WO2010029701A1 - Élément magnéto-résistif, son procédé de fabrication et support de stockage utilisé dans le procédé de fabrication - Google Patents

Élément magnéto-résistif, son procédé de fabrication et support de stockage utilisé dans le procédé de fabrication Download PDF

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WO2010029701A1
WO2010029701A1 PCT/JP2009/004247 JP2009004247W WO2010029701A1 WO 2010029701 A1 WO2010029701 A1 WO 2010029701A1 JP 2009004247 W JP2009004247 W JP 2009004247W WO 2010029701 A1 WO2010029701 A1 WO 2010029701A1
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atoms
layer
alloy containing
forming
atom
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PCT/JP2009/004247
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Japanese (ja)
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栗林正樹
ジュリアント ジャヤプラウィラダビッド
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キヤノンアネルバ株式会社
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09—Magnetoresistive devices
    • G01R33/098—Magnetoresistive devices comprising tunnel junctions, e.g. tunnel magnetoresistance sensors
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/33—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
    • G11B5/39—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
    • G11B5/3903—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects using magnetic thin film layers or their effects, the films being part of integrated structures
    • G11B5/3906—Details related to the use of magnetic thin film layers or to their effects
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/33—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
    • G11B5/39—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
    • G11B5/3903—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects using magnetic thin film layers or their effects, the films being part of integrated structures
    • G11B5/3906—Details related to the use of magnetic thin film layers or to their effects
    • G11B5/3909—Arrangements using a magnetic tunnel junction
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/3254—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/3295—Spin-exchange coupled multilayers wherein the magnetic pinned or free layers are laminated without anti-parallel coupling within the pinned and free layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H01F41/30—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE]
    • H01F41/302—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F41/305—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices applying the spacer or adjusting its interface, e.g. in order to enable particular effect different from exchange coupling
    • H01F41/307—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices applying the spacer or adjusting its interface, e.g. in order to enable particular effect different from exchange coupling insulating or semiconductive spacer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/10—Magnetoresistive devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/3268—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn
    • H01F10/3272—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn by use of anti-parallel coupled [APC] ferromagnetic layers, e.g. artificial ferrimagnets [AFI], artificial [AAF] or synthetic [SAF] anti-ferromagnets

Definitions

  • the present invention relates to a magnetic reproducing head of a magnetic disk drive, a storage element of a magnetic random access memory, and a magnetoresistive element used for a magnetic sensor, preferably a tunnel magnetoresistive element (in particular, a spin valve tunnel magnetoresistive element). Further, the present invention relates to a method of manufacturing a magnetoresistive element and a storage medium used in the method.
  • Patent documents 1 to 6 and non-patent documents 1 and 2 disclose TMR (tunneling magnetoresistance) effect elements comprising a tunnel barrier layer and first and second ferromagnetic layers disposed on both sides thereof. Is described.
  • An alloy containing Co atoms, Fe atoms and B atoms (hereinafter referred to as a CoFeB alloy) is used as the first and / or second ferromagnetic layers constituting this element.
  • the CoFeB alloy layer a polycrystalline structure is described.
  • Patent documents 2 to 5 disclose TMR elements using a crystalline magnesium oxide film consisting of a single crystal or a polycrystal as a tunnel barrier film. ing.
  • An object of the present invention is to provide a magnetoresistive element having a further improved MR ratio as compared with the prior art, a method of manufacturing the same, and a storage medium used in the method of manufacturing.
  • the first aspect of the present invention is a substrate, A crystalline first ferromagnetic layer located on the substrate and made of an alloy containing Co atoms, Fe atoms and B atoms, A tunnel barrier layer located on the crystalline first ferromagnetic layer and having a crystalline magnesium oxide layer or a crystalline boron magnesium oxide layer, A crystalline second ferromagnetic layer located on the tunnel barrier layer and comprising an alloy containing Co atoms, Fe atoms and B atoms, or an alloy containing Co atoms and Fe atoms, An intermediate layer made of a nonmagnetic material located on the crystalline second ferromagnetic layer, and A crystalline ferromagnetic material layer located on the intermediate layer and made of an alloy containing Co atoms, Fe atoms and B atoms or an alloy containing Co atoms and Fe atoms, Ni atoms, Fe atoms and B It is a magnetoresistive element characterized by having a third ferromagnetic layer having a crystalline
  • a step of forming a magnetization fixed layer, a magnetization free layer, and a tunnel barrier layer positioned between the magnetization fixed layer and the magnetization free layer on a substrate by using a sputtering method A method of manufacturing a magnetoresistive element having The step of forming the tunnel barrier layer includes the step of forming a crystalline magnesium oxide layer or a crystalline boron magnesium oxide layer by sputtering.
