WO2010038957A2 - Procédé de fabrication d'écran tactile, et écran tactile fabriqué à l'aide du procédé - Google Patents

Procédé de fabrication d'écran tactile, et écran tactile fabriqué à l'aide du procédé Download PDF

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Publication number
WO2010038957A2
WO2010038957A2 PCT/KR2009/005516 KR2009005516W WO2010038957A2 WO 2010038957 A2 WO2010038957 A2 WO 2010038957A2 KR 2009005516 W KR2009005516 W KR 2009005516W WO 2010038957 A2 WO2010038957 A2 WO 2010038957A2
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WO
WIPO (PCT)
Prior art keywords
pad
coating layer
pattern
conductive material
transparent conductive
Prior art date
Application number
PCT/KR2009/005516
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English (en)
Korean (ko)
Other versions
WO2010038957A3 (fr
Inventor
박준영
정주현
김세현
배상모
Original Assignee
신와전공 주식회사
윈도우터치컴퍼니리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 신와전공 주식회사, 윈도우터치컴퍼니리미티드 filed Critical 신와전공 주식회사
Priority to CN2009801389349A priority Critical patent/CN102171633A/zh
Publication of WO2010038957A2 publication Critical patent/WO2010038957A2/fr
Publication of WO2010038957A3 publication Critical patent/WO2010038957A3/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser

Definitions

  • the present invention relates to a method for manufacturing a touch panel and a touch panel manufactured by the same, which can be manufactured by a simple uniform process than a process using a conventional silver paste, so that the pattern of the transparent conductive material coating layer can be visually identified.
  • the present invention relates to a touch panel manufacturing method and a touch panel manufactured thereby, which can easily perform a functional test and a visual inspection during a process, thereby reducing a defective rate and reducing a manufacturing cost.
  • the material layer such as ITO is not evenly formed on the plate, but may be formed to have a certain pattern.
  • the transparent conductive material is panel-coated in a constant pattern as shown in FIGS. 1 to 4 to obtain coordinate values. It can also form within.
  • a conventional touch panel manufacturing method uses a photolithography process or the like to form an ITO pattern, and after forming such an ITO layer pattern, a general method for electrical connection between each pattern and the outside is performed.
  • silver paste patterned by a method such as screen printing to produce a pad for manufacturing a touch panel
  • the pad prepared as described above is combined with a plurality of laminated layers to form a touch panel as shown in FIG. Done.
  • the thickness of the conducting wire becomes thick because there is a limit in applying the silver paste thinly, and a step difference occurs in the up and down direction, and the width of the conducting wire in the planar direction becomes wide. Therefore, the durability of the touch panel is reduced, and the density of devices is decreased.
  • a process of curing the silver paste after applying it at a high temperature is needed.
  • an annealing process is a complicated process, there is a problem that the cost increases.
  • the present invention can be produced in a simple uniform process than the process of applying the conventional silver paste, it is possible to visually identify the pattern of the transparent conductive material coating layer, the functional inspection and visual inspection process It is an object of the present invention to provide a touch panel manufacturing method and a touch panel manufactured thereby, which can be easily carried out, which can reduce the defective rate and reduce the manufacturing cost.
  • An insulator layer made of a transparent organic insulator of polyimide or polyethylene terephthalate (PET) or polycarbonate (PC), a transparent conductive material coating layer formed on an upper surface of the insulator layer, and formed on an upper surface of the transparent conductive material coating layer Providing a pad for manufacturing a touch panel including a metal coating layer;
  • a method of manufacturing a touch panel i) bonding a dielectric layer composed of an adhesive layer and an insulator to an upper surface of the pad on which the pattern is formed, or ii) inverting other pads having a pattern on the upper surface of the pad on which the pattern is formed to be spaced apart from each other vertically.
  • a pad including an insulator layer, a transparent conductive material coating layer having a transparent conductive material electrode pattern formed on an upper surface of the insulator layer, and a metal coating layer having a metal electrode pattern formed on an upper surface of the transparent conductive material coating layer;
  • An adhesive layer bonded to an upper surface of the pad;
  • Capacitive touch panel comprising a dielectric layer made of an insulator coupled to the upper surface of the adhesive layer
  • a bottom pad including an insulator layer, a transparent conductive material coating layer having a transparent conductive material electrode pattern formed on the top surface of the insulator layer, and a metal coating layer having a metal electrode pattern formed on the top surface of the transparent conductive material coating layer;
  • a spacer film coupled to the top surface of the pad or a separation film layer coupled to the top edge;
  • an upper surface pad coupled to the upper surface of the spacer or the separation film layer, the upper surface pad having a laminated structure vertically opposite to the lower surface pad.
