CN1738517A - Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatus - Google Patents
Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatus Download PDFInfo
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- CN1738517A CN1738517A CN 200510091991 CN200510091991A CN1738517A CN 1738517 A CN1738517 A CN 1738517A CN 200510091991 CN200510091991 CN 200510091991 CN 200510091991 A CN200510091991 A CN 200510091991A CN 1738517 A CN1738517 A CN 1738517A
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Abstract
The present invention provides a method of forming multilayered structure, a method of manufacturing wiring substrate, and a method of manufacturing electronic apparatus. The method of forming the multilayer structure includes a step of forming a first insulation layer, a conductive layer disposed on the first insulation layer, and a second insulation layer covering the first insulation layer and the conductive layer by heating at a time a first insulation material layer, a second insulation material layer, and a conductive material layer formed using the droplet dispenser.
Description
Technical field
The present invention relates to utilize the sandwich construction formation method of droplet ejection apparatus, particularly relate to the sandwich construction formation method of the manufacturing that is suitable for wiring substrate and manufacturing of electronic instrument etc.
Background technology
Utilize the additive process (Additive Process) of print process, the method for making wiring substrate or circuit substrate receives publicity.Be because compare the cause that the cost of additive process is low with the method that photo-mask process is made wiring substrate or circuit substrate with the working procedure of coating that repeats film.
Be used in technology a kind of of such additive process, the known formation technology (for example, patent documentation 1) that the conductive pattern of the ink-jet method utilized is arranged
Patent documentation 1: the spy opens the 2004-6578 communique.
But, utilize ink-jet method to come under the situation of stacked a plurality of resin beds, basalis with cover basalis layer between the interface, have the phenomenon of residual stress.Therefore, exist to apply and impact or when hot, produce the phenomenon of slight crack at the interface from the outside.
In addition, utilize the ink-jet method setting, possess under the situation of insulating barrier of via hole, most situations are to form respectively: first insulating pattern of via hole fringing and surround second insulating pattern of its first insulating pattern just.Particularly, the form of removing the shape edges of via hole forms first insulating pattern, and then, the form of surrounding first insulating pattern forms second insulating pattern.This is because if like this, the profile of via hole is clearer and can form the insulating barrier of broad range.But, in such method, follow the cure shrinkage when solidifying insulating pattern, at these insulating pattern that forms respectively interfaces each other, there is residual stress.Therefore, exist to apply and impact or when hot, produce the phenomenon of slight crack at the interface from the outside.
Summary of the invention
The present invention uses for reference the problems referred to above and carries out, and one of its purpose is: utilize ink-jet method, form stable sandwich construction on the structure.
Sandwich construction formation method of the present invention comprises: the step (A) that forms first insulation material layer that comprises the first photo-curable material on substrate; The light that shines first wavelength to described first insulation material layer makes the step (B) of the described first insulation material layer semi-solid preparation; From the nozzle of droplet ejection apparatus drop, on first insulation material layer of described semi-solid preparation, form the step (C) of conductive material layer to first insulation material layer ejection conductive material of described semi-solid preparation; Cover first insulation material layer of described semi-solid preparation and the form of described conductive material layer, form the step (D) of its second insulation material layer that comprises the second photo-curable material; Heat described first insulation material layer, described conductive material layer and described second insulation material layer simultaneously, with form first insulating barrier, be positioned at position on described first insulating barrier conductive layer, cover the step (E) of second insulating barrier of described first insulating barrier and described conductive layer.
According to above-mentioned formation, first insulation material layer and second insulation material layer are heated simultaneously.Therefore, first insulation material layer and second insulation material layer solidify simultaneously, so, between first insulating barrier that is obtained and second insulating barrier, can residual stress.
Above-mentioned sandwich construction formation method preferably also comprises: between described step (D) and step (E), shine the light of second wavelength to described second insulation material layer, make the step (F) of the described second insulation material layer semi-solid preparation.
According to one of effect that above-mentioned formation obtained be, begin till the hot curing of second insulation material layer that even need the time, the shape of second insulation material layer is difficult for collapsing.This be because, utilize the irradiation of light, the photo-curable material of second insulation material layer is in polymerization, and can reduce the cause of the flowability of second insulation material layer.
The present invention can enough various ways realize.For example, can realize the present invention as the manufacture method of wiring substrate or the manufacture method of electronic instrument.
Sandwich construction formation method of the present invention comprises: the step (A) that forms first insulation material layer that comprises the first photo-curable material on substrate; The light that shines first wavelength to described first insulation material layer makes the step (B) of the described first insulation material layer semi-solid preparation; Cover the form of first insulation material layer of described semi-solid preparation, form the step (C) of its second insulation material layer that comprises the second photo-curable material; Heat described first insulation material layer, described second insulation material layer simultaneously, form the step (D) of second insulating barrier of first insulating barrier, described first insulating barrier of covering.
According to above-mentioned formation, first insulation material layer and second insulation material layer are heated simultaneously.Therefore, first insulation material layer and second insulation material layer are cured simultaneously, so between first insulating barrier and second insulating barrier that are obtained, can residual stress.
In sandwich construction formation method of the present invention, utilize droplet ejection apparatus.This sandwich construction formation method comprises: ejection comprises the drop of first insulating material of the first photo-curable material, on Wiring pattern, forms the step (A) with the first insulating material pattern of via hole fringing; To the light of the described first insulating material patterned illumination, first wavelength, make the step (B) of the described first insulating material pattern semi-solid preparation; Ejection comprises the drop of second insulating material of the second photo-curable material, forms it and is bonded on the step (C) of the second insulating material pattern of described first insulating pattern of semi-solid preparation; Heat the described first insulating material pattern and the described second insulating material pattern of semi-solid preparation simultaneously, and the step that is cured (D).
According to one of effect that above-mentioned formation obtained be: after the first insulating material pattern and the described second insulating material pattern are heated and solidify, can residual stress between these patterns.
Above-mentioned sandwich construction formation method preferably also comprises: between described step (C) and step (D), to the light of the described second insulating material patterned illumination, second wavelength, make the step (E) of the described second insulating material pattern semi-solid preparation.
According to one of effect that above-mentioned formation obtained be: begin till the hot curing of the second insulating material pattern, even need the time, the shape of the second insulating material pattern is difficult for collapsing.This be because, utilize the irradiation of light, the photo-curable material of the second insulating material pattern is in polymerization, and can reduce the cause of the flowability of second insulation material layer.
In a certain execution mode of the present invention, described Wiring pattern is the Wiring pattern of the gold (Au) that forms on the substrate.
According to one of effect that above-mentioned formation obtained be: utilize droplet ejection apparatus, on the Wiring pattern of gold (Au), can establish via hole.
In a certain execution mode of the present invention, above-mentioned sandwich construction formation method also comprises: the drop of ejection conductive material, the step (F) of the described conductive material pattern of formation on body surface; Form the step (G) of described Wiring pattern with the pattern activate that makes described conductive material.
According to one of effect that above-mentioned formation obtained be: utilize droplet ejection apparatus can form Wiring pattern.
According to other execution modes of the present invention, described step (F) is the step that ejection comprises the drop of silver (Ag).So described Wiring pattern is the Wiring pattern of silver.
According to one of effect that above-mentioned formation obtained be: utilize the Wiring pattern of droplet ejection apparatus to form and become easily.
In addition, the present invention can realize with various ways.Particularly, can realize as the manufacture method of wiring substrate or the manufacture method of electronic instrument.
Description of drawings
Fig. 1 is the ideograph of the droplet ejection apparatus of expression first, second, third execution mode.
Fig. 2 (a) and (b) be the ideograph of shower nozzle of expression droplet ejection apparatus.
Fig. 3 is the FBD (function block diagram) of the control part of droplet ejection apparatus.
(a) of Fig. 4 is the figure of manufacture method of the wiring substrate of explanation execution mode 1 to (d).
(a) of Fig. 5 is the figure of manufacture method of the wiring substrate of explanation execution mode 1 to (d).
(a) of Fig. 6 is the figure of manufacture method of the wiring substrate of explanation execution mode 2 to (d).
(a) of Fig. 7 is the figure of manufacture method of the wiring substrate of explanation execution mode 2 to (d).
(a) of Fig. 8 is the figure of manufacture method of the wiring substrate of explanation execution mode 2 to (d).
(a) of Fig. 9 is the figure of manufacture method of the wiring substrate of explanation execution mode 2 to (d).