  • Co atoms, Fe atoms and B atoms are made to be adjacent to the tunnel barrier layer by sputtering using a target comprising an alloy containing Co atoms, Fe atoms and B atoms, or an alloy containing Co atoms and B atoms
  • a target comprising an alloy containing Co atoms, Fe atoms and B atoms, or an alloy containing Co atoms and B atoms
  • a nonmagnetic intermediate layer is formed adjacent to a layer made of an alloy containing Co atoms, Fe atoms and B atoms or an alloy containing Co atoms and B atoms by sputtering using a target made of nonmagnetic material.
  • Co atoms, Fe atoms and B atoms are formed by sputtering using a target consisting of an alloy containing Co atoms, Fe atoms and B atoms or an alloy containing Co atoms and Fe atoms on the nonmagnetic interlayer.
  • a third aspect of the present invention is a process of forming a magnetization fixed layer, a magnetization free layer, and a tunnel barrier layer positioned between the magnetization fixed layer and the magnetization free layer on a substrate by using a sputtering method.
  • a method of manufacturing a magnetoresistive element having In the step of forming the tunnel barrier layer, a layer made of crystalline metal magnesium or crystalline boron magnesium alloy is formed by sputtering, and the metal magnesium or boron magnesium alloy is oxidized to form a crystalline magnesium oxide layer.
  • Co atoms, Fe atoms and B atoms are made to be adjacent to the tunnel barrier layer by sputtering using a target comprising an alloy containing Co atoms, Fe atoms and B atoms, or an alloy containing Co atoms and B atoms
  • a target comprising an alloy containing Co atoms, Fe atoms and B atoms, or an alloy containing Co atoms and B atoms
  • a nonmagnetic intermediate layer is formed adjacent to a layer made of an alloy containing Co atoms, Fe atoms and B atoms or an alloy containing Co atoms and B atoms by sputtering using a target made of nonmagnetic material.
  • Co atoms, Fe atoms and B atoms are formed by sputtering using a target consisting of an alloy containing Co atoms, Fe atoms and B atoms or an alloy containing Co atoms and Fe atoms on the nonmagnetic interlayer.
  • a step of forming a magnetization fixed layer, a magnetization free layer, and a tunnel barrier layer positioned between the magnetization fixed layer and the magnetization free layer on a substrate by using a sputtering method is provided.
  • a storage medium storing a control program for executing the manufacture of a magnetoresistive element having A control program for executing the step of forming the tunnel barrier layer and the magnetization free layer is Forming a crystalline magnesium oxide layer or a crystalline boron magnesium oxide layer by a sputtering method using a target made of magnesium oxide or boron magnesium oxide; Co atoms, Fe atoms and B atoms are made to be adjacent to the tunnel barrier layer by sputtering using a target comprising an alloy containing Co atoms, Fe atoms and B atoms, or an alloy containing Co atoms and B atoms Forming a layer comprising an alloy containing or an alloy containing Co atoms and B atoms, A nonmagnetic intermediate layer is formed adjacent to a layer made of an alloy containing Co atoms, Fe atoms and B atoms or an alloy containing Co atoms and B atoms by sputtering using a target made of nonmagnetic material.
  • a process of filming, and Co atoms, Fe atoms and B atoms are formed by sputtering using a target consisting of an alloy containing Co atoms, Fe atoms and B atoms or an alloy containing Co atoms and Fe atoms on the nonmagnetic interlayer.
  • a step of forming a magnetization fixed layer, a magnetization free layer, and a tunnel barrier layer positioned between the magnetization fixed layer and the magnetization free layer on a substrate using a sputtering method A storage medium storing a control program for executing the manufacture of a magnetoresistive element having A control program for executing the step of forming the tunnel barrier layer and the magnetization free layer is A layer of crystalline metallic magnesium or crystalline boron magnesium alloy is formed by sputtering using a target of metallic magnesium or boron magnesium alloy, and the metallic magnesium or boron magnesium alloy is oxidized to form crystalline magnesium oxide.
  • Co atoms, Fe atoms and B atoms are made to be adjacent to the tunnel barrier layer by sputtering using a target comprising an alloy containing Co atoms, Fe atoms and B atoms, or an alloy containing Co atoms and B atoms
  • a layer comprising an alloy containing or an alloy containing Co atoms and B atoms
  • a nonmagnetic intermediate layer is formed adjacent to a layer made of an alloy containing Co atoms, Fe atoms and B atoms or an alloy containing Co atoms and B atoms by sputtering using a target made of nonmagnetic material.
  • a process of filming, and Co atoms, Fe atoms and B atoms are formed by sputtering using a target consisting of an alloy containing Co atoms, Fe atoms and B atoms or an alloy containing Co atoms and Fe atoms on the nonmagnetic interlayer.
  • the MR ratio achieved by the conventional tunnel magnetoresistive effect element (hereinafter referred to as TMR element) can be significantly improved.
  • the present invention can be mass-produced and highly practical. Therefore, by using the present invention, a memory element of MRAM (Magnetoresistive Random Access Memory: ferroelectric memory) capable of achieving ultra-high integration can be efficiently provided. .
