WO2010022248A2 - Improved method and apparatus for optically transparent via filling - Google Patents

Improved method and apparatus for optically transparent via filling Download PDF

Info

Publication number
WO2010022248A2
WO2010022248A2 PCT/US2009/054485 US2009054485W WO2010022248A2 WO 2010022248 A2 WO2010022248 A2 WO 2010022248A2 US 2009054485 W US2009054485 W US 2009054485W WO 2010022248 A2 WO2010022248 A2 WO 2010022248A2
Authority
WO
WIPO (PCT)
Prior art keywords
transparent material
setting
external
panel
internal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2009/054485
Other languages
French (fr)
Other versions
WO2010022248A3 (en
Inventor
Glenn F. Simenson
William Antoni
Steve Cohen
Jeffrey Howerton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Priority to CN200980138265.5A priority Critical patent/CN102165250B/en
Priority to JP2011523992A priority patent/JP5814121B2/en
Publication of WO2010022248A2 publication Critical patent/WO2010022248A2/en
Publication of WO2010022248A3 publication Critical patent/WO2010022248A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00663—Production of light guides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00365—Production of microlenses
    • B29D11/00375—Production of microlenses by moulding lenses in holes through a substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts

Definitions

  • the field of the technical subject matter relates to methods for filling a via with material and products produced through use of such methods. More particularly it relates to filling very small vias with optically transparent material. Even more particularly it relates to filling very small vias with optically transparent material so that the vias are largely unnoticeable when unlit and provide an even, uniform light when backlit.
  • a light through a housing to provide information is commonplace. Examples include but are not limited to computer keyboards that include indication lights for functions such as “Caps Lock” or “Num Lock”; computer monitors that include an "on/off light, automobiles that include lights to indicate whether heated seats are on or off, or whether an air bag is on or off; televisions with indicator lights, and a whole host of other consumer electronics.
  • a common way to provide for such lighting is to provide a projecting light that is visible when the light is off and brightly lit to indicate when the light is on.
  • a collection of lights, or holes for lights, may be disruptive to the objectives of an industrial designer.
  • One method of attempting to make the holes for lights less visible is to drill very small, tapered holes and fill them with a transparent material. Holes or vias can be formed using mechanical drills, lasers, electrical discharge machining, or chemical etching. A method for producing optical vias is described in co-pending application 11/742,862 PROCESS FOR OPTICALLY TRANSPARENT VIA FILLING, assigned to the assignee of the instant invention. In this method, the vias are drilled, filled with workable transparent material, the filler transparent material set, and then the surface is cleaned to remove excess set transparent material from the visible surface of the article.
  • Figs Ia- Id a substrate 10, having a front or cosmetic side 12 and a back side 14, the substrate 10 having a via 16 filled with a transparent filler 18 being irradiated with ultraviolet (UV) radiation 20 from an ultraviolet light source 22 to set the filler 18.
  • Fig Ib shows the same substrate 10 and via 16 now filled with set filler 24. Note that the UV radiation has penetrated and set filler that extends beyond front side 12 causing a "finger" 26 of cured filler to extend beyond front side 12.
  • a mechanical device such as a blade is used to remove the finger 26 of set material from front side 12 of the substrate 10.
  • the finger 26 of set material can also sometimes be removed by simply wiping with a cloth if the fingers are small enough.
  • Fig Id shows the substrate 10 with via 16 filled with set material 24 following removal of finger 26.
  • Fig 2 shows a high resolution optical microscope image of a via 30 filled with cured filler 32 taken from the front or cosmetic side 34 of the substrate following removal of excess cured filler. As can be seen in Fig 2, this process leaves a fractured surface in the cured transparent material 32 on the visible side of the article which can make the via unsightly, more visible when unlit and impairs the lit appearance, all of which are undesirable. Accordingly, there remains a need for a method and apparatus for filling vias with a transparent material without surface fractures to improve their aesthetics both when lit and unlit.
  • via we refer to a hole formed in a panel or substrate extending from one surface to another characterized by an interior volume bounded by the interior walls of the via and planes which extend the surfaces penetrated by the via.
  • occlude we mean to introduce material into the interior volume of the via in such a fashion as to completely fill a cross-section of the via. Note that the entire via volume of the via may or may not be completely filled, however, excess material that extends beyond the volume of the via at one surface is typically present.
  • Panels or substrates to be filled in this manner are typically made of metal, although other materials such as plastic or composite materials may be used.
  • Transparent filler material is introduced into the via in workable form and then made or allowed to set or cure into a hard, optically transparent material that typically adheres to the inside walls of the via to assist in remaining in place in the via.
  • Exemplary materials that may be used include UV-settable polymers, or other polymers that set by exposure to radiation, epoxies or other multi-part compounds that set through chemical reactions, compounds that set through cooling or application of heat and compounds that set by evaporation of solvents or otherwise harden. Any of these materials may be used advantageously in the instant invention.
  • An exemplary light transmissive material is AHS-1100 Developmental Material manufactured by 3M Company, St. Paul, Minnesota.
  • Other transparent fillers may be used advantageously, including fillers that can be set by means other than UV radiation. Set refers to the process whereby transparent filler transforms from a substantially liquid or workable state to a solid or relatively hardened state.
