light-emitting diodes 9 illustrated here by way of example.
- the 3D structure 13 of the substrate 1 formed in this way can be provided with a protective lacquer or a similar, insulating and corrosion-inhibiting substance in order to obtain a particularly long-lived, reliable and space-saving arrangement.
Abstract
The invention relates to a method for producing a substrate provided with electrical elements. It is provided that a deformable, ductile substrate is used as the substrate. Said substrate is formed into a 3-D structure after said substrate is populated with the electrical elements. The invention further relates to a substrate (1) provided with electrical elements (4), wherein the substrate (1) is designed as a deformable, ductile substrate (3) and is formed into a 3-D structure (13) together with the electrical elements (4).
Description
Beschreibung description
Titel VERFAHREN ZUR HERSTELLUNG EINES MIT ELEKTRISCHEN VERSEHENEN DUKTILEN SUBSTRATSTitle METHOD FOR PRODUCING AN ELECTRICALLY PROVED DUCTILE SUBSTRATE
Die Erfindung betrifft ein Verfahren zur Herstellung eines mit elektrischen Elementen versehenen Substrats.The invention relates to a method for producing a substrate provided with electrical elements.
Stand der TechnikState of the art
Insbesondere unter beengten Bauraumverhältnissen ist es häufig wünschenswert, den ohnehin knappen Bauraum, der zur Einbringung von elektronischen Schaltungen zur Verfügung steht, bestmöglich ausnutzen zu können. Häufig ist es auch im Stand der Technik gar nicht möglich, bestimmte, für eine bestimmte Funktionsweise erforderliche Schaltungen in einem bestimmten Bauraum unterzubringen, so dass eine externe Beschaltung und eine Verbindung über elektrische Leiter erfolgen muss. Dies ist häufig unerwünscht. Deswegen ist beispielsweise aus der JP 2007172058 A bekannt, eine dreidimensionale Substratausbildung dadurch zu erreichen, dass das Substrat in Abschnitten gefertigt wird, und anschließend Abschnitte mittels mechanisch umformbarer Verbindungselemente verbunden und wiederum anschließend diese umformbaren Verbindungselemente durch mechanische Kraftbeaufschlagung umgeformt werden. Daran ist nachteilig, dass das Substrat durch die Verbindungsabschnitte unterbrochen ist. Die Verbindungsabschnitte müssen, in Abhängigkeit von der gewünschten dreidimensionalen Geometrie, bestimmte Mindestabmessungen haben, um beispielsweise bestimmte Kurvenradien ohne Bruch der Verbindungsstücke oder ohne unerwünschte Spannungsrisse, bewerkstelligen zu können. Hierdurch wird in unerwünschter Weise eine Bauformverlängerung und eine Unterbindung elektrischer Leiterbahnen bewirkt.In particular, in confined space conditions, it is often desirable to be able to exploit the already scarce space available for the introduction of electronic circuits, the best possible. Often it is not even possible in the prior art to accommodate certain, required for a specific operation circuits in a particular space, so that an external wiring and a connection must be made via electrical conductors. This is often undesirable. For this reason, it is known from JP 2007172058 A, for example, to achieve a three-dimensional substrate formation in that the substrate is manufactured in sections, and subsequently sections are connected by means of mechanically deformable connecting elements, and in turn subsequently these deformable connecting elements are formed by mechanical application of force. This is disadvantageous in that the substrate is interrupted by the connecting sections. Depending on the desired three-dimensional geometry, the connecting sections must have certain minimum dimensions in order, for example, to be able to achieve certain curve radii without breakage of the connecting pieces or without undesirable stress cracks. As a result, a design extension and an inhibition of electrical conductors is caused in an undesirable manner.
Aufgabe der Erfindung ist es, ein Verfahren zur Herstellung eines mit elektrischen Elementen versehenen Substrats bereitzustellen, das die
genannten Nachteile vermeidet und in weitem Maße in gewünschte Formen zu bringen ist.The object of the invention is to provide a method for producing a substrate provided with electrical elements, which is the avoid mentioned disadvantages and to bring to a great extent in desired shapes.
