WO2010011701A3 - Glass fiber composition and printed circuit board made from the glass fiber composition - Google Patents

Glass fiber composition and printed circuit board made from the glass fiber composition Download PDF

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Publication number
WO2010011701A3
WO2010011701A3 PCT/US2009/051329 US2009051329W WO2010011701A3 WO 2010011701 A3 WO2010011701 A3 WO 2010011701A3 US 2009051329 W US2009051329 W US 2009051329W WO 2010011701 A3 WO2010011701 A3 WO 2010011701A3
Authority
WO
WIPO (PCT)
Prior art keywords
equal
less
glass fiber
fiber composition
circuit board
Prior art date
Application number
PCT/US2009/051329
Other languages
French (fr)
Other versions
WO2010011701A2 (en
Inventor
John J. Kuhn
Kenneth D. Beer
Original Assignee
Dielectric Solutions, Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dielectric Solutions, Llc filed Critical Dielectric Solutions, Llc
Publication of WO2010011701A2 publication Critical patent/WO2010011701A2/en
Publication of WO2010011701A3 publication Critical patent/WO2010011701A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C13/00—Fibre or filament compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

Abstract

Disclosed are glass fibers having a dielectric constant less than or equal to 6 and glass viscosity of 1000 poise at a temperature no greater than 2250 ° F (1232.2 °C). The glass fibers include between 45 Wt% and 65 Wt% of SiO2; between 15 Wt% and 25 Wt% of B2O3; between 8 Wt% and 16 Wt% of Al2O3; less than or equal to 10 Wt% of CaO; less than or equal to 10 Wt% of MgO; less than or equal to 3 Wt% of Na2O; less than or equal to 2 Wt% of K2O; less than or equal Io 2 Wt% of Li2O; less than or equal to 5 Wt% of TiO2; less than or equal to 2 Wt% of F2; and less than or equal to 1 Wt% of Fe2O3. The glass fibers can have less than or equal to five hollow glass fibers per cubic centimeter of glass and are intended for use in a printed circuit board.
PCT/US2009/051329 2008-07-25 2009-07-22 Glass fiber composition and printed circuit board made from the glass fiber composition WO2010011701A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US8370608P 2008-07-25 2008-07-25
US61/083,706 2008-07-25

Publications (2)

Publication Number Publication Date
WO2010011701A2 WO2010011701A2 (en) 2010-01-28
WO2010011701A3 true WO2010011701A3 (en) 2010-05-27

Family

ID=41570840

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/051329 WO2010011701A2 (en) 2008-07-25 2009-07-22 Glass fiber composition and printed circuit board made from the glass fiber composition

Country Status (2)

Country Link
TW (1) TW201012771A (en)
WO (1) WO2010011701A2 (en)

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JP6790812B2 (en) * 2016-12-26 2020-11-25 日東紡績株式会社 Glass fiber reinforced resin molded product
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US11339083B2 (en) 2016-12-28 2022-05-24 Agy Holding Corporation Low dielectric glass composition, fibers, and article
US11739023B2 (en) 2016-12-28 2023-08-29 Agy Holding Corporation Low dielectric glass composition, fibers, and article
JP7410450B2 (en) * 2018-12-14 2024-01-10 日本電気硝子株式会社 Glass fiber and its manufacturing method
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TWI694976B (en) * 2019-12-31 2020-06-01 富喬工業股份有限公司 Low dielectric constant glass composition with low bubble number and glass fiber
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CN111646693B (en) * 2020-06-17 2022-07-08 深圳南玻科技有限公司 Low-dielectric-constant and low-loss lithium-aluminum silicate glass, and preparation method and application thereof
CN111960666A (en) * 2020-07-23 2020-11-20 北方夜视技术股份有限公司 Lobster eye optical device leather glass and preparation method thereof
CN112250311B (en) * 2020-10-26 2023-03-24 辽宁新洪源环保材料有限公司 Low-dielectric glass fiber composition, low-dielectric glass fiber and preparation method thereof

Citations (4)

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US20050101470A1 (en) * 1999-05-28 2005-05-12 Wallenberger Frederick T. Glass fiber forming compositions
US20050107238A1 (en) * 2003-09-09 2005-05-19 Hong Li Glass compositions, glass fibers, and methods of inhibiting boron volatization from glass compositions
US20080103036A1 (en) * 2006-10-26 2008-05-01 Boessneck Douglas S Low dielectric glass fiber

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0711258B1 (en) * 1994-05-28 1997-08-13 Isover Saint-Gobain Glass-fiber compositions
US20050101470A1 (en) * 1999-05-28 2005-05-12 Wallenberger Frederick T. Glass fiber forming compositions
US20050107238A1 (en) * 2003-09-09 2005-05-19 Hong Li Glass compositions, glass fibers, and methods of inhibiting boron volatization from glass compositions
US20080103036A1 (en) * 2006-10-26 2008-05-01 Boessneck Douglas S Low dielectric glass fiber

Also Published As

Publication number Publication date
TW201012771A (en) 2010-04-01
WO2010011701A2 (en) 2010-01-28

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