WO2010008212A2 - Magazine for semiconductor package - Google Patents

Magazine for semiconductor package Download PDF

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Publication number
WO2010008212A2
WO2010008212A2 PCT/KR2009/003910 KR2009003910W WO2010008212A2 WO 2010008212 A2 WO2010008212 A2 WO 2010008212A2 KR 2009003910 W KR2009003910 W KR 2009003910W WO 2010008212 A2 WO2010008212 A2 WO 2010008212A2
Authority
WO
WIPO (PCT)
Prior art keywords
magazine
surface portion
semiconductor
protruding
fastening hole
Prior art date
Application number
PCT/KR2009/003910
Other languages
French (fr)
Korean (ko)
Other versions
WO2010008212A3 (en
Inventor
서금석
후세인만와
서대도
진민규
이호영
Original Assignee
신일이엠에스아이 (주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신일이엠에스아이 (주) filed Critical 신일이엠에스아이 (주)
Publication of WO2010008212A2 publication Critical patent/WO2010008212A2/en
Publication of WO2010008212A3 publication Critical patent/WO2010008212A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67376—Closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier

Definitions

  • the present invention relates to a magazine for semiconductor packages, and more particularly, to suppress warpage, which is mainly caused in plastic materials, and to minimize wear area due to friction by minimizing the contact area between the semiconductor strip and the magazine for semiconductor packages.
  • the present invention relates to a magazine for a semiconductor package having excellent durability by suppressing a phenomenon such that the fixing pin is separated or loosened by an impact or vibration from the outside.
  • the semiconductor package magazine is used in the manufacturing process of a semiconductor package, and is a case which accommodates a semiconductor strip.
  • Korean Patent Publication No. 10-0477933 discloses a magazine for a semiconductor package, which is manufactured by using engineering plastic instead of aluminum metal, and aims to reduce cost and improve productivity, and to provide conductivity. It is described that a magazine for semiconductor package is manufactured by adding any one of carbon fiber, carbon black, whisker, nickel coated carbon fiber, stainless skill fiber and copper coated fiber to engineering plastic.
  • the magazine for a semiconductor package made of a plastic material is the top plate, the bottom plate and the body is separated from each other and are coupled by a coupling means as shown in the above Patent Publication, such a structure may cause bending problems after plastic injection processing Even if the top plate, the bottom plate and the body are assembled by the coupling means, the bending phenomenon still exists. If such bending occurs, the semiconductor strip may be defective when the semiconductor strip is loaded or unloaded into the guide channel.
  • the guide channel in which the semiconductor strip is accommodated has a rail shape.
  • the contact area between the semiconductor strip and the magazine for the semiconductor package is large, so that wear due to friction is large.
  • a conventional end cap designed with a large area window has a problem in that defects such as discoloration of the semiconductor strip due to excessive plasma may occur during plasma cleaning.
  • the technical problem to be achieved by the present invention is to provide a magazine for a semiconductor package that can suppress the warpage phenomenon mainly occurring in the plastic material.
  • Another object of the present invention is to provide a magazine for a semiconductor package that can minimize wear by friction by minimizing the contact area between the semiconductor strip and the magazine for the semiconductor package.
  • Another technical problem to be achieved by the present invention is to provide a semiconductor package magazine having excellent durability by suppressing a phenomenon such that the fixing pin is separated or loosened by an impact or vibration from the outside.
  • a plurality of guide channels for accommodating a semiconductor strip are formed on a side surface, and a top body and a bottom portion are formed with protrusions protruding from each other in a vertical direction from the side surface, and have a cross-sectional shape of a 'c' shaped first body.
  • a second body having the same structure as that of the first body and disposed to face the first body, and coupling means for coupling the first body and the second body, wherein an upper surface portion of the first body is provided.
  • the upper surface portion of the second body and the protrusion plate is arranged to alternate with each other, the lower surface portion of the first body and the lower surface of the second body provides a magazine for a semiconductor package arranged so that the protrusion plate is crossed with each other.
  • the inner side surfaces of the first and second bodies are formed with a plurality of island-shaped support protrusions separated at regular intervals, and between the support protrusions and the support protrusions form a guide channel for receiving a semiconductor strip, and perpendicular to the guide channel.
  • a plurality of slot grooves may be formed between the support protrusion and the support protrusion in one direction.
  • the corner portion of the support protrusion and the inner corner portion of the slot groove may be rounded so as not to be caught when the semiconductor strip is inserted into the guide channel.
  • Insertion plates having through holes are formed in the upper and lower surfaces of the first body, and insertion grooves into which the insertion plates are inserted, and fastening holes formed to penetrate the insertion grooves, respectively.
  • the upper and lower surfaces of the first and second bodies may have at least two protrusion plates.
  • the side portion is formed with a plurality of guide channels for receiving the semiconductor strip and the upper surface portion and the lower surface portion is formed so that the protruding plate protruding vertically from a portion of the side portion is faced up and down and the cross-sectional shape ''
  • a coupling means for coupling the first body and the second body, wherein the protruding plate formed on the upper surface of the second body is alternately protruded with respect to the protruding plate formed on the upper surface of the first body.
  • the protrusion plate formed on the lower surface of the body is a magazine for semiconductor packages formed to protrude staggered with respect to the protrusion plate formed on the lower surface of the first body to provide.
  • the inner side surfaces of the first and second bodies are formed with a plurality of island-shaped support protrusions separated at regular intervals, and between the support protrusions and the support protrusions form a guide channel for receiving a semiconductor strip, and perpendicular to the guide channel.
  • a plurality of slot grooves may be formed between the support protrusion and the support protrusion in one direction.
  • the corner portion of the support protrusion and the inner corner portion of the slot groove may be rounded so as not to be caught when the semiconductor strip is inserted into the guide channel.
  • Insertion plates having through holes are formed in the upper and lower surfaces of the first body, and insertion grooves into which the insertion plates are inserted, and fastening holes formed to penetrate the insertion grooves, respectively.
  • a fastening hole formed in the lower part of the fastening hole and having a diameter larger than that of the through hole, and a convex column-shaped fixing protrusion protruding upward in the fastening hole and increasing inwardly in the downward direction. It may include a fixing pin that is larger than the upper outer diameter of the fixing protrusion and smaller than the lower outer diameter of the fixing protrusion and is sequentially inserted into the fastening hole, the through hole and the fastening hole to couple the first body and the second body. Can be.
  • the upper and lower surfaces of the first and second bodies may have at least two protrusion plates.
  • the present invention is a semiconductor package magazine including a pair of side portions formed with a plurality of guide channels for accommodating a semiconductor strip, and an upper surface portion and a lower surface portion, in an island shape separated at regular intervals on an inner surface of the side portion.
  • a semiconductor including a plurality of support protrusions formed, a plurality of guide channels formed between the support protrusions and the support protrusions and accommodating the semiconductor strips, and a plurality of slot grooves formed between the support protrusions and the support protrusions in a direction perpendicular to the guide channel.
  • the corner portion of the support protrusion and the inner corner portion of the slot groove may be rounded so as not to be caught when the semiconductor strip is inserted into the guide channel.
  • the semiconductor package magazine has a first body including a side portion, an upper surface portion and a lower surface portion, and a second body including the side portion, the upper surface portion and the lower surface portion disposed to face the first body, and the upper surface of the first body.
  • An insertion plate having a through hole is formed in the lower and lower portions, and an insertion groove into which the insertion plate is inserted is inserted into the upper and lower portions of the second body, a fastening hole formed through the insertion groove, and a lower portion of the fastening hole.
  • a fastening hole formed to extend and having a diameter larger than the through hole, and a convex column-shaped fixing protrusion protruding upward in the fastening hole and increasing inwardly downward, and having a larger diameter than the upper outer diameter of the fixing protrusion. It has a larger inner diameter than the lower outer diameter of the fixing protrusion and is sequentially inserted into the fastening hole, the through hole and the fastening hole so that the first body and the second It may include a fixing pin for coupling the body.