  • the touch panel manufacturing method of the present invention and the touch panel manufactured thereby, the high temperature curing process and the annealing process can be omitted as compared to the process using the conventional silver paste, so that the manufacturing can be made in a simpler process, and thus the manufacturing is easy.
  • the manufacturing cost can be reduced, and the defect rate can be reduced due to the simplification of the process.
  • the metal layer by patterning the metal layer through a photolithography method, it is possible to form finer conductors and to manufacture a compact device. Since wiring can be arranged at a narrow pitch, the display area can be minimized by minimizing the margin margin of the panel. It is possible to increase, to minimize the step to improve the durability, there is an effect that can implement a touch panel having a high resolution.
  • the pattern of the transparent conductive material coating layer can be visually identified, the functional test and the visual inspection can be easily performed during the process immediately after the pattern of the transparent conductive material coating layer is formed, thereby reducing defect rate and manufacturing cost.
  • the metal electrode part and the lead wire part are made of a double layer of the metal coating layer and the transparent conductive material coating layer, even if a breakage of the metal coating layer occurs, the breakage of the metal coating layer does not occur as a whole. There is an effect to increase.
  • FIG. 1 is an exploded cross-sectional view of a conventional capacitive touch panel and a plan view of a pad for manufacturing a lowermost touch panel.
  • FIG. 2 is a view schematically showing an embodiment of a method of manufacturing a touch panel of the present invention.
  • FIG. 2C shows a plan view.
  • FIG 3 is a view schematically showing another embodiment of the method for manufacturing a touch panel of the present invention.
  • Figure 4 is a photograph taken for another embodiment of the touch panel manufacturing method of the present invention.
  • OCA adhesive layer
  • 50 touch pad top housing
  • 55 screening unit
  • 100 insulator layer
  • 200 transparent conductive material coating layer
  • 300 metal coating layer
  • 400 adhesive layer
  • 500 dielectric layer (touch pad)
  • 550 blocking layer
  • the present invention relates to a method of manufacturing a touch panel, the method of manufacturing a touch panel, comprising an insulator layer made of an organic insulator or an inorganic insulator, a transparent conductive material coating layer formed on an upper surface of the insulator layer, and the transparent conductive material coating layer
  • the metal coating layer and the transparent conductive material coating layer are etched to form a pattern leaving all portions corresponding to any one of the metal electrode pattern and the transparent conductive material electrode pattern.
  • a first step of manufacturing a pad A second step of manufacturing a pad on which a metal coating layer pattern is formed leaving only a portion corresponding to the metal electrode pattern in the metal coating layer remaining in the first step by etching only the metal coating layer on the upper surface of the patterned pad; And i) bonding a dielectric layer made of an adhesive layer and an insulator to an upper surface of the pad on which the pattern is formed, or ii) inverting another pad having a pattern on the upper surface of the pad on which the pattern is formed, to be spaced apart from each other vertically, and then bonding. It is configured to include.
  • the dielectric film (organic insulator) in the case of the capacitance method for example in PET film
  • a transparent conductive material coating layer such as ITO, IZO or ATO
  • Photolithography process including PR coating, exposure, development, etching, strip, etc., Guide processing for setting a standard to form a silver paste pattern on the upper surface of the ITO pattern, Silver paste printing based on the processed guide and the The lower panel as shown in FIG. 1 is completed through a process such as a high temperature curing process for silver paste curing, and other laminated layers as shown. In combination with the touch panel is prepared.
  • an insulator layer made of an organic insulator or an inorganic insulator, a transparent conductive material coating layer formed on the upper surface of the insulator layer, and a metal formed on the upper surface of the transparent conductive material coating layer Since a pad for manufacturing a touch panel including a coating layer is applied, the pad to be supplied includes a transparent conductive material coating layer including ITO on the upper surface of the insulator layer, and a metal coating layer is already formed on the upper surface of the insulator layer.