(a) of Figure 10 is the figure of manufacture method of the wiring substrate of explanation execution mode 2 to (c).
Figure 11 is the ideograph of the liquid crystal indicator of first, second, third execution mode.
Figure 12 is the ideograph of the mobile phone of expression first, second, third execution mode.
Figure 13 is the home computer's of expression first, second, third execution mode a ideograph.
(a) of Figure 14 is the figure of manufacture method of the wiring substrate of explanation the 3rd execution mode to (c).Among the figure:
1,2,3,4,5, the 6-droplet ejection apparatus, 7, the 17-insulating barrier, 7A, the 17A-insulating material, 7B, 7B '-insulation material layer, 9, the 11-insulating pattern, 9A, the 11A-insulating material, 9B, 9B ', 11B, 11B '-insulating material pattern, 9L-insulating barrier, 9LB, 9LB '-insulation material layer, the 8-conductive layer, 8A, the 15A-conductive material, the 8B-conductive material layer, the 10-wiring substrate, 10A-substrate, 10B-matrix, 15B-conductive material pattern, 15-Wiring pattern, 25-Wiring pattern, the 26-semiconductor element, the 32-liquid crystal panel, 34-liquid crystal indicator, 40A, the 40B-via hole, 41A, the 41B-conductive connector, 104-primary importance control device, 118-nozzle, 140-light irradiation device, the 500-mobile phone, the 520-electro-optical device, 600-home computer, 620-electro-optical device.
Embodiment
(execution mode 1)
(all formations of A. droplet ejection apparatus)
Droplet ejection apparatus 1 shown in Fig. 1 is the device that is used in the sandwich construction formation method of present embodiment.But, in the sandwich construction formation method of present embodiment, on the basis of droplet ejection apparatus 1, also utilize droplet ejection apparatus 2,3.And, in the sandwich construction formation method of second, third execution mode that the back will be narrated, on the basis of droplet ejection apparatus 1, also utilize droplet ejection apparatus 2,3,4,5,6.
By execution mode 1～3, these 6 droplet ejection apparatus 1～6th are used in to spraying insulating material 7A, conductive material 8A, insulating material 9A, insulating material 11A, conductive material 15A, insulating material 17A respectively.In addition, as the back narration, these insulating material 7A, conductive material 8A, insulating material 9A, insulating material 11A, conductive material 15A, insulating material 17A all are a kind of of " liquid material ".
The 26S Proteasome Structure and Function separately of droplet ejection apparatus 2～6 26S Proteasome Structure and Function with droplet ejection apparatus 1 basically is identical.Therefore, though the following describes the 26S Proteasome Structure and Function of droplet ejection apparatus 1, also be applicable to droplet ejection apparatus 2～6.
Turn back to Fig. 1, droplet ejection apparatus 1 is ink discharge device basically.Particularly, droplet ejection apparatus 1 possesses: the chest 101, flexible pipe 110, sealing platform GS, showerhead 103, objective table 106, primary importance control device 104, second place control device 108, control part 112, light irradiation device 140 and the 104a of support sector that keep liquid material 111.
Showerhead 103 keeps shower nozzle 114 (Fig. 2).This shower nozzle 114 is according to the signal from control part 112, sprays the drop of liquid material 111.In addition, the shower nozzle 114 of showerhead 103 is to be connected chest 101 by flexible pipe 110, therefore, from chest 101 to shower nozzle 114 feed fluid shape materials 111.
Objective table 106 provides the plane in order to fixing base 10A.And objective table 106 also has, and utilizes attraction to fix the function of the position of substrate 10A.At this, substrate 10A is the flexible substrate that is made of polyimides, and its shape is banded.And the two ends of substrate 10A are to be fixed on to omit on the illustrated a pair of cylinder.
Primary importance control device 104 is to be secured in the position of leaving institute's take the altitude from sealing platform GS with the 104a of support sector.This primary importance control device 104 has: according to the signal of control part 112, and the function that showerhead 103 is moved along X-direction, perpendicular to the Z-direction of X-direction.And primary importance control device 104 also has: around the function of the axle rotary nozzle portion 103 that is parallel to Z-direction.At this, in the present embodiment, Z-direction is the direction that is parallel to vertical (being the direction of acceleration of gravity).
Second place control device 108 is the signals according to control part 112, and objective table 106 is moved to Y direction on sealing platform GS.At this, Y direction is not only perpendicular to X-direction but also perpendicular to the direction of Z-direction.
Having as mentioned above, the formation and the second place control device 108 of the primary importance control device 104 of function are to utilize the well-known XY manipulator of linear motor to realize.Therefore, at this, omit the explanation of these detailed formation.In addition, in the present embodiment, be " manipulator " or " scanner section " with primary importance control device 104 and second place control device 108 also souvenir.
As mentioned above, by primary importance control device 104, showerhead 103 moves to X-direction.And by second place control device 108, substrate 10A and objective table 106 move to Y direction together.Its result, the relative position of 114 couples of substrate 10A of shower nozzle is changing.More specifically, because these actions, showerhead 103, shower nozzle 114 or nozzle 118 (Fig. 2) are with respect to substrate 10A, on one side Z-direction keep fixed distance, relatively moving to X-direction and Y direction on one side is relative scanning.So-called " relatively moving " or " relative scanning " be mean the side that sprays liquid material 111 and from that ejecta by the bullet action that at least one side of side (being ejected portion) relatively moves with respect to the opposing party that falls.
Droplet ejection apparatus 1 with above-mentioned formation when according to the ejection data nozzle 118 (Fig. 2) of shower nozzle 114 being relatively moved with respect to substrate 10A, sprays liquid material 111 from nozzle 118 to the portion of being ejected.In addition, relatively moving and be " ejection scanning " by the shower nozzle 114 of droplet ejection apparatus 1 sometimes from the ejection of the liquid material 111 of shower nozzle 114 souvenir that sums up.
In this manual, the part that falls of liquid material 111 bullets also souvenir be " being ejected portion ".
And the part of the droplets wet expansion that bullet falls also souvenir is " a coated portion "." be ejected portion " and " coated portion " which all is in order to make liquid material present the contact angle of wanting, base object has been implemented the method that surfaction handles and the part that forms.But, though not carrying out surfaction handles, the surface of base object presents under desired lyophobicity or the lyophily situation of (promptly the liquid material that falls of bullet is presenting desired contact angle on the base object surface) liquid material, and the base object surface itself also can be " being ejected portion " or " coated portion ".In addition, in this manual, will " be ejected the position " also souvenir for " target " or " resettlement section ".
Turn back to Fig. 1, light irradiation device 140 is devices of liquid material 111 irradiating ultraviolet light of giving to substrate 10A.The connection of the irradiation of the ultraviolet light of light irradiation device 140, disconnection also are to control with control part 112.
In addition, what is called utilizes ink-jet method cambium layer, film or pattern to be meant: utilize the technology of coming cambium layer, film or pattern on the object of regulation as the device of droplet ejection apparatus 1.
(B, shower nozzle)
As Fig. 2 (a) with (b), the shower nozzle 114 of droplet ejection apparatus 1 is the shower nozzle with a plurality of nozzles 118.Particularly, shower nozzle 114 possesses: nozzle plate 128, supply port 130 and the hole 131 of the opening of oscillating plate 126, liquid-storing box 129, a plurality of next door 122, a plurality of vibrator 124, a plurality of nozzles 118 of separate provision.Liquid-storing box 129 often is filled in this liquid-storing box 129 from omitting the liquid material 111 that illustrated outside chest supplied with by hole 131 between oscillating plate 126 and nozzle plate 128.
And a plurality of next doors 122 is between oscillating plate 126 and nozzle plate 128.So the part that oscillating plate 126, nozzle plate 128 and a counter septum 122 are surrounded is a cavity 120.Cavity 120 is provided with corresponding to nozzle 118, so the number of cavity 120 is identical with the number of nozzle 118.By its supply port 130 between a counter septum 122, liquid material 111 is supplied with cavity 120 from liquid-storing box 129.In addition, in the present embodiment, the diameter of nozzle 118 is about 27 μ m.