Offenbarung der ErfindungDisclosure of the invention
Hierzu wird ein Verfahren vorgeschlagen zur Herstellung eines mit elektrischen Elementen versehenen Substrats. Dabei ist vorgesehen, dass als Substrat ein duktiles, also dehnbares, streckbares beziehungsweise formbares und/oder umformbares Substrat verwendet wird, das nach dem Bestücken mit den elektrischen Elementen in eine 3D-Struktur umgeformt wird. Als Substrat kommt hierbei ein duktiles Substrat zur Anwendung, also ein solches, das bereits aufgrund seiner Materialeigenschaften dehnbar und streckbar (zumindest in gewissen Grenzen) formbar ist. Bevorzugt ist dieses Substrat hierbei ohne allzu großen Kraftaufwand plastisch verformbar, also in einer solchen Art und Weise, dass es nach dem Umformvorgang seine so eingenommene Formgebung beibehält. Das Umformen geschieht nach dem Bestücken mit den elektrischen Elementen. Durch das Umformen wird das duktile Substrat in eine 3D-Struktur gebracht, also in eine solche, die eine gewünschte Ausdehnung des Substrats im Raum ergibt. Hierdurch ist es möglich, das mit den elektrischen Elementen versehene Substrat an gegebene Bauraumerfordernisse anzupassen, insbesondere nämlich, das Substrat in beispielsweise vorgegebene Gehäuseabmessungen zur Beschaltung elektronischer Anordnungen zu bringen, wie beispielsweise von Leuchtdioden in Scheinwerfergehäusen, wie sie beispielsweise bei Design-Formteilen für Scheinwerfer, Tagfahrlicht und Rückleuchten zur Anwendung kommen. Hierbei ist bereichsweise auch eine vollflächige Auftragung von umformbarem, elektrischem Isolationsmaterial auch vor dem Umformvorgang möglich und teilweise wünschenswert. Die Raumnutzung für elektronische Schaltungen kann hierbei in den Raum hinein, also dreidimensional, erweitert werden. Wesentlich hierbei ist, dass das Substrat mit den darauf angeordneten elektrischen Elementen seine elektrischen Eigenschaften nach dem Umformen unverändert beibehält. Für besondere Anwendungsfälle ist es auch möglich, durch den Umformungsvorgang erst bestimmte elektrische Eigenschaften herzustellen.
In einer Verfahrensausbildung werden die elektrischen Elemente als 2D-Struktur ausgebildet. Als 2D-Strukturen werden in erster Linie flächig erstreckte elektrische Elemente verstanden.For this purpose, a method is proposed for producing a substrate provided with electrical elements. It is provided that a ductile, ie expandable, stretchable or moldable and / or deformable substrate is used as the substrate, which is formed after the placement of the electrical elements in a 3D structure. The substrate used in this case is a ductile substrate, that is to say one which, owing to its material properties, can already be stretched and stretched (at least within certain limits). In this case, this substrate is preferably plastically deformable without too great a force, that is to say in such a manner that it retains its thus-formed shape after the forming process. Forming happens after loading with electrical elements. By forming the ductile substrate is brought into a 3D structure, ie in such a way that gives a desired extension of the substrate in space. In this way, it is possible to adapt the substrate provided with the electrical elements to given space requirements, in particular to bring the substrate into, for example, predetermined housing dimensions for the connection of electronic arrangements, such as, for example, light-emitting diodes in headlight housings, as used, for example, in design moldings for headlights, Daytime running lights and taillights are used. In this case, a full-surface application of formable, electrical insulation material is sometimes possible and sometimes desirable before the forming process. The use of space for electronic circuits can be extended into the room, ie in three dimensions. It is essential here that the substrate with the electrical elements arranged thereon retains its electrical properties unchanged after the forming. For special applications, it is also possible to produce only certain electrical properties by the forming process. In a process training, the electrical elements are formed as a 2D structure. 2D structures are understood to mean, in the first place, planar electrical elements.
In einer Verfahrensausbildung werden als elektrische Elemente Leiterbahnen, dielektrische Lagen, Isolationslagen, Widerstände, Kondensatoren, Anschlüsse und/oder Spulen verwendet. Diese werden vor dem Umformvorgang auf das duktile Substrat aufgebracht und gegebenenfalls mit einem umformbaren elektrischen Isolationsmaterial beaufschlagt.In a process training, conductor tracks, dielectric layers, insulating layers, resistors, capacitors, connections and / or coils are used as electrical elements. These are applied to the ductile substrate before the forming process and optionally applied with a deformable electrical insulation material.
