WO2010034139A1 - 交流电发光二极管模块 - Google Patents

交流电发光二极管模块 Download PDF

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Publication number
WO2010034139A1
WO2010034139A1 PCT/CN2008/001689 CN2008001689W WO2010034139A1 WO 2010034139 A1 WO2010034139 A1 WO 2010034139A1 CN 2008001689 W CN2008001689 W CN 2008001689W WO 2010034139 A1 WO2010034139 A1 WO 2010034139A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat conducting
conducting plate
alternating current
emitting diode
light emitting
Prior art date
Application number
PCT/CN2008/001689
Other languages
English (en)
French (fr)
Inventor
张义辉
郝敬健
Original Assignee
Chang Yihui
Hao Chingchien
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chang Yihui, Hao Chingchien filed Critical Chang Yihui
Priority to EP08877018A priority Critical patent/EP2330639A4/en
Priority to US13/121,374 priority patent/US20110180841A1/en
Priority to PCT/CN2008/001689 priority patent/WO2010034139A1/zh
Priority to JP2011528156A priority patent/JP2012503865A/ja
Priority to CN2008801153651A priority patent/CN101889353A/zh
Publication of WO2010034139A1 publication Critical patent/WO2010034139A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB

Definitions

  • the present invention relates to an LED module, and more particularly to an AC LED module that is driven by an alternating current. Background technique
  • LED Light Emi tt ing Diode
  • LEDs According to different driving modes of LED chips (chips, ie, chips), LEDs can be divided into DC LEDs and AC LED modules.
  • the LED chip of the DC light-emitting diode needs to be lit by DC power.
  • an additional circuit such as a current converter (Inverter) is needed to convert the AC power in the daily power environment into DC power.
  • the external circuit increases the manufacturing cost and space, so that the volume of the direct current LED is difficult to be reduced, and the heat generated by the external circuit increases the heat dissipation load of the direct current LED, thereby affecting the service life of the direct current LED.
  • the AC LED module is a light-emitting diode that can be directly plugged into an AC voltage.
  • the AC LED module can be directly used without adding an external circuit such as a current converter, and the AC LED module has a low current operation characteristic.
  • AC LED modules Compared with DC photodiodes, AC LED modules have the advantages of small size, easy cost reduction, and long life extension. In recent years, the application and research and development of AC LED modules have attracted more and more attention.
  • the heat dissipation performance of the conventional AC light-emitting diode module is generally low.
  • the heat generated by the AC light-emitting diode chip is large, it is often difficult to dissipate heat in a timely and rapid manner, so that the service life and reliability of the AC LED module are easily made. Degree is affected.
  • the object of the present invention is to overcome the defects of the existing AC light emitting diode module, and Providing a novel structure of an alternating current light emitting diode module, the technical problem to be solved is that it has better heat dissipation performance and insulation performance.
  • An AC LED module includes: an AC LED chip, a first heat conducting plate, and a ceramic base, wherein the AC LED chip is driven by an alternating current driving, the first heat conducting plate is located On the ceramic base, the AC LED chip is located on the first heat conducting plate.
  • the material of the ceramic base is alumina or aluminum nitride.
  • the alternating current light emitting diode module further includes a heat conducting column, one end of the heat conducting column is connected to the first heat conducting plate, and the other end of the heat conducting column extends into the ceramic base, wherein the first heat conduction
  • the material of the plate or the heat conducting column is metal, aluminum or copper.
  • the first heat conducting plate and the heat conducting column are formed by integral molding, or are fixedly connected to each other by welding or screw.
  • the ceramic base includes a bottom surface, a top surface opposite to the bottom surface, and a connecting hole extending from the top surface toward the interior of the ceramic base, wherein the first heat conducting plate is located On the top side, the heat conducting post extends into the interior of the ceramic base by mating with the connecting hole.
  • a heat dissipating paste is filled between the heat conducting column and the wall of the connecting hole.
  • the ceramic base includes a bottom surface, a top surface opposite to the bottom surface, and a connecting hole extending through the top surface and the bottom surface, the first heat conducting plate is located on the top surface side.
  • the connecting hole is a stepped through hole, and the larger end of the connecting hole has a larger end on the bottom surface side, and the heat conducting column is loaded from the bottom side to the connecting hole and connected to the first heat conducting plate.
  • a heat dissipating paste is filled between the heat conducting column and the wall of the connecting hole.
  • the alternating current light emitting diode module further includes a heat conducting column, one end of the heat conducting column is connected to the first heat conducting plate, and the ceramic base is formed on the first heat conducting plate by injection molding. And wrap the other end of the heat conducting column.
  • the portion of the heat conducting column wrapped by the ceramic base has a diffusing portion.
  • the heat conducting column is bent by the diffusing portion of the ceramic base.
  • the AC LED module further includes a second heat conducting plate
  • the ceramic base includes a top surface, a bottom surface opposite to the top surface, and a side surface connecting the top surface and the bottom surface
  • the first guide The heat conducting plate is located at the top surface
  • the second heat conducting plate is located at the bottom surface or the side surface
  • the heat conducting column is connected to the first heat conducting plate and the second heat conducting plate, wherein the first heat conducting plate, the heat conducting column and the first heat conduction
  • the material of the board is metal, aluminum or copper.