  • MRAM Magneticoresistive Random Access Memory: ferroelectric memory
  • FIG. 6 is a cross-sectional view of another tunnel barrier layer of the present invention. It is a model perspective view of the column-like crystal structure which concerns on the magnetoresistive element of this invention. It is sectional drawing of the TMR element of the other structure of the magnetoresistive element of this invention.
  • the magnetoresistive element of the present invention comprises a substrate, a crystalline first ferromagnetic layer, a tunnel barrier layer, a crystalline second ferromagnetic layer, a nonmagnetic intermediate layer, and a crystalline third ferromagnetic layer.
  • the first ferromagnetic layer is made of an alloy containing Co atoms, Fe atoms, and B atoms (hereinafter referred to as CoFeB).
  • the tunnel barrier layer has a crystalline magnesium oxide layer or a crystalline boron magnesium oxide layer.
  • the second ferromagnetic layer is made of CoFeB or an alloy containing Co atoms and Fe atoms (hereinafter referred to as CoFe).
  • the third ferromagnetic layer comprises a crystalline ferromagnetic layer comprising a CoFe layer or a CoFeB layer, and a crystalline strong layer comprising an alloy containing Ni atoms, Fe atoms and B atoms, or an alloy containing Ni atoms and Fe atoms It consists of a laminated film with a magnetic layer.
  • an alloy containing Ni atoms, Fe atoms and B atoms is referred to as NiFeB
  • an alloy containing Ni atoms and Fe atoms is referred to as NiFe.
  • magnesium oxide is described as Mg oxide, boron magnesium oxide as BMg oxide, metal magnesium as Mg, and a boron magnesium alloy as BMg.
  • FIG. 1 shows an example of the laminated structure of the magnetoresistive element 10 according to the present invention, and shows the laminated structure of the magnetoresistive element 10 using the TMR element 12.
  • a multilayer film of 12 layers including the TMR element 12 is formed on the substrate 11.
  • the twelve-layer multilayer film is a multilayer film structure from the lowermost first layer (Ta layer) to the uppermost twelfth layer (Ru layer).
  • the PtMn layer 14 the CoFe layer 15, the nonmagnetic metal layer (Ru) layer 161, the first ferromagnetic layer CoFeB layer 121, the tunnel barrier layer nonmagnetic polycrystalline Mg oxide layer or BMg
  • An oxide layer 122 is stacked.
  • a second ferromagnetic layer, a polycrystalline CoFe layer or CoFeB layer 1233, a nonmagnetic Ta layer 162, a third ferromagnetic layer, a polycrystalline CoFe layer or CoFeB layer 1232 and a polycrystalline NiFe layer A NiFeB layer 1231 is stacked. Furthermore, the nonmagnetic Ta layer 17 and the nonmagnetic Ru layer 18 are stacked in this order.
  • the numerical values in parentheses in each layer in the drawing indicate the thickness of each layer, and the unit is nm. The said thickness is an example, Comprising: It is not limited to this.
  • the first ferromagnetic layer 121 described above may have a laminated structure of two or more layers in which a CoFeB layer and another ferromagnetic layer are added.
  • a substrate such as a wafer substrate, a glass substrate or a sapphire substrate.
  • Reference numeral 12 denotes a TMR element, which is formed of a laminated structure of a first ferromagnetic layer 121 made of polycrystalline CoFeB, a tunnel barrier layer 122, a second ferromagnetic layer 1233, and a third ferromagnetic layer 1232 and 1231.
  • the tunnel barrier layer 122 has a polycrystalline Mg oxide layer or a polycrystalline BMg oxide layer
  • the second ferromagnetic layer 1232 is made of a polycrystalline CoFe layer or a polycrystalline CoFeB layer.
  • the third ferromagnetic layer is formed of a laminated film of a polycrystalline CoFe layer or CoFeB layer 1232 and a polycrystalline NiFe layer or NiFeB layer 1231.
  • an intermediate layer 162 made of a nonmagnetic metal or a nonmagnetic material of a nonmagnetic insulator is disposed.
  • the polycrystalline CoFe can contain a small amount (5 atomic% or less, preferably 0.01 to 1 atomic%) of other atoms such as Pt or the like.
  • 13 is a lower electrode layer (underlayer) of a first layer (Ta layer), and 14 is an antiferromagnetic layer of a second layer (PtMn layer).
  • 15 is a ferromagnetic layer of the third layer (CoFe layer), and 161 is a nonmagnetic layer for exchange coupling of the fourth layer (Ru layer).
  • the fifth layer is a ferromagnetic layer formed of the crystalline CoFeB layer 121.
  • the B atom content (hereinafter referred to as B content) in the crystalline CoFeB layer 121 is preferably set in the range of 0.1 atomic% to 60 atomic%, more preferably 10 atomic% to 50 atomic%.