In einer weiteren Verfahrensausbildung werden die elektrischen Elemente mittels Liquid Deposition, insbesondere durch InkJet und/oder Microdispensing und/oder anderen Druckverfahren, wie etwa Laserdruck, auf dem Substrat angeordnet. Auf diese Weise ist es in sehr einfacher und preisgünstiger Weise möglich, die elektrischen Elemente, unter denen auch elektronische Elemente verstanden werden, in einer Art Bedruckungsvorgang durch Ablagerung von hierzu geeignetem Material auf dem Substrat auszubilden und anzuordnen.In a further development of the method, the electrical elements are arranged on the substrate by means of liquid deposition, in particular by inkjet and / or microdispensing and / or other printing methods, such as laser printing. In this way, it is possible in a very simple and inexpensive manner, the electrical elements, which are understood to be electronic elements, in a kind of printing process by depositing suitable material on the substrate form and arrange.
In einer ganz besonders bevorzugten Ausführungsform geschieht die Ausbildung der elektrischen Elemente selbst durch das beschriebene Verfahren mittels Liquid Deposition, wie etwa InkJet oder Microdispensing; in einer anderen Ausführungsform werden vorhandene Elemente durch Microdiposition auf dem Substrat angeordnet, also beispielsweise mit dem Substrat und dort bereits befindlichen anderen elektrischen Elementen wie Leiterbahnen verbunden.In a very particularly preferred embodiment, the formation of the electrical elements is done even by the described method by means of liquid deposition, such as inkjet or microdispensing; In another embodiment, existing elements are arranged by microdiposition on the substrate, that is, for example, connected to the substrate and there already existing other electrical elements such as interconnects.
In einer weiteren Verfahrensausbildung wird als Substrat Blech verwendet. Blech ist in sehr hohem Maße duktil, insbesondere nämlich dehnbar, streckbar und formbar. Es ist ohne großen Aufwand mechanisch umformbar, insbesondere kalt verformbar. Bei Aufbringung der elektrischen Elemente ist hierbei auf eine entsprechende Isolierung derselben zum elektrisch leitfähigen Substrat Rechnung zu tragen. Dies kann insbesondere dann, wenn die elektrischen Elemente mittels Liquid Deposition aufgebracht werden, durch die Aufbringung mindestens einer nicht leitfähigen Schicht zwischen Substrat und dem elektrischen Element geschehen. Auf diese Weise lässt sich eine sehr stabile, leicht herstellbare und kostengünstig ausbildbare dreidimensionale
Substratstruktur ausbilden, die einbaufertig mit den elektrischen Elementen versehen ist. Die elektrischen Strukturen können hierbei als 2D-Struktur ausgebildet werden oder als dreidimensionale Struktur in der Art einer Schichtstruktur, also bereits mit einer in den Raum, insbesondere in die Höhe erstreckten Ausdehnung. Selbstverständlich ist es auch möglich, so ausgebildete und in dreidimensionaler Ausführung ausgebildete erfindungsgemäße Strukturen auch nach der Umformung weiter zu bearbeiten, insbesondere weitere elektrische oder elektronische Elemente auf diesen anzubringen oder mit ihnen zu verbinden.In a further development of the method, sheet metal is used as the substrate. Sheet metal is ductile to a very high degree, in particular namely ductile, ductile and malleable. It is mechanically deformable without great effort, in particular cold deformable. When the electrical elements are applied, a corresponding insulation of the same relative to the electrically conductive substrate must be taken into account. This can happen, in particular when the electrical elements are applied by means of liquid deposition, by the application of at least one non-conductive layer between the substrate and the electrical element. In this way, a very stable, easy to produce and inexpensive formable three-dimensional Form substrate structure, which is ready to install with the electrical elements. In this case, the electrical structures can be formed as a 2D structure or as a three-dimensional structure in the manner of a layer structure, that is to say already with an extent extending into the space, in particular into the height. Of course, it is also possible to further process structures of the invention thus formed and formed in a three-dimensional design, even after the forming, in particular to attach or to connect further electrical or electronic elements to them.