  • the above-described guide process, the curing process for curing the silver paste, and the like are not necessary separately, and therefore, the annealing process, which is a pretreatment process for preventing the film deformation during curing, is also unnecessary.
  • the pad for manufacturing a touch panel provided as described above is as shown in FIG. 2 (a) and FIG. 3 (a), and the touch pad manufacturing pad is touched through the manufacturing method described above. It is formed as a contact panel of the panel.
  • the pad for manufacturing the touch panel is subjected to etching on the two layers on the upper surface through a patterning process such as a photolithography process on the two layers on the upper surface (transparent conductive material coating layer and the metal coating layer) at the same time.
  • Pattern forming work will be performed.
  • the pattern formed as described above corresponds to a metal electrode pattern (a portion formed by a conventional silver paste printing process, substantially a metal electrode portion connected to a transparent conductive material such as ITO, and a rib line portion connecting the metal electrode signal to the outside).
  • a transparent conductive material electrode pattern corresponding to a portion where a conventional ITO pattern is formed).
  • the ITO electrode which is the part that needs to ensure light transmittance, is left in the first step, leaving the part (pattern) corresponding to the union of the metal electrode (including the lead wire part) and the part corresponding to the transparent conductive material electrode part because it must be electrically connected to each other.
  • the part of is to remove the metal coating layer located on the upper part through two steps to ensure the light transmittance The. Therefore, after the etching process in the first step, the etching state of the transparent conductive material coating layer such as ITO becomes the same shape as the etching state of the metal coating layer, so that the etching pattern can be checked with the naked eye.
  • the inspection process can be performed in the intermediate process, and then, in the second step, the portion corresponding to the light transmitting part is etched to secure the light transmitting part in the second step.
  • the portion corresponding to the metal electrode maintains the two-layer structure of the ITO and the metal layer coated on the upper surface thereof. Details of this are as shown in FIGS. 2 to 4.
  • the etching of the first step may be performed by sequentially etching the two layers, or etching the metal on the uppermost surface first and then etching the transparent conductive material.
  • the etching in the step of etching the metal first may be performed by the etching process of the second step.
  • Simultaneous etching of such a metal coating layer and a transparent conductive material coating layer may be performed in a variety of known manners, preferably through FeCl 3 aqueous solution, the etching of only the metal coating layer of the second step using NaOH aqueous solution It can be etched.
  • the insulator layer 100 is a transparent material as an organic insulator or an inorganic insulator, and the organic insulator is more preferably polyimide or polyethylene terephthalate (PET). Or a transparent or opaque organic insulator comprising polycarbonate (PC) or made of polyimide or polyethylene terephthalate (PET) or polycarbonate (PC), and the inorganic insulator is more preferably made of glass.
  • the transparent conductive material of the transparent conductive material coating layer 200 is preferably a transparent conductive material containing ITO or IZO or made of ITO or IZO in terms of excellent properties and ease of manufacture.
  • the metal coating layer 300 may correspond to a variety of known metals as the material, preferably copper or aluminum in consideration of ease of manufacture and electrical conductivity.
  • various known methods may be applied to the formation of such a metal coating layer, and in order to be coated with a thin thickness, it is preferable that the coating is performed through deposition or sputtering including conventional vapor deposition. .
  • the insulator layer, the transparent conductive material coating layer and the metal coating layer is made of 10 to 1000 ⁇ m in the case of an organic insulator for the durability of the panel, ease of manufacturing during etching of each layer, minimizing the step,
  • the case is made of 100 to 3000 ⁇ m
  • the transparent conductive material coating layer is made of 0.005 to 0.1 ⁇ m
  • the metal coating layer is preferably made of 0.01 to 10 ⁇ m
  • the metal coating layer 300 and the transparent conductive material coating layer ( 200) (particularly ITO) may be easy to manufacture in the etching process when the thickness is formed as described above, having a thickness in the above range reduces the process and facilitates manufacturing, and the thickness of the insulator layer 100 is Durability can be ensured in the said range.
  • the metal coating layer 300 has a thickness of 0.5 to 0.6 ⁇ m, and when the transparent conductive material coating layer 200 is ITO, the thickness of the ITO layer is 0.01 to 0.02 ⁇ m.
  • the thickness of the insulator layer 100 is 50 to 175 ⁇ m when the insulator layer is an organic insulator, and is easy to assemble with the device and to manufacture a compact size device.