  • Transparent fillers can be set by chemical reactions, heat or other electromagnetic radiation, exposure to air, evaporation of solvents or other means.
  • the embodiments described herein can be adapted to use these other setting methods. For example, in the case where the filler is a two-part epoxy that is mixed prior to application to the via and will set in a determined amount of time, the residue can be quickly removed by mechanical or compressed air before the filler sets completely.
  • thermoplastic materials can form the transparent fillers.
  • the excess material would have to be removed prior to the setting by cooling of the thermoplastic materials.
  • the method comprises providing a panel including at least one via and occluding the via with an optically transmissive material, then removing the excess material prior to it becoming set through curing, cooling, evaporation of solvent or otherwise hardened. Removing the excess material prior to setting leaves the exposed surface of the transparent material smooth and unfeatured, thereby making it less visible when unlit and provides more even, uniform illumination when lit.
  • the excess material can be removed by wiping the surface by mechanical means, such as a blade or a squeegee or the excess material can be removed with compressed air. These steps can be followed by wiping with a solvent or vacuum suction or combinations of these methods to remove any remaining excess material.
  • light-transmissive vias made according to methods described herein are also disclosed. For example, taught herein is a via having a light transmissive properties wherein the light transmissive via in an article is filled with an optically transmissive material, where the excess optically transmissive material is at least partially removed from the surface of the article prior to the material setting.
  • Figs Ia, Ib, Ic, and Id show a prior art method of setting and removing excess material from a filled via.
  • Fig 2 is an optical microscopic image of a filled via having been set and cleaned with prior art methods.
  • Figs 3a, 3b, 3c and 3d show a method of setting and removing excess material from a filled via using mechanical means.
  • Figs 4a, 4b, and 4c show a method of setting and removing excess material from a filled via using an air knife and vacuum.
  • Fig 5 is an optical microscopic image of a filled via processed according to an embodiment of the instant invention.
  • Fig 6 is a scanning electron microscope image of a filled via processed according to an embodiment of the instant invention.
  • Fig 7 is a scanning electron microscope image of a filled via processed according to an embodiment of the instant invention.
  • FIG 3a shows a schematic diagram of a substrate 10 with a front or cosmetic side or surface 12 and a back side or surface 14 having a via 16 occluded with a transparent filler 18.
  • the transparent filler 18 is partially set using a UV light source 50 emitting UV light 52. Note that the UV light is being directed to the substrate at an angle close to parallel with the back side 14 of the substrate to prevent radiation from penetrating through the via 16 and setting the portion of filler 54 that extends beyond the front surface 12.
  • Fig 3b shows the substrate 10 and partially set filler 48 in the via 16.
  • Fig 3c shows the substrate 10 with the partially set filler 48 and the excess unset filler 58 on the top surface 12 of the substrate 10.
  • UV light source 60 is placed more perpendicular to the back surface 14 so that the UV light rays 62 penetrate the partially set filler 48 all the way to the top surface 12 and thereby complete the setting process.
  • the excess filler material can be removed prior to any setting taking place.
  • Fig 3d shows the substrate 10 with the completely set filler 64 after being cleaned to remove the unset filler remaining on the top surface 12. This cleaning can be accomplished by either vacuum or solvent wash or other equivalent methods and can be performed either before or after the material in the via has been finally set.
  • FIGs 4a-4c Another embodiment of the instant invention is illustrated in Figs 4a-4c.
  • Fig 4a shows a substrate 10 with a front side 12 and a back side 14 with a via 16. Via 16 is occluded with workable transparent filler 18.
  • an air knife 80 is used to direct a compressed air stream 82 onto the top surface of the substrate 12 to remove excess filler 58 from the immediate vicinity of the via 16.
  • a vacuum nozzle, 86 removes the excess filler 58 from the top surface 12 once it has been moved away from the via.
  • Fig 4c shows the partially set filler 48 in the via 16 being set using UV radiation 62 from a UV source 60 from the back surface 14 of the substrate 10.
  • Fig 5 shows an optical microscope picture of a filled via 30 produced by the instant invention taken from the cosmetic or front side 34. Note the smooth appearance of the filler 90, which makes the filled via less noticeable when unlit and makes the via appear more evenly illuminated from a wider range of viewing angles.
  • Fig 6 shows a scanning electron microscope image of a via 30 taken from the front side 34 of a panel, filled with transparent material 92 that has been prepared according to an embodiment of the instant invention using a mechanical means to remove the excess unset filler.
  • Fig 7 shows a scanning electron microscope image of a via 30 with a transparent filler 94 taken from the front side 34 of a panel, processed according to an embodiment of the instant invention that uses compressed air and vacuum to remove excess filler from the via. This picture shows that the filler 94 has no detectable residue and no apparent surface texture.

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)

Abstract

A method and apparatus for filling a via 16 with transparent material 18 is presented, including the steps of providing a panel 10 having a via 16, occluding the via 16 with transparent material 18 in a workable state so that a portion of the occluding material 18 is internal to the via 16 and a portion of the material is external 54 to the via 16. The external 54 and internal portions are separated so the transparent filler material 18, when set, forms a smooth and featureless surface 12. This causes the filled via 16 to have a substantially even and uniform appearance over a wide range of viewing angles when lit.