Weiter wird ein mit elektrischen Elementen versehenes Substrat vorgeschlagen, insbesondere hergestellt wie vorstehend beschrieben, wobei das Substrat als duktiles, umformbares Substrat ausgebildet ist und zusammen mit den elektrischen Elementen in eine 3D-Struktur umgeformt ist.Furthermore, a substrate provided with electrical elements is proposed, in particular produced as described above, wherein the substrate is formed as a ductile, deformable substrate and is formed together with the electrical elements in a 3D structure.
Weitere vorteilhafte Ausführungsformen ergeben sich aus den Unteransprüchen und aus Kombinationen derselben.Further advantageous embodiments will become apparent from the dependent claims and combinations thereof.
Kurze Beschreibung der ZeichnungenBrief description of the drawings
Die Erfindung wird nachfolgend anhand eines Ausführungsbeispiels näher beschrieben, ohne aber hieraus beschränkt zu sein.The invention will be described in more detail with reference to an embodiment, but without being limited thereto.
Es zeigenShow it
Figur 1 ein zweidimensional erstrecktes, gestanztes Substrat;Figure 1 is a two-dimensionally extended, stamped substrate;
Figur 2 dasselbe Substrat mit aufgebrachten elektrischen Elementen undFigure 2 shows the same substrate with applied electrical elements and
Figur 3 dasselbe Substrat nach dem Umformvorgang in dreidimensionaler Struktur.Figure 3 shows the same substrate after the forming process in three-dimensional structure.
Ausführungsform(en) der Erfindung
Figur 1 zeigt ein zweidimensional erstrecktes Substrat 1 , das aus einem umformbaren Material 2 gearbeitet, insbesondere gestanzt ist. Das Material 2 ist hierbei ein duktiles Substrat 3, also ein solches, das sich durch Kraftbeaufschlagung umformen lässt. Die gezeigte Ausbildung zeigt beispielhaft eine flächig erstreckte Grundform des Substrats 1 vor der Bestückung und Umformung.Embodiment (s) of the invention Figure 1 shows a two-dimensionally extended substrate 1, which is made of a deformable material 2, in particular punched. The material 2 is in this case a ductile substrate 3, ie one which can be deformed by application of force. The embodiment shown shows by way of example a flatly extended basic shape of the substrate 1 before assembly and forming.
Figur 2 zeigt das Substrat 1 nach der drucktechnisch erfolgten Bestückung, bei der elektrische Elemente 4 aufgebracht wurden, nämlich Leiterbahnen 5 und elektronische Bausteine 6. Das Substrat 1 wurde vor Aufbringung der elektrischen Elemente 4 mit einer Isolationslage 7 bedruckt, um die auf die Isolationslage 7 unmittelbare Aufbringung der Leiterbahnen 5 und der elektrischen Elemente 4 zu ermöglichen, auch wenn das Substrat 1 selbst leitfähig ist, beispielsweise aus einem Blech 8 besteht. Als elektronische Bauteile kommen beispielsweise hocheffiziente Leuchtdioden 9 in Betracht, wie sie zur Ausbildung von Tagfahrlicht an modernen Kraftfahrzeugen Verwendung finden. Nach der Bestückung mit den elektrischen Elementen 4 liegt das Substrat 1 in gestreckter Form 10, also im Wesentlichen flächig, vor. Hierbei können die durch den Stanzvorgang (vergleiche Figur 1 ) gebildeten, flächig verbreiterten Bestückungsinseln 11 und diese untereinander verbindende, schmälere Leiterbahnsegmente 12 unterschieden werden.FIG. 2 shows the substrate 1 according to the assembly made by printing, in which electrical elements 4 have been applied, namely conductor tracks 5 and electronic components 6. The substrate 1 was printed with an insulating layer 7 prior to the application of the electrical elements 4 in order to apply the insulation layer 7 to the insulation layer 7 allow direct application of the interconnects 5 and the electrical elements 4, even if the substrate 1 itself is conductive, for example, consists of a sheet 8. As electronic components, for example, highly efficient light-emitting diodes 9 come into consideration, as they are used to form daytime running lights on modern motor vehicles. After being fitted with the electrical elements 4, the substrate 1 is in an elongated form 10, ie substantially flat. In this case, it is possible to differentiate between the assembly islands 11 formed by the stamping process (see FIG. 1), and the narrower strip segments 12 connecting them to one another and narrowing them.