  • a conventional photolithography method for such pattern forming etching, a conventional photolithography method (repetition of processes such as PR coating, exposure, development, etching, and peeling as shown in FIG. 4 as a specific example), or other various partial etching methods known in the art Can be applied.
  • the method of manufacturing the touch panel includes: i) a dielectric layer 500 including an adhesive layer 400 and an insulator on an upper surface of a pad on which the pattern is formed. Or 500/550 combination), or ii) inverting other pads having a pattern on the upper surface of the pad on which the pattern is formed, and spaced apart from each other vertically.
  • step i) the agent for coupling the insulator layer 500 or 500/550 made of the adhesive layer 400 and the insulator to the upper surface of the pad on which the pattern is formed.
  • the above-mentioned pad for manufacturing a capacitive touch panel is made of poly A transparent dielectric film comprising mid or polyethylene terephthalate (PET) or polycarbonate (PC), the transparent conductive material is a transparent conductive material including ITO or IZO, and the metal coating layer is aluminum formed by deposition or sputtering or The upper surface of the pad for manufacturing the capacitive touch panel as copper is partially etched to form a pattern.
  • PET polyethylene terephthalate
  • PC polycarbonate
  • the transparent conductive material is a transparent conductive material including ITO or IZO
  • the metal coating layer is aluminum formed by deposition or sputtering or The upper surface of the pad for manufacturing the capacitive touch panel as copper is partially etched to form a pattern.
  • a third step of inverting other pads having the pattern on the upper surface of the pad on which the pattern is formed and being spaced apart from each other vertically is combined. It can be prepared by performing ii).
  • the separation of the two pads formed with the opposite pattern may be configured to include a separation film layer at the edge as shown, or may be configured by arranging spacers in a space at a constant price.
  • the present invention provides a capacitive touch panel and a resistive touch panel manufactured by the manufacturing method as described above, which is manufactured by the manufacturing method of the touch panel as described above, the structure is first
  • the capacitive touch panel is a touch panel manufactured by the manufacturing method of the touch panel (in the third step i).
  • the structure of the capacitive touch panel is (a) (preferably 10).
  • a metal nose having a metal electrode pattern (preferably including a lead line 35) formed on the top surface of the transparent conductive material coating layer 200 (preferably formed to a thickness of 0.01 to 10 ⁇ m).
  • a dielectric layer 500 or 500/550 binder consisting of a pad consisting of a coating layer 300, (b) an adhesive layer 400 bonded to an upper surface of the pad, and (c) an insulator bonded to an upper surface of the adhesive layer 400. It is configured to include).
  • the insulator layer 100 is made of 10 to 1000 ⁇ m in the case of an organic insulator, and of 100 to 3000 ⁇ m in the case of an inorganic insulator.
  • a specific example of this may correspond to an assembly in which these are assembled in step (d) of FIG. 2.
  • the touch panel manufactured by the method of manufacturing the touch panel in the third step ii), the structure of which is (a) (preferably Is an insulator layer 100 having a thickness of 10 to 3000 ⁇ m, and a transparent conductive material coating layer having a transparent conductive material electrode pattern (preferably formed to a thickness of 0.005 to 0.1 ⁇ m) on an upper surface of the insulator layer 100.
  • the upper surface of the 200 is formed of a metal coating layer 300 (preferably formed with a thickness of 0.01 to 10 ⁇ m) and the metal electrode pattern is formed including a top pad having a laminated structure that is vertically symmetrical with the bottom pad Lose.
  • the insulator layer 100 is made of 10 to 10
  • a specific example of this may correspond to an assembly in which they are assembled in step (d) of FIG. 3.
  • the touch panel manufacturing method of the present invention and the touch panel manufactured thereby, the high temperature curing process and the annealing process can be omitted compared to the process using the conventional silver paste, so that the manufacturing can be made in a simpler process, and thus the manufacturing is easy.
  • the manufacturing cost can be reduced, and the defect rate can be reduced due to the simplification of the process.
  • the metal layer by patterning the metal layer through a photolithography method, it is possible to form finer conductors and to manufacture a compact device. Since wiring can be arranged at a narrow pitch, the display area can be minimized by minimizing the margin margin of the panel. It is possible to increase, to minimize the step to improve the durability, there is an effect that can implement a touch panel having a high resolution.