On oscillating plate 126, be positioned at separately vibrator 124 corresponding to separately cavity 120.Vibrator 124 comprises separately: piezoelectric element 124C and a pair of electrode 124A and the 124B that clamp piezoelectric element 124C.To applying driving voltage between this a pair of electrode 124A and the 124B, spray the drop D of liquid material 111 by control part 112 from the nozzle 118 of correspondence.At this, can be variable in the following scope of the above 42pl of 0pl (picoliter) from the volume of the material of nozzle 118 ejection.In addition, can adjust the shape of nozzle 118, so that can spray the drop D of liquid material 111 to Z-direction from nozzle 118.
In this manual, will comprise a nozzle 118, corresponding to the cavity 120 of a nozzle 118, corresponding to the part of the vibrator 124 of cavity 120, also souvenir is " an ejection portion 127 " sometimes.According to this souvenir, shower nozzle 114 possesses the ejection portion 127 with nozzle 118 number similar numbers.Ejection portion 127 also can possess electrothermal conversioning element and substitute piezoelectric element.That is, ejection portion 127 utilizes the material coefficient of thermal expansion of electrothermal conversioning element and the formation that sprays material.
(C, control part)
The formation of control part 112 then, is described.As shown in Figure 3, control part 112 has: input buffer stores device 200, storage device 202, handling part 204, light source drive part 205, scanning driving part 206 and shower nozzle drive division 208.Be to intercom mutually to connect possibly between input buffer stores device 200 and the handling part 204.Intercom mutually and connect possibly by omitting the diagram bus between handling part 204, storage device 202, light source drive part 205, scanning driving part 206, the shower nozzle drive division 208.
Light source drive part 205 is connected possibly with light irradiation device 140 communications.And scanning driving part 206 intercoms mutually with second place control device 108 with primary importance control device 104 and is connected possibly.Equally, shower nozzle drive division 208 intercoms mutually with shower nozzle 114 and connects possibly.
Input buffer stores device 200 receives the ejection data in order to the drop that sprays liquid material 111 from the external information processing (omitting diagram) of the external position that is positioned at droplet ejection apparatus 1.Input buffer stores device 200 is supplied with the ejection data to handling part 204, and handling part 204 will spray storage at storage device 202.In Fig. 3, storage device 202 is RAM.
Handling part 204 with 118 pairs of data that are ejected the position relative position of its nozzle of expression, gives scanning driving part 206 according to the ejection data in the storage device 202.Scanning driving part 206 is with data and corresponding objective table drive signal of ejection cycle give primary importance control device 104 and second place control device 108 therewith.Its result, the relative position that 103 pairs of showerheads are ejected the position is changing.On the other hand, handling part 204 will spray liquid material 111 necessary ejection signals according to the ejection data that are stored in storage device 202, give shower nozzle 114.Its result, from shower nozzle 114 corresponding to nozzle 118, spray the drop D of liquid material 111.
And handling part 204 becomes light irradiation device 140 state of on-state or off-state according to the ejection data in the storage device 202.Particularly, handling part 204 is supplied with the signal separately that it represents on-state or off-state to light source drive part 205, so that light source drive part 205 can be set the state of light irradiation device 140.
(D, liquid material)
So-called above-mentioned " liquid material 111 " is meant: the material with viscosity that can spray as drop D from the nozzle 118 of shower nozzle 114.At this, pay no attention to liquid material 111 and be water-based or oiliness.As long as have from the possible flowability (viscosity) of nozzle 118 ejection just passable, even sneak into solid matter, as all so long as liquid is just passable.At this, the viscosity of liquid material 111 is that the above 50mPas of 1mPas is following for well.Viscosity is under the above situation of 1mPas, and when spraying the drop D of liquid material 111, the position is difficult for polluting by liquid material 111 around the nozzle 118.On the other hand, viscosity is that the obstruction frequency of nozzle 118 is little, therefore, can realize the ejection of drop D smoothly under the following situation of 50mPas.
As decentralized medium (or solvent), so long as can disperse silver particles etc. conductive particle, do not cause just having no particular limits of cohesion.For example, except water, can also enumerate: methyl alcohol, ethanol, propyl alcohol, the alcohols of butanols etc., normal heptane, normal octane, decane, dodecane, the tetradecane, toluene, dimethylbenzene, cymol, durene, indenes, cinene, tetrahydronaphthalene, decahydronaphthalenes, the hydrocarbon compound of cyclohexylbenzene etc., or glycol dimethyl ether, ethylene glycol diethyl ether, the Ethylene Glycol Methyl ethylether, diethylene glycol dimethyl ether, diethyl carbitol, the diethylene glycol (DEG) methyl ethyl ether, 1,2 dimethoxy-ethanes, the ether compound of two (2-Ethyl Methyl Ether base) ether Dui diox etc., and, propylene carbonate, γ-Ding lactones, the N-N-methyl-2-2-pyrrolidone N-, dimethyl formamide, dimethyl sulfoxide (DMSO), the polar compound of cyclohexanone etc.Wherein, the viewpoint of the easiness of using in the stability or the drop ejection method (ink-jet method) of the dispersiveness of conductive particle and dispersion liquid is seen, water, alcohols, hydrocarbon compound, ether compound can be enumerated water, hydrocarbon compound for well as better decentralized medium.
In addition, average grain diameter be about 1nm the particle till several 100nm also souvenir be " nano rice ".According to this souvenir, conductive material 8A, 15A include nano rice.
And insulating material 7A, the 9A that the back will be narrated, 11A, 17A (Fig. 1, Fig. 4 (a), Fig. 5 (a), Fig. 9 (a)) also are respectively liquid materials 111.And insulating material 7A, 9A, 11A, 17A all include the acrylic compounds photoresist.And in the present embodiment, the acrylic compounds photoresist is corresponding to " first photosensitive material " of the present invention and " second photosensitive material ".Like this, in the present embodiment, " first photosensitive material " is identical mutually with " second photosensitive material ".
Usually, " photo-curable material " of the present invention also can contain solvent, be dissolved in the resin of solvent.At this, in such cases " photo-curable material " also can contain: it improves the resin of the degree of polymerization from body sensitization.Or the Photoepolymerizationinitiater initiater that also can contain resin and the curing of its resin is begun.
Certainly, state form on generation, " photo-curable material " of the present invention also can contain: produce the monomer of insoluble insulating resin, the Photoepolymerizationinitiater initiater that the photopolymerization of monomer whose is begun after the photopolymerization.But if monomer has the light functional group from body, then " photo-curable material " in such cases also can not comprise Photoepolymerizationinitiater initiater.
The manufacture method of the wiring substrate of the sandwich construction formation method of having utilized present embodiment is described below.
(E, manufacture method)
At first, UV cleaning base plate 10A surperficial S.Clean by UV, not only surperficial S is cleaned, and the liquid insulating material 7A that surperficial S will be narrated the back presents lyophily.Therefore, in the present embodiment, the surperficial S after UV cleans becomes above-mentioned portion and the coated portion of being ejected.
Secondly, shown in Fig. 4 (a), utilize droplet ejection apparatus 1, surperficial S comprehensively, form insulation material layer 7B.Particularly, at first, substrate 10A is positioned on the objective table 106 of droplet ejection apparatus 1.In that event, droplet ejection apparatus 1 two-dimensionally (being X-direction and Y direction) change the relative position of 118 couples of surperficial S of nozzle.Then, droplet ejection apparatus 1 to surperficial S, sprays the drop D of liquid insulating material 7A from nozzle 118 with institute's determining deviation.In that event, relate to the universe of surperficial S, a plurality of drop D bullets are fallen and moistening expansion with institute's determining deviation.Then, if the moistening expansion of a plurality of drop D that falls of bullet then can obtain the insulation material layer 7B of covering surfaces S.In addition, volume and the number of the drop D of the insulating material 7A that is ejected are set for: the thickness of the insulating barrier 7 that is obtained after the heating process that the back will be narrated approximately becomes 10 μ m.
In addition, insulation material layer 7B be there is no need to cover substrate 10A with belt like shape comprehensively, as long as cover for the sufficient scope of the substrate of the pattern (Fig. 5 (d)) that forms the conductive layer 8 that will narrate the back just passable.
At this, the nozzle 118 of the shower nozzle 114 of droplet ejection apparatus 1 also souvenir is " first nozzle ".
And, in the present embodiment, substrate 10A is " matrix 10B " with the also blanket souvenir of more than one layer that is located on the substrate 10A.