Figur 3 zeigt das Substrat 1 nach dem Umformvorgang, bei dem die Leiterbahnsegmente 12 zwischen den Bestückungsinseln 11 zwei Mal in Folge in einem etwa rechten Winkel α derart abgewinkelt wurden, dass dieFIG. 3 shows the substrate 1 after the forming process, in which the conductor track segments 12 between the assembly islands 11 have been angled twice in succession at an approximately right angle .alpha
Bestückungsinseln 11 nach wie vor gleich ausgerichtet im Wesentlichen parallel zueinander liegen. Auf diese Weise lassen sich, insbesondere für Tagfahrlichtanwendungen in Kraftfahrzeugen, gleich gerichtet ausstrahlende Leuchtdioden 9 in einer dem Design und Formgebung des nicht dargestellten Scheinwerfers angepassten Schaltungsanordnung aufbringen.Placement islands 11 are aligned in the same direction substantially parallel to each other. In this way, in particular for daytime running light applications in motor vehicles, directing light emitting diodes 9 can be applied in a design adapted to the design and shape of the headlight, not shown.
Selbstverständlich kann das Substrat 1 zusätzlich zu den hier dargestellten elektrischen Elementen 4 weitere, insbesondere auch andere elektrische und elektronische Komponenten aufweisen, insbesondere solche zur Beschaltung der hier beispielhaft dargestellten Anordnung von Leuchtdioden 9.
Besonders bevorzugt kann die so ausgebildete 3D-Struktur 13 des Substrats 1 mit einem Schutzlack oder einem ähnlichen, isolierenden und korrosionshemmenden Substanzen versehen werden, um eine besonders langlebige, betriebssichere und bauraumsparende Anordnung zu erhalten.
Of course, in addition to the electrical elements 4 illustrated here, the substrate 1 may have further, in particular also other electrical and electronic components, in particular those for the connection of the arrangement of light-emitting diodes 9 illustrated here by way of example. Particularly preferably, the 3D structure 13 of the substrate 1 formed in this way can be provided with a protective lacquer or a similar, insulating and corrosion-inhibiting substance in order to obtain a particularly long-lived, reliable and space-saving arrangement.
Claims
1. Verfahren zur Herstellung eines mit elektrischen Elementen versehenen Substrats, dadurch gekennzeichnet, dass als Substrat ein duktiles, umformbares Substrat verwendet wird, das nach dem Bestücken mit den elektrischen Elementen in eine 3D-Struktur umgeformt wird.1. A method for producing a substrate provided with electrical elements, characterized in that a ductile, deformable substrate is used as the substrate, which is formed after the assembly with the electrical elements in a 3D structure.
2. Verfahren nach Anspruch 1 , dadurch gekennzeichnet, dass die elektrischen Elemente als 2D-Struktur ausgebildet werden.2. The method according to claim 1, characterized in that the electrical elements are formed as a 2D structure.
3. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die elektrischen Elemente als 2D-Schicht-Struktur ausgebildet werden.3. The method according to any one of the preceding claims, characterized in that the electrical elements are formed as a 2D-layer structure.
4. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass als elektrische Elemente Leiterbahnen, dielektrische Lagen, Isolationslagen, Widerstände, Kondensatoren, Anschlüsse und/oder Spulen verwendet werden.4. The method according to any one of the preceding claims, characterized in that are used as electrical elements printed conductors, dielectric layers, insulating layers, resistors, capacitors, terminals and / or coils.
5. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die elektrischen Elemente mittels Liquid Deposition, insbesondere durch InkJet, Microdispensing und/oder anderen Druckverfahren, wie etwa Laserdruck, auf dem Substrat angeordnet werden.5. The method according to any one of the preceding claims, characterized in that the electrical elements by means of liquid deposition, in particular by inkjet, microdispensing and / or other printing methods, such as laser printing, are arranged on the substrate.
6. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass als Substrat Blech verwendet wird.6. The method according to any one of the preceding claims, characterized in that is used as the substrate sheet.