  • the first side of the side portion is formed with a plurality of guide channels for receiving the semiconductor strip
  • the upper surface and the lower portion is formed with a protrusion plate protruding from each other in the vertical direction from the side portion and the cross-sectional shape of the first body
  • the first A first body having the same structure as the body and disposed to face the first body, and coupling means for coupling the first body and the second body, the upper surface portion and the second of the first body
  • the upper surface of the body may be disposed such that the protruding plates are alternate with each other, and the lower surface of the first body and the lower surface of the second body may be arranged such that the protruding plates are alternate with each other.
  • the upper and lower surfaces of the first and second bodies may have at least two protrusion plates.
  • the side surface portion is formed with a plurality of guide channels for receiving the semiconductor strip, and the upper surface portion and the lower surface portion is formed with the protruding plate protruding vertically from a portion of the side portion facing up and down, the first body having a cross-sectional shape '' 'shaped And a second body having a plurality of guide channels for accommodating a semiconductor strip, and having an upper surface portion and a lower surface portion with a protruding plate protruding vertically from a portion of the side portion.
  • the first body including a side portion formed with a plurality of guide channels for accommodating a semiconductor strip, an upper surface portion and a lower surface portion formed with an insertion plate having a through hole, and a plurality of guide channels for accommodating a semiconductor strip are formed.
  • a second body including a side portion, an upper surface portion and a lower surface portion, an insertion groove into which the insertion plate is inserted into an upper surface portion and a lower surface portion of the second body facing the upper surface portion and the lower surface portion on which the insertion plate is formed;
  • a fastening hole formed to penetrate the groove, a fastening hole extending below the fastening hole and having a larger diameter than the through hole, and a conical column shape protruding upward in the fastening hole and increasing inwardly downward.
  • the protrusion is formed, and has an inner diameter larger than the upper outer diameter of the fixing protrusion and smaller than the lower outer diameter of the fixing protrusion, Balls, the through holes and are sequentially inserted into the coupling hole provides a magazine for a semiconductor package including a fixed pin coupling the second body and the first body.
  • the inner side surfaces of the first and second bodies are formed with a plurality of island-shaped support protrusions separated at regular intervals, and between the support protrusions and the support protrusions form a guide channel for receiving a semiconductor strip, and perpendicular to the guide channel.
  • a plurality of slot grooves may be formed between the support protrusion and the support protrusion in one direction.
  • the corner portion of the support protrusion and the inner corner portion of the slot groove may be rounded so as not to be caught when the semiconductor strip is inserted into the guide channel.
  • the first side of the side portion is formed with a plurality of guide channels for receiving the semiconductor strip, and the upper surface and the lower portion is formed with a protrusion plate protruding from each other in the vertical direction from the side portion and the cross-sectional shape of the first body, and the first A first body having the same structure as the body and disposed to face the first body, and coupling means for coupling the first body and the second body, the upper surface portion and the second of the first body
  • the upper surface of the body may be disposed such that the protruding plates are alternate with each other, and the lower surface of the first body and the lower surface of the second body may be arranged such that the protruding plates are alternate with each other.
  • the upper and lower surfaces of the first and second bodies may have at least two protrusion plates.
  • the side surface portion is formed with a plurality of guide channels for receiving the semiconductor strip, and the upper surface portion and the lower surface portion is formed with the protruding plate protruding vertically from a portion of the side portion facing up and down, the first body having a cross-sectional shape '' 'shaped And a second body having a plurality of guide channels for accommodating a semiconductor strip, and having an upper surface portion and a lower surface portion with a protruding plate protruding vertically from a portion of the side portion.
  • packaging magazine of the present invention may further include an end cap formed so that a plurality of perforations are evenly distributed to suppress discoloration of the semiconductor strip by excessive plasma during plasma cleaning.
  • the two body body consisting of the side portion, the upper surface portion and the lower surface portion is assembled to improve the bending of the body physically in the process of assembling the protrusion plate of the upper surface and the lower surface with each other. Therefore, the warpage phenomenon, which occurs mainly in plastic materials, can be suppressed.
  • the contact area between the semiconductor package magazine and the semiconductor strip is minimized due to the island-shaped support protrusions, thereby minimizing wear caused by friction between the semiconductor package magazine and the semiconductor strip.
  • the phenomenon that the fixing pin is separated or loosened due to an impact or vibration from the outside is suppressed and the durability is excellent.
  • FIG. 1 is an exploded perspective view illustrating a magazine for a semiconductor package according to a preferred embodiment of the present invention.
  • FIG. 2 is a perspective view illustrating a bonding state of a magazine for a semiconductor package.
  • FIG. 3 is a perspective view showing a body of a magazine for a semiconductor package
  • FIG. 4 is a front view of the body shown in FIG. 3
  • FIG. 5 is a rear view of the body shown in FIG. 3
  • FIG. 6 is shown in FIG. 3. Left side view of the body.
  • FIG. 7 is a perspective view showing the state of the fixing pin.
  • FIG 8 to 10 are views illustrating a coupling relationship between the first body and the second body.
  • FIG. 1 is an exploded perspective view illustrating a magazine for a semiconductor package according to a preferred embodiment of the present invention.
  • 2 is a perspective view illustrating a bonding state of a magazine for a semiconductor package.
  • 3 is a perspective view illustrating a body of a magazine for a semiconductor package. 4 is a front view of the body shown in FIG. 3,
  • FIG. 5 is a rear view of the body shown in FIG. 3, and
  • FIG. 6 is a left side view of the body shown in FIG. 3.
  • 7 is a perspective view showing the state of the fixing pin.
  • 8 to 10 are views illustrating a coupling relationship between the first body and the second body.
  • a magazine for a semiconductor package includes a first body 10a, a second body 10b, a first body 10a, and a second body ( And a coupling means 20 for coupling 10b).
  • the first body 10a and the second body 10b each include a side portion, an upper surface portion, and a lower surface portion, and the side portion, the upper surface portion, and the lower surface portion are integrally formed instead of the side portion, the upper surface portion, and the lower surface portion being joined by a coupling means. .
  • the side portion 12a of the first body 10a is formed with a plurality of guide channels 18 for receiving a semiconductor strip, and the upper surface portion 14a and the lower surface portion 16a of the first body 10a have side portions 12a.
  • Protruding plate 38 protruding from each other in the vertical direction from the () is formed, the cross-sectional shape of the first body (10a) forms a 'c' shape.
  • the second body 10b has the same structure as the first body 10a but is disposed to face the first body 10a.
  • the upper surface portion 14a of the first body 10a and the upper surface portion 14b of the second body 10b are arranged such that the protruding plates 38 are alternate with each other, and the lower surface portion 16a of the first body 10a is disposed.
  • the lower surface portion 16b of the second body 10b is disposed such that the protrusion plates 38 are alternate with each other.
  • Protrusion plates 38 are not formed on the lower surface portions 16a and 16b positioned below the protruding plate 38 formed on the upper surface portions 14a and 14b of the first and second bodies 10a and 10b.
  • the protrusions 38 are not formed on the upper surface portions 14a and 14b positioned above the protrusion plates 38 formed on the lower surface portions 16a and 16b of the first and second bodies 10a and 10b. Is done.
  • the upper surface portion 14a protrudes by a distance H2 smaller than the protrusion plate 38 by a predetermined distance D in a direction parallel to the guide channel 18 from the protrusion plate 38 of the upper surface portion 14a.
  • the corresponding lower surface portion 16a consists of a protruding plate 38 protruding from the side portion 12a in the vertical direction by a predetermined distance H1.
  • the upper surface portion 14a and the lower surface portion 16a of the first body 10a are provided with protrusion plates 38 protruding from each other in the vertical direction from the side portions 12a, and the protrusion plates 38 are fixed. Spaced apart from each other by a distance (D). 1 to 3 illustrate an example in which three protrusion plates 38 are provided.