Description

IMPROVED METHOD AND APPARATUS FOR OPTICALLY TRANSPARENT VIA
FILLING
FIELD OF THE DISCLOSURE
[0001] The field of the technical subject matter relates to methods for filling a via with material and products produced through use of such methods. More particularly it relates to filling very small vias with optically transparent material. Even more particularly it relates to filling very small vias with optically transparent material so that the vias are largely unnoticeable when unlit and provide an even, uniform light when backlit.
BACKGROUND
[0002] Projecting a light through a housing to provide information is commonplace. Examples include but are not limited to computer keyboards that include indication lights for functions such as "Caps Lock" or "Num Lock"; computer monitors that include an "on/off light, automobiles that include lights to indicate whether heated seats are on or off, or whether an air bag is on or off; televisions with indicator lights, and a whole host of other consumer electronics. A common way to provide for such lighting is to provide a projecting light that is visible when the light is off and brightly lit to indicate when the light is on. A collection of lights, or holes for lights, may be disruptive to the objectives of an industrial designer.
[0003] One method of attempting to make the holes for lights less visible is to drill very small, tapered holes and fill them with a transparent material. Holes or vias can be formed using mechanical drills, lasers, electrical discharge machining, or chemical etching. A method for producing optical vias is described in co-pending application 11/742,862 PROCESS FOR OPTICALLY TRANSPARENT VIA FILLING, assigned to the assignee of the instant invention. In this method, the vias are drilled, filled with workable transparent material, the filler transparent material set, and then the surface is cleaned to remove excess set transparent material from the visible surface of the article. By workable we mean that the material is in a plastic state, able to be poured or otherwise inserted into the via and conform to the interior shape of the via, thereby sealing it. This process is illustrated in Figs Ia- Id. In Fig Ia, a substrate 10, having a front or cosmetic side 12 and a back side 14, the substrate 10 having a via 16 filled with a transparent filler 18 being irradiated with ultraviolet (UV) radiation 20 from an ultraviolet light source 22 to set the filler 18. Fig Ib shows the same substrate 10 and via 16 now filled with set filler 24. Note that the UV radiation has penetrated and set filler that extends beyond front side 12 causing a "finger" 26 of cured filler to extend beyond front side 12. In Fig Ic, a mechanical device such as a blade is used to remove the finger 26 of set material from front side 12 of the substrate 10. The finger 26 of set material can also sometimes be removed by simply wiping with a cloth if the fingers are small enough. Fig Id shows the substrate 10 with via 16 filled with set material 24 following removal of finger 26. [0004] Fig 2 shows a high resolution optical microscope image of a via 30 filled with cured filler 32 taken from the front or cosmetic side 34 of the substrate following removal of excess cured filler. As can be seen in Fig 2, this process leaves a fractured surface in the cured transparent material 32 on the visible side of the article which can make the via unsightly, more visible when unlit and impairs the lit appearance, all of which are undesirable. Accordingly, there remains a need for a method and apparatus for filling vias with a transparent material without surface fractures to improve their aesthetics both when lit and unlit.
SUMMARY OF THE INVENTION
[0005] Disclosed are improved methods for occluding a via in a relatively thin substrate or panel with a material that permits the transmission of light through the transparent filler material and products that are made by such methods. By via we refer to a hole formed in a panel or substrate extending from one surface to another characterized by an interior volume bounded by the interior walls of the via and planes which extend the surfaces penetrated by the via. By occlude we mean to introduce material into the interior volume of the via in such a fashion as to completely fill a cross-section of the via. Note that the entire via volume of the via may or may not be completely filled, however, excess material that extends beyond the volume of the via at one surface is typically present. It is one of the goals of the instant invention to disclose methods and apparatuses for removing this excess material in such a fashion as to leave the surface smooth and debris-free and thereby provide an improved filled, light-transmissive via. Panels or substrates to be filled in this manner are typically made of metal, although other materials such as plastic or composite materials may be used. Transparent filler material is introduced into the via in workable form and then made or allowed to set or cure into a hard, optically transparent material that typically adheres to the inside walls of the via to assist in remaining in place in the via. Exemplary materials that may be used include UV-settable polymers, or other polymers that set by exposure to radiation, epoxies or other multi-part compounds that set through chemical reactions, compounds that set through cooling or application of heat and compounds that set by evaporation of solvents or otherwise harden. Any of these materials may be used advantageously in the instant invention.
[0006] An exemplary light transmissive material is AHS-1100 Developmental Material manufactured by 3M Company, St. Paul, Minnesota. Other transparent fillers may be used advantageously, including fillers that can be set by means other than UV radiation. Set refers to the process whereby transparent filler transforms from a substantially liquid or workable state to a solid or relatively hardened state. Transparent fillers can be set by chemical reactions, heat or other electromagnetic radiation, exposure to air, evaporation of solvents or other means. The embodiments described herein can be adapted to use these other setting methods. For example, in the case where the filler is a two-part epoxy that is mixed prior to application to the via and will set in a determined amount of time, the residue can be quickly removed by mechanical or compressed air before the filler sets completely. It is also contemplated that, in the alternative to the materials described above, thermoplastic materials can form the