  • the first heat conducting plate or the second heat conducting plate and the heat conducting column are formed by integral molding or are fixedly connected to each other by welding or screw.
  • the AC LED module of the present invention has at least the following advantages and benefits:
  • the ceramic base has excellent heat dissipation performance, heat generated by the alternating current light emitting diode chip is easily transmitted to the ceramic base through the first heat conducting plate to be quickly dissipated.
  • the AC LED module further includes a heat conducting column, the heat conducting column has better heat conduction performance, so that the heat conduction performance of the ceramic base can be compensated for, and the heat generated by the AC light emitting diode chip is transmitted to the ceramic base. , thereby further improving the heat dissipation performance of the AC LED module.
  • the present invention relates to an alternating current light emitting diode module including an alternating current light emitting diode chip, a first heat conducting plate and a ceramic base.
  • the first heat conducting plate is located on the ceramic base, and the alternating current light emitting diode chip is located.
  • the first heat conducting plate is located on the ceramic base, and the alternating current light emitting diode chip is located.
  • the first heat conducting plate is located on the ceramic base.
  • the first heat conducting plate is located.
  • the above-mentioned AC LED module has the advantages of better heat dissipation and insulation performance.
  • the invention has the above-mentioned many advantages and practical values, and has great improvement in product structure or function, has significant progress in technology, and has produced useful and practical effects, and is more than existing AC electroluminescence.
  • the diode module has an enhanced outstanding effect, which makes it more suitable for practical use. It is a new, progressive and practical new design.
  • FIG. 1 is a cross-sectional view showing a first embodiment of an alternating current light emitting diode module of the present invention.
  • FIG. 2 is a cross-sectional view showing a second embodiment of the alternating current light emitting diode module of the present invention.
  • FIG 3 is a cross-sectional view showing a third embodiment of the alternating current light emitting diode module of the present invention.
  • FIG. 4 is a cross-sectional view showing a fourth embodiment of the alternating current light emitting diode module of the present invention.
  • Figure 5 is a cross-sectional view showing a fifth embodiment of the alternating current light emitting diode module of the present invention.
  • FIG. 6 is a cross-sectional view showing a sixth embodiment of an alternating current light emitting diode module of the present invention.
  • FIG. 7 is a cross-sectional view showing a seventh embodiment of an alternating current light emitting diode module of the present invention.
  • Figure 8 is a cross-sectional view showing an eighth embodiment of the alternating current light emitting diode module of the present invention. 10, 20, 30, 40, 50, 60, 70, 80: AC-current illuminating. Diode module
  • the AC LED module 10 of the first embodiment of the present invention includes an AC LED chip 12, a first heat conducting plate 14, and a ceramic base 16.
  • the first heat conducting plate 14 is located on the ceramic base 16, and the AC LED chip 12 is located on the first heat conducting plate 14.
  • the first heat conducting plate 14 is made of a material having better thermal conductivity, such as a metal material; and the ceramic base 16 is made of a ceramic material having better heat dissipation properties, such as alumina, aluminum nitride or silicon carbide.
  • the AC LED module 10 further includes a heat conducting column 18 .
  • the heat conducting column 18 is formed integrally with the first heat conducting plate 14.
  • the heat conducting column 18 is similar to the first heat conducting plate 14 and is made of a material having better heat conducting properties, such as a metal, such as aluminum or copper. In order to make the alternating current light emitting diode module 10 have a lower cost, aluminum is preferred. s Choice. It can be understood that the material of the heat conducting column 18 and the first heat conducting plate 14 may be the same or different. Of course, to make the heat conducting column 18 and the first heat conducting plate 14 easy to integrally form, the same material is preferred.
  • the ceramic base 16 includes a bottom surface 164, a top surface 166 opposite the bottom surface, and a connection hole 162.
  • the first heat conducting plate 14 is located on the top surface 166.
  • the connection hole 162 extends from the top surface 166 toward the inside of the ceramic base 16.
  • the other end of the heat conducting post 18 opposite to the first heat conducting plate 14 is engaged with the connecting hole 162, that is, a portion of the heat conducting post 18 projects into the interior of the ceramic base 16 by mating with the connecting hole 162.
  • the ceramic base 16 has excellent heat dissipation performance, heat generated by the AC LED chip 12 is easily transmitted to the ceramic base 16 through the first heat conducting plate 14 to be quickly dissipated; for example, the ceramic base 16 has a porous shape.
  • the gas outside the ceramic base 16 can enter the interior of the ceramic base 16 through the pores of the ceramic base 16, and the heat inside the ceramic base 16 is affected by thermal convection. Bring out.
  • the heat generated by the AC LED chip 12 is quickly transmitted to the ceramic base 16 by the first heat conducting plate 14, and the heat is easily radiated to the outside of the AC LED module 10 by the above-mentioned thermal convection, thereby improving the AC power.
  • the heat dissipation performance of the LED module 10 further improves the service life and reliability of the AC LED module 10.
  • the AC LED module 10 further includes a heat conducting column 18, the heat conducting column 18 has better heat conduction performance, so that the heat generated by the AC LED chip 12 is transmitted to the ceramic base 16 to increase the heat transfer speed.
