WO2010031987A3 - Encapsulation method - Google Patents

Encapsulation method Download PDF

Info

Publication number
WO2010031987A3
WO2010031987A3 PCT/GB2009/001861 GB2009001861W WO2010031987A3 WO 2010031987 A3 WO2010031987 A3 WO 2010031987A3 GB 2009001861 W GB2009001861 W GB 2009001861W WO 2010031987 A3 WO2010031987 A3 WO 2010031987A3
Authority
WO
WIPO (PCT)
Prior art keywords
cavity
facing
loop
substrate
substrates
Prior art date
Application number
PCT/GB2009/001861
Other languages
French (fr)
Other versions
WO2010031987A2 (en
Inventor
Changhai Wang
Jun Zeng
Original Assignee
Heriot-Watt University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heriot-Watt University filed Critical Heriot-Watt University
Priority to CN2009801459977A priority Critical patent/CN102216201A/en
Priority to GB1106000.1A priority patent/GB2476209B/en
Publication of WO2010031987A2 publication Critical patent/WO2010031987A2/en
Publication of WO2010031987A3 publication Critical patent/WO2010031987A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0041—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS maintaining a controlled atmosphere with techniques not provided for in B81B7/0038
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The invention provides a cavity-containing package (1 ) for a MEMS device (17) comprising a first substrate (3) having a surface (4) facing the cavity (15), a second substrate (5) having a surface (6) facing the cavity (15) and a loop of composite material (7), the loop having a surface (8) facing the cavity (15), a surface (10) facing away from the cavity (15) and two substrate-abutting surfaces (12, 14) and comprising a layer of polymeric material (11, 13, 29) and a layer of metal (9, 99) each of which layers' edges face the cavity-facing surfaces (4, 6) of the substrates, said cavity-facing surfaces (4, 6) of the substrates (3, 5) being connected to each other by said loop of composite material (7), wherein the substrate-abutting surfaces (12, 14) abut the cavity-facing surfaces (4, 6) continuously along the length of said loop (7), whereby said cavity-facing surfaces (4, 6) of the substrates (3, 5) and the loop (7) define the cavity (15).
PCT/GB2009/001861 2008-09-19 2009-07-29 Encapsulation method WO2010031987A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2009801459977A CN102216201A (en) 2008-09-19 2009-07-29 Encapsulation method
GB1106000.1A GB2476209B (en) 2008-09-19 2009-07-29 Encapsulation method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0817309.8A GB0817309D0 (en) 2008-09-19 2008-09-19 Encapsulation method
GB0817309.8 2008-09-19

Publications (2)

Publication Number Publication Date
WO2010031987A2 WO2010031987A2 (en) 2010-03-25
WO2010031987A3 true WO2010031987A3 (en) 2010-06-24

Family

ID=39951977

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2009/001861 WO2010031987A2 (en) 2008-09-19 2009-07-29 Encapsulation method

Country Status (3)

Country Link
CN (1) CN102216201A (en)
GB (2) GB0817309D0 (en)
WO (1) WO2010031987A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105565248B (en) * 2016-02-23 2017-11-10 美新半导体（无锡）有限公司 The level Hermetic Package structure and manufacture method of attached cavity device
US9929290B2 (en) * 2016-06-20 2018-03-27 Globalfoundries Inc. Electrical and optical via connections on a same chip
CN110092348B (en) * 2018-01-30 2021-12-24 上海新微技术研发中心有限公司 Eutectic bonding structure and eutectic bonding method
CN113387319B (en) * 2021-06-11 2023-07-14 中国兵器工业集团第二一四研究所苏州研发中心 MEMS chip packaging structure based on multi-through hole silicon substrate and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020179921A1 (en) * 2001-06-02 2002-12-05 Cohn Michael B. Compliant hermetic package
WO2004025727A1 (en) * 2002-09-10 2004-03-25 Frank Niklaus Method for sealing a microcavity and package comprising at least one microcavity
US20040200736A1 (en) * 2003-04-09 2004-10-14 Van Heerden David Peter Hermetically sealed product and related methods of manufacture
US20050017329A1 (en) * 2003-06-10 2005-01-27 California Institute Of Technology Multiple internal seal ring micro-electro-mechanical system vacuum package

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1047718C (en) * 1993-05-03 1999-12-22 艾利森电话股份有限公司 A flexible device for encapsulating electronic components
DE60235389D1 (en) * 2001-09-17 2010-04-01 John Stafford CAPSULATION OF POLARIZED MEMS RELAY AND METHOD OF CAPSULATION
CN1799133A (en) * 2003-04-09 2006-07-05 活性纳米技术股份有限公司 Hermetically sealed product and related methods of manufacture

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020179921A1 (en) * 2001-06-02 2002-12-05 Cohn Michael B. Compliant hermetic package
WO2004025727A1 (en) * 2002-09-10 2004-03-25 Frank Niklaus Method for sealing a microcavity and package comprising at least one microcavity
US20040200736A1 (en) * 2003-04-09 2004-10-14 Van Heerden David Peter Hermetically sealed product and related methods of manufacture
US20050017329A1 (en) * 2003-06-10 2005-01-27 California Institute Of Technology Multiple internal seal ring micro-electro-mechanical system vacuum package

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
CARCHON G J ET AL: "Integration of 0/1-Level Packaged RF-MEMS Devices on MCM-D at Millimeter-Wave Frequencies", IEEE TRANSACTIONS ON ADVANCED PACKAGING, IEEE SERVICE CENTER, PISCATAWAY, NJ, US LNKD- DOI:10.1109/TADVP.2007.901772, vol. 30, no. 3, 1 August 2007 (2007-08-01), pages 369 - 376, XP011189593, ISSN: 1521-3323 *
OBERHAMMER J ET AL: "BCB Contact Printing for Patterned Adhesive Full-Wafer Bonded 0-Level Packages", JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, IEEE SERVICE CENTER, PISCATAWAY, NJ, US LNKD- DOI:10.1109/JMEMS.2004.839030, vol. 14, no. 2, 1 April 2005 (2005-04-01), pages 419 - 425, XP011129677, ISSN: 1057-7157 *
ZENG J ET AL: "Laser assisted polymer bonding technology for advanced MEMS packaging", ELECTRONICS SYSTEM INTEGRATION TECHNOLOGY CONFERENCE, 2008. ESTC 2008. 2ND, IEEE, PISCATAWAY, NJ, USA, 1 September 2008 (2008-09-01), pages 1225 - 1230, XP031364659, ISBN: 978-1-4244-2813-7 *

Also Published As

Publication number Publication date
WO2010031987A2 (en) 2010-03-25
GB201106000D0 (en) 2011-05-25
GB2476209A (en) 2011-06-15
GB2476209B (en) 2012-03-28
GB0817309D0 (en) 2008-10-29
CN102216201A (en) 2011-10-12

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