transparent fillers. In this case the excess material would have to be removed prior to the setting by cooling of the thermoplastic materials. [0007] According to one embodiment of the instant invention, the method comprises providing a panel including at least one via and occluding the via with an optically transmissive material, then removing the excess material prior to it becoming set through curing, cooling, evaporation of solvent or otherwise hardened. Removing the excess material prior to setting leaves the exposed surface of the transparent material smooth and unfeatured, thereby making it less visible when unlit and provides more even, uniform illumination when lit. The excess material can be removed by wiping the surface by mechanical means, such as a blade or a squeegee or the excess material can be removed with compressed air. These steps can be followed by wiping with a solvent or vacuum suction or combinations of these methods to remove any remaining excess material. Additionally, light-transmissive vias made according to methods described herein are also disclosed. For example, taught herein is a via having a light transmissive properties wherein the light transmissive via in an article is filled with an optically transmissive material, where the excess optically transmissive material is at least partially removed from the surface of the article prior to the material setting.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] The description herein makes reference to the accompanying drawings wherein like reference numerals refer to like parts throughout the several views, and wherein:
[0009] Figs Ia, Ib, Ic, and Id show a prior art method of setting and removing excess material from a filled via.
[0010] Fig 2 is an optical microscopic image of a filled via having been set and cleaned with prior art methods.
[0011] Figs 3a, 3b, 3c and 3d show a method of setting and removing excess material from a filled via using mechanical means. [0012] Figs 4a, 4b, and 4c show a method of setting and removing excess material from a filled via using an air knife and vacuum.
[0013] Fig 5 is an optical microscopic image of a filled via processed according to an embodiment of the instant invention.
[0014] Fig 6 is a scanning electron microscope image of a filled via processed according to an embodiment of the instant invention.
[0015] Fig 7 is a scanning electron microscope image of a filled via processed according to an embodiment of the instant invention.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0016] An object of the instant invention is to provide methods and apparatuses for creating improved filled holes in surfaces. Fig 3a shows a schematic diagram of a substrate 10 with a front or cosmetic side or surface 12 and a back side or surface 14 having a via 16 occluded with a transparent filler 18. The transparent filler 18 is partially set using a UV light source 50 emitting UV light 52. Note that the UV light is being directed to the substrate at an angle close to parallel with the back side 14 of the substrate to prevent radiation from penetrating through the via 16 and setting the portion of filler 54 that extends beyond the front surface 12. Fig 3b shows the substrate 10 and partially set filler 48 in the via 16. Since the portion of the partially set filler 48 that extends beyond the front surface 12 is not set, it can be removed using a mechanical blade or squeegee 56 wiped across the surface, removing excess filler 58 from the immediate vicinity of the via 16. Fig 3c shows the substrate 10 with the partially set filler 48 and the excess unset filler 58 on the top surface 12 of the substrate 10. In this embodiment, UV light source 60 is placed more perpendicular to the back surface 14 so that the UV light rays 62 penetrate the partially set filler 48 all the way to the top surface 12 and thereby complete the setting process. In other embodiments the excess filler material can be removed prior to any setting taking place. Fig 3d shows the substrate 10 with the completely set filler 64 after being cleaned to remove the unset filler remaining on the top surface 12. This cleaning can be accomplished by either vacuum or solvent wash or other equivalent methods and can be performed either before or after the material in the via has been finally set.
[0017] Another embodiment of the instant invention is illustrated in Figs 4a-4c. Fig 4a shows a substrate 10 with a front side 12 and a back side 14 with a via 16. Via 16 is occluded with workable transparent filler 18. In Fig 4b, an air knife 80 is used to direct a compressed air stream 82 onto the top surface of the substrate 12 to remove excess filler 58 from the immediate vicinity of the via 16. In this embodiment of the invention, a vacuum nozzle, 86 removes the excess filler 58 from the top surface 12 once it has been moved away from the via. Fig 4c shows the partially set filler 48 in the via 16 being set using UV radiation 62 from a UV source 60 from the back surface 14 of the substrate 10. It is also contemplated that the setting could be by heating, cooling, evaporation of solvents, chemical reaction or other means. Following setting, the front surface 10 may be wiped with solvent to remove any remaining traces of excess filler. [0018] Fig 5 shows an optical microscope picture of a filled via 30 produced by the instant invention taken from the cosmetic or front side 34. Note the smooth appearance of the filler 90, which makes the filled via less noticeable when unlit and makes the via appear more evenly illuminated from a wider range of viewing angles. [0019] Fig 6 shows a scanning electron microscope image of a via 30 taken from the front side 34 of a panel, filled with transparent material 92 that has been prepared according to an embodiment of the instant invention using a mechanical means to remove the excess unset filler. While the appearance of the filled via is greatly improved over the prior art, for example as shown in Fig 2, a small amount of debris and surface texture is apparent on the set filler. Fig 7 shows a scanning electron microscope image of a via 30 with a transparent filler 94 taken from the front side 34 of a panel, processed according to an embodiment of the instant invention that uses compressed air and vacuum to remove excess filler from the via. This picture shows that the filler 94 has no detectable residue and no apparent surface texture. [0020] It will also be appreciated that details of the preferred embodiments can be interchanged and still be within the bounds of the teachings of this invention.