  • the second body 10b has the same structure as the first body 10a but is disposed to face the first body 10a.
  • the upper surface portion 14a of the first body 10a and the upper surface portion 14b of the second body 10b are arranged so that the protruding portions (protrusion plates) are alternate with each other, and the lower surface portion of the first body 10a ( The lower surface part 16b of 16a) and the 2nd body 10b are arrange
  • the semiconductor package magazine has a structure installed by combining two 'c' shaped bodies. When the two bodies 10a and 10b are assembled, the bending of the bodies 10a and 10b may be physically improved while the protrusion plates 38 of the upper and lower surfaces are alternately assembled.
  • a plurality of guide channels 18 for storing semiconductor strips are formed in the side surface portion 12a, and the upper surface portion 14a and the lower surface portion 16a are formed on the side surface portion.
  • a protruding plate 38 protruding in a vertical direction from a portion of the portion 12a is formed, and a first body having a cross-sectional shape of a 'c' shape, and the side portion 12b includes a plurality of guide channels 18 for receiving a semiconductor strip.
  • the upper surface portion 14b and the lower surface portion 16b are formed, and the second body 10b and the first body 10a and the first protrusion 10 formed with a protruding plate 38 protruding in a vertical direction from a part of the side portion 12b.
  • 2 includes a coupling means for coupling the body (10b), the protrusion plate 38 formed on the upper surface portion 14b of the second body (10b) is a protrusion plate formed on the upper surface portion (14a) of the first body (10a)
  • the protruding plate 38 formed to be staggered with respect to the 38 and formed on the lower surface portion 16b of the second body 10b is shaped on the lower surface portion 16a of the first body 10a.
  • the stone can also be formed to protrude staggered with respect to the publication (38).
  • the first body 10a and the second body 10b may have other structures than the same structure.
  • the upper surface portion 14a of the first body 10a and the protruding plate 38 formed on the lower surface portion 16a are provided to face up and down, and the upper surface portion 14b of the second body 10b
  • Protruding plate 38 formed on the lower surface portion 16b is provided to face up and down
  • the protruding plate 38 formed on the upper surface portion 14b of the second body 10b is the upper surface portion (1) of the first body 10a.
  • Protruding plate 38 formed on the lower surface portion 16b of the second body 10b is formed on the lower surface portion 16a of the first body 10a.
  • the protrusions 38 are alternately formed to protrude.
  • a plurality of island-shaped support protrusions 22 separated at regular intervals on inner surfaces of the side parts 12a and 12b of the first and second bodies 10a and 10b. ) Is formed.
  • the supporting protrusions 22 are arranged in a row to form a row, and the rows of the supporting protrusions 22 are formed in a plurality of structures at regular intervals.
  • the support protrusion 22 and the support protrusion 22 form a guide channel 18 for receiving a semiconductor strip.
  • Slot grooves 24 are formed between the support protrusions 22 and the support protrusions 22 in a direction perpendicular to the guide channel 18, and a plurality of slot grooves 24 are formed at predetermined intervals.
  • the island-shaped support protrusion 22 minimizes the contact between the semiconductor package magazine and the semiconductor strip, thereby minimizing wear caused by friction between the semiconductor package magazine and the semiconductor strip.
  • the corner portion of the support protrusion 22 is rounded and the inner corner portion of the slot groove 24 is rounded so as not to be caught when the semiconductor strip is inserted into the guide channel 18.
  • an insertion plate 28 having a through hole 26 is formed in the upper surface portion 14a and the lower surface portion 16a of the first body 10a.
  • a conical pillar-shaped fixing protrusion 36 is formed which protrudes upward and becomes larger in the downward direction.
  • the insertion plate 28 may be connected to the protrusion plate 38 formed on the upper surface portion 14a and the lower surface portion 16b of the first body 10a.
  • an insertion plate 28 having a through hole 26 is formed in the upper surface portion 14b and the lower surface portion 16b of the second body 10b, and the second body 10b in which the insertion plate 28 is formed.
  • the fixing projection 36 is formed in a conical column shape which protrudes upward and becomes larger as the inner diameter d1 goes downward.
  • the insertion plate 28 may be connected to the protrusion plate 38 formed on the upper surface portion 14b and the lower surface portion 16b of the second body 10b.
  • the first body 10a and the second body 10b are coupled by the fixing pin 20.
  • the fixing pin 20 is composed of a head portion 20a and an assembling portion 20b, and the assembling portion 20b is larger than the upper outer diameter d2 of the fixing protrusion 36 and the lower outer diameter d3 of the fixing protrusion 36.
  • the assembly portion 20b of the fixing pin 20 is sequentially inserted into the fastening hole 32, the through hole 26, and the fastening hole 34 to couple the first body 10a and the second body 10b.
  • the assembly portion 20b is inserted into the fastening hole 34 and is bent in the outer direction as shown in FIG. 10 by the fixing projection 36 having a conical column shape that increases in the downward direction.
  • the assembly portion 20b is bent in the outward direction is caught by the step 44 caused by the insertion plate 28 so that the fixing pin 20 does not fall.
  • the assembly portion 20b of the fixing pin 20 is inserted into the fastening hole 34 to be at least two parts as shown in FIG. 7 so as to be easily opened in the outward direction along the outer surface of the high protrusion 36. It is preferably formed to be divided.
  • the magazine for semiconductor packages according to a preferred embodiment of the present invention further includes an end cap 40 formed so that a plurality of perforations 42 are evenly distributed so as to prevent the semiconductor strip from discoloring by excessive plasma during plasma cleaning. can do.
  • Conventional end caps designed with large area windows have defects such as discoloration of semiconductor strips due to excessive plasma during plasma cleaning.
  • the end cap 40 may be designed such that the plurality of perforations 42 are evenly distributed on the front surface, thereby preventing the plasma from concentrating only on a part of the semiconductor strip.
  • the magazine for semiconductor package may further include an identification recognition unit (not shown) to insert a barcode, serial number or RFID for confirming the serial number of the magazine for semiconductor package.
  • the magazine for semiconductor packages according to a preferred embodiment of the present invention is formed of a conductive plastic containing carbon nanotubes, it is preferable that the particles of the conductive plastic has a size smaller than 1 ⁇ m.
  • Carbon fibers or metal fibers are added to give conductivity to engineering plastics. As dust generated by abrasion of plastics causes conductive fillers such as carbon fibers or metal fibers to fall on the semiconductor strip during the semiconductor assembly process, causing serious defects frequently. do.
  • carbon nanotubes CNTs
  • Conductive plastics are manufactured so that the conductive plastic particles have a nano size of less than 1 ⁇ m so as not to affect the semiconductor strip even when dust is generated.
  • the surface of the magazine for semiconductor package is coated with a conductive metal coating layer so that the automated equipment can be recognized.
  • an adhesion part is first formed in order to increase the adhesion of the metal coating layer, and then a conductive metal coating layer is formed on the adhesion part.
  • the conductive metal coating layer may be formed by spray spraying, dip coating, or the like using metal powders such as gold (Au), silver (Ag), aluminum (Al), and copper (Cu).
  • metal powders such as gold (Au), silver (Ag), aluminum (Al), and copper (Cu).
  • a ceramic coating layer may be formed by mixing a ceramic powder, such as alumina and zirconia, into the paint using a spray spraying method or the like.

Abstract

The present invention relates to a magazine for a semiconductor package. The magazine comprises two bodies each of which is integrated with a lateral unit, a top unit and a bottom unit. While protrusion plates at the top and bottom of the bodies are meshed for joining the bodies, flexibility of the plastic material can be prevented because flexibility of the body is physically decreased. The contact portion between the semiconductor strip and the magazine for the semiconductor package is minimized, due to a support stud shaped like an island, so abrasion caused by friction between the semiconductor strip and the magazine for the semiconductor package can be minimized. In addition, a fastening pin is prevented from being separated or loosened as a result of external impact or vibration. Therefore, the durability of the magazine for the semiconductor package is excellent.