  • the heat dissipation performance of the AC LED module 10 is further improved.
  • FIG. 2 is a cross-sectional view showing a second embodiment of the AC light emitting diode module of the present invention.
  • the AC LED module 20 of the second embodiment of the present invention is similar to the AC LED module 10, and includes an AC LED chip 22, a first heat conducting plate 24, a ceramic base 26, and a heat conducting column 28. The difference is that the heat conducting column 28 and the first heat conducting plate 24 are fixedly connected to each other by welding.
  • FIG. 3 is a cross-sectional view showing a third embodiment of the AC light emitting diode module of the present invention.
  • the AC LED module 30 of the third embodiment of the present invention is similar to the AC LED module 10, and includes an AC LED chip 32, a first heat conducting plate 34, a ceramic base 36, and a heat conducting column 38. The difference is that the heat conducting column 38 and the first heat conducting plate 34 are fixedly connected to each other by screws 35.
  • FIG. 4 is a cross-sectional view showing a fourth embodiment of the AC light emitting diode module of the present invention.
  • the AC LED module 40 of the fourth embodiment of the present invention is similar to the AC LED module 10, and includes an AC LED chip 4 2 , a first heat conducting plate 44 , a ceramic base 46 , and a heat conducting column 48 .
  • the ceramic base 46 has a connecting hole. 462. The difference is that a heat dissipating paste 49 is filled between the heat conducting post 48 and the hole wall of the connecting hole 462.
  • thermal grease 49 is filled with a heat conducting wall of the hole 462 between the post 48 and the connecting hole, and therefore may further exclude air voids heat conducting column 4 ⁇ coupling hole 462 between the hole wall, thereby reducing the heat conducting column 48 and the ceramic base 46
  • the thermal resistance between the two increases the heat dissipation performance of the AC LED module 40.
  • FIG. 5 is a cross-sectional view showing a fifth embodiment of the AC light emitting diode module of the present invention.
  • the AC LED module 50 of the fifth embodiment of the present invention is similar to the AC LED module 10, and includes an AC LED chip 5, a first heat conducting plate M, a ceramic base 56, and a heat conducting column 58.
  • the ceramic base 56 includes a bottom surface 564, and The bottom surface is opposite to the top surface 566 and the connecting hole 562.
  • the difference is that the connecting hole 562 is a stepped through hole penetrating the bottom surface 564 and the top surface 566.
  • the connecting hole 562 includes a first hole segment 561 and a second hole segment 563, and the second hole segment 5 63 bits On the side of the bottom surface 564, and its aperture is larger than the first hole segment 561.
  • the heat conducting post 58 can be inserted into the connecting hole 562 from the second hole segment 563 on the bottom surface 564 side and then fixed to the first heat conducting plate 54 by screws 55. Since the heat conducting post 58 is inserted into the connecting hole 562 from the second hole segment 563 on the bottom surface 564 side, the heat conducting post 58 can be mounted after the AC LED chip 52, the first heat conducting plate 54, and the ceramic base 56 are molded, so that The preparation of the AC LED module 50.
  • the larger diameter end of the heat conducting post 58 is located away from the bottom surface 564 side of the first heat conducting plate 54, so that the heat conducting post 58 is easy to transfer more heat to the bottom surface 564 side of the ceramic base 56.
  • the heat dissipation performance of the AC LED module 50 is further improved. It can be understood that a heat dissipating paste (not shown) may be filled between the heat conducting column 58 and the wall of the connecting hole 562.
  • FIG. 6 there is shown a cross-sectional view of a sixth embodiment of an alternating current light emitting diode module of the present invention.
  • the AC LED module 60 of the sixth embodiment of the present invention is similar to the AC LED module 10, and includes an AC LED chip 62, a first heat conducting plate 64, a ceramic base 66, and a heat conducting column 68.
  • the ceramic base 66 has a connecting hole 662. .
  • the difference is that the ceramic base 66 has a plurality of connecting holes 662 and a heat conducting post 68.
  • the AC LED module 70 of the seventh embodiment of the present invention is similar to the AC LED module 10, and includes an AC LED chip 72, a first heat conducting plate 74, a ceramic base 76, and a heat conducting column 78.
  • the ceramic base 76 is formed on the first heat conducting plate 74 by injection molding and wraps the heat conducting column 78, and is located at the other end of the first heat conducting plate 74 opposite to the alternating current light emitting diode chip 72;
  • the portion of the post 78 that is wrapped by the ceramic base 76 can have a diffuser 782.
  • the diffusing portion 782 is for expanding the contact area of the thermally conductive post 78 with the ceramic base 76 inside the ceramic base 76, which may be bent. Since the ceramic base 76 wraps the heat conducting post 78 by injection molding, the heat conducting post 78 can be brought into close contact with the ceramic base 76, and an air layer is formed between the heat conducting post 78 and the ceramic base 76, thereby reducing the heat conducting column 78. The thermal resistance between the ceramic base 76 and the ceramic base 76 further enhances the heat dissipation performance of the AC LED module 70.