Claims

What is claimed:
1. A method of filling a via with transparent material including the steps of providing a panel having a via, occluding said via with said transparent material in a workable state, a portion of said occluding transparent material substantially internal to said via and a portion of said occluding transparent material substantially external to said via, comprising:
separating said external portion and said internal portion while said transparent material is workable.
2. The method of claim 1 where said external portion and said internal portion is separated by directing high velocity fluid at said panel.
3. The method of claim 1 where said external portion and said internal portion is separated by sweeping a mechanical blade substantially flush with said panel.
4. The method of claim 1 including the further step of applying a vacuum to said external portion.
5. The method of claim 1 including the further step of applying a solvent to said external portion
6. The method of claim 1 where said transparent material is set.
7. The method of claim 6 where said setting is done by one of radiation, heat, cooling, evaporation, or chemical reaction.
8. An apparatus for filling a via in a panel with transparent material including a means for occluding said via with transparent material in a workable state, a portion of said transparent material substantially internal to said via and a portion substantially external to said via, comprising:
a separating device which separates said external portion of said transparent material from said internal portion of said transparent material, while said transparent material is workable.
9. The system of claim 8 where said separating device is a fluid knife.
10. The system of claim 8 where said separating device is a mechanical blade.
11. The system of claim 8 including a vacuum device which removes said external portion of said transparent material from said panel.
12. The system of claim 8 including a device for setting said transparent material.
13. The setting device of claim 12 where the setting is performed by one of radiation, heat, cooling, evaporation, or chemical reaction.
14. A via, formed in a panel and filled with a transparent material in a workable state with a portion of said transparent material substantially internal to said via and a portion of said transparent material substantially external to said via, and subsequently setting said transparent material, comprising:
providing a via with a substantially smooth, debris and fracture-free surface as a result of separating said external transparent material from said internal transparent material prior to setting the transparent material, and
setting said optically transparent material following said separation.
15. The via of claim 14 where said separating device is a fluid knife.
16. The via of claim 14 where said separating device is a mechanical blade.
17. The via of claim 14 including cleaning said panel with a solvent following said setting.
18. The via of claim 14 where said setting is performed by one of radiation, heat, cooling, evaporation, or chemical reaction.
PCT/US2009/054485 2008-08-20 2009-08-20 Improved method and apparatus for optically transparent via filling Ceased WO2010022248A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200980138265.5A CN102165250B (en) 2008-08-20 2009-08-20 For ameliorative way and the equipment of optical clear via filling
JP2011523992A JP5814121B2 (en) 2008-08-20 2009-08-20 Improved method and apparatus for filling optically transparent vias

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/194,886 US7943862B2 (en) 2008-08-20 2008-08-20 Method and apparatus for optically transparent via filling
US12/194,886 2008-08-20

Publications (2)

Publication Number Publication Date
WO2010022248A2 true WO2010022248A2 (en) 2010-02-25
WO2010022248A3 WO2010022248A3 (en) 2010-05-20

Family

ID=41695286

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/054485 Ceased WO2010022248A2 (en) 2008-08-20 2009-08-20 Improved method and apparatus for optically transparent via filling

Country Status (6)

Country Link
US (3) US7943862B2 (en)
JP (1) JP5814121B2 (en)
KR (1) KR101637397B1 (en)
CN (1) CN102165250B (en)
TW (1) TWI479213B (en)
WO (1) WO2010022248A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007142909A2 (en) 2006-06-02 2007-12-13 Electro Scientific Industries, Inc. Process for optically transparent via filling
US7943862B2 (en) 2008-08-20 2011-05-17 Electro Scientific Industries, Inc. Method and apparatus for optically transparent via filling
US9812042B2 (en) * 2012-10-29 2017-11-07 Innotec Corp. Lighted trim assembly and perforated member therefor
US20140291246A1 (en) 2013-03-16 2014-10-02 Chemica Technologies, Inc. Selective Adsorbent Fabric for Water Purification
EP3867098A4 (en) 2018-10-19 2022-07-06 Shanghai Yanfeng Jinqiao Automotive Trim Systems Co. Ltd VEHICLE INTERIOR PART
US10821889B2 (en) 2018-10-19 2020-11-03 Shanghai Yanfeng Inqiao Automotive Trim Systems Co. Ltd. Vehicle interior component
EP4140812B1 (en) * 2021-08-24 2024-01-10 Grupo Antolin-Ingenieria, S.A. Skin for dressing backlit vehicle interior parts, method and installation for manufacturing thereof