Description

[규칙 제26조에 의한 보정 24.09.2009]　반도체 패키지용 매거진[Revision 24.09.2009 by Rule 26] Magazine for Semiconductor Packages
본 발명은 반도체 패키지용 매거진에 관한 것으로, 더욱 상세하게는 플라스틱 재질에 주로 발생하는 휨 현상을 억제할 수 있고, 반도체 스트립과 반도체 패키지용 매커진의 접촉면적을 최소화하여 마찰에 의한 마모를 최소화할 수 있으며, 외부로부터의 충격이나 진동 등에 의해 고정핀이 이탈하거나 헐거워지는 등의 현상을 억제하여 내구성이 우수한 반도체 패키지용 매거진에 관한 것이다.The present invention relates to a magazine for semiconductor packages, and more particularly, to suppress warpage, which is mainly caused in plastic materials, and to minimize wear area due to friction by minimizing the contact area between the semiconductor strip and the magazine for semiconductor packages. The present invention relates to a magazine for a semiconductor package having excellent durability by suppressing a phenomenon such that the fixing pin is separated or loosened by an impact or vibration from the outside.
반도체 패키지용 매거진은 반도체 패키지의 제조공정에서 사용되는 것으로서 반도체 스트립을 수납하는 케이스이다. The semiconductor package magazine is used in the manufacturing process of a semiconductor package, and is a case which accommodates a semiconductor strip.
대한민국 등록특허공보 제10-0477933호는 반도체 패키지용 매거진에 관하여 제시하고 있는데, 상기 등록특허공보는 알루미늄 금속 대신에 엔지니어링 플라스틱을 이용한 제작한 것으로 원가절감 및 생산성 향상을 도모하였으며, 전도성을 부여하기 위해 카본 화이어, 카본 블랙, 휘스커, 니켈코팅 카본 화이버, 스테인레스 스킬 화이버, 구리 코팅 화이버 중 어느 하나를 엔지니어링 플라스틱에 첨가하여 반도체 패키지용 매거진을 제작한다고 기술하고 있다. Korean Patent Publication No. 10-0477933 discloses a magazine for a semiconductor package, which is manufactured by using engineering plastic instead of aluminum metal, and aims to reduce cost and improve productivity, and to provide conductivity. It is described that a magazine for semiconductor package is manufactured by adding any one of carbon fiber, carbon black, whisker, nickel coated carbon fiber, stainless skill fiber and copper coated fiber to engineering plastic.
그러나, 플라스틱 재질로 이루어진 반도체 패키지용 매거진은 상기 등록특허공보에 제시된 바와 같이 상판, 하판 및 몸체가 서로 분리되어 있고 결합수단에 의해 결합되며, 이러한 구조는 플라스틱 사출 가공 이후에 휨 문제가 발생할 수 있고 상판, 하판 및 몸체가 결합수단에 의해 조립되더라도 휨 현상이 여전히 존재하게 된다. 이러한 휨 현상이 발생하게 되면 반도체 스트립을 가이드채널에 로딩(loading)하거나 언로딩(unloading)할 때 반도체 스트립에 불량을 초래할 수 있다.However, the magazine for a semiconductor package made of a plastic material is the top plate, the bottom plate and the body is separated from each other and are coupled by a coupling means as shown in the above Patent Publication, such a structure may cause bending problems after plastic injection processing Even if the top plate, the bottom plate and the body are assembled by the coupling means, the bending phenomenon still exists. If such bending occurs, the semiconductor strip may be defective when the semiconductor strip is loaded or unloaded into the guide channel.
또한, 상판, 하판 및 몸체가 고정핀과 같은 일반적인 결합수단에 의해 결합되는 경우, 외부로부터의 충격이나 진동 등에 의해 고정핀이 이탈하거나 헐거워지는 등의 문제를 발생할 수 있고, 따라서 내구성이 취약할 수 있는 단점이 있다. In addition, when the upper plate, the lower plate and the body are coupled by a general coupling means such as a fixing pin, it may cause a problem such that the fixing pin is separated or loosened by an impact or vibration from the outside, and thus the durability may be weak. There is a disadvantage.
또한, 플라스틱에 전도성 부여하기 위하여 카본섬유 또는 금속섬유를 첨가하게 되면, 플라스틱의 마모로 인한 분진이 발생되면서 카본섬유 또는 금속섬유와 같은 전도성 충진제들이 반도체 조립 공정 중에 반도체 스트립 위에 떨어져 심각한 불량이 발생할 수 있다. In addition, when carbon fiber or metal fiber is added to impart conductivity to the plastic, dust may be generated due to abrasion of the plastic, and conductive fillers such as carbon fiber or metal fiber may fall on the semiconductor strip during the semiconductor assembly process, causing serious defects. have.
또한, 반도체 스트립이 수납되는 가이드채널은 레일 형상으로 이루어지는데, 이러한 레일 형상의 가이드채널로 이루어지는 경우 반도체 스트립과 반도체 패키지용 매커진의 접촉면적이 커서 마찰에 의한 마모가 크다는 단점이 있다. In addition, the guide channel in which the semiconductor strip is accommodated has a rail shape. When the guide channel is formed in the rail shape, the contact area between the semiconductor strip and the magazine for the semiconductor package is large, so that wear due to friction is large.
또한, 넓은 면적의 창으로 설계된 종래의 엔드캡(end cap)은 플라즈마 클리닝(cleaning) 시에 과도한 플라즈마에 의해 반도체 스트립이 변색되는 등의 불량이 발생할 수 있다는 문제가 있다. In addition, a conventional end cap designed with a large area window has a problem in that defects such as discoloration of the semiconductor strip due to excessive plasma may occur during plasma cleaning.
본 발명이 이루고자 하는 기술적 과제는 플라스틱 재질에 주로 발생하는 휨 현상을 억제할 수 있는 반도체 패키지용 매거진을 제공함에 있다. The technical problem to be achieved by the present invention is to provide a magazine for a semiconductor package that can suppress the warpage phenomenon mainly occurring in the plastic material.
본 발명이 이루고자 하는 다른 기술적 과제는 반도체 스트립과 반도체 패키지용 매커진의 접촉면적을 최소화하여 마찰에 의한 마모를 최소화할 수 있는 반도체 패키지용 매거진을 제공함에 있다. Another object of the present invention is to provide a magazine for a semiconductor package that can minimize wear by friction by minimizing the contact area between the semiconductor strip and the magazine for the semiconductor package.
본 발명이 이루고자 하는 또 다른 기술적 과제는 외부로부터의 충격이나 진동 등에 의해 고정핀이 이탈하거나 헐거워지는 등의 현상을 억제하여 내구성이 우수한 반도체 패키지용 매거진을 제공함에 있다.Another technical problem to be achieved by the present invention is to provide a semiconductor package magazine having excellent durability by suppressing a phenomenon such that the fixing pin is separated or loosened by an impact or vibration from the outside.