  • the pattern of the transparent conductive material coating layer can be visually identified, the functional test and the visual inspection can be easily performed during the process immediately after the pattern of the transparent conductive material coating layer is formed, thereby reducing defect rate and manufacturing cost.
  • the metal electrode part and the lead wire part are made of a double layer of the metal coating layer and the transparent conductive material coating layer, even when the metal coating layer is disconnected, there is no disconnection as a whole. There is an effect to increase.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Position Input By Displaying (AREA)
  • Manufacture Of Switches (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un écran tactile, et un écran tactile fabriqué à l'aide du procédé. Le procédé comprend les étapes consistant à: 1) graver une couche de revêtement métallique et une couche de revêtement de matière conductrice transparente sur une surface supérieure d'une plaquette en vue de la fabrication de l'écran tactile, qui comprend une couche isolante faite d'un isolant organique ou d'un isolant inorganique, la couche de revêtement de matière conductrice transparente étant formée sur la couche isolante, et la couche de revêtement métallique étant formée sur la couche de revêtement de matière conductrice transparente, afin de produire une plaquette comportant un motif dans lequel soit un motif d'électrode conductrice métallique, soit un motif d'électrode de matière conductrice transparente reste entier; 2) graver uniquement la couche de revêtement métallique sur la surface supérieure de la plaquette où le motif est formé, afin de produire une plaquette comportant le motif de couche de revêtement métallique dans laquelle seule la partie correspondant au motif d'électrode métallique reste, à partir de la couche de revêtement métallique restante de la première étape; et 3) a) coupler une couche adhésive et une couche diélectrique faite d'un isolant sur la surface supérieure de la plaquette comportant le motif, ou b) tourner vers le bas la face supérieure d'une autre plaquette comportant un motif et coupler une autre plaquette sur la surface supérieure de la plaquette comportant le motif, de sorte que les deux plaquettes sont espacées verticalement l'une par rapport à l'autre. L'écran tactile de l'invention peut être fabriqué à l'aide de procédés simplifiés par rapport aux procédés classiques comportant l'application d'une pâte d'argent. De plus, l'invention permet de distinguer à l'oeil nu le motif d'une couche de revêtement de matière conductrice transparente, ce qui facilite la mise en œuvre d'un test de fonction et d'un test visuel pendant le procédé et permet de réduire le taux de défauts et les coûts de fabrication.
PCT/KR2009/005516 2008-10-01 2009-09-28 Procédé de fabrication d'écran tactile, et écran tactile fabriqué à l'aide du procédé WO2010038957A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009801389349A CN102171633A (zh) 2008-10-01 2009-09-28 触摸面板的制造方法及使用该方法制造的触摸面板

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Application Number Priority Date Filing Date Title
KR10-2008-0096674 2008-10-01
KR1020080096674A KR100908101B1 (ko) 2008-10-01 2008-10-01 터치패널의 제조방법 및 이에 의해 제조되는 터치패널

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WO2010038957A2 true WO2010038957A2 (fr) 2010-04-08
WO2010038957A3 WO2010038957A3 (fr) 2010-07-29

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WO2014084696A1 (fr) * 2012-11-30 2014-06-05 주식회사 엘지화학 Substrat conducteur et procédé pour sa fabrication
CN111028702A (zh) * 2019-12-05 2020-04-17 湖南创瑾科技有限公司 一种制造led透明显示屏的方法及显示屏

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US9482693B2 (en) 2011-02-04 2016-11-01 Shin-Etsu Polymer Co., Ltd. Capacitive sensor sheet and production method thereof
JP5942725B2 (ja) * 2012-09-18 2016-06-29 デクセリアルズ株式会社 導電性シート
KR20140122338A (ko) 2013-04-09 2014-10-20 쓰리엠 이노베이티브 프로퍼티즈 캄파니 터치패널, 그 제조방법 및 터치패널용 Ag-Pd-Nd 합금
CN103396012A (zh) * 2013-07-23 2013-11-20 蓝思科技（长沙）有限公司 一种采用金属或合金实现触控面板视窗边框图案及色彩的方法
EP2863291A1 (fr) * 2013-10-18 2015-04-22 Applied Materials, Inc. Corps transparent pour procédé de fabrication de panneau tactile et système de fabrication d'un corps transparent pour un tel panneau
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