Family Cites Families (112)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4155972A (en) 1977-09-06 1979-05-22 Keystone Consolidated Industries, Inc. Multiple-shot method of molding plastic products
US4161280A (en) * 1977-10-13 1979-07-17 State Of Connecticut Method and apparatus for dispensing a deicer liquid
US4305770A (en) * 1979-04-26 1981-12-15 Sea-Log Corporation Fabrication of fiber reinforced resin structures
GB9012727D0 (en) * 1990-06-07 1990-08-01 Shell Int Research Treating an underground formation
JPH0471293A (en) * 1990-07-11 1992-03-05 Cmk Corp Filling of conductive substance and the like in through hole and the like in printed-wiring board
US5243142A (en) * 1990-08-03 1993-09-07 Hitachi Aic Inc. Printed wiring board and process for producing the same
US5125425A (en) * 1991-02-27 1992-06-30 Folts Michael E Cleaning and deburring nozzle
US5293025A (en) 1991-08-01 1994-03-08 E. I. Du Pont De Nemours And Company Method for forming vias in multilayer circuits
US5348693A (en) * 1991-11-12 1994-09-20 Advanced Cardiovascular Systems, Inc. Formation of three dimensional objects and assemblies
US6861159B2 (en) * 1992-03-27 2005-03-01 The Louis Berkman Company Corrosion-resistant coated copper and method for making the same
JPH07201260A (en) 1993-12-29 1995-08-04 Yamatake Honeywell Co Ltd Method for forming display window of electronic switch
US5376859A (en) * 1994-02-07 1994-12-27 The United States Of America As Represented By The Secretary Of The Navy Transducers with improved signal transfer
US5518964A (en) 1994-07-07 1996-05-21 Tessera, Inc. Microelectronic mounting with multiple lead deformation and bonding
US5614114A (en) 1994-07-18 1997-03-25 Electro Scientific Industries, Inc. Laser system and method for plating vias
US5593606A (en) 1994-07-18 1997-01-14 Electro Scientific Industries, Inc. Ultraviolet laser system and method for forming vias in multi-layered targets
US5699613A (en) 1995-09-25 1997-12-23 International Business Machines Corporation Fine dimension stacked vias for a multiple layer circuit board structure
US5757079A (en) 1995-12-21 1998-05-26 International Business Machines Corporation Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages and the resulting MLTF structure
US6631558B2 (en) 1996-06-05 2003-10-14 Laservia Corporation Blind via laser drilling system
AU3301197A (en) 1996-06-05 1998-01-05 Larry W. Burgess Blind via laser drilling system
US5787578A (en) 1996-07-09 1998-08-04 International Business Machines Corporation Method of selectively depositing a metallic layer on a ceramic substrate
US5718326A (en) 1996-07-22 1998-02-17 Delco Electronics Corporation Backlit button/switchpad assembly
TW439007B (en) * 1996-09-11 2001-06-07 Canon Kk Process and apparatus for producing electrode plate and process for producing liquid crystal device including the plate
GB9621049D0 (en) * 1996-10-09 1996-11-27 Secr Defence Dielectric composites
US5817347A (en) * 1996-10-28 1998-10-06 Edge Concepts Corporation Apparatus for thermoset injection molding
US6541709B1 (en) 1996-11-01 2003-04-01 International Business Machines Corporation Inherently robust repair process for thin film circuitry using uv laser
AU5238898A (en) 1996-11-08 1998-05-29 W.L. Gore & Associates, Inc. Method for reducing via inductance in an electronic assembly and device
DE19758496A1 (en) 1997-04-25 1999-03-25 Trw Automotive Electron & Comp Transparent illuminated aperture part or actuator part manufacturing method
US5843567A (en) * 1997-06-03 1998-12-01 Xerox Corporation Electrical component containing magnetic particles
GB9811328D0 (en) 1998-05-27 1998-07-22 Exitech Ltd The use of mid-infrared lasers for drilling microvia holes in printed circuit (wiring) boards and other electrical circuit interconnection packages
US6400018B2 (en) 1998-08-27 2002-06-04 3M Innovative Properties Company Via plug adapter
MY144503A (en) * 1998-09-14 2011-09-30 Ibiden Co Ltd Printed circuit board and method for its production
MY139405A (en) * 1998-09-28 2009-09-30 Ibiden Co Ltd Printed circuit board and method for its production
US6239049B1 (en) * 1998-12-22 2001-05-29 3M Innovative Properties Company Aminoplast resin/thermoplastic polyamide presize coatings for abrasive article backings
US6235544B1 (en) 1999-04-20 2001-05-22 International Business Machines Corporation Seed metal delete process for thin film repair solutions using direct UV laser
JP3459380B2 (en) * 1999-06-30 2003-10-20 日本特殊陶業株式会社 Manufacturing method of printed wiring board and mask
EP1119058A4 (en) * 1999-07-29 2006-08-23 Citizen Electronics LIGHT EMITTING DIODE
JP2001083906A (en) * 1999-09-09 2001-03-30 Canon Inc Method of forming spacer, color filter with spacer and method of manufacturing the same, and liquid crystal element using the color filter
US6871396B2 (en) * 2000-02-09 2005-03-29 Matsushita Electric Industrial Co., Ltd. Transfer material for wiring substrate
US6383322B1 (en) * 2000-05-12 2002-05-07 Wen Ping Wang Method for manufacturing knockdown board material
US6834426B1 (en) * 2000-07-25 2004-12-28 International Business Machines Corporation Method of fabricating a laminate circuit structure
US6649146B2 (en) * 2000-10-17 2003-11-18 Kerr Corporation Dental impression material utilizing ruthenium metathesis catalyst
JP3915873B2 (en) * 2000-11-10 2007-05-16 セイコーエプソン株式会社 Manufacturing method of optical device
US7632434B2 (en) * 2000-11-17 2009-12-15 Wayne O. Duescher Abrasive agglomerate coated raised island articles
JP2005317986A (en) 2000-11-29 2005-11-10 Taiyo Ink Mfg Ltd Process for producing printed wiring board by use of liquid thermosetting resin composition
US6731843B2 (en) * 2000-12-29 2004-05-04 Intel Corporation Multi-level waveguide
US20020173062A1 (en) * 2001-05-17 2002-11-21 Lung-Chien Chen Method for manufacturing GaN-based LED
DE10125397B4 (en) 2001-05-23 2005-03-03 Siemens Ag Method for drilling microholes with a laser beam
GB0112675D0 (en) * 2001-05-24 2001-07-18 Vantico Ltd Three-dimensional structured printing
US7217375B2 (en) * 2001-06-04 2007-05-15 Ophthonix, Inc. Apparatus and method of fabricating a compensating element for wavefront correction using spatially localized curing of resin mixtures
US6512861B2 (en) * 2001-06-26 2003-01-28 Intel Corporation Packaging and assembly method for optical coupling
US6982178B2 (en) * 2002-06-10 2006-01-03 E Ink Corporation Components and methods for use in electro-optic displays
JP3911690B2 (en) * 2001-07-19 2007-05-09 山栄化学株式会社 Thermosetting resin composition, smooth plate manufacturing method and smooth plate
JP2003046034A (en) * 2001-07-31 2003-02-14 Nec Kagobutsu Device Kk Resin-sealed semiconductor device
US20030066679A1 (en) 2001-10-09 2003-04-10 Castro Abram M. Electrical circuit and method of formation
US6627844B2 (en) 2001-11-30 2003-09-30 Matsushita Electric Industrial Co., Ltd. Method of laser milling
US6541712B1 (en) 2001-12-04 2003-04-01 Teradyhe, Inc. High speed multi-layer printed circuit board via
JP2003202589A (en) * 2001-12-28 2003-07-18 Fujitsu Display Technologies Corp Liquid crystal display device and method of manufacturing the same