본 발명은, 측면부는 반도체 스트립을 수납하는 다수의 가이드채널이 형성되고 상면부와 하면부는 상기 측면부로부터 수직방향으로 서로 엇갈리게 돌출된 돌출판이 형성되어 있으며 단면 모양이 'ㄷ'자형인 제1 몸체와, 상기 제1 몸체와 동일한 구조를 갖되 상기 제1 몸체에 마주보게 배치된 제2 몸체와, 상기 제1 몸체와 상기 제2 몸체를 결합하는 결합수단을 포함하며, 상기 제1 몸체의 상면부와 상기 제2 몸체의 상면부는 상기 돌출판이 서로 엇갈리도록 배치되고, 제1 몸체의 하면부와 상기 제2 몸체의 하면부는 상기 돌출판이 서로 엇갈리도록 배치된 반도체 패키지용 매거진을 제공한다. 상기 제1 및 제2 몸체의 측면부의 내측면에는 일정 간격으로 분리된 다수의 섬 모양의 받침돌기가 형성되어 있고, 받침돌기와 받침돌기 사이는 반도체 스트립을 수납하는 가이드채널을 이루며, 상기 가이드채널에 수직한 방향으로 상기 받침돌기와 받침돌기 사이에 다수의 슬롯홈이 형성되어 있을 수 있다. 상기 반도체 스트립이 상기 가이드채널에 삽입될 때 걸리지 않도록 상기 받침돌기의 코너 부분 및 상기 슬롯홈의 내측 코너 부분은 둥글게 라운딩되어 있을 수 있다. 상기 제1 몸체의 상면부 및 하면부에는 관통공을 갖는 삽입판이 형성되어 있고, 상기 제2 몸체의 상면부 및 하면부에는 상기 삽입판이 삽착되는 삽입홈과, 상기 삽입홈까지 관통되게 형성된 체결공과, 상기 체결공 하부에 연장되게 형성되고 상기 관통공보다 큰 직경을 갖는 체결홀과, 상기 체결홀 내에 상방향으로 돌출되고 내경이 하방향으로 갈수록 커지는 원뿔기둥 형상의 고정돌기가 형성되어 있으며, 상기 고정돌기의 상부 외경보다는 크고 상기 고정돌기의 하부 외경보다는 작은 내경을 갖고 상기 체결공, 상기 관통공 및 상기 체결홀에 순차 삽입되어 상기 제1 몸체와 상기 제2 몸체를 결합시키는 고정핀을 포함할 수 있다. 상기 제1 및 제2 몸체의 상기 상면부 및 하면부는 적어도 2개의 돌출판을 가질 수 있다. According to the present invention, a plurality of guide channels for accommodating a semiconductor strip are formed on a side surface, and a top body and a bottom portion are formed with protrusions protruding from each other in a vertical direction from the side surface, and have a cross-sectional shape of a 'c' shaped first body. And a second body having the same structure as that of the first body and disposed to face the first body, and coupling means for coupling the first body and the second body, wherein an upper surface portion of the first body is provided. The upper surface portion of the second body and the protrusion plate is arranged to alternate with each other, the lower surface portion of the first body and the lower surface of the second body provides a magazine for a semiconductor package arranged so that the protrusion plate is crossed with each other. The inner side surfaces of the first and second bodies are formed with a plurality of island-shaped support protrusions separated at regular intervals, and between the support protrusions and the support protrusions form a guide channel for receiving a semiconductor strip, and perpendicular to the guide channel. A plurality of slot grooves may be formed between the support protrusion and the support protrusion in one direction. The corner portion of the support protrusion and the inner corner portion of the slot groove may be rounded so as not to be caught when the semiconductor strip is inserted into the guide channel. Insertion plates having through holes are formed in the upper and lower surfaces of the first body, and insertion grooves into which the insertion plates are inserted, and fastening holes formed to penetrate the insertion grooves, respectively. A fastening hole formed in the lower part of the fastening hole and having a diameter larger than that of the through hole, and a convex column-shaped fixing protrusion protruding upward in the fastening hole and increasing inwardly in the downward direction. It may include a fixing pin that is larger than the upper outer diameter of the fixing protrusion and smaller than the lower outer diameter of the fixing protrusion and is sequentially inserted into the fastening hole, the through hole and the fastening hole to couple the first body and the second body. Can be. The upper and lower surfaces of the first and second bodies may have at least two protrusion plates.
또한, 본 발명은, 측면부는 반도체 스트립을 수납하는 다수의 가이드채널이 형성되고 상면부와 하면부는 상기 측면부의 일부로부터 수직방향으로 돌출된 돌출판이 상하로 대향되게 형성되어 있으며 단면 모양이 'ㄷ'자형인 제1 몸체와, 측면부는 반도체 스트립을 수납하는 다수의 가이드채널이 형성되고 상면부와 하면부는 상기 측면부의 일부로부터 수직방향으로 돌출된 돌출판이 상하로 대향되게 형성된 제2 몸체와, 상기 제1 몸체와 상기 제2 몸체를 결합하는 결합수단을 포함하며, 상기 제2 몸체의 상면부에 형성된 돌출판은 상기 제1 몸체의 상면부에 형성된 돌출판에 대하여 엇갈려 돌출되게 형성되고 상기 제2 몸체의 하면부에 형성된 돌출판은 상기 제1 몸체의 하면부에 형성된 돌출판에 대하여 엇갈려 돌출되게 형성된 반도체 패키지용 매거진을 제공한다. 상기 제1 및 제2 몸체의 측면부의 내측면에는 일정 간격으로 분리된 다수의 섬 모양의 받침돌기가 형성되어 있고, 받침돌기와 받침돌기 사이는 반도체 스트립을 수납하는 가이드채널을 이루며, 상기 가이드채널에 수직한 방향으로 상기 받침돌기와 받침돌기 사이에 다수의 슬롯홈이 형성되어 있을 수 있다. 상기 반도체 스트립이 상기 가이드채널에 삽입될 때 걸리지 않도록 상기 받침돌기의 코너 부분 및 상기 슬롯홈의 내측 코너 부분은 둥글게 라운딩되어 있을 수 있다. 상기 제1 몸체의 상면부 및 하면부에는 관통공을 갖는 삽입판이 형성되어 있고, 상기 제2 몸체의 상면부 및 하면부에는 상기 삽입판이 삽착되는 삽입홈과, 상기 삽입홈까지 관통되게 형성된 체결공과, 상기 체결공 하부에 연장되게 형성되고 상기 관통공보다 큰 직경을 갖는 체결홀과, 상기 체결홀 내에 상방향으로 돌출되고 내경이 하방향으로 갈수록 커지는 원뿔기둥 형상의 고정돌기가 형성되어 있으며, 상기 고정돌기의 상부 외경보다는 크고 상기 고정돌기의 하부 외경보다는 작은 내경을 갖고 상기 체결공, 상기 관통공 및 상기 체결홀에 순차 삽입되어 상기 제1 몸체와 상기 제2 몸체를 결합시키는 고정핀을 포함할 수 있다. 상기 제1 및 제2 몸체의 상기 상면부 및 하면부는 적어도 2개의 돌출판을 가질 수 있다. In addition, the present invention, the side portion is formed with a plurality of guide channels for receiving the semiconductor strip and the upper surface portion and the lower surface portion is formed so that the protruding plate protruding vertically from a portion of the side portion is faced up and down and the cross-sectional shape '' A first body having a 'shape', a second body formed with a plurality of guide channels for receiving semiconductor strips, and an upper surface portion and a lower surface portion having a protruding plate protruding vertically from a portion of the side portion; And a coupling means for coupling the first body and the second body, wherein the protruding plate formed on the upper surface of the second body is alternately protruded with respect to the protruding plate formed on the upper surface of the first body. 2 The protrusion plate formed on the lower surface of the body is a magazine for semiconductor packages formed to protrude staggered with respect to the protrusion plate formed on the lower surface of the first body to provide. The inner side surfaces of the first and second bodies are formed with a plurality of island-shaped support protrusions separated at regular intervals, and between the support protrusions and the support protrusions form a guide channel for receiving a semiconductor strip, and perpendicular to the guide channel. A plurality of slot grooves may be formed between the support protrusion and the support protrusion in one direction. The corner portion of the support protrusion and the inner corner portion of the slot groove may be rounded so as not to be caught when the semiconductor strip is inserted into the guide channel. Insertion plates having through holes are formed in the upper and lower surfaces of the first body, and insertion grooves into which the insertion plates are inserted, and fastening holes formed to penetrate the insertion grooves, respectively. A fastening hole formed in the lower part of the fastening hole and having a diameter larger than that of the through hole, and a convex column-shaped fixing protrusion protruding upward in the fastening hole and increasing inwardly in the downward direction. It may include a fixing pin that is larger than the upper outer diameter of the fixing protrusion and smaller than the lower outer diameter of the fixing protrusion and is sequentially inserted into the fastening hole, the through hole and the fastening hole to couple the first body and the second body. Can be. The upper and lower surfaces of the first and second bodies may have at least two protrusion plates.
