WO2010020116A1

WO2010020116A1 - High power led lamp with candle-shape

Info

Publication number: WO2010020116A1
Application number: PCT/CN2009/070477
Authority: WO
Inventors: 曹殿生; 朱火生; 耿立建; 刘培栽; 杨荣平
Original assignee: 鑫谷光电股份有限公司
Priority date: 2008-08-19
Filing date: 2009-02-19
Publication date: 2010-02-25

Abstract

A high-power LED lamp with candle-shape comprises a high-power LED light source (2) consisted of a high-power LED, a driving circuit, a heat sink (3) provided with a connecting unit on its upper end for LED light source, a lamp cap (5), a base (4), and a lamp shade (1). The heat sink (3) is supported on top of the base (4) and the lamp cap (5) is connected to the bottom of the base (4). The LED light source (2) is screwed on the heat sink (3), the anode and cathode thereof are electrically connected to the driving circuit. The LED light source (2) and the heat sink (3) are both enclosed within the lamp shade (1), or the LED light source (2) is individually enclosed within the lamp shade (1).

Description

High-power LED candle light technology

The present invention relates to a candle lamp for use as a decorative light source (Candelabra), and more particularly to a new type of high power LED candle lamp.

Background technique

The traditional Candelabra decorative light source is generally an ordinary incandescent lamp, which has the following disadvantages:

1. The lamp has a large heat and its life is short;

2. The photoelectric efficiency is relatively low, the power consumption is large, the energy is not saved, and the environment is not environmentally friendly.

LED light source is an emerging semiconductor lighting source, low voltage use, small size, safe and controllable, with high luminous efficiency; such as high-power LED light source to replace the light source used in traditional decorative light source will be better and broader Prospects: Long LED life, up to 30,000-50,000 hours; Low-voltage DC drive, safe and controllable; High photoelectric output efficiency, can reach 80LM/W; Plus LED itself does not need to use environmentally harmful metal mercury, more Environmental protection. Due to the various superior characteristics of LED light sources, it has been developed for use as a lighting and decorative light source. In the future, the use of LED light sources for lighting and decorative light sources will be an optimistic development direction.

However, the brightness of the high-power LED light source needs to be improved and the cost is still to be reduced.

Summary of the invention

The object of the present invention is to provide a new high-power LED candle lamp with environmental protection, energy saving and long life. The novel structure design can effectively improve the brightness of the light, the heat dissipation capability of the LED and the seismic strength, and the illumination is more uniform and the brightness is higher.

To achieve the above object, the present invention adopts the following design scheme:

A novel high-power LED candle lamp is composed of an LED lamp source and a driving circuit thereof, and the LED lamp source is composed of a multi-chip high-power LED.

It also includes:

a heat sink, the upper end is provided with an LED light source connection unit; a lamp head;

a base having a support heat sink assembly on the upper portion and a lower portion connected to the lamp cap;

The LED light source is screwed on the heat sink, and the two poles are electrically connected to the corresponding control end of the driving circuit board; the LED light source and the heat sink are simultaneously covered in the lamp cover, or the LED light source is separately covered in the lamp cover.

The LED light source comprises an illumination light source shell composed of an outer surface and an inner surface and a base body provided for electrically connecting with an external power source, the housing has a support body inside, and at least one heat dissipating device is mounted on the support body, At least one LED semiconductor device is mounted on each heat sink of the heat sink, and each LED semiconductor device is electrically connected to each other through an electrical connection point, and the positive and negative poles of the combined body are connected to the positive and negative points of the base through the power line.

The positive and negative electrodes of the combined semiconductor device may be connected to the positive and negative points of the substrate through a power line disposed at an electrical connection point on the heat sink.

The heat dissipation design of the high-power LED candle lamp of the invention is mainly realized by a heat sink of metal material, which can ensure that the LED works at a constant temperature.

The circuit input is 80~240VAC, and the constant current output drives the high-power LED, making it stable and no stroboscopic. The base can be made of American UL approved plastic material, flame retardant, safe, and other flame retardant materials.

The high power LED candle lamp (Candelabra) of the invention provides a decorative light source with environmental protection, energy saving, long life and fast response time.