  • the portion of the heat conducting post 78 surrounded by the ceramic base 76 contains the diffusing portion 782, the heat distribution on the ceramic base 76 can be further accelerated, thereby further utilizing the heat dissipation performance of the ceramic base 76 and improving the alternating current light emitting diode.
  • the heat dissipation performance of module 70 since the portion of the heat conducting post 78 surrounded by the ceramic base 76 contains the diffusing portion 782, the heat distribution on the ceramic base 76 can be further accelerated, thereby further utilizing the heat dissipation performance of the ceramic base 76 and improving the alternating current light emitting diode.
  • the heat dissipation performance of module 70 is not limited to be used in the portion of the heat conducting post 78 surrounded by the ceramic base 76.
  • FIG. 8 is a cross-sectional view showing an eighth embodiment of the AC light emitting diode module of the present invention.
  • the AC LED module 80 of the eighth embodiment of the present invention is similar to the AC LED module 10, and includes an AC LED chip 8 2 , a first heat conducting plate 84 , a ceramic base 86 , and a heat conducting column 88 . The difference is that the AC LED module 80 further includes a second heat conducting plate 89.
  • the ceramic base 86 includes a top surface 866, a bottom surface 864 opposite the top surface 866, and a side surface 865 connecting the top surface 866 and the bottom surface 864.
  • first heat conducting plate 84 and the heat conducting column 88 is formed in one piece, a second heat conducting plate 89 secured by screws 85 to each other and the connection between the heat conducting column 88, this is only an example, the first object of the thermally conductive Both the plate 84 and the second heat conducting plate 89 can be connected by a heat conducting column 88.
  • the material of the second heat conducting plate 89 may be similar to the first heat conducting plate 84 and the heat conducting column 88, such as aluminum or copper.
  • the AC LED module 80 can easily further improve the heat dissipation performance.
  • the second heat conducting plate 89 can also be located at the side 865 of the ceramic base 86; the connection manner between the first heat conducting plate 84 or the second heat conducting plate 89 and the heat conducting column 88 can also be changed, for example, the first heat conduction.