또한, 본 발명은, 반도체 스트립을 수납하는 다수의 가이드채널이 형성된 한쌍의 측면부와, 상면부 및 하면부를 포함하는 반도체 패키지용 매거진에 있어서, 상기 측면부의 내측면에 일정 간격으로 분리된 섬 모양으로 형성된 다수의 받침돌기와, 상기 받침돌기와 받침돌기 사이에 형성되고 반도체 스트립을 수납하는 다수의 가이드채널과, 상기 가이드채널에 수직한 방향으로 상기 받침돌기와 받침돌기 사이에 형성된 다수의 슬롯홈을 포함하는 반도체 패키지용 매거진을 제공한다. 상기 반도체 스트립이 상기 가이드채널에 삽입될 때 걸리지 않도록 상기 받침돌기의 코너 부분 및 상기 슬롯홈의 내측 코너 부분은 둥글게 라운딩되어 있을 수 있다. 상기 반도체용 패키지 매거진은, 측면부, 상면부 및 하면부를 포함하는 제1 몸체와, 측면부, 상면부 및 하면부를 포함하는 제2 몸체가 상기 제1 몸체에 대향되게 배치되며, 상기 제1 몸체의 상면부 및 하면부에는 관통공을 갖는 삽입판이 형성되어 있고, 상기 제2 몸체의 상면부 및 하면부에는 상기 삽입판이 삽착되는 삽입홈과, 상기 삽입홈까지 관통되게 형성된 체결공과, 상기 체결공 하부에 연장되게 형성되고 상기 관통공보다 큰 직경을 갖는 체결홀과, 상기 체결홀 내에 상방향으로 돌출되고 내경이 하방향으로 갈수록 커지는 원뿔기둥 형상의 고정돌기가 형성되어 있으며, 상기 고정돌기의 상부 외경보다는 크고 상기 고정돌기의 하부 외경보다는 작은 내경을 갖고 상기 체결공, 상기 관통공 및 상기 체결홀에 순차 삽입되어 상기 제1 몸체와 상기 제2 몸체를 결합시키는 고정핀을 포함할 수 있다. 측면부는 반도체 스트립을 수납하는 다수의 가이드채널이 형성되고 상면부와 하면부는 상기 측면부로부터 수직방향으로 서로 엇갈리게 돌출된 돌출판이 형성되어 있으며 단면 모양이 'ㄷ'자형인 제1 몸체와, 상기 제1 몸체와 동일한 구조를 갖되 상기 제1 몸체에 마주보게 배치된 제2 몸체와, 상기 제1 몸체와 상기 제2 몸체를 결합하는 결합수단을 포함하며, 상기 제1 몸체의 상면부와 상기 제2 몸체의 상면부는 상기 돌출판이 서로 엇갈리도록 배치되고, 상기 제1 몸체의 하면부와 상기 제2 몸체의 하면부는 상기 돌출판이 서로 엇갈리도록 배치된 것일 수 있다. 상기 제1 및 제2 몸체의 상기 상면부 및 하면부는 적어도 2개의 돌출판을 가질 수 있다. 측면부는 반도체 스트립을 수납하는 다수의 가이드채널이 형성되고 상면부와 하면부는 상기 측면부의 일부로부터 수직방향으로 돌출된 돌출판이 상하로 대향되게 형성되어 있으며 단면 모양이 'ㄷ'자형인 제1 몸체와, 측면부는 반도체 스트립을 수납하는 다수의 가이드채널이 형성되고 상면부와 하면부는 상기 측면부의 일부로부터 수직방향으로 돌출된 돌출판이 상하로 대향되게 형성된 제2 몸체와, 상기 제1 몸체와 상기 제2 몸체를 결합하는 결합수단을 포함하며, 상기 제2 몸체의 상면부에 형성된 돌출판은 상기 제1 몸체의 상면부에 형성된 돌출판에 대하여 엇갈려 돌출되게 형성되고 상기 제2 몸체의 하면부에 형성된 돌출판은 상기 제1 몸체의 하면부에 형성된 돌출판에 대하여 엇갈려 돌출되게 형성된 것일 수 있다. In addition, the present invention is a semiconductor package magazine including a pair of side portions formed with a plurality of guide channels for accommodating a semiconductor strip, and an upper surface portion and a lower surface portion, in an island shape separated at regular intervals on an inner surface of the side portion. A semiconductor including a plurality of support protrusions formed, a plurality of guide channels formed between the support protrusions and the support protrusions and accommodating the semiconductor strips, and a plurality of slot grooves formed between the support protrusions and the support protrusions in a direction perpendicular to the guide channel. Provide a magazine for the package. The corner portion of the support protrusion and the inner corner portion of the slot groove may be rounded so as not to be caught when the semiconductor strip is inserted into the guide channel. The semiconductor package magazine has a first body including a side portion, an upper surface portion and a lower surface portion, and a second body including the side portion, the upper surface portion and the lower surface portion disposed to face the first body, and the upper surface of the first body. An insertion plate having a through hole is formed in the lower and lower portions, and an insertion groove into which the insertion plate is inserted is inserted into the upper and lower portions of the second body, a fastening hole formed through the insertion groove, and a lower portion of the fastening hole. A fastening hole formed to extend and having a diameter larger than the through hole, and a convex column-shaped fixing protrusion protruding upward in the fastening hole and increasing inwardly downward, and having a larger diameter than the upper outer diameter of the fixing protrusion. It has a larger inner diameter than the lower outer diameter of the fixing protrusion and is sequentially inserted into the fastening hole, the through hole and the fastening hole so that the first body and the second It may include a fixing pin for coupling the body. The first side of the side portion is formed with a plurality of guide channels for receiving the semiconductor strip, and the upper surface and the lower portion is formed with a protrusion plate protruding from each other in the vertical direction from the side portion and the cross-sectional shape of the first body, and the first A first body having the same structure as the body and disposed to face the first body, and coupling means for coupling the first body and the second body, the upper surface portion and the second of the first body The upper surface of the body may be disposed such that the protruding plates are alternate with each other, and the lower surface of the first body and the lower surface of the second body may be arranged such that the protruding plates are alternate with each other. The upper and lower surfaces of the first and second bodies may have at least two protrusion plates. The side surface portion is formed with a plurality of guide channels for receiving the semiconductor strip, and the upper surface portion and the lower surface portion is formed with the protruding plate protruding vertically from a portion of the side portion facing up and down, the first body having a cross-sectional shape '' 'shaped And a second body having a plurality of guide channels for accommodating a semiconductor strip, and having an upper surface portion and a lower surface portion with a protruding plate protruding vertically from a portion of the side portion. It includes a coupling means for coupling the second body, the protruding plate formed on the upper surface portion of the second body is formed to protrude alternately with respect to the protruding plate formed on the upper surface portion of the first body and to the lower surface portion of the second body The protruding plate may be formed to be alternately protruding from the protruding plate formed on the lower surface of the first body.