Form after the insulation material layer 7B,, make the insulation material layer 7B semi-solid preparation that is obtained and form insulation material layer 7B ' as Fig. 4 (b) with (c).Particularly, will have the light of ultraviolet region wavelength, between about 4 seconds, irradiation insulation material layer 7B and obtain insulation material layer 7B ' from light irradiation device 140.In the present embodiment, the light wavelength to insulation material layer 7B irradiation is 365nm.In addition, to the light wavelength of insulation material layer 7B irradiation corresponding to " first wavelength " of the present invention.
At this, so-called " insulation material layer " or " insulating material " semi-solid preparation is to mean: be included in insulation material layer " or the state of the photo-curable material of " insulating material " become the state between state during ejection and the full solidification state.In the present embodiment, such intermediateness is exactly above-mentioned " semi-cured state ".In addition, the state during so-called ejection is meant: the state with viscosity that the photo-curable material can spray from nozzle 118.
Then, shown in Fig. 4 (d), utilize droplet ejection apparatus 2, on the insulation material layer 7B ' of semi-cured state, form the pattern of conductive material layer 8B.Particularly, at first, substrate 10A is positioned on the objective table 106 of droplet ejection apparatus 2.In that event, droplet ejection apparatus 2 changes the relative position of 118 couples of insulation material layer 7B ' of nozzle two-dimensionally.Then, droplet ejection apparatus 2 arrives position corresponding to conductive material layer 8B pattern each time at nozzle 118, from the surface of nozzle 118 to insulation material layer 7B ', sprays the drop D of liquid conductive material 8A.In that event, in the position that should form conductive layer 8 (Fig. 5 (d)), a plurality of drop D bullets fall and moistening expansion.Then, if the moistening expansion of a plurality of drop D that falls of bullet then on insulation material layer 7B ', forms the pattern of conductive material layer 8B.In addition, volume and the number of the drop D of the insulation material layer 7B that is ejected are set for: the thickness of the conductive layer 8 that is obtained after the heating process that the back will be narrated approximately becomes 4 μ m.
At this, the nozzle 118 of the shower nozzle 114 of droplet ejection apparatus 2 also souvenir is " second nozzle ".
In addition, in the present embodiment, shown in Fig. 5 (a), the pattern of conductive material layer 8B comprises two band portions parallel to each other.Each of two band portions lays respectively on the part of insulating barrier 7 (Fig. 5 (d)) naturally.And the width separately of two band portions is about 50 μ m, and its length direction is the paper direction that extends in perpendicular to Fig. 5 (a).
Then, shown in Fig. 5 (a), utilize droplet ejection apparatus 3, form: the insulation material layer 9LB of covering insulating material layer 7B ' and conductive material layer 8B.Particularly, substrate 10A is positioned on the objective table 106 of droplet ejection apparatus 3.In that event, droplet ejection apparatus 3 changes the relative position of 118 couples of insulation material layer 7B ' of nozzle and conductive material layer 8B two-dimensionally.Then, droplet ejection apparatus 3, with specified period from the drop D of nozzle 118 to the liquid insulating material 9A of insulation material layer 7B ' and conductive material layer 8B ejection.In that event, relate to the universe of insulation material layer 7B ' and conductive material layer 8B, with institute's determining deviation, a plurality of drop D bullets fall and moistening expansion.Then, if the moistening expansion of a plurality of drop D that falls of bullet then obtains the insulation material layer 9LB of covering insulating material layer 7B ' and conductive material layer 8B.In addition, volume and the number of the drop D of the insulating material 9A that is ejected are set for: the thickness of the insulating barrier 9L that is obtained after the heating process that the back will be narrated approximately becomes 10 μ m.
At this, the nozzle 118 of the shower nozzle 114 of droplet ejection apparatus 3 also souvenir is " the 3rd nozzle ".
Form after the insulation material layer 9LB, shown in Fig. 5 (b), make the insulation material layer 9LB semi-solid preparation that is obtained, form insulation material layer 9LB '.Particularly, will have the light of ultraviolet region wavelength, between about 4 seconds, irradiation insulation material layer 9LB and obtain the insulation material layer 9LB ' of semi-cured state from light irradiation device 140.In the present embodiment, the light wavelength to insulation material layer 9LB irradiation is 365nm.At this, to the light wavelength of insulation material layer 9LB irradiation corresponding to " second wavelength " of the present invention.Like this, in the present embodiment, " first wavelength " is identical with " second wavelength ".But under the photo-curable material that is included in insulation material layer 7B and the different mutually situation of the photo-curable material that is included in insulation material layer 9LB, " first wavelength " and " second wavelength " is possible inequality.
The insulation material layer 9LB ' of acquisition semi-cured state shown in Fig. 5 (c), adds hot basal body 10B afterwards, gives heat Q.In the present embodiment, utilize to purify stove (clean oven), spend temperature 150, added hot basal body 10B in about 60 minutes.By this heating, the polymerization reaction of the resin of insulation material layer 7B ' and insulation material layer 9LB ' is further accelerated, and Ceng resin is cured separately.Its result, insulation material layer 7B ' and insulation material layer 9LB ' become insulating barrier 7 and insulating barrier 9 respectively.
And, when forming insulating barrier 7 and insulating barrier 9L, the silver particles sintering of conductive material 8B or melt deposited, so, can obtain conductive layer 8 from conductive material 8B.
By above-mentioned operation, shown in Fig. 5 (d), can obtain: by the insulating barrier 7 of covered substrate 10A, be positioned at position on the insulating barrier 7 conductive layer 8 pattern and cover the sandwich construction that the insulating barrier 9L of insulating barrier 7 and conductive layer 8 patterns is constituted.In the present embodiment, insulating barrier 7 and insulating barrier 9L are allyl resins, and conductive layer 8 is silver-colored distributions.In addition, the substrate 10A souvenir that is provided with conductive layer 8 is " wiring substrate 10 ".
According to present embodiment, heat insulation material layer 7B ', conductive material layer 8B and insulation material layer 9LB ' simultaneously.Therefore, constitute the resin of insulation material layer 7B ' and the resin of formation insulation material layer 9LB ', shrink simultaneously by polymerization reaction, so, on the interface between final insulating barrier that obtains 7 and the insulating barrier 9L, can residual stress.Therefore, can obtain, the impact or the thermally stable multilayer structure of outside at substrate 10A.
(execution mode 2)
The manufacture method of the wiring substrate of the sandwich construction formation method of having utilized execution mode 2 is described.Below, the formation identical to formation illustrated in the execution mode 1, attached with the reference marks identical with execution mode 1.
(F, manufacture method)
At first, UV cleaning base plate 10A surperficial S.Clean by UV, not only surperficial S is cleaned, and the liquid insulating material 7A that surperficial S will narrate the back presents lyophily.Therefore, in the present embodiment, the surperficial S after UV cleans becomes above-mentioned portion and the coated portion of being ejected.
Secondly, shown in Fig. 6 (a), utilize droplet ejection apparatus 1 surperficial S comprehensively, form insulation material layer 7B.Particularly, at first, substrate 10A is positioned on the objective table 106 of droplet ejection apparatus 1.In that event, droplet ejection apparatus 1 two-dimensionally (being X-direction and Y direction) change the relative position of 118 couples of surperficial S of nozzle.Then, droplet ejection apparatus 1 with specified period, to surperficial S, sprays the drop D of liquid insulating material 7A from nozzle 118 according to the first ejection data.In that event, relate to the universe of surperficial S, with institute's determining deviation, a plurality of drop D bullets fall and moistening expansion.Then, if the moistening expansion of a plurality of drop D that falls of bullet then can obtain the insulation material layer 7B of covering surfaces S.In addition, volume and the number of the drop D of the insulating material 7A that is ejected are set for: the thickness of the insulating barrier 7 that is obtained after the heating process that the back will be narrated (Fig. 6 (c)) approximately becomes 10 μ m.
In addition, Fig. 6 is the YZ section of expression substrate 10A.So-called YZ section is meant: both be parallel to the plane that above-mentioned Y-axis side also is parallel to Z-direction.And, in the present embodiment, substrate 10A is " matrix 10B " with the also blanket souvenir of more than one layer that is located on the substrate 10A.
Then, as Fig. 6 (b) with (c), solidify the insulation material layer 7B obtained and form insulating barrier 7.Particularly, will have the light of ultraviolet region wavelength, between about 60 seconds, irradiation insulation material layer 7B and obtain insulating barrier 7 from light irradiation device 140.In the present embodiment, the light wavelength to insulation material layer 7B irradiation is 365nm.