  • the plate 84 and the heat conducting column 88 are fixedly connected to each other by welding or screwing, and the second heat conducting plate 89 and the heat conducting column 88 are integrally formed or fixed by welding, or the first heat conducting plate 84, the second heat conducting plate 89 and the heat conducting.
  • the post 88 is formed in an integrally formed manner.
  • the ceramic base has excellent heat dissipation and insulation properties, heat generated by the alternating current light emitting diode chip is easily transmitted to the ceramic base through the first heat conducting plate to be quickly dissipated.
  • the AC LED module further includes a heat conducting column, the heat conducting column has better heat conduction performance, so that the heat conduction performance of the ceramic base can be compensated for, and the heat generated by the AC light emitting diode chip is transmitted to the ceramic base. , thereby further improving the heat dissipation and insulation performance of the AC LED module.
  • the heat conducting column can be omitted when the heat dissipation performance is relatively low and the first heat conducting plate has a high contact area with the adjacent surface of the ceramic base.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Description

交流电发光二极管模块 技术领域
本发明是有关于一种发光二极管模块，且特别是有关于一种以交流电 驱动的交流电发光二极管模块。 背景技术
发光二极管 （Light Emi tt ing Diode, LED )是一种固态半导体发光元 作。
Figure imgf000003_0001
高、体积小、 5寿命长、 污染低等特性，在照明、 背光及显示等领域具有广阔的应用前景。
依据发光二极管芯片 （芯片即晶片， 本文均称为芯片） 不同电流的驱 动方式， 发光二极管可分为直流电发光二极管与交流电发光二极管模块。
其中直流电发光二极管的发光二极管芯片需通过直流电点亮，使用时， 其需增设一外加电路，例如电流转换器（Inverter) ,以将日常电力环境下的 交流电转换为直流电使用。 然而，该外加电路会增加制造成本、 占用空间， 从而使直流电发光二极管体积难以缩小，且该外加电路产生的热量还会增 加直流电发光二极管的散热负荷， 进而影响直流电发光二极管的使用寿命。
交流电发光二极管模块是指可以直接插接于交流电压使用的发光二极 管。 交流电发光二极管模块无需增设电流转换器等的外加电路便可直接使 用，并且交流电发光二极管模块还具有低电流操作的特性。 相较于直流电发 光二极管，交流电发光二极管模块具有体积小、 易于降低成本且寿命较易延 长等优点。 近年来交流电发光二极管模块的应用与研发已越来越受到关注。
然而， 习知技术的交流电发光二极管模块的散热性能一般， 当交流电 发光二极管芯片产生的热量较多时， 其往往难以将热量及时、 快速地散发 出去， 因此容易使交流电发光二极管模块的使用寿命及可靠度受影响。
有鉴于上述现有的交流电发光二极管模块存在的缺陷，本发明人基于 从事此类产品设计制造多年丰富的实务经验及专业知识，并配合学理的运 用，积极加以研究创新，以期创设一种新型结构的交流电发光二极管模块， 能够改进一般现有的交流电发光二极管模块， 使其更具有实用性。 经过不 断的研究、 设计，并经过反复试作样品及改进后， 终于创设出确具实用价值 的本发明。 发明内容
本发明的目的在于，克服现有的交流电发光二极管模块存在的缺陷，而 提供一种新型结构的交流电发光二极管模块，所要解决的技术问题是使其 具有较佳的散热性能与绝缘性能。
本发明的目的及解决其技术问题是采用以下技术方案来实现的。 依据 本发明提出的一种交流电发光二极管模块， 其包括： 一交流电发光二极管 芯片、 一第一导热板及一陶瓷基座， 其中该交流电发光二极管芯片是以交 流电驱动发光， 该第一导热板位于该陶瓷基座上， 该交流电发光二极管芯 片位于该第一导热板上。
本发明的目的及解决其技术问题还可采用以下技术措施进一步实现。 前述的交流电发光二极管模块，其中所陶瓷基座的材料为氧化铝或氮 化铝。
前述的交流电发光二极管模块，其中所述的交流电发光二极管模块还 包括一导热柱， 该导热柱一端与该第一导热板相连， 相对的另一端伸入该 陶瓷基座内部， 其中该第一导热板或该导热柱的材料为金属、 铝或铜。
前述的交流电发光二极管模块，其中所述的第一导热板与该导热柱藉 由一体成型方式形成， 或藉由焊接或螺丝相互固定连接。