또한, 본 발명은, 반도체 스트립을 수납하는 다수의 가이드채널이 형성된 측면부와, 관통공을 갖는 삽입판이 형성된 상면부 및 하면부를 포함하는 제1 몸체와, 반도체 스트립을 수납하는 다수의 가이드채널이 형성된 측면부, 상면부 및 하면부를 포함하는 제2 몸체를 포함하며, 상기 삽입판이 형성된 상면부 및 하면부에 대향하는 상기 제2 몸체의 상면부 및 하면부에는 상기 삽입판이 삽착되는 삽입홈과, 상기 삽입홈까지 관통되게 형성된 체결공과, 상기 체결공 하부에 연장되게 형성되고 상기 관통공보다 큰 직경을 갖는 체결홀과, 상기 체결홀 내에 상방향으로 돌출되고 내경이 하방향으로 갈수록 커지는 원뿔기둥 형상의 고정돌기가 형성되어 있고, 상기 고정돌기의 상부 외경보다는 크고 상기 고정돌기의 하부 외경보다는 작은 내경을 갖고, 상기 체결공, 상기 관통공 및 상기 체결홀에 순차 삽입되어 상기 제1 몸체와 상기 제2 몸체를 결합시키는 고정핀을 포함하는 반도체 패키지용 매거진을 제공한다. 상기 제1 및 제2 몸체의 측면부의 내측면에는 일정 간격으로 분리된 다수의 섬 모양의 받침돌기가 형성되어 있고, 받침돌기와 받침돌기 사이는 반도체 스트립을 수납하는 가이드채널을 이루며, 상기 가이드채널에 수직한 방향으로 상기 받침돌기와 받침돌기 사이에 다수의 슬롯홈이 형성되어 있을 수 있다. 상기 반도체 스트립이 상기 가이드채널에 삽입될 때 걸리지 않도록 상기 받침돌기의 코너 부분 및 상기 슬롯홈의 내측 코너 부분은 둥글게 라운딩되어 있을 수 있다. 측면부는 반도체 스트립을 수납하는 다수의 가이드채널이 형성되고 상면부와 하면부는 상기 측면부로부터 수직방향으로 서로 엇갈리게 돌출된 돌출판이 형성되어 있으며 단면 모양이 'ㄷ'자형인 제1 몸체와, 상기 제1 몸체와 동일한 구조를 갖되 상기 제1 몸체에 마주보게 배치된 제2 몸체와, 상기 제1 몸체와 상기 제2 몸체를 결합하는 결합수단을 포함하며, 상기 제1 몸체의 상면부와 상기 제2 몸체의 상면부는 상기 돌출판이 서로 엇갈리도록 배치되고, 상기 제1 몸체의 하면부와 상기 제2 몸체의 하면부는 상기 돌출판이 서로 엇갈리도록 배치된 것일 수 있다. 상기 제1 및 제2 몸체의 상기 상면부 및 하면부는 적어도 2개의 돌출판을 가질 수 있다. 측면부는 반도체 스트립을 수납하는 다수의 가이드채널이 형성되고 상면부와 하면부는 상기 측면부의 일부로부터 수직방향으로 돌출된 돌출판이 상하로 대향되게 형성되어 있으며 단면 모양이 'ㄷ'자형인 제1 몸체와, 측면부는 반도체 스트립을 수납하는 다수의 가이드채널이 형성되고 상면부와 하면부는 상기 측면부의 일부로부터 수직방향으로 돌출된 돌출판이 상하로 대향되게 형성된 제2 몸체와, 상기 제1 몸체와 상기 제2 몸체를 결합하는 결합수단을 포함하며, 상기 제2 몸체의 상면부에 형성된 돌출판은 상기 제1 몸체의 상면부에 형성된 돌출판에 대하여 엇갈려 돌출되게 형성되고 상기 제2 몸체의 하면부에 형성된 돌출판은 상기 제1 몸체의 하면부에 형성된 돌출판에 대하여 엇갈려 돌출되게 형성된 것일 수 있다. In addition, the present invention, the first body including a side portion formed with a plurality of guide channels for accommodating a semiconductor strip, an upper surface portion and a lower surface portion formed with an insertion plate having a through hole, and a plurality of guide channels for accommodating a semiconductor strip are formed. A second body including a side portion, an upper surface portion and a lower surface portion, an insertion groove into which the insertion plate is inserted into an upper surface portion and a lower surface portion of the second body facing the upper surface portion and the lower surface portion on which the insertion plate is formed; A fastening hole formed to penetrate the groove, a fastening hole extending below the fastening hole and having a larger diameter than the through hole, and a conical column shape protruding upward in the fastening hole and increasing inwardly downward. The protrusion is formed, and has an inner diameter larger than the upper outer diameter of the fixing protrusion and smaller than the lower outer diameter of the fixing protrusion, Balls, the through holes and are sequentially inserted into the coupling hole provides a magazine for a semiconductor package including a fixed pin coupling the second body and the first body. The inner side surfaces of the first and second bodies are formed with a plurality of island-shaped support protrusions separated at regular intervals, and between the support protrusions and the support protrusions form a guide channel for receiving a semiconductor strip, and perpendicular to the guide channel. A plurality of slot grooves may be formed between the support protrusion and the support protrusion in one direction. The corner portion of the support protrusion and the inner corner portion of the slot groove may be rounded so as not to be caught when the semiconductor strip is inserted into the guide channel. The first side of the side portion is formed with a plurality of guide channels for receiving the semiconductor strip, and the upper surface and the lower portion is formed with a protrusion plate protruding from each other in the vertical direction from the side portion and the cross-sectional shape of the first body, and the first A first body having the same structure as the body and disposed to face the first body, and coupling means for coupling the first body and the second body, the upper surface portion and the second of the first body The upper surface of the body may be disposed such that the protruding plates are alternate with each other, and the lower surface of the first body and the lower surface of the second body may be arranged such that the protruding plates are alternate with each other. The upper and lower surfaces of the first and second bodies may have at least two protrusion plates. The side surface portion is formed with a plurality of guide channels for receiving the semiconductor strip, and the upper surface portion and the lower surface portion is formed with the protruding plate protruding vertically from a portion of the side portion facing up and down, the first body having a cross-sectional shape '' 'shaped And a second body having a plurality of guide channels for accommodating a semiconductor strip, and having an upper surface portion and a lower surface portion with a protruding plate protruding vertically from a portion of the side portion. It includes a coupling means for coupling the second body, the protruding plate formed on the upper surface portion of the second body is formed to protrude alternately with respect to the protruding plate formed on the upper surface portion of the first body and to the lower surface portion of the second body The protruding plate may be formed to be alternately protruding from the protruding plate formed on the lower surface of the first body.
또한, 본 발명의 패키지용 매거진은, 플라즈마 클리닝 시에 과도한 플라즈마에 의해 반도체 스트립이 변색되는 것을 억제하도록 다수 개의 천공이 고르게 분포되게 형성된 엔드캡을 더 포함할 수 있다. In addition, the packaging magazine of the present invention may further include an end cap formed so that a plurality of perforations are evenly distributed to suppress discoloration of the semiconductor strip by excessive plasma during plasma cleaning.
본 발명의 패키지용 매거진은, 반도체 패키지용 매거진의 일련 번호를 확인하기 위한 반도체 패키지용 매거진의 일련 번호를 확인하기 위한 바코드, 시리얼번호 또는 RFID가 삽입되는 식별인식부를 더 포함할 수 있다. The packaging magazine of the present invention may further include an identification recognition unit for inserting a barcode, a serial number or an RFID for confirming the serial number of the semiconductor package magazine for confirming the serial number of the semiconductor package magazine.
본 발명의 반도체 패키지용 매거진은 탄소나노튜브가 함유된 전도성 플라스틱으로 형성되고, 상기 전도성 플라스틱의 입자는 1㎛보다 작은 크기를 갖는 것이 바람직하다. Magazine for semiconductor package of the present invention is formed of a conductive plastic containing carbon nanotubes, it is preferable that the particles of the conductive plastic has a size smaller than 1㎛.
상기 반도체 패키지용 매거진의 표면은, 전도성 금속 코팅층의 접착력을 높이기 위한 접착부와, 상기 접착부 상에 형성된 전도성 금속 코팅층 및 상기 전도성 금속 코팅층을 보호하기 위한 세라믹 코팅층을 포함할 수 있다. The surface of the magazine for semiconductor package may include an adhesive part for increasing the adhesion of the conductive metal coating layer, a conductive metal coating layer formed on the adhesive part, and a ceramic coating layer for protecting the conductive metal coating layer.