Like this, the pattern (Fig. 6 (d)) of the conductive material layer 8B that the formation back will be narrated solidifies the insulation material layer 7B that it becomes substrate before, so, in the pattern of conductive material layer 8B, can not produce broken string.
Then, shown in Fig. 6 (d), utilize droplet ejection apparatus 2, on insulating barrier 7, form the pattern of conductive material layer 8B.Particularly, at first, substrate 10A is positioned on the objective table 106 of droplet ejection apparatus 2.In that event, droplet ejection apparatus 2 changes the relative position of 118 pairs of insulating barriers 7 of nozzle two-dimensionally.Then, droplet ejection apparatus 2 is according to the second ejection data, in nozzle 118 every positions that reach corresponding to conductive material layer 8B pattern, from the drop D of nozzle 118 to the liquid conductive material 8A of the surface of insulating barrier 7 ejection.In that event, a plurality of drop D bullets drop on the insulating barrier 7 and moistening expansion.Then, if the moistening expansion of a plurality of drop D that falls of bullet on insulating barrier 7, forms the pattern of conductive material layer 8B.In addition, volume and the number of the drop D of the conductive material 8A that is ejected are set for: the thickness of the conductive layer 8 that is obtained after the heating process that the back will be narrated (Fig. 7 (b)) approximately becomes 4 μ m.
At this, the surface of insulating barrier 7 is an example of " body surface " of the present invention.
Then, shown in Fig. 7 (a), the pattern of activate conductive material layer 8B, the pattern of the conductive layer 8 shown in formation Fig. 7 (b).Particularly, utilize to purify stove,, burnt till the pattern of (heating) conductive material layer 8B in 30 minutes 150 ℃ of temperature.In that event, the silver particles of conductive material layer 8B is sintered or melts depositedly, obtains the pattern of conductive layer 8.In the present embodiment, the pattern table with conductive layer 8 is designated as " Wiring pattern 25 (or conductive pattern) ".In addition, Fig. 7 (a) and (b) be the YZ section of expression matrix 10B.So-called YZ section is the plane that not only had been parallel to above-mentioned Y direction but also had been parallel to Z-direction.
Like this, in the present embodiment, at the insulating pattern 11 (back will be narrated) that insulating barrier 7 is set and covers Wiring pattern 25 before, burn till conductive material layer 8B in advance and form conductive layer 8.In that event, more can reduce the stress that the cure shrinkage by insulating pattern 11 causes, and the possibility of conductive layer 8 distortion.This is because the adhesion strength between insulating barrier 7 and the conductive layer 8 is stronger than the adhesion strength between insulating barrier 7 and the conductive material layer 8B (conductive layer 8 before the activate).
And Wiring pattern 25 is the positions that are positioned on the insulating barrier 7 that is made of allyl resin.By the insulating barrier 7 that allyl resin constituted, play and connect airtight the substrate 10A that constitutes by polyimides and function by the Wiring pattern 25 that silver constituted.So the Wiring pattern 25 of present embodiment is difficult for peeling off.
Shown in Fig. 7 (c), Wiring pattern 25 comprises: distribution 25A, distribution 25B, distribution 25C.Distribution 25A, 25B, 25C have belt like shape.The width separately of these distributions 25A, 25B, 25C is about 50 μ m.More specifically, these distributions 25A, 25B, 25C lay respectively on the part of insulating barrier 7 of so-called " full film ".That is, these distributions 25A, 25B, 25C are positioned on the Surface L 1 of same level almost.But, all physical property separation mutually on Surface L 1 of any two distributions among these distributions 25A, 25B, the 25C.In addition, by the operation that the back will be narrated, be the distribution that be electrically connected mutually between distribution 25A and the distribution 25B.On the other hand, distribution 25C be should and distribution 25A and distribution 25B between be the distribution of insulation.In addition, Fig. 7 (c) is the XY plane of expression matrix 10B.So-called XY plane is the plane that not only had been parallel to X-direction but also had been parallel to Y direction.
In the present embodiment, on distribution 25A, be provided with binding post and form regional 18A, on distribution 25B, be provided with binding post and form regional 18B.So-called binding post forms the position that conductive connector will be set after regional 18A, 18B are.In addition, basal region 19A is positioned to surround binding post forms the form of regional 18A, and basal region 19B is positioned to surround the position that binding post forms the form of regional 18B.
Then, shown in Fig. 8 (a), utilize droplet ejection apparatus 3, insulating material pattern 9B is set on basal region 19A, 19B.
Particularly, substrate 10A is positioned on the objective table 106 of droplet ejection apparatus 3.In that event, droplet ejection apparatus 3 two-dimensionally (being X-direction and Y direction) change the relative position of 118 couples of matrix 10B of nozzle.Then, droplet ejection apparatus 3 when nozzle 118 whenever reaches corresponding to basal region 19A, 19B, from nozzle 118 basad regional 19A, 19B, sprays the drop D of liquid insulating material 9A according to the 3rd ejection data.In that event, on basal region 19A, 19B, a plurality of drop D bullets fall and moistening expansion.Then, if the moistening expansion of a plurality of drop D that falls of bullet then forms insulating material pattern 9B on basal region 19A, 19B.
At this, basal region 19A, 19B are the surfaces on the Wiring pattern 25 that is made of silver, and therefore, basal region 19A, 19B present lyophobicity to insulating material 9A.Therefore, to drop on the degree of the moistening expansion of drop D of insulating material 9A of basal region 19A, 19B little for bullet.Therefore, basal region 19A, 19B are suitable for ink-jet method moulding via hole.
Then, as Fig. 8 (b) with (c), make the insulating material pattern 9B semi-solid preparation that is obtained and form insulating material pattern 9B '.Particularly, will have the light of ultraviolet region wavelength, between about 4 seconds, irradiation insulating material mould 9B and obtain insulating material pattern 9B ' from light irradiation device 140.In the present embodiment, the light wavelength to insulating material pattern 9B irradiation is 365nm.And the inboard of two insulating material pattern 9B ' becomes via hole 40A, 40B respectively.Promptly two insulating material pattern 9B ' are respectively with via hole 40A, 40B fringing.In addition, be radiated at the light wavelength of insulating material pattern 9B corresponding to " first wavelength " of the present invention.
At this, the semi-solid preparation of so-called " insulating material pattern " or " insulating material " is to mean: be included in the state of the photo-curable material in " insulating material pattern " or " insulating material ", state when becoming ejection and because the state between the solid state on the reality that rayed causes.In the present embodiment, such intermediateness is exactly above-mentioned " semi-cured state ".In addition, the state during so-called ejection is meant: the state with viscosity that the photo-curable material can spray from nozzle 118.
Then, shown in Fig. 8 (d), make basal region 20 lyophilyizations.At this, so-called basal region 20 is meant: with basal region 19A, when 19B engages, surround the zone of basal region 19A, 19B.Perhaps, basal region 20 is neither basal region 19A, 19B neither binding post form the surface of regional 18A, 18B.In the present embodiment, basal region 20 is that part institute by the surface of the part on the surface of Wiring pattern 25 and insulating barrier 7 is constituted.
Make under the situation of basal region 20 lyophilyizations, particularly, the light of second wavelength that will be different, about 60 seconds, basad regional 20 surperficial uniform irradiation with above-mentioned first wavelength.In that event, become the liquid insulating material 11A (Fig. 9 (a)) that will narrate as the surface of the insulating barrier 7 of the part of basal region 20 and present lyophily the back.In addition, in the present embodiment, second wavelength is 172nm.
In addition, be " contact angle " as one of index of representing the lyophily degree.In the present embodiment, the drop D of insulating material 11A contact under the situation on the surface of the insulating barrier 7 of lyophilyization, the angle that the surface constituted of drop D and insulating barrier 7 be 20 spend below.
Make the reasons are as follows of surperficial lyophilyization of insulating barrier 7.If through in order to the curing process that obtains insulating barrier 7 or through burning till (heating) operation in order to what obtain Wiring pattern 25, then the surface of insulating barrier 7 becomes, and liquid insulating material 11A is presented lyophobicity.At this, body surface presents under the situation of lyophobicity, and relating to wide area, to form uniform layer be difficult.In contrast, in the present embodiment, insulating barrier 7 surfaces become lyophilyization behind firing process, so the degree of the moistening expansion of insulating material 11A (lyophily degree) relates to insulating barrier 7 surfaces and becomes big once again.Therefore, relate on the insulating barrier 7, can form the insulating pattern 11 that has an even surface.