  • the crystalline CoFeB layer 121 can contain other atoms, for example, Pt, Ni, Mn, etc. in a trace amount (5 atomic% or less, preferably 0.01 to 1 atomic%).
  • the layer formed of the third layer, the fourth layer, and the fifth layer described above is the magnetization fixed layer 19.
  • the substantial magnetization fixed layer 19 is a ferromagnetic layer of the crystalline CoFeB layer 121 of the fifth layer.
  • Reference numeral 122 denotes a tunnel barrier layer of a sixth layer (polycrystalline Mg oxide layer or BMg oxide layer), which is an insulating layer.
  • the tunnel barrier layer 122 may be a single polycrystalline Mg oxide layer or a polycrystalline BMg oxide layer.
  • the tunnel barrier layer 122 can be configured as illustrated in FIG. That is, it is a stacked structure of a polycrystalline Mg oxide layer or polycrystalline BMg oxide layer 1221, a polycrystalline Mg layer or polycrystalline BMg layer 1222, and a polycrystalline Mg oxide layer or polycrystalline BMg oxide layer 1223. Furthermore, it may be a laminated structure in which a plurality of three layers consisting of the laminated films 1221, 1222 and 1223 shown in FIG. 6 are provided.
  • FIG. 8 is an example of another TMR element 12 of the present invention.
  • Reference numerals 12, 121, 122, 162, 1231 to 1233 in FIG. 8 are the same members as those described above.
  • the tunnel barrier layer 122 is a laminated film composed of a polycrystalline Mg oxide layer or polycrystalline BMg oxide layer 82 and Mg layers or BMg layers 81 and 83 on both sides of the layer 82.
  • the use of the layer 81 can be omitted, and the layer 82 can be disposed adjacent to the crystalline CoFe layer or the crystalline CoFeB layer 1233.
  • the use of layer 83 can be omitted and layer 82 can be placed adjacent to crystalline CoFeB layer 121.
  • FIG. 7 is a schematic perspective view of a polycrystalline structure composed of an aggregate 71 of column-like crystals 72 in the BMg oxide layer or the Mg oxide layer.
  • the polycrystalline structure also includes the structure of a polycrystalline-amorphous mixed region including a partially amorphous region in the polycrystalline region.
  • the column-like crystal is preferably a single crystal in which the (001) crystal plane is preferentially oriented in the film thickness direction in each column.
  • the average diameter of the column-shaped single crystal is preferably 10 nm or less, more preferably 2 nm to 5 nm, and the film thickness is preferably 10 nm or less, more preferably 0.5 nm. To 5 nm.
  • the BMg oxide used in the present invention has a general formula B x Mg y O z (0.7 ⁇ Z / (X + Y) ⁇ 1.3, preferably 0.8 ⁇ Z / (X + Y) ⁇ It is indicated by 1.0).
  • B x Mg y O z 0.7 ⁇ Z / (X + Y) ⁇ 1.3, preferably 0.8 ⁇ Z / (X + Y) ⁇ It is indicated by 1.0).
  • a stoichiometric amount of BMg oxide a high MR ratio can be obtained even with an oxygen deficient BMg oxide.
  • Mg oxide used in the present invention has a general formula of Mg y O z (0.7 ⁇ Z / Y ⁇ 1.3, preferably 0.8 ⁇ Z / Y ⁇ 1.0) It is indicated by.
  • the polycrystalline Mg oxide or polycrystalline BMg oxide used in the present invention contains various minor components such as Zn atom, C atom, Al atom, Ca atom, Si atom, etc. in the range of 10 ppm to 100 ppm. Can.
  • the seventh, ninth, and tenth layers are each a ferromagnetic layer comprising a crystalline CoFe layer or CoFeB layer 1233, a ferromagnetic layer comprising a crystalline CoFe layer or CoFeB layer 1232, a crystalline NiFe layer or a crystalline NiFe layer or It is a ferromagnetic layer composed of a NiFeB layer.
  • the laminated film consisting of the seventh, ninth and tenth layers can function as a magnetization free layer.
  • an eighth layer Ta layer 162 which is an intermediate layer made of a nonmagnetic material, is disposed between the seventh layer and the ninth layer.
  • the eighth layer is made of nonmagnetic metal such as Ru or Ir, nonmagnetic insulator such as Al 2 O 3 (aluminum oxide), SiO 2 (silicon oxide), Si 3 N 4 (silicon nitride), etc. in addition to Ta. It can be used. Further, the film thickness can be set preferably in the range of 50 nm or less, more preferably 5 nm to 40 nm.
  • the crystalline CoFe layer or the crystalline CoFeB layer 1232 constituting the seventh layer and the ninth layer can be deposited by sputtering using a CoFe target or a CoFeB target.
  • the crystalline NiFe layer or the crystalline NiFeB layer 1231 constituting the tenth layer can be deposited by sputtering using a NiFe target or a NiFeB target.