US20030183905A1 (en) * 2002-02-14 2003-10-02 Fujitsu Limited Interconnection structure and interconnection structure formation method
US20030153176A1 (en) * 2002-02-14 2003-08-14 Fujitsu Limited Interconnection structure and interconnection structure formation method
EP1491927B1 (en) * 2002-04-01 2013-02-27 Ibiden Co., Ltd. Ic chip mounting substrate, and ic chip mounting substrate manufacturing method
TW558823B (en) 2002-04-10 2003-10-21 Via Tech Inc Through-hole process of integrated circuit substrate
US20040112881A1 (en) 2002-04-11 2004-06-17 Bloemeke Stephen Roger Circle laser trepanning
TWI271131B (en) 2002-04-23 2007-01-11 Via Tech Inc Pattern fabrication process of circuit substrate
US7253112B2 (en) * 2002-06-04 2007-08-07 Taiwan Semiconductor Manufacturing Co., Ltd. Dual damascene process
TWI294262B (en) * 2002-06-28 2008-03-01 Matsushita Electric Industrial Co Ltd A light reception/emission device built-in module with optical and electrical wiring combined therein and method of making the same
TWI282625B (en) * 2002-08-01 2007-06-11 Au Optronics Corp Method of forming a thin film transistor liquid crystal display
US6599768B1 (en) * 2002-08-20 2003-07-29 United Epitaxy Co., Ltd. Surface mounting method for high power light emitting diode
US7165895B2 (en) * 2002-09-16 2007-01-23 Emcore Corporation Method of guiding an optical signal
TW561803B (en) 2002-10-24 2003-11-11 Advanced Semiconductor Eng Circuit substrate and manufacturing method thereof
US7495819B2 (en) * 2002-12-17 2009-02-24 Bridgestone Corporation Method of manufacturing image display panel, method of manufacturing image display device, and image display device
US6834761B1 (en) * 2002-12-17 2004-12-28 Tp Orthodontics, Inc. Package for ready mountable bondable orthodontic appliances and method of making same
US7300894B2 (en) * 2002-12-30 2007-11-27 University Of Maine Composites pressure resin infusion system (ComPRIS)
US20040126547A1 (en) * 2002-12-31 2004-07-01 Coomer Boyd L. Methods for performing substrate imprinting using thermoset resin varnishes and products formed therefrom
TW587322B (en) 2002-12-31 2004-05-11 Phoenix Prec Technology Corp Substrate with stacked via and fine circuit thereon, and method for fabricating the same
US6867121B2 (en) 2003-01-16 2005-03-15 International Business Machines Corporation Method of apparatus for interconnecting a relatively fine pitch circuit layer and adjacent power plane(s) in a laminated construction
TW594337B (en) * 2003-02-14 2004-06-21 Quanta Display Inc Method of forming a liquid crystal display panel
US6835960B2 (en) * 2003-03-03 2004-12-28 Opto Tech Corporation Light emitting diode package structure
US7001788B2 (en) * 2003-05-29 2006-02-21 Applied Materials, Inc. Maskless fabrication of waveguide mirrors
CN100428507C (en) * 2003-06-06 2008-10-22 夏普株式会社 optical transmitter
JP2005079385A (en) * 2003-09-01 2005-03-24 Toshiba Corp Optical semiconductor device and optical signal input / output device
US7352066B2 (en) * 2003-09-30 2008-04-01 International Business Machines Corporation Silicon based optical vias
US8755644B2 (en) * 2003-09-30 2014-06-17 International Business Machines Corporation Silicon based optical vias
US7402758B2 (en) 2003-10-09 2008-07-22 Qualcomm Incorporated Telescoping blind via in three-layer core
KR100575951B1 (en) * 2003-11-11 2006-05-02 삼성전자주식회사 Optical printed circuit board integrated optical connection packaging device
JP4152375B2 (en) * 2004-01-14 2008-09-17 東海商事株式会社 Electronic component printing device
US7018219B2 (en) 2004-02-25 2006-03-28 Rosenau Steven A Interconnect structure and method for connecting buried signal lines to electrical devices
US20050189656A1 (en) 2004-02-26 2005-09-01 Chun Yee Tan Micro-vias for electronic packaging
US7250327B2 (en) * 2004-06-30 2007-07-31 Intel Corporation Silicon die substrate manufacturing process and silicon die substrate with integrated cooling mechanism
JP2006039233A (en) 2004-07-27 2006-02-09 Matsushita Electric Works Ltd Method of manufacturing optical waveguide plate
US7348786B2 (en) * 2004-08-31 2008-03-25 Georgia Tech Research Corporation Probe module for testing chips with electrical and optical input/output interconnects, methods of use, and methods of fabrication
JP2006120729A (en) 2004-10-19 2006-05-11 Ngk Spark Plug Co Ltd Wiring board manufacturing method
JP4587772B2 (en) * 2004-10-22 2010-11-24 イビデン株式会社 Multilayer printed wiring board
JP4672331B2 (en) * 2004-10-26 2011-04-20 富士通株式会社 Optical deflection element and optical switch
US20060091023A1 (en) 2004-10-28 2006-05-04 Ahsan Bukhari Assessing micro-via formation PCB substrate manufacturing process
JP3955065B2 (en) * 2005-01-18 2007-08-08 シャープ株式会社 Optical coupler
TWI244780B (en) * 2005-01-19 2005-12-01 Chih-Chen Chou LED package method
DK1859330T3 (en) * 2005-01-28 2012-10-15 Univ Duke DEVICES AND METHODS OF HANDLING SMALL DROPS ON A PRINTED CIRCUIT CARD
US7355222B2 (en) * 2005-05-19 2008-04-08 Micron Technology, Inc. Imaging device having a pixel cell with a transparent conductive interconnect line and the method of making the pixel cell
JP4438685B2 (en) * 2005-05-23 2010-03-24 セイコーエプソン株式会社 Transparent conductive film and method for forming the same, electro-optical device, and electronic apparatus
JP2006330418A (en) * 2005-05-27 2006-12-07 Seiko Epson Corp Pixel electrode and method for forming the same, electro-optical device, and electronic apparatus
US7523547B2 (en) * 2005-08-31 2009-04-28 International Business Machines Corporation Method for attaching a flexible structure to a device and a device having a flexible structure
JP2007108515A (en) * 2005-10-14 2007-04-26 Fujitsu Ltd Optical element and manufacturing method thereof
DE102005053690A1 (en) * 2005-11-10 2007-05-31 Airbus Deutschland Gmbh Tool, assembly and method for manufacturing a component, component
WO2007142909A2 (en) * 2006-06-02 2007-12-13 Electro Scientific Industries, Inc. Process for optically transparent via filling
US8394301B2 (en) 2006-06-02 2013-03-12 Electro Scientific Industries, Inc. Process for forming panel with an optically transmissive portion and products related thereto
US7968820B2 (en) 2006-06-02 2011-06-28 Electro Scientific Industries, Inc. Method of producing a panel having an area with light transmissivity
KR100826452B1 (en) * 2006-12-18 2008-04-29 삼성전기주식회사 Optical component and its manufacturing method
US7907801B2 (en) * 2007-01-17 2011-03-15 Ibiden Co., Ltd. Optical element, package substrate and device for optical communication
US7919849B2 (en) * 2007-04-04 2011-04-05 Ibiden Co., Ltd. Package substrate and device for optical communication
US7783141B2 (en) * 2007-04-04 2010-08-24 Ibiden Co., Ltd. Substrate for mounting IC chip and device for optical communication
US7960684B2 (en) * 2007-08-06 2011-06-14 Apple Inc. Side cured light-transmissive display system
US7943862B2 (en) * 2008-08-20 2011-05-17 Electro Scientific Industries, Inc. Method and apparatus for optically transparent via filling