Then, utilize droplet ejection apparatus 4, on basal region 20, form insulating material pattern 11B.Shown in Fig. 9 (a), particularly, at first, substrate 10A is positioned on the objective table 106 of droplet ejection apparatus 4.In that event, droplet ejection apparatus 4 changes the relative position of nozzle 118 basal regions 20 two-dimensionally.Then, droplet ejection apparatus 4 is according to the 4th ejection data, in nozzle 118 every positions that reach corresponding to insulating material pattern 11B, from the drop D of nozzle 118 to the liquid insulating material 11A of the surface of the surface of insulating barrier 7 or Wiring pattern 25 ejection.In that event, a plurality of drop D bullets drop on basal region 20 and moistening expansion.Then, if the moistening expansion of a plurality of drop D that falls of bullet then on the insulating barrier 7 or on the Wiring pattern 25, forms insulating material pattern 11B.That is, obtain to surround the insulating material pattern 11B of insulating material pattern 9B '.
As mentioned above, the surface of insulating barrier 7 is because the lyophily chemical industry preface of front presents the lyophily to liquid insulating material 11A.Therefore, bullet drop on the drop D of insulating material 11A on the surface of insulating barrier 7 can even moistening expansion on these surfaces.In addition, the volume of the drop D that is ejected and number are configured in the 4th ejection data, so that insulating material pattern 11B can absorb by insulating barrier 7 and the Wiring pattern 25 formed jumps (highly about 4 μ m) that are positioned on the insulating barrier 7.Therefore, the surface of the insulating pattern 11 that is obtained behind the curing process that the back will be narrated relates to insulating pattern 11 and becomes smooth.
Then, as Fig. 9 (b) with (c), with the insulating material pattern 11B semi-solid preparation that obtained and form insulating material pattern 11B '.Particularly, will have the light of ultraviolet region wavelength, between about 4 seconds, irradiation insulating material pattern 11B and obtain insulating material pattern 11B ' from light irradiation device 140.In the present embodiment, the light wavelength to insulating material pattern 11B irradiation is 365nm.At this, to the light wavelength of insulating material pattern 11B irradiation corresponding to " three-wavelength " of the present invention.Like this, in the present embodiment, above-mentioned " first wavelength " is identical mutually with " three-wavelength ".But under the photo-curable material that is included in insulating material pattern 9B and the different mutually situation of the photo-curable material that is included in insulating material pattern 11B, " first wavelength " can be different with " three-wavelength ".In addition, also can omit the operation of semi-solid preparation insulating material pattern 11B.
The insulating material pattern 11B ' of acquisition semi-cured state shown in Fig. 9 (c), adds hot basal body 10B afterwards, gives heat Q '.In the present embodiment, utilize to purify stove, spend temperature 150, added hot basal body 10B in about 60 minutes.By this heating, the polymerization reaction of the resin of insulating material pattern 9B ', 11B ' is further accelerated, and Ceng resin almost completely solidifies separately.Its result, insulating material pattern 9B ' and insulating material pattern 11B ' become insulating pattern 9 and insulating pattern 11 respectively.
As mentioned above, basal region 19A, 19B are connected with basal region 20, so insulating pattern 11 also is connected on the insulating pattern 9.And the thickness of insulating pattern 9 is about 10 μ m on insulating barrier 7, is about 6 μ m on Wiring pattern 25.In addition, set for by the ejection scanning of the drop D of droplet ejection apparatus 4: the surface of the surface of insulating pattern 9 and insulating pattern 11 constitutes the Surface L 3 of par.
As above-mentioned illustrated, in the present embodiment, add heat insulator pattern 9B ' and insulating material pattern 11B ' simultaneously.I.e. two insulating material patterns of thermal polymerization simultaneously.Therefore, because by polymerization reaction, constitute the resin of insulating material pattern 9B ' and the resin of formation insulating material pattern 11B ' and shrink simultaneously, so, interface between final insulating material pattern 9B that obtains and insulating material pattern 11B can residual stress.Therefore, on substrate 10A, can obtain impact and thermally stable multilayer structure to the outside.
After forming insulating pattern 11, shown in Fig. 9 (d), utilize droplet ejection apparatus 5, be full of via hole 40A, 40B with insulating pattern 9 fringings with conductive material 15A.
Particularly, at first droplet ejection apparatus 5, change the relative position of 118 couples of matrix 10B of nozzle two-dimensionally.Then, nozzle 118 every reaching under its situation corresponding to the position of via hole 40A, 40B, droplet ejection apparatus 5 is the drop D from nozzle 118 ejection conductive material 15A.The drop D bullet of the conductive material 15A that is ejected drops on the pattern (Wiring pattern 25) of the conductive layer 8 that is exposed by via hole 40A, 40B.Then, by falling (spray) in via hole 40A, 40B for being full of the sufficient drop D bullet of via hole 40A, 40B institute, shown in Fig. 9 (d), via hole 40A, 40B are full of by conductive material 15A.
Secondly, utilize the drop D of droplet ejection apparatus 5 ejection conductive material 15A once again, on insulating pattern 9,11, form: the conductive material pattern 15B that links two via hole 40A, 40B.
Then, make via hole 40A, 40B interior conductive material 15A and conductive material pattern 15B activate.In the present embodiment, shown in Figure 10 (a), give heat Q and heat, sintering or melt the particulate of the silver that applies conductive material 15A.Particularly, utilize to purify stove, spend temperature 150, added hot basal body 10B in 30 minutes.The result of such activate shown in Figure 10 (b), can obtain: be connected it and lay respectively at two via hole 40A, 40B interior conductive connector 41A, 41B and the Wiring pattern 15 of conductive connector 41A, 41B.
By conductive connector 41A, 41B and Wiring pattern 15, as being mutual the electrical connection between the distribution 25A of the part of Wiring pattern 25 and the distribution 25C.On the other hand, both distribution 25A was also become electric insulation to distribution 25C as the distribution 25B of the part of Wiring pattern 25.
Then, though the diagram of omission makes the surface of insulating pattern 9,11 and the surperficial lyophilyization of Wiring pattern 15.Particularly, with the light of above-mentioned second wavelength, about 60 seconds uniform irradiations are on the surface of matrix 10B.In that event, the surface of the surface of insulating pattern 9,11 and Wiring pattern 15 becomes liquid insulating material 17A (Fig. 1) is presented lyophily.As mentioned above, second wavelength is 172nm.
Thereafter, the ejection operation of the liquid insulating material 17A by utilizing droplet ejection apparatus 6 (omitting diagram) forms the insulation material layer 17B that covers insulating pattern 9,11 and Wiring pattern 15.
Then, make edge material layer 17B be solidified to form insulating barrier 17.Particularly, from the light with first wavelength of light irradiation device 140, between about 60 seconds, shine insulation material layer 17B and obtain insulating barrier 17 with ultraviolet region.In the present embodiment, first wavelength is 365nm.Insulating barrier 17 is so-called full films.
, with purification stove add hot basal body 10B, carry out the polymerization reaction of the polymer of insulating barrier 17 fully thereafter.Through above operation, obtain the wiring substrate 10 shown in Figure 10 (c) from matrix 10B.
(G, installation procedure)
Then, as shown in figure 11, liquid crystal board 32 and semiconductor element 26 are installed on wiring substrate 10.Particularly, form on the part of wiring substrate 10: the pattern of conductive layer 8 both be not insulated pattern 9,11 and had covered the part that yet is not insulated layer 17 covering.Then, on the pattern of the conductive layer 8 that is exposed, suitably engage pairing liner of liquid crystal panel or semiconductor element 26 pairing liners.Like this, obtain liquid crystal indicator 34.Like this, the manufacture method of present embodiment can be applied in the manufacturing of liquid crystal indicator 34.In addition, in the present embodiment, semiconductor element 26 is liquid crystal display drive circuits.
And the manufacture method of present embodiment not only is applied to also can be applied to all electro-optical devices in the manufacturing of liquid crystal indicator.Said here " electro-optical device " is the change of optical property (so-called electrooptics effect) of the variation that is not limited to birefringence, the variation of optical activity or the variation of light scattering etc., but means corresponding with signal voltage and penetrate whole aspects of the device of light, luminous, infiltration or reflection.