前述的交流电发光二极管模块，其中所述的陶瓷基座包括一底面、 一与 该底面相对的顶面及一从该顶面朝该陶瓷基座内部延伸的连接孔， 该第一 导热板位于该顶面侧， 该导热柱是藉由与该连接孔相配合而伸入该陶瓷基 座内部。
前述的交流电发光二极管模块，其中所述的导热柱与该连接孔孔壁之 间填充有散热膏。
前述的交流电发光二极管模块，其中所述的陶瓷基座包括一底面、 一与 该底面相对的顶面及一贯穿该顶面与该底面的连接孔， 该第一导热板位于 该顶面侧， 该连接孔为阶梯形通孔， 该连接孔的孔径较大端位于底面侧， 该导热柱从该底面侧装入该连接孔再与该第一导热板相连。
前述的交流电发光二极管模块，其中所述的导热柱与该连接孔孔壁之 间填充有散热膏。
前述的交流电发光二极管模块，其中所述的交流电发光二极管模块还 包括一导热柱， 该导热柱一端与该第一导热板相连， 该陶瓷基座藉由射出 成型方式形成于该第一导热板上且包裹该导热柱的另一端。
前述的交流电发光二极管模块，其中所述的导热柱被该陶瓷基座包裹 的部分具有一扩散部。
前述的交流电发光二极管模块，其中所述的导热柱被该陶瓷基座的扩 散部呈弯折状。
前述的交流电发光二极管模块，其还包括一第二导热板， 该陶瓷基座包 括一顶面、 一与该顶面相对的底面及连接该顶面与底面的侧面， 该第一导 热板位于该顶面， 该第二导热板位于该底面或侧面， 该导热柱连接该第一 导热板与该第二导热板， 其中该第一导热板、 该导热柱及该二第一导热板 之材料为金属、 铝或铜。
前述的交流电发光二极管模块，其中所述的第一导热板或该第二导热 板与该导热柱藉由一体成型方式形成或藉由焊接或螺丝相互固定连接。
本发明与现有技术相比具有明显的优点和有益效果。 借由上述技术方 案，本发明交流电发光二极管模块至少具有下列优点及有益效果：
本发明的交流电发光二极管模块， 由于陶瓷基座具有优良的散热性能， 因此容易使交流电发光二极管芯片产生的热量通过第一导热板传给陶瓷基 座而快速散发。 进一步， 由于交流电发光二极管模块还包括导热柱，导热柱 具有较佳的热传导性能， 因此还可弥补陶瓷基座的热传导性能的不足,使交 流电发光二极管芯片产生的热量传递至陶瓷基座的速度加快， 从而进一步 提升交流电发光二极管模块的散热性能。
为让本发明之上述和其他目的、 特征和优点能更明显易懂，下文特举实 施例， 并配合所附图式， 作详细说明如下。
综上所述， 本发明本发明是有关于一种交流电发光二极管模块， 其包 括交流电发光二极管芯片、 第一导热板及陶瓷基座， 第一导热板位于陶瓷 基座上， 交流电发光二极管芯片位于第一导热板上。 上述交流电发光二极 管模块具有散热与绝缘性能较佳的优点。 本发明具有上述诸多优点及实用 价值， 其不论在产品结构或功能上皆有较大的改进， 在技术上有显著的进 步，并产生了好用及实用的效果， 且较现有的交流电发光二极管模块具有增 进的突出功效， 从而更加适于实用， 诚为一新颖、 进步、 实用的新设计。
上述说明仅是本发明技术方案的概述， 为了能够更清楚了解本发明的 技术手段， 而可依照说明书的内容予以实施， 并且为了让本发明的上述和 其他目的、 特征和优点能够更明显易懂， 以下特举较佳实施例， 并配合附 图，详细说明如下。 附图的简要说明
图 1是本发明交流电发光二极管模块第一实施例的剖面示意图。
图 2是本发明交流电发光二极管模块第二实施例的剖面示意图。
图 3是本发明交流电发光二极管模块第三实施例的剖面示意图。
图 4是本发明交流电发光二极管模块第四实施例的剖面示意图。
图 5是本发明交流电发光二极管模块第五实施例的剖面示意图。
图 6是本发明交流电发光二极管模块第六实施例的剖面示意图。
图 7是本发明交流电发光二极管模块第七实施例的剖面示意图。
图 8是本发明交流电发光二极管模块第八实施例的剖面示意图。 10、 20、 30、 40、 50、 60、 70、 80： 交-流电发光.二极管模块
12、 22、 32、 42、 52、 62、 72、 82： 交流电发光-二极管芯片
14、 24、 34、 44、 54、 64、 74、 84： 第一导热板
89： 第二导热板
16、 26、 36、 46、 56、 66、 76、 86： 陶瓷基座
162、 462、 562、 662： 连接孔
561: 第一孔段
563： 与第二孔段
164、 564、 864: 底面
865： 侧面
166、 566、 866: 顶面
18、 28、 38、 48、 58、 68、 78、 88： 导热柱
35、 55、 85： 螺丝
49: 散热膏
782： 扩散部 实现发明的最佳方式
为更进一步阐述本发明为达成预定发明目的所采取的技术手段及功 效，以下结合附图及较佳实施例， 对依据本发明提出的交流电发光二极管模 块其具体实施方式、 结构、 特征及其功效， 详细说明如后。
请参阅图 1 所示， 是本发明交流电发光二极管模块第一实施例的剖面 示意图。 本发明第一实施例的交流电发光二极管模块 10, 其包括一交流电 发光二极管芯片 12、 一第一导热板 14及一陶瓷基座 16。 第一导热板 14位 于陶瓷基座 16上， 交流电发光二极管芯片 12位于第一导热板 14上。 其中 第一导热板 14是由导热性较佳的材料制成，例如金属材料； 陶瓷基座 16是 由散热性能较佳的陶瓷材料制成， 例如氧化铝、 氮化铝或碳化硅。