The advantages of the invention are:

(1) using the novel high-power LED of the invention as a light source, without damaging the object to be illuminated;

(2) The LED is a cold light source and has a long service life. Therefore, the novel high-power LED candle lamp of the present invention has a low failure rate and reduces the maintenance cost;

(3) Low power consumption, which can save electricity;

(4) The versatility of the color of the LED light source enables the high-power LED candle lamp of the present invention to exhibit its corresponding color according to the use requirement, and broadens the selection range of colors compared with the existing conventional incandescent lamp decorative light source;

(5) Because the connector can be used with a universal lamp holder, it is more convenient to use, and is suitable for decorative light sources in various places such as hotels and hotels; (6) Designed for UL flame-retardant plastic casing, which can better protect the circuit and device parts, and the standard lamp installation structure is convenient to use;

(7) U.S. UL-certified materials are used to make processed parts with high safety performance. DRAWINGS

Figure 1 is a schematic view showing the structure of a novel high-power LED candle lamp of the present invention

2 is a schematic structural view of an LED light source of the present invention

Figure 3 is a cross-sectional view of a heat sink of the LED light source of the present invention

Figure 4 is a schematic view of the outer casing structure of the present invention

Figure 5 is a schematic view of the heat sink structure of the present invention (a is a perspective view, and b is a side cross-sectional view)

Figure 6 is a schematic view of the structure of the base of the present invention (a is a main view, b is a side cross-sectional view; c is a plan view) Figure 7 is a schematic view of the structure of the standard lamp cap of the present invention

8 is a schematic diagram of an LED light source driving circuit of the present invention.

As shown in FIG. 1, the main components of the high-power LED candle lamp of the present invention include: a lampshade 1, an LED light source 2, a heat sink 3, a base 4, a base 5, and a circuit board for driving the LED light source ( Not shown in the drawing, it can be placed in the section of the plastic base 4 and the base 5).

The traditional LED light source is a separate LED light-emitting diode packaged in the module, the brightness is not high, can not meet the lighting requirements. The LED light source used in the invention is a novel light source independently designed for realizing high brightness and avoiding high heat generation problem, and is composed of a single high power LED, as shown in FIG. 2, the LED light source The utility model comprises an illumination light source housing 21, a base body and a support body 23 which are electrically connected to an external power supply, a heat dissipation device 24 is mounted on the support body, and a set of (may be one) semiconductor device 26 is mounted on each heat sink of the heat dissipation device. Each of the semiconductor devices is electrically connected to each other through an electrical connection line 27, and the positive and negative electrodes of the combination are connected to the positive and negative points of the substrate through the power supply line. In order to increase the brightness of the light, the inner surface 21b of the LED light source is coated with a material layer for enhancing the light energy, and the material layer for enhancing the light energy may be a yttrium aluminum garnet or a yttrium phosphor layer.

In order to achieve better illumination and heat dissipation, the heat sink of the LED light source should have a plurality of heat dissipation surfaces. As shown in FIG. 2 and FIG. 3, each of the heat dissipation surfaces is a plane, and each other Room At a certain angle, the light emitted by the light-emitting chip mounted thereon can be illuminated in different directions. The overall shape of the heat dissipating device is a three-step Baishing platform type, and each outer layer 243 of the central Ba-Ling station is an upright plane parallel to the central axis, and the outer layer bodies 242 and 244 of the upper and lower Baingtai are oriented. The adjoining straight face body cooperates with the upper layer body 241 and the lower layer body 245 to form a main heat dissipating unit for carrying the semiconductor light emitting device. The angle between the fins can be set as needed, and the embodiment of FIG. 3 is 45. The degree angle, such that the upper layer body 241 and the lower layer body 245 will be perpendicular to each other. A plurality of semiconductor chips that can emit light or a high-power LED chip 26 are directly fixed on the heat sink 2401 (surface package). The heat sink is designed to be thick enough to dissipate the heat generated by the LED chip 26 to keep the chip cool. A layer or series of thermoelectric material layers 2402 can be mounted within the heat sink 2401. The thermoelectric (TE) material layer will decrease in temperature after voltage application. Therefore, by applying a voltage to the TE material, its temperature is lowered, so that the temperature of the heat sink is lowered, and finally the temperature of the LED chip 26 is lowered. The TE material may have an air layer 2406 having an air inlet 2406a and an outlet 2406b. A set of fans 2407 may be placed in or near the air layer 2406 so that the air 2408 can enter from the inlet 2406a through the TE material. The air with heat is taken out from the outlet 2406b, effectively improving the heat dissipation efficiency of the LED chip 26. Of course, any LED light source heat sink structure having a plurality of heat dissipating surfaces is possible, and will not be further described herein.

As shown in FIG. 4, the lampshade 1 of the high-power LED candle lamp of the present invention can be made of a transparent material, preferably a candle type, which corresponds to the shape of the flame, and is similar to a torch, which is more fashionable.

Referring to FIG. 5, the reference of the heat sink structure is also a highlight of the present invention. The LED light source connection unit can be provided at the upper end of the heat sink 3. In this embodiment, the LED light source connection unit is internally mounted with a high power LED light. The threaded port 301 for the source; the heat sink is made of a petal type (with a petal body 302) made of a metal material, which is advantageous for better heat dissipation.