Particularly, so-called electro-optical device is meant: the term of liquid crystal indicator, el display device, plasm display device, the display (SED:Surface-Conduction Electron-Display surface conductance electronic console) that utilizes surface conductive type electron-emitting device, electric field transmitted display (FED:Field Emission Display Field Emission Display) etc.
And the sandwich construction formation method of present embodiment can be applied to the manufacture method of all electronic instruments.For example, the manufacture method of present embodiment can be applied to have the manufacture method of the mobile phone 500 of electro-optical device 520 as shown in figure 12, also can be applied to have home computer's 600 as shown in figure 12 manufacture method.
In addition, being used in the wiring substrate 10 of above-mentioned electro-optical device or electronic instrument, is the wiring substrate 10 that the wiring substrate 10 of the 3rd execution mode that will narrate with the wiring substrate 10 or the back of execution mode 1 substitutes present embodiment.
(execution mode 3)
The sandwich construction formation method of present embodiment except the formation method of insulating pattern 11 and the sandwich construction formation method of execution mode 2 basic identical.Therefore, to avoid the repetition purpose, to omitting its explanation with the operation or the same part of structure of execution mode 2.
At first, illustrated as enforcement mode 2, on basal region 19A, the 19B on the Wiring pattern 25, the insulating material pattern 9B ' (Fig. 8 (a)～(c)) of semi-cured state is set., carry out basad regional 20 rayed, make the surperficial lyophilyization (Fig. 8 (d)) of insulating barrier 7 thereafter.Then, be the form of carrying out in order to the ejection operation that forms insulating pattern to smooth total surface, carry out following operation.
Shown in Figure 14 (a), utilize ejection operation and semi-solid preparation operation, as on the insulating barrier 7 but be not the part of Wiring pattern 25, the insulating material pattern 51B ' of semi-cured state is set.The thickness setting of insulating material pattern 51B ' is identical with the thickness of Wiring pattern 25, so the jump that is produced by Wiring pattern 25 becomes nothing.That is, Wiring pattern 25 and insulating material pattern 51B ' form the Surface L 2 of level much at one.
And, utilizing ejection operation and semi-solid preparation operation, the insulating material pattern 9B ' that both do not have in Surface L 2 does not have the part of via hole 40A, 40B yet, and the insulating material pattern 52B ' of semi-cured state is set.Thus, shown in Figure 14 (b), obtain to surround the insulating material pattern 52B ' of insulating material pattern 9B '.At this, the insulating material pattern 51B ' of basalis is a semi-cured state, and therefore, the surface of insulating material pattern 51B ' presents lyophily to the drop D that forms insulating material pattern 52B '.So, because the surface of insulating material pattern 51B ' is a lyophily, so, on insulating material pattern 51B ', utilize the ejection operation, uniform insulating material pattern 52B ' is set easily.
The thickness setting of insulating material pattern 52B ' is identical with the thickness of insulating material pattern 9B ', so insulating material pattern 52B ' and insulating material pattern 9B ' form the Surface L 3 of level much at one.
Then, shown in Figure 14 (b), add hot basal body 10B, give heat Q '.In the present embodiment, utilize to purify stove, spend temperature 150, added hot basal body 10B in about 60 minutes.By this heating, the polymerization reaction of the resin of insulating material pattern 9B ', 51B ', 52B ' is further accelerated, and the resin of pattern almost completely solidifies separately.Its result, shown in Figure 14 (c), insulating material pattern 9B ', insulating material pattern 51B ' and insulating material pattern 52B ' become insulating material pattern 9, insulating material pattern 51 and insulating material pattern 52 respectively.
Be later on, carry out the operation same, can form wiring substrate 10 with execution mode 2.
The insulating material pattern 51 of present embodiment and insulating material pattern 52 are the insulating patterns 11 corresponding to execution mode 2.Like this, in the present embodiment, form the suitable part of insulating pattern 11 of execution mode 2 through repeatedly " ejection form ".So-called " ejection forms " is the formation that means with the patterns of material of ejection operation in a broad sense, is narrowly to mean the formation of the patterns of material of utilizing the ejection operation and with the combination of the semi-solid preparation of the patterns of material of semi-solid preparation operation.
If carry out such operation, always can form insulating pattern on the smooth surface.Therefore, even the thickness of Wiring pattern 25 is under the thick situation, the side that also can wrap Wiring pattern 25 well with insulating pattern
(variation 1)
According to execution mode 1,2,3, droplet ejection apparatus 1,2,3,4,5,6 sprays insulating material 7A, conductive material 8A, insulating material 9A, insulating material 11A, conductive material 15A, insulating material 17A respectively.Can utilize a droplet ejection apparatus (for example, droplet ejection apparatus 1) ejection two kinds mutual different " liquid materials " to substitute such formation.In such cases, these two or more " liquid materials " can be that the different nozzle 118 by droplet ejection apparatus 1 sprays, and also can be that a nozzle 118 by droplet ejection apparatus 1 sprays.Nozzle 118 sprays under the situation of two kinds of mutual different " liquid materials ", during conversion " liquid material ", as long as additional operation of cleaning from chest 101 to nozzle 119 path just can.
At this, spray from a nozzle 118 under the situation of two kinds of mutual different " liquid materials ", illustrated " first nozzle ", " second nozzle " and " the 3rd nozzle " are corresponding to a nozzle 118 in the execution mode 1.
(variation 2)
According to execution mode 1,2,3, on the substrate 10A that polyimides constituted, sandwich construction is set.Yet ceramic substrate, glass substrate, epoxy resin base plate, glass epoxy resin substrate substitute such substrate 10A, even or utilize silicon substrate, can obtain effect same effect illustrated in the above-mentioned execution mode.
(variation 3)
The nano particle that in conductive material 8A, the 15A of execution mode 1,2,3, is comprising silver.Yet, can substitute silver-colored nano particle with the nano particle of other metals.At this,, for example can utilize any one in gold, platinum, copper, palladium, rhodium, osmium, ruthenium, iridium, iron, tin, zinc, cobalt, nickel, chromium, titanium, tantalum, tungsten, the indium as other metals.Maybe can utilize the alloy of any two or more combinations.But, if silver then can reduce in low temperature, so handle easily.In this, utilize under the situation of droplet ejection apparatus, preferably utilize, comprise conductive material 8A, the 15A of the nano particle of silver.
In addition, conductive material 8A, 15A also can comprise the nano particle that organo-metallic compound comes alternative metals.Be meant at this said organo-metallic compound: by thermal decomposition, the compound of precipitating metal.Have at such organic compound: chlorine triethyl phosphine gold (I), chlorine trimethyl-phosphine gold (I), chlorine triphenylphosphine gold (I), silver (I) 2,4-diamyl thiosulfate complex, trimethyl-phosphine (hexafluoro acetoacetyl salt) silver (I) complex, copper (I) hexafluoro penta thiosulfate octadiene complex etc.
Like this, the form that is included in the metal of liquid conductive material 8A, 15A can be that nano particle is the particle shape of representative, also can be the form as organic compound.
And the soluble material that conductive material 8A, 15A also can comprise the high score subclass of polyaniline, polythiophene, polyphenylene vinylene etc. replaces metal.
(variation 4)
In execution mode 1,2,3, as mentioned above, the nano particle of the silver of conductive material 8A, 15A is to be covered by the coating agent of organic substance etc.Known as such coating agent: amine, ethanol, mercaptan etc.More specifically, have as coating agent: the amines of 2-methyl aminoethanol, diethanol amine, diethylmethyl amine, 2-dimethylamino-ethanol, methyl diethanolamine etc., alkyl amine, ethylenediamine, alkyl alcohol class, ethylene glycol, propylene glycol, alkyl sulfide alcohols, dithioglycol etc.The nano particle of the silver of coated dose of lining is a stable dispersion more in decentralized medium.
(variation 5)
According to execution mode 1,2,3, " the first photo-curable material " of the present invention is identical with " the second photo-curable material ".Yet, be not limited to such form." the first photo-curable material " promptly of the present invention can be different with " the second photo-curable material ".For example, according to execution mode 2,3, insulating barrier 7 and insulating pattern the 9,11,51, the 52nd are made of identical materials, but also can be to be made of mutual different material, to substitute such formation.Particularly, insulating barrier 7 is that third rare resin, insulating pattern 9,11 can be polyimide resin.In such cases, insulating material 7A is for containing photonasty third rare resin (photoresist of third rare class) or contain the liquid material of monomer whose/polymer, and insulating material 9A, 11A are that to contain the liquid material of photosensitive polyimides precursor just passable.The insulating barrier 7 of execution mode 1 and the relation between the insulating barrier 9L also can with above-mentioned same change.Like this, " the first photo-curable material " of the present invention and " the second photo-curable material " can be inequality.