  • the crystalline CoFeB layer 121, the CoFe layer or CoFeB layer 1233, 1232 and the NiFe layer or NiFeB layer 1231 have the same crystal structure as the aggregate 71 composed of the column-like crystal structure 72 shown in FIG. It may be
  • the crystalline CoFeB layer 121 and the CoFe layer or CoFeB layer 1233 are preferably provided adjacent to the tunnel barrier layer 122 located in the middle. In the manufacturing apparatus, these three layers are sequentially stacked without breaking the vacuum.
  • Reference numeral 17 denotes an electrode layer of a tenth layer (Ta layer).
  • Reference numeral 18 denotes a hard mask layer of an eleventh layer (Ru layer).
  • the eleventh layer may be removed from the magnetoresistive element when used as a hard mask.
  • FIG. 2 is a schematic plan view of an apparatus for manufacturing the magnetoresistive element 10.
  • This apparatus is an apparatus capable of producing a multilayer film including a plurality of magnetic layers and a nonmagnetic layer, and mass production type sputtering film formation It is an apparatus.
  • the magnetic multilayer film manufacturing apparatus 200 shown in FIG. 2 is a cluster type manufacturing apparatus, and includes three film forming chambers based on the sputtering method.
  • a transfer chamber 202 including a robot transfer device (not shown) is installed at a central position.
  • Two load lock / unload lock chambers 205 and 206 are provided in the transfer chamber 202 of the manufacturing apparatus 200 for manufacturing the magnetoresistance element, and loading and unloading of the substrate (for example, silicon substrate) 11 is performed by each of them. .
  • the tact time can be shortened, and the magnetoresistive element can be manufactured with high productivity.
  • the manufacturing apparatus 200 for manufacturing a magnetoresistive element three deposition magnetron sputtering chambers 201A to 201C and one etching chamber 203 are provided around the transfer chamber 202.
  • the required surface of the TMR element 10 is etched.
  • a gate valve 204 which can be opened and closed is provided between each of the chambers 201A to 201C and 203 and the transfer chamber 202.
  • Each of the chambers 201A to 201C and 202 is provided with an evacuation mechanism, a gas introduction mechanism, a power supply mechanism, and the like (not shown).
  • the respective films from the first layer to the eleventh layer described above can be sequentially deposited on the substrate 11 using high frequency sputtering without breaking the vacuum. it can.
  • cathodes 31 to 35, 41 to 45, 51 to 54 disposed on suitable circumferences are disposed on the ceilings of the film forming magnetron sputtering chambers 201A to 201C, respectively.
  • the substrate 11 is disposed on a substrate holder located coaxially with the circumference.
  • high frequency power such as radio frequency (RF frequency) is applied to the cathodes 31 to 35, 41 to 45, 51 to 54 from the power input means 207A to 207C.
  • RF frequency radio frequency
  • power in the range of 0.3 MHz to 10 GHz, preferably in the range of 5 MHz to 5 GHz and in the range of 10 W to 500 W, preferably 100 W to 300 W can be used.
  • a Ta target is attached to the cathode 31, a PtMn target to the cathode 32, a CoFeB target to the cathode 33, a CoFe target to the cathode 34, and a Ru target to the cathode 35.
  • a Mg oxide target is attached to the cathode 51, a BMg oxide target to the cathode 52, a Mg target to the cathode 53, and a BMg target to the cathode 54.
  • the TMR element 122 of the structure illustrated in FIG. 8 can be manufactured by using this cathode 53 or 54.
  • the cathode 41 has a CoFe target for the ninth layer
  • the cathode 42 has a CoFeB target for the seventh layer
  • the cathode 43 has a Ta target for the eighth layer and the eleventh layer
  • the cathode 44 The Ru target for the 12th layer is attached.
  • a NiFe target or a NiFeB target for the tenth layer is attached.
  • the in-plane directions of the targets mounted on the cathodes 31 to 35, 41 to 45, and 51 to 54 and the in-plane direction of the substrate be nonparallel to each other.
  • the non-parallel arrangement it is possible to deposit a magnetic film and a nonmagnetic film with the same composition as the target composition with high efficiency by sputtering while rotating a target smaller than the substrate diameter.
  • both can be arranged non-parallel so that the crossing angle between the target central axis and the substrate central axis is 45 ° or less, preferably 5 ° to 30 °.
  • the substrate at this time can use a rotational speed of 10 rpm to 500 rpm, preferably, a rotational speed of 50 rpm to 200 rpm.
  • a crystalline (preferably polycrystalline) Mg layer is formed by sputtering using a Mg target, and the Mg is introduced into an oxidation chamber (not shown) for introducing an oxidizing gas. Can be obtained by oxidation.
  • a crystalline (preferably polycrystalline) BMg layer is formed by a sputtering method using a BMg target, and the BMg is formed in an oxidation chamber (not shown) for introducing an oxidizing gas. Can be obtained by oxidation.
  • oxidizing gas examples include oxygen gas, ozone gas, water vapor and the like.