Also Published As

Publication number Publication date
WO2010022248A3 (en) 2010-05-20
TWI479213B (en) 2015-04-01
JP2012500145A (en) 2012-01-05
CN102165250A (en) 2011-08-24
US20100044092A1 (en) 2010-02-25
US20110151046A1 (en) 2011-06-23
US8735740B2 (en) 2014-05-27
KR101637397B1 (en) 2016-07-07
KR20110049813A (en) 2011-05-12
US8729404B2 (en) 2014-05-20
TW201009407A (en) 2010-03-01
US7943862B2 (en) 2011-05-17
JP5814121B2 (en) 2015-11-17
CN102165250B (en) 2015-12-02
US20110147067A1 (en) 2011-06-23

Similar Documents

Publication Publication Date Title
US8735740B2 (en) Method and apparatus for optically transparent via filling
US8450640B2 (en) Panel with micro-hole pattern in a structurally thin portion
EP1484119A4 (en) PCB RECYCLING METHOD AND DEVICE THEREFOR
KR20160008307A (en) Method for manufacturing display module using optically clear resin
WO2007063818A1 (en) Bonding method and method for manufacturing display device
CN108372704A (en) The method for manufacturing gadget
EP2024767A2 (en) Process for optically transparent via filling
WO2011119931A2 (en) Method of manufacturing a panel with occluded microholes and products made thereby
US20110069260A1 (en) Display panel and repair method thereof
US9614173B2 (en) Packaging method for electronic device and packaging system
AU2003251700A1 (en) Fixing method and system for mounting a vehicle glass in a support frame, said vehicle glass and a vehicle provided therewith
US20060189093A1 (en) Adhesive with differential optical properties and its application for substrate processing
JP2007529356A5 (en)
HK1045825B (en) Molded article of synthetic resin and process for producing the same
TW201114600A (en) Anti-overflow device and method for adhering substrates
CN100380418C (en) Method for manufacturing touch panel
KR102063154B1 (en) Automotive curved glass optical bonding process equipment using lcd
CN1872562A (en) In-mold transfer film and its manufacturing method
CN101454143A (en) Process for structurally thinning materials drilled with via patterns
JP4695951B2 (en) Ion milling processing method and ion milling processing apparatus
WO2009093857A3 (en) Security glass and a production method therefor
EP0709443B1 (en) Method and apparatus for bonding
JP2001322536A (en) Automobile body repairing method and device
CN1738517A (en) Method for forming multilayer structure, method for manufacturing wiring board and electronic device
WO2008019707A1 (en) Three-dimensional component and method for producing the same

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200980138265.5

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09808827

Country of ref document: EP

Kind code of ref document: A2

ENP Entry into the national phase

Ref document number: 2011523992

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 20117003959

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09808827

Country of ref document: EP

Kind code of ref document: A2