在本实施例中，交流电发光二极管模块 10还包括导热柱 18。 导热柱 18 与第一导热板 14 以一体成型方式形成。 导热柱 18与第一导热板 14相似， 是采用具有较佳热传导性能的材料制成，例如金属，具体如铝或铜；为使交 流电发光二极管模块 10具有较低的成本，以为铝为较佳的选择。可以理解， 导热柱 18与第一导热板 14的材料可以相同，也可不同，当然为使导热柱 18 与第一导热板 14之间容易一体成型，采用相同的材料为较佳的选择。 陶瓷 基座 16包括底面 164、 与底面相对的顶面 166及连接孔 162。 第一导热板 14位于顶面 166上。连接孔 162从顶面 166朝陶瓷基座 16内部延伸。导热 柱 18与第一导热板 14相对的另一端与连接孔 162相配合， 亦即导热柱 18 的部分藉由与连接孔 162相配合而伸入到陶瓷基座 16的内部。 使用时，由于陶瓷基座 16具有优良的散热性能，因此容易使交流电发光 二极管芯片 12产生的热量通过第一导热板 14快速传递给陶瓷基座 16而快 速散发； 例如陶瓷基座 16具有多孔隙结构， 当陶瓷基座 16位于气体环境 中时， 陶瓷基座 16外部的气体即可经由陶瓷基座 16的孔隙进入陶瓷基座 16内部， 并藉由热对流作用将陶瓷基座 16内部的热量带出。 如此一来，交 流电发光二极管芯片 12产生的热量藉由第一导热板 14快速传递至陶瓷基 座 16后，极易由上述的热对流作用将热量散发到交流电发光二极管模块 10 外，从而提升交流电发光二极管模块 10 的散热性能， 进而提高交流电发光 二极管模块 10的使用寿命及可靠度。 进一步， 由于交流电发光二极管模块 10还包括导热柱 18， 导热柱 18具有较佳的热传导性能， 使交流电发光二 极管芯片 12产生的热量传递至陶瓷基座 16的面积增加， 使热量传递速度 加快， 从而进一步提升交流电发光二极管模块 10的散热性能。
请参阅图 2 所示， 是本发明交流电发光二极管模块第二实施例的剖面 示意图。 本发明第二实施例的交流电发光二极管模块 20与交流电发光二极 管模块 10相似， 包括交流电发光二极管芯片 22、 第一导热板 24、 陶瓷基 座 26及导热柱 28。其不同点在于： 导热柱 28与第一导热板 24之间是采用 焊接相互固定连接。
请参阅图 3 所示， 是本发明交流电发光二极管模块第三实施例的剖面 示意图。 本发明第三实施例的交流电发光二极管模块 30与交流电发光二极 管模块 10相似， 包括交流电发光二极管芯片 32、 第一导热板 34、 陶瓷基 座 36及导热柱 38。其不同点在于： 导热柱 38与第一导热板 34之间是采用 螺丝 35相互固定连接。
请参阅图 4所示， 是本发明交流电发光二极管模块第四实施例的剖面 示意图。 本发明第四实施例的交流电发光二极管模块 40与交流电发光二极 管模块 10相似， 包括交流电发光二极管芯片 42、 第一导热板 44、 陶瓷基 座 46及导热柱 48; 陶瓷基座 46具有连接孔 462。 其不同点在于： 导热柱 48与连接孔 462孔壁之间填充有散热膏 49。 由于导热柱 48与连接孔 462 孔壁之间填充有散热膏 49，因此还可进一步排除导热柱 4δ与连接孔 462孔 壁之间空隙内的空气， 从而降低导热柱 48与陶瓷基座 46之间的热阻，进而 提升交流电发光二极管模块 40的散热性能。
请参阅图 5 所示， 是本发明交流电发光二极管模块第五实施例的剖面 示意图。 本发明第五实施例的交流电发光二极管模块 50与交流电发光二极 管模块 10相似， 包括交流电发光二极管芯片 5 第一导热板 M、 陶瓷基 座 56及导热柱 58 , 陶瓷基座 56包括底面 564、 与底面相对之顶面 566及 连接孔 562。 其不同点在于： 连接孔 562为阶梯形通孔， 其贯穿底面 564与 顶面 566。 连接孔 562包括第一孔段 561与第二孔段 563, 第二孔段 563位 于底面 564侧，且其孔径大于第一孔段 561。装配时，导热柱 58可从底面 564 侧的第二孔段 563装入连接孔 562再与第一导热板 54藉由螺丝 55相互连 接固定。 由于导热柱 58是从底面 564侧的第二孔段 563装入连接孔 562， 因此导热柱 58可在交流电发光二极管芯片 52、 第一导热板 54及陶瓷基座 56均成型后再安装， 以便于交流电发光二极管模块 50的制备。 并且对应于 连接孔 562的形状， 导热柱 58的直径较大端位于远离第一导热板 54的底 面 564侧， 使得导热柱 58易于将更多的热量快速传递到陶瓷基座 56的底 面 564侧， 以充分利用陶瓷基座 56的散热作用， 从而进一步提高交流电发 光二极管模块 50的散热性能。 可以理解， 在导热柱 58与连接孔 562孔壁 之间亦可填充有散热膏 （图中未显示）。
请参阅图 6 所示， 是本发明交流电发光二极管模块第六实施例的剖面 示意图。 本发明第六实施例的交流电发光二极管模块 60与交流电发光二极 管模块 10相似， 包括交流电发光二极管芯片 62、 第一导热板 64、 陶瓷基 座 66及导热柱 68; 陶瓷基座 66具有连接孔 662。 其不同点在于： 陶瓷基 座 66的连接孔 662以及导热柱 68为多数个。
请参阅图 7 所示， 是本发明交流电发光二极管模块第七实施例的剖面 示意图。 本发明第七实施例的交流电发光二极管模块 70与交流电发光二极 管模块 10相似， 包括交流电发光二极管芯片 72、 第一导热板 74、 陶瓷基 座 76及导热柱 78。 其不同点在于： 陶瓷基座 76是藉由射出成型方式形成 在第一导热板 74上且包裹导热柱 78 , 并位于与第一导热板 74上相对交流 电发光二极管芯片 72的另一端； 并且导热柱 78被陶瓷基座 76包裹的部分 可具有一扩散部 782。扩散部 782用于扩大导热柱 78在陶瓷基座 76内部与 陶瓷基座 76的接触面积， 其可呈弯折状。 由于陶瓷基座 76藉由射出成型 来包裹导热柱 78， 因此可使导热柱 78与陶瓷基座 76接触紧密， 避免导热 柱 78与陶瓷基座 76之间形成空气层，从而可降低导热柱 78与陶瓷基座 76 之间的热阻， 进而提升交流电发光二极管模块 70的散热性能。 并且， 由于 导热柱 78被陶瓷基座 76包裹的部分含有扩散部 782，因此还可进一步加速 热量在陶瓷基座 76上的分布， 从而进一步充分利用陶瓷基座 76的散热性 能， 提升交流电发光二极管模块 70的散热性能。