  • FIG. 3 is a block diagram of a film forming apparatus used in the present invention.
  • a transfer chamber 301 corresponds to the transfer chamber 202 in FIG. 2
  • a film forming chamber 302 corresponds to the film forming magnetron sputtering chamber 201A
  • a film forming chamber 303 corresponds to the film forming magnetron sputtering chamber 201B.
  • Reference numeral 304 denotes a film forming chamber corresponding to the film forming magnetron sputtering chamber 201C
  • 305 denotes a load lock and unload lock chamber corresponding to the load lock and unload lock chambers 205 and 206.
  • reference numeral 306 denotes a central processing unit (CPU) incorporating the storage medium 312.
  • Reference numerals 309 to 311 are bus lines connecting the CPU 306 and the processing chambers 301 to 305, and control signals for controlling the operations of the processing chambers 301 to 305 are transmitted from the CPU 306 to the processing chambers 301 to 305.
  • the substrate (not shown) in the load lock / unload lock chamber 305 is carried out to the transfer chamber 301.
  • the substrate unloading step is calculated based on the control program stored in the storage medium 312 by the CPU 306.
  • Control signals based on the operation result are implemented by controlling the execution of various devices mounted on the load lock / unload lock chamber 305 and the transfer chamber 301 through the bus lines 307 and 311. Examples of the various devices include a gate valve (not shown), a robot mechanism, a transport mechanism, and a drive system.
  • the substrate transported to the transport chamber 301 is carried out to the film forming chamber 302.
  • the substrate carried into the film forming chamber 302 is the first layer (Ta layer 13), the second layer (PtMn layer 14), the third layer (CoFe layer 15), and the fourth layer (Ru layer) of FIG. 161) and the fifth layer (CoFeB layer 121) are sequentially stacked.
  • the CoFeB layer 121 of the fifth layer at this stage preferably has an amorphous structure, but may have a polycrystalline structure.
  • control signals calculated based on the control program stored in the storage medium 312 in the CPU 306 execute the various devices mounted on the transfer chamber 301 and the film forming chamber 302 through the bus lines 307 and 308. It is implemented by controlling. Examples of the various devices include a power input mechanism to a cathode (not shown), a substrate rotation mechanism, a gas introduction mechanism, an exhaust mechanism, a gate valve, a robot mechanism, a transport mechanism, a drive system, and the like.
  • the substrate having the laminated film up to the fifth layer is temporarily returned to the transfer chamber 301 and then carried into the film forming chamber 303.
  • a polycrystalline Mg oxide layer or a polycrystalline BMg oxide layer 122 is formed as a sixth layer on the amorphous CoFeB 121 layer of the fifth layer.
  • control signals calculated based on the control program stored in the storage medium 312 in the CPU 306 execute various devices mounted on the transfer chamber 301 and the film formation chamber 303 through the bus lines 307 and 309.
  • the various devices include a power input mechanism to a cathode (not shown), a substrate rotation mechanism, a gas introduction mechanism, an exhaust mechanism, a gate valve, a robot mechanism, a transport mechanism, a drive system, and the like.
  • the substrate having the laminated film up to the Mg oxide layer or the BMg oxide layer 122 of the sixth layer is once returned again to the transfer chamber 301, and is then carried to the film formation chamber 304.
  • an eleventh layer (Ta layer 17) and a twelfth layer (Ru layer 18) are sequentially stacked.
  • the seventh layer CoFe layer or CoFeB layer 1233, the ninth layer CoFe layer or CoFeB layer 1232 and the tenth layer NiFe layer or NiFeB layer 1231 at this stage preferably has an amorphous structure, but is polycrystalline. It may be a structure.
  • control signals calculated based on the control program stored in the storage medium 312 in the CPU 306 execute the various devices mounted in the transfer chamber 301 and the film forming chamber 304 through the bus lines 307 and 310. It is implemented by controlling.
  • the various devices include a power input mechanism to a cathode (not shown), a substrate rotation mechanism, a gas introduction mechanism, an exhaust mechanism, a gate valve, a robot mechanism, a transport mechanism, a drive system, and the like.
  • the eighth Ta layer 162 and the eleventh Ta layer 17 are formed using the same target attached to the cathode 54.
  • the storage medium 312 is a storage medium of the present invention, and a control program for executing the manufacture of the magnetoresistive element is stored in the storage medium.
  • Examples of the storage medium 312 used in the present invention include hard disk media, magneto-optical disk media, floppy (registered trademark) disk media, nonvolatile memories such as flash memory and MRAM, and the like, and include media capable of storing programs. .
  • the fifth layer (CoFeB layer 121), the seventh layer and the ninth layer (CoFe layer or CoFeB layer 1233, 1232) and the tenth layer (NiFe layer or NiFeB layer 1231) immediately after film formation are used.
  • the amorphous state can be crystallized by annealing. As a result, the polycrystalline structure shown in FIG. 7 can be obtained.