Referring to FIG. 6, the base 4 (which may be made of plastic) functions to support the upper and lower sides. In this embodiment, the plastic base 4 has a cup shape on the upper part, and the upper inner edge has a support base 401 and is provided with a set. The support block 402 supporting the heat sink assembly, and the lower portion is a chuck 403 that is connected to the standard base. The plastic base can be made of UL-certified UL flame-retardant parts, flame retardant, safe, or other flame retardant materials.

As shown in FIG. 7, the lamp cap 5 can adopt the lamp heads such as E12 and E 14 of the current common standard, or can be based on It is necessary to use a non-standard lamp cap and screw it directly onto the chuck 403 of the plastic base 4 for use.

The high-power LED light source is screwed on the heat sink, and its two poles are in electrical communication with the corresponding control ends of the driving circuit board; the combination body is buckled in the cup-shaped plastic base 4 through the lamp cover 1.

The LED light source of the novel high-power LED candle lamp of the invention can select more power than IPCS 1W. In this embodiment, the LED light source with the power of IPCS 1W is selected, and the illumination angle of the LED is selected in the 360/275 degree butterfly type light shape. Because the LED has a large angle, it can satisfy the effect of uniform illumination. It is cooled by a metal heat sink to ensure that the LED operates at a constant temperature.

An embodiment of the driving circuit of the LED light source of the present invention is shown in Fig. 8. The 110VAC input of the circuit is rectified by a rectifier bridge, and the capacitor and the inductor are filtered to enter the chip, and the chip can output a constant current of 320MA. The high-brightness LED driver chip Ul HV9910 is selected in the circuit. The HV9910 is a high-efficiency PWM LED driver control IC that can drive LEDs with constant current. It is extremely efficient and suitable for driving groups from 1 to hundreds of LEDs. The LED light source of the present invention is extremely suitable. The circuit performance of the invention is made as follows: 1. The output is stable: when the input voltage of 110V AC is provided, a stable 320mA constant current output can be provided, so that the new high-power LED candle lamp has stable illumination and no stroboscopic. 2. High reliability: After high-temperature and high-humidity reliability tests, the circuit performance is stable. This drive circuit is small enough to meet the requirements for assembly in a limited space. Of course, other types of LED driver chips can also be used, which are equivalently replaced, and will not be enumerated here.

The novel high-power LED candle lamp of the invention is a decorative light source with environmental protection, energy saving, long life and fast response time.

Three anti-paint layers are applied to the drive circuit board and wiring locations.

When the novel high-power LED candle lamp of the invention is produced: first screw the high-power LED light source on the heat sink, and then connect the constant current driving electronic board assembly of the LED light source, and then insert the plastic seat after the connection is completed. The heat sink and the plastic seat are fixed by screws, the circuit board is placed inside the plastic seat, the E12 lamp head is assembled and spliced, and then the glass case is glued.

Depending on the parameters of the high-power LED angle, color and brightness used, different effects of the LED channel (Dynasty Channel Letter) can be produced to meet the needs of various environments and customers. Special designs can be made according to the customer's special requirements, such as the LED color area, the change in brightness, the change in mounting method, and the change in input voltage conditions.

The above-described embodiments are intended to be illustrative, and not to limit the scope of the invention.

Claims

Claim

1. A new type of high-power LED candle lamp, which is composed of a high-power LED lamp source and its driving circuit, and is characterized by:

The LED light source is composed of a multi-chip high-power LED;

It also includes:

a heat sink, the upper end is provided with an LED light source connection unit;

a lamp head;

a base, an upper support heat sink assembly, and a lower portion connected to the lamp cap;

2. The novel high power LED candle lamp according to claim 1, wherein: said LED light source comprises an illumination light source housing composed of an outer surface and an inner surface, and a substrate for electrically connecting to an external power source. The inside of the casing has a support body, at least one heat dissipating device is mounted on the support body, and at least one LED semiconductor device is mounted on each heat sink of the heat dissipating device, and each LED semiconductor device is electrically connected to each other through an electrical connection point, and the combination thereof The positive and negative poles correspond to the positive and negative points of the base through the power line.

3. The novel high-power LED candle lamp according to claim 2, wherein: the material layer for enhancing the light energy sprayed on the inner surface of the illumination light source casing is a yttrium aluminum garnet and a bismuth phosphor layer.

4. The novel high power LED candle lamp according to claim 1, wherein: said multi-chip high power LED adopts IPCS 1W high power LED.

5. The novel high power LED candle lamp according to claim 1, wherein: said heat sink is a petal type heat dissipation structure metal material body.

6. The novel high power LED candle lamp according to claim 1, wherein: said multi-chip high power LED adopts a 360/275 degree butterfly-shaped light-emitting LED.

7. The novel LED candle lamp according to claim 1, wherein: a three anti-paint layer is applied to the driving circuit board and the wiring position.