请参阅图 8 所示， 是本发明交流电发光二极管模块第八实施例的剖面 示意图。 本发明第八实施例的交流电发光二极管模块 80与交流电发光二极 管模块 10相似， 包括交流电发光二极管芯片 82、 第一导热板 84、 陶瓷基 座 86及导热柱 88。其不同点在于：交流电发光二极管模块 80还包括一第二 导热板 89;陶瓷基座 86包括一顶面 866、 一与顶面 866相对的底面 864及 连接顶面 866与底面 864的侧面 865; 第一导热板 84位于顶面 866,第二导 热板 89位于底面 864;导热柱 88连接第一导热板 84与第二导热板 89。 更 具体地说明， 第一导热板 84与导热柱 88 以一体成型方式形成， 第二导热 板 89与导热柱 88之间藉由螺丝 85相互固定连接， 此仅为举例， 目的使第 一导热板 84与第二导热板 89之间藉由导热柱 88连接者均可以实施。 第二 导热板 89的材料可与第一导热板 84与导热柱 88相似， 例如为铝或铜。 由 于具有第二导热板 89，交流电发光二极管模块 80可易于进一步提升散热性 能。可以理解的是，第二导热板 89还可位于陶瓷基座 86的侧面 865;第一导 热板 84或第二导热板 89与导热柱 88之间的连接方式还可变更， 例如，第 一导热板 84与导热柱 88藉由焊接或螺丝相互固定连接， 第二导热板 89与 导热柱 88以一体成型方式形成或藉由焊接固定连接， 或第一导热板 84、 第 二导热板 89及导热柱 88以一体成型方式形成。
综上所述， 在本发明的交流电发光二极管模块， 由于陶瓷基座具有优 良的散热与绝缘性能， 因此容易使交流电发光二极管芯片产生的热量通过 第一导热板传给陶瓷基座而快速散发。 进一步， 由于交流电发光二极管模 块还包括导热柱， 导热柱具有较佳的热传导性能， 因此还可弥补陶瓷基座 的热传导性能的不足， 使交流电发光二极管芯片产生的热量传递至陶瓷基 座的速度加快， 从而进一步提升交流电发光二极管模块的散热与绝缘性能。
另外， 可以理解， 在上述交流电发光二极管模块中， 当对散热性能要 求相对较低并且第一导热板与陶瓷基座相邻表面之间具有较高的接触面积 时，导热柱还可省略。
以上所述， 仅是本发明的较佳实施例而已， 并非对本发明作任何形式 上的限制， 虽然本发明已以较佳实施例揭露如上， 然而并非用以限定本发 明，任何熟悉本专业的技术人员， 在不脱离本发明技术方案范围内，当可利 用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例，但 凡是未脱离本发明技术方案内容， 依据本发明的技术实质对以上实施例所 作的任何简单修改、 等同变化与修饰，均仍属于本发明技术方案的范围内。

Claims

杈 利 要 求
1、 一种交流电发光二极管模块， 其特征在于其包括： 一交流电发光二 极管芯片、 一第一导热板及一陶瓷基座， 其中该交流电发光二极管芯片是 以交流电驱动发光， 该第一导热板位于该陶瓷基座上， 该交流电发光二极 管芯片位于该第一导热板上。
2、 根据权利要求 1 所述的交流电发光二极管模块，其特征在于其中所 陶瓷基座的材料为氧化铝或氮化铝。
3、 根据权利要求 1所述的交流电发光二极管模块， 其特征在于其中所 述的交流电发光二极管模块还包括一导热柱， 该导热柱一端与该第一导热 板相连， 相对的另一端伸入该陶瓷基座内部， 其中该第一导热板或该导热 柱的材料为金属、 铝或铜。
4、 根据权利要求 3所述的交流电发光二极管模块，其特征在于其中所 述的第一导热板与该导热柱为一体成型结构形成， 或由焊接或螺丝相互固 定连接。
5、 根据权利要求 3所述的交流电发光二极管模块，其特征在于其中所 述的陶瓷基座包括一底面、 一与该底面相对的顶面及一从该顶面朝该陶瓷 基座内部延伸的连接孔， 该第一导热板位于该顶面侧，该导热柱是藉由与该 连接孔相配合而伸入该陶瓷基座内部。
6、 根据权利要求 5 所述的交流电发光二极管模块，其特征在于其中所 述的导热柱与该连接孔孔壁之间填充有散热膏。
7、 根据权利要求 3所述的交流电发光二极管模块，其特征在于其中所 述的陶瓷基座包括一底面、 一与该底面相对的顶面及一贯穿该顶面与该底 面的连接孔， 该第一导热板位于该顶面侧， 该连接孔为阶梯形通孔， 该连 接孔的孔径较大端位于底面侧， 该导热柱从该底面侧装入该连接孔再与该 第一导热板相连。
8、 根据权利要求 7 所述的交流电发光二极管模块,其特征在于其中所 述的导热柱与该连接孔孔壁之间填充有散热膏。
9、 根据权利要求 1 所述的交流电发光二极管模块，其特征在于其中所 述的交流电发光二极管模块还包括一导热柱， 该导热柱一端与该第一导热 板相连， 该陶瓷基座由注射成型结构形成于该第一导热板上且包裹该导热 柱的另一端。
10、 据权利要求 9所述的交流电发光二极管模块,其特征在于其中所 述的导热柱被该陶瓷基座包裹的部分具有一扩散部。
11、 根据权利要求 10所述的交流电发光二极管模块，其特征在于其中 所述的导热柱被该陶瓷基座的扩散部呈弯折状。
12、根据权利要求 3所述的交流电发光二极管模块,其特征在于其还包 括一第二导热板， 该陶瓷基座包括一顶面、 一与该顶面相对的底面及连接 该顶面与底面的侧面， 该第一导热板位于该顶面， 该第二导热板位于该底 面或侧面， 该导热柱连接该第一导热板与该第二导热板， 其中该第一导热 板、 该导热柱及该二第一导热板之材料为金属、 铝或铜。
1 3、 根据权利要求 12 所述的交流电发光二极管模块，其特征在于其中 所述的第一导热板或该第二导热板与该导热柱由一体成型结构形成或由焊 接或螺丝相互固定连接。
PCT/CN2008/001689 2008-09-28 2008-09-28 交流电发光二极管模块 WO2010034139A1 (zh)

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PCT/CN2008/001689 WO2010034139A1 (zh) 2008-09-28 2008-09-28 交流电发光二极管模块
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