  • the magnetoresistive element 10 immediately after film formation is carried into an annealing furnace (not shown), where the fifth layer 121, the seventh layer 1233, the ninth layer 1232 and the tenth layer 1231 are used.
  • the amorphous state can be phase-changed to the crystalline state.
  • magnetism can be imparted to the PtMn layer 14 which is the second layer.
  • the storage medium 312 stores a control program for performing the process in the annealing furnace. Therefore, according to a control signal obtained by the operation of the CPU 306 based on the control program, various devices (for example, a heater mechanism, an exhaust mechanism, a transport mechanism, etc.) in the annealing furnace are controlled to execute the annealing process. Can.
  • a Rh layer or an Ir layer can be used.
  • an alloy layer such as an IrMn layer, an IrMnCr layer, an NiMn layer, a PdPtMn layer, a RuRhMn layer, or an OsMn layer is preferably used.
  • the film thickness is preferably 10 to 30 nm.
  • FIG. 4 is a schematic view of an MRAM 401 using the magnetoresistive element of the present invention as a memory element.
  • 402 is a memory element of the present invention
  • 403 is a word line
  • 404 is a bit line.
  • Each of the large number of memory elements 402 is arranged at each intersection position of the plurality of word lines 403 and the plurality of bit lines 404, and is arranged in a lattice-like positional relationship.
  • Each of the multiple memory elements 402 can store one bit of information.
  • FIG. 5 is an equivalent circuit diagram configured by TMR element 10 storing 1-bit information at the intersection position of word line 403 and bit line 404 of MRAM 401, and transistor 501 having a switch function.
  • the magnetoresistive element shown in FIG. 1 was manufactured using the film forming apparatus shown in FIG.
  • the film formation conditions of the TMR element 12 which is the main part are as follows.
  • the CoFeB layer 121 uses a target having a CoFeB composition ratio (atomic: atomic ratio) of 60/20/20, Ar as a sputtering gas, and a pressure of 0.03 Pa.
  • the CoFeB layer 121 was formed at a sputtering rate of 0.64 nm / sec by magnetron DC sputtering (chamber 201A).
  • the CoFeB layer 121 at this time had an amorphous structure.
  • the tunnel barrier layer 122 was formed using an MgO target having an MgO composition ratio (atomic: atomic ratio) of 50/50.
  • An Mg oxide layer was formed by magnetron RF sputtering (13.56 MHz) using Ar as a sputtering gas and using a pressure of 0.2 Pa out of a pressure range of 0.01 to 0.4 Pa as a preferable range.
  • the Mg oxide layer had a polycrystalline structure composed of the aggregate 71 of column-like crystals 72 shown in FIG.
  • the film-forming rate of magnetron RF sputtering (13.56 MHz) at this time was 0.14 nm / sec.
  • the substrate is introduced into a sputtering apparatus (chamber 201 B), and the magnetization free layer (the seventh CoFeB layer 1233, the eighth Ta layer 162, the ninth CoFe layer 1232 and the tenth NiFe layer 1231 ) was deposited.
  • the CoFeB layer 1233, the CoFe layer 1232 and the NiFe layer 1231 were formed using Ar as a sputtering gas, a pressure of 0.03 Pa, and a magnetron DC sputtering (chamber 201B) at a sputtering rate of 0.64 nm / sec.
  • targets of CoFeB composition ratio (atomic) 25/25/50, CoFe composition ratio (atomic) 50/50 and NiFe composition ratio (atomic) 40/60 were used, respectively.
  • the CoFeB layer 1233, the CoFe layer 1232 and the NiFe layer 1231 had an amorphous structure.
  • the deposition rate of the Mg oxide layer is 0.14 nm / sec.
  • the deposition rate of the Mg oxide layer is 0.14 nm / sec.
  • the magnetoresistive element 10 which has been deposited by sputtering in each of the magnetron sputtering chambers 201A, 201B and 201C for film formation, is annealed in a heat treatment furnace at a temperature of about 300 ° C. and 4 hours in a magnetic field of 8 kOe. Carried out. As a result, it was confirmed that the amorphous structure of CoFeB layer 121, BoFeB layer 1233, CoFe layer 1232 and NiFe layer 1231 had a polycrystalline structure comprising aggregate 71 of columnar crystals 72 shown in FIG.
  • the magnetoresistive element 10 can act as a magnetoresistive element having a TMR effect. Moreover, predetermined magnetization was given to the antiferromagnetic material layer 14 which is a PtMn layer of a 2nd layer by this annealing process.
  • a magnetoresistive element is manufactured using the same method as the above example except that the use of the eighth layer Ta layer 162, the ninth layer CoFe layer 1232 and the tenth layer NiFe layer 1231 is omitted. Was produced.
  • the MR ratio of the magnetoresistive element of the example and the magnetoresistive element of the comparative example was measured and compared, the MR ratio of the magnetoresistive element of the example was compared with the MR ratio of the magnetoresistive element of the comparative example. It has been improved by 2 times to 1.5 times or more.