7. Mit elektrischen Elementen (4) versehenes Substrat (1 ), insbesondere hergestellt nach dem Verfahren gemäß einem oder mehreren der vorhergehenden Ansprüche, wobei das Substrat (1 ) als duktiles, umformbares Substrat (3) ausgebildet ist und zusammen mit den elektrischen Elementen (4) in eine 3D-Struktur (13) umgeformt ist. 7. substrate (1) provided with electrical elements (4), in particular produced by the method according to one or more of the preceding claims, wherein the substrate (1) is formed as a ductile, deformable substrate (3) and together with the electrical elements ( 4) is converted into a 3D structure (13).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE200810042810 DE102008042810A1 (en) | 2008-10-14 | 2008-10-14 | Method for producing a substrate provided with electrical elements |
| DE102008042810.8 | 2008-10-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2010043540A1 true WO2010043540A1 (en) | 2010-04-22 |
Family
ID=41402521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2009/063110 WO2010043540A1 (en) | 2008-10-14 | 2009-10-08 | Method for producing a ductile substrate provided with electrical elements |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE102008042810A1 (en) |
| WO (1) | WO2010043540A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10257935B2 (en) | 2013-07-09 | 2019-04-09 | Signify Holding B.V. | Method for manufacturing a printed circuit board assembly based on printed electronics |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010025591A1 (en) * | 2010-06-29 | 2011-12-29 | Conti Temic Microelectronic Gmbh | Sensor carrier and sensor module in particular for use in a motor vehicle suburb control unit |
| DE102010027149A1 (en) * | 2010-07-14 | 2012-01-19 | Fela Hilzinger Gmbh | Bendable metal core board |
| EP3090609B1 (en) | 2014-01-02 | 2017-06-28 | Philips Lighting Holding B.V. | Method for manufacturing a non-planar printed circuit board assembly |
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|---|---|---|---|---|
| US4074419A (en) * | 1976-03-16 | 1978-02-21 | Texas Instruments Incorporated | Printed wiring board with angled portion and its method of manufacture |
| GB2131233A (en) * | 1982-11-29 | 1984-06-13 | Gen Electric | Fabricating shaped printed circuit boards |
| GB2133934A (en) * | 1983-01-17 | 1984-08-01 | Plessey Co Plc | Improvements relating to thick film circuits |
| EP0651598A1 (en) * | 1993-11-02 | 1995-05-03 | Philips Patentverwaltung GmbH | Electronic circuit module |
| EP1091625A2 (en) * | 1999-10-08 | 2001-04-11 | Auxilium S.r.l. | Printed circuit with high heat dissipation capacity |
| DE102004053958B3 (en) * | 2004-11-09 | 2005-09-01 | Behr Hella Thermocontrol Gmbh | Device for detecting electromagnetic radiation, especially sunlight, for use in vehicle, has metal core conducting plate with region(s) inclined to its plane, at least one optoelectronic component arranged in inclined region |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4774979B2 (en) | 2005-12-19 | 2011-09-21 | 村田機械株式会社 | Sheet metal model creation system, sheet metal model creation method, and sheet metal model creation program |
-
2008
- 2008-10-14 DE DE200810042810 patent/DE102008042810A1/en not_active Withdrawn
-
2009
- 2009-10-08 WO PCT/EP2009/063110 patent/WO2010043540A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4074419A (en) * | 1976-03-16 | 1978-02-21 | Texas Instruments Incorporated | Printed wiring board with angled portion and its method of manufacture |
| GB2131233A (en) * | 1982-11-29 | 1984-06-13 | Gen Electric | Fabricating shaped printed circuit boards |
| GB2133934A (en) * | 1983-01-17 | 1984-08-01 | Plessey Co Plc | Improvements relating to thick film circuits |
| EP0651598A1 (en) * | 1993-11-02 | 1995-05-03 | Philips Patentverwaltung GmbH | Electronic circuit module |
| EP1091625A2 (en) * | 1999-10-08 | 2001-04-11 | Auxilium S.r.l. | Printed circuit with high heat dissipation capacity |
| DE102004053958B3 (en) * | 2004-11-09 | 2005-09-01 | Behr Hella Thermocontrol Gmbh | Device for detecting electromagnetic radiation, especially sunlight, for use in vehicle, has metal core conducting plate with region(s) inclined to its plane, at least one optoelectronic component arranged in inclined region |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10257935B2 (en) | 2013-07-09 | 2019-04-09 | Signify Holding B.V. | Method for manufacturing a printed circuit board assembly based on printed electronics |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102008042810A1 (en) | 2010-04-15 |
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