(variation 6)
According to execution mode 1, on insulating barrier 7, form conductive layer 8.Yet sandwich construction formation method of the present invention is not limited to the formation of such structure.Particularly, also can omit conductive layer 8 on the insulating barrier 7.In addition, can reuse also that droplet ejection apparatus forms the operation of insulation material layer separately and the operation of the semi-solid preparation of the insulation material layer that formed, so that the total of the thickness of stacked a plurality of insulating barriers becomes desired value.In such cases, solidify a plurality of insulation material layers as long as heat final the time, then same with execution mode 1, can obtain impact and heat-staple wiring substrate to the outside.
(variation 7)
According to execution mode 2,3, the light of the wavelength in irradiating ultraviolet light zone makes the lyophilyization on the surface of insulating barrier 7 and insulating pattern 9,11 surfaces.Yet, in the atmospheric environment with oxygen as the O that handles gas
2Plasma treatment replace above-mentioned lyophilyization, also can make the surface and insulating pattern 9, the 11 surperficial lyophilyizations of insulating barrier 7.O
2Plasma treatment be processing from the oxygen that omits illustrated plasma discharge electrode pair substrate 10A (matrix 10B) irradiation plasmoid.O
2Plasma process conditions be plasma power be 50～1000W, oxygen flow be the relative moving speed of 50～100mL/min, matrix 10B article on plasma body sparking electrode be 0.5～10mm/sec, substrate temperature be 70～90 ℃ just passable.
(variation 8)
According to execution mode 1,2,3, insulating barrier 7 utilizes ink-jet method to form.Particularly, insulation material layer 7B utilizes droplet ejection apparatus 1 to form.Yet, also can additive method substitute ink-jet method and form insulating barrier 7.For example, also can utilize the print process of stencil printing or photographic printing method etc. to form.
(variation 9)
According to execution mode 1, insulating barrier 7 and insulating barrier 9L utilize ink-jet method to form.Particularly, utilize droplet ejection apparatus 1,3 to form insulating barrier 7 and insulating barrier 9L respectively.Yet, also can substitute ink-jet method and form insulating barrier 7 and insulating barrier 9L with additive method.For example, also can utilize the print process of stencil printing or photographic printing method etc. to form.
(variation 10)
In execution mode 2,3, Wiring pattern 25 can be formed on the substrate 10A.And Wiring pattern 25 can be the Wiring pattern of gold (Au).Substrate 10A goes up even Wiring pattern 25 is formed on, Wiring pattern 25 substitutes formation of silver (Ag) for gold (Au), as long as carry out the sandwich construction formation method of above-mentioned execution mode, just can obtain with above-mentioned execution mode in illustrated effect same.
Claims (12)
1, a kind of sandwich construction formation method is characterized in that, comprising:
On substrate, form, comprise the step (A) of first insulation material layer of the first photo-curable material;
Shine the light of first wavelength to described first insulation material layer, make the step (B) of the described first insulation material layer semi-solid preparation;
From the nozzle of droplet ejection apparatus, first insulation material layer ejection conductive material drop to described semi-solid preparation on first insulation material layer of described semi-solid preparation, forms the step (C) of conductive material layer;
With first insulation material layer that covers described semi-solid preparation and the form of described conductive material layer, form the step (D) of second insulation material layer that comprises the second photo-curable material;
Heat described first insulation material layer, described conductive material layer and described second insulation material layer simultaneously, form first insulating barrier, be positioned at position on described first insulating barrier conductive layer, cover the step (E) of second insulating barrier of described first insulating barrier and described conductive layer.
2, according to the described sandwich construction of described claim 1 formation method, it is characterized in that, also comprise:
Between described step (D) and step (E), shine the light of second wavelength to described second insulation material layer, so that the step of the described second insulation material layer semi-solid preparation (F).
3, a kind of manufacture method of wiring substrate is characterized in that:
Claim 1 or 2 described sandwich construction formation methods have been comprised.
4, a kind of manufacture method of electronic instrument is characterized in that:
The manufacture method that has comprised the described wiring substrate of claim 3.
5, a kind of sandwich construction formation method is characterized in that, comprising:
On substrate, form the step (A) of first insulation material layer that comprises the first photo-curable material;
Shine the light of first wavelength to described first insulation material layer, make the step (B) of the described first insulation material layer semi-solid preparation;
With the form of first insulation material layer that covers described semi-solid preparation, form the step (C) of second insulation material layer that comprises the second photo-curable material;
Heat described first insulation material layer, described second insulation material layer simultaneously, form first insulating barrier and cover the step (D) of second insulating barrier of described first insulating barrier.
6, a kind of sandwich construction formation method of utilizing droplet ejection apparatus is characterized in that, comprising:
Ejection comprises the drop of first insulating material of the first photo-curable material, on Wiring pattern, forms the step (A) with the first insulating material pattern of via hole fringing;
To the light of the described first insulating material patterned illumination, first wavelength, make the step (B) of the described first insulating material pattern semi-solid preparation;
Ejection comprises the drop of second insulating material of the second photo-curable material, forms to be connected the step (C) of the second insulating material pattern of described first insulating pattern of semi-solid preparation;
Heat the described first insulating material pattern and the described second insulating material pattern of semi-solid preparation simultaneously, and the step that is cured (D).
7, sandwich construction formation method according to claim 6 is characterized in that, also comprises:
Between described step (C) and step (D), to the light of the described second insulating material patterned illumination, second wavelength, so that the step (E) of the described second insulating material pattern semi-solid preparation.
8, according to claim 6 or 7 described sandwich construction formation methods, it is characterized in that:
Described Wiring pattern is the Wiring pattern of the gold that forms on the substrate.
9, according to claim 6 or 7 described sandwich construction formation methods, it is characterized in that, also comprise:
The drop of ejection conductive material, the step (F) of the described conductive material pattern of formation on body surface; With
Make the pattern activate of described conductive material and form the step (G) of described Wiring pattern.
10, sandwich construction formation method according to claim 9 is characterized in that:
Described step (F) is the step that ejection comprises the drop of silver;
Described Wiring pattern is the Wiring pattern of described silver.
11, a kind of manufacture method of wiring substrate is characterized in that:
Comprised the described arbitrary sandwich construction formation method of claim 6 to 10.
12, a kind of manufacture method of electronic instrument is characterized in that:
Comprised the described arbitrary sandwich construction formation method of claim 6 to 10.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004240939 | 2004-08-20 | ||
| JP2004240939 | 2004-08-20 | ||
| JP2004278994 | 2004-09-27 | ||
| JP2005182752 | 2005-06-23 |
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| CN1738517A true CN1738517A (en) | 2006-02-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510091991 Pending CN1738517A (en) | 2004-08-20 | 2005-08-15 | Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatus |
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| Country | Link |
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| CN (1) | CN1738517A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104345549A (en) * | 2013-08-09 | 2015-02-11 | 住友重机械工业株式会社 | Substrate manufacturing method and substrate manufacuturing apparatus |
| CN103828495B (en) * | 2011-09-30 | 2016-12-28 | 名幸电子有限公司 | Manufacture of substrates |
| CN112533761A (en) * | 2018-08-20 | 2021-03-19 | 株式会社斯库林集团 | Printing method and printing apparatus |
-
2005
- 2005-08-15 CN CN 200510091991 patent/CN1738517A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103828495B (en) * | 2011-09-30 | 2016-12-28 | 名幸电子有限公司 | Manufacture of substrates |
| CN104345549A (en) * | 2013-08-09 | 2015-02-11 | 住友重机械工业株式会社 | Substrate manufacturing method and substrate manufacuturing apparatus |
| CN104345549B (en) * | 2013-08-09 | 2019-04-16 | 住友重机械工业株式会社 | Manufacture of substrates and apparatus for manufacturing substrate |
| CN112533761A (en) * | 2018-08-20 | 2021-03-19 | 株式会社斯库林集团 | Printing method and printing apparatus |
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