  • the MR ratio is a parameter related to the magnetoresistance effect in which the electric resistance of the film changes as the magnetization direction of the magnetic film or magnetic multilayer film changes in response to an external magnetic field, and the rate of change of the electric resistance Rate (MR ratio).
  • the magnetoresistive element was manufactured using the same method as that of the ninth example except that the CoFe layer 1232 of the ninth layer was changed to CoFeB (atomic composition ratio: 50/30/20). The same effect as in the example was obtained.
  • the magnetoresistive element was manufactured using the same method as that of the tenth example except that the NiFe layer 1231 of the tenth layer was changed to NiFeB (atomic composition ratio: 50/30/20). The same effect as in the example was obtained.
  • a magnetoresistive element is manufactured by the same method as that of the sixth embodiment except that a polycrystalline BMg oxide layer is used.
  • MR ratio was measured.
  • the deposition rate was 0.14 nm / sec using a BMgO target with a BMgO composition ratio (atomic: atomic ratio) of 25/25/50.
  • the MR ratio significantly improved (compared to the MR ratio according to the embodiment using the polycrystalline Mg oxide layer).
  • MR ratio of 5 times or more was obtained.
  • a magnetoresistive element is manufactured using the completely same method as the above example except that the CoFeB layer 121 of the magnetization fixed layer is changed to a CoFe (atomic composition ratio; 50/50) layer, The MR ratio was measured. As a result, the measurement results were as low as 1/100 or less of the MR ratio obtained by the magnetoresistive element of the present invention.

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Abstract

L’invention concerne un élément magnéto-résistif qui a un taux de MR plus élevé que les éléments magnéto-résistifs traditionnels, ainsi qu’un procédé de fabrication de l’élément magnéto-résistif. L’élément magnéto-résistif comprend un substrat, une première couche ferromagnétique cristalline, une couche de barrière tunnel, une deuxième couche ferromagnétique cristalline, une couche intermédiaire non magnétique et une troisième couche ferromagnétique cristalline. La première couche ferromagnétique est composée d’un alliage contenant des atomes Co, des atomes Fe et des atomes B ; la couche de barrière tunnel contient une couche d’oxyde de magnésium cristalline ou une couche d’oxyde de magnésium et de bore cristalline ; la deuxième couche ferromagnétique est composée d’un alliage contenant des atomes Co, des atomes Fe et des atomes B ou d’un alliage contenant des atomes Co et des atomes Fe ; et la troisième couche ferromagnétique est composée d’une couche qui est composée d’un alliage contenant des atomes Co, des atomes Fe et des atomes B ou d’un alliage contenant des atomes Co et des atomes Fe, et d’une couche qui est composée d’un alliage contenant des atomes Ni, des atomes Fe et des atomes B ou d’un alliage contenant des atomes Ni et des atomes Fe.
PCT/JP2009/004247 2008-09-09 2009-08-31 Élément magnéto-résistif, son procédé de fabrication et support de stockage utilisé dans le procédé de fabrication WO2010029701A1 (fr)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002204002A (ja) * 2000-12-28 2002-07-19 Nec Corp スピントンネル磁気抵抗効果膜及び素子及びそれを用いた磁気抵抗センサー、及び磁気装置及びその製造方法
JP2004172599A (ja) * 2002-11-01 2004-06-17 Nec Corp 磁気抵抗デバイス及びその製造方法
JP2004349687A (ja) * 2003-04-17 2004-12-09 Applied Materials Inc 抗磁ランダムアクセスメモリ（ｍｒａｍ）装置の製造方法
JP2007294737A (ja) * 2006-04-26 2007-11-08 Hitachi Ltd トンネル磁気抵抗効果素子、それを用いた磁気メモリセル及びランダムアクセスメモリ
JP2008085170A (ja) * 2006-09-28 2008-04-10 Toshiba Corp 磁気抵抗効果型素子および磁気抵抗効果型ランダムアクセスメモリ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002204002A (ja) * 2000-12-28 2002-07-19 Nec Corp スピントンネル磁気抵抗効果膜及び素子及びそれを用いた磁気抵抗センサー、及び磁気装置及びその製造方法
JP2004172599A (ja) * 2002-11-01 2004-06-17 Nec Corp 磁気抵抗デバイス及びその製造方法
JP2004349687A (ja) * 2003-04-17 2004-12-09 Applied Materials Inc 抗磁ランダムアクセスメモリ（ｍｒａｍ）装置の製造方法
JP2007294737A (ja) * 2006-04-26 2007-11-08 Hitachi Ltd トンネル磁気抵抗効果素子、それを用いた磁気メモリセル及びランダムアクセスメモリ
JP2008085170A (ja) * 2006-09-28 2008-04-10 Toshiba Corp 磁気抵抗効果型素子および磁気抵抗効果型ランダムアクセスメモリ

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