본 발명에 의한 반도체 패키지용 매거진에 의하면, 측면부, 상면부 및 하면부가 일체형으로 이루어진 2개의 몸체가 조립됨으로써 상부면 및 하부면의 돌출판이 서로 엇갈리며 조립되는 과정에서 물리적으로 몸체의 휨이 개선되어 플라스틱 재질에서 주로 발생하는 휨 현상을 억제할 수 있다. According to the magazine for semiconductor package according to the present invention, the two body body consisting of the side portion, the upper surface portion and the lower surface portion is assembled to improve the bending of the body physically in the process of assembling the protrusion plate of the upper surface and the lower surface with each other. Therefore, the warpage phenomenon, which occurs mainly in plastic materials, can be suppressed.
또한, 본 발명에 의하면, 섬 모양의 받침돌기로 인해 반도체 패키지용 매거진과 반도체 스트립이 접촉면적이 최소화됨으로써 반도체 패키지용 매거진과 반도체 스트립 간의 마찰로 발생되는 마모를 최소화할 수 있다. In addition, according to the present invention, the contact area between the semiconductor package magazine and the semiconductor strip is minimized due to the island-shaped support protrusions, thereby minimizing wear caused by friction between the semiconductor package magazine and the semiconductor strip.
또한, 본 발명에 의하면, 외부로부터의 충격이나 진동 등에 의해 고정핀이 이탈하거나 헐거워지는 등의 현상이 억제되고 내구성이 우수하다. In addition, according to the present invention, the phenomenon that the fixing pin is separated or loosened due to an impact or vibration from the outside is suppressed and the durability is excellent.
또한, 본 발명에 의하면, 다수 개의 천공이 전면에 고르게 분포되도록 엔드캡을 설계하여 플라즈마가 반도체 스트립의 일부 영역에만 집중되는 것을 방지하여 플라즈마에 의해 반도체 스트립이 변색되는 등의 불량이 발생하는 현상을 최소화할 수 있다.In addition, according to the present invention, the end cap is designed so that a plurality of perforations are evenly distributed on the front surface to prevent the plasma from being concentrated only on a part of the semiconductor strip, thereby causing a defect such as discoloration of the semiconductor strip by the plasma. It can be minimized.
또한, 본 발명에 의하면, 종래에 사용되던 카본섬유 또는 금속섬유와 같은 전도성 충진제 대신에 탄소나노튜브(carbon nano tube; CNT)를 사용하여 분진 발생을 억제할 수 있으며, 전도성 플라스틱 입자는 1㎛보다 작은 나노 크기를 갖기 때문에 불가피한 미세 분진이 발생하는 경우에도 반도체 스트립에 거의 영향을 주지 않는다. In addition, according to the present invention, carbon nanotubes (CNTs) can be used instead of conductive fillers such as carbon fibers or metal fibers, which are conventionally used, and dust generation can be suppressed. Because of their small nano-size, they have little effect on semiconductor strips, even when unavoidable fine dust occurs.
도 1은 본 발명의 바람직한 실시예에 따른 반도체 패키지용 매거진을 도시한 분해 사시도이다. 1 is an exploded perspective view illustrating a magazine for a semiconductor package according to a preferred embodiment of the present invention.
도 2는 반도체 패키지용 매거진의 결합 모습을 도시한 사시도이다. 2 is a perspective view illustrating a bonding state of a magazine for a semiconductor package.
도 3은 반도체 패키지용 매거진의 몸체를 도시한 사시도이고, 도 4는 도 3에 도시된 몸체의 정면도이고, 도 5는 도 3에 도시된 몸체의 배면도이며, 도 6은 도 3에 도시된 몸체의 좌측면도이다. 3 is a perspective view showing a body of a magazine for a semiconductor package, FIG. 4 is a front view of the body shown in FIG. 3, FIG. 5 is a rear view of the body shown in FIG. 3, and FIG. 6 is shown in FIG. 3. Left side view of the body.
도 7은 고정핀의 모습을 도시한 사시도이다. 7 is a perspective view showing the state of the fixing pin.
도 8 내지 도 10은 제1 몸체와 제2 몸체의 결합 관계를 도시한 도면이다. 8 to 10 are views illustrating a coupling relationship between the first body and the second body.
<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>
10a: 제1 몸체 10b: 제2 몸체10a: first body 10b: second body
12a: 제1 몸체의 측면부 12b: 제2 몸체의 측면부12a: side portion of the first body 12b: side portion of the second body
14a: 제1 몸체의 상면부 14b: 제2 몸체의 상면부14a: upper portion of the first body 14b: upper portion of the second body
16a: 제1 몸체의 하면부 16b: 제2 몸체의 하면부16a: lower surface of the first body 16b: lower surface of the second body
18: 가이드채널 20: 고정핀18: guide channel 20: fixed pin
22: 받침돌기 24: 슬롯홈22: base protrusion 24: slot groove
26: 관통공 28: 삽입판26: through hole 28: insert plate
30: 삽입홈 32: 체결공30: insertion groove 32: fastener
34: 체결홀 36: 고정돌기34: fastening hole 36: fixing protrusion
38: 돌출판 40: 엔드캡38: protrusion plate 40: end cap
42: 천공 44: 단턱42: perforation 44: step
46: 지지 플레이트46: support plate
이하, 첨부된 도면을 참조하여 본 발명에 따른 바람직한 실시예를 상세하게 설명하기로 한다. 그러나, 이하의 실시예는 이 기술분야에서 통상적인 지식을 가진 자에게 본 발명이 충분히 이해되도록 제공되는 것으로서 여러 가지 다른 형태로 변형될 수 있으며, 본 발명의 범위가 다음에 기술되는 실시예에 한정되는 것은 아니다. 도면상에서 동일 부호는 동일한 요소를 지칭한다. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the following embodiments are provided to those skilled in the art to fully understand the present invention, and may be modified in various forms, and the scope of the present invention is limited to the embodiments described below. It doesn't happen. Like numbers refer to like elements in the figures.
도 1은 본 발명의 바람직한 실시예에 따른 반도체 패키지용 매거진을 도시한 분해 사시도이다. 도 2는 반도체 패키지용 매거진의 결합 모습을 도시한 사시도이다. 도 3은 반도체 패키지용 매거진의 몸체를 도시한 사시도이다. 도 4는 도 3에 도시된 몸체의 정면도이고, 도 5는 도 3에 도시된 몸체의 배면도이며, 도 6은 도 3에 도시된 몸체의 좌측면도이다. 도 7은 고정핀의 모습을 도시한 사시도이다. 도 8 내지 도 10은 제1 몸체와 제2 몸체의 결합 관계를 도시한 도면이다. 1 is an exploded perspective view illustrating a magazine for a semiconductor package according to a preferred embodiment of the present invention. 2 is a perspective view illustrating a bonding state of a magazine for a semiconductor package. 3 is a perspective view illustrating a body of a magazine for a semiconductor package. 4 is a front view of the body shown in FIG. 3, FIG. 5 is a rear view of the body shown in FIG. 3, and FIG. 6 is a left side view of the body shown in FIG. 3. 7 is a perspective view showing the state of the fixing pin. 8 to 10 are views illustrating a coupling relationship between the first body and the second body.
도 1 내지 도 10을 참조하면, 본 발명의 바람직한 실시예에 따른 반도체 패키지용 매거진은 제1 몸체(10a)와, 제2 몸체(10b)와, 제1 몸체(10a)와 상기 제2 몸체(10b)를 결합하는 결합수단(20)을 포함한다. 제1 몸체(10a)와 제2 몸체(10b)는 각각 측면부, 상면부 및 하면부를 포함하며, 측면부, 상면부 및 하면부가 결합수단에 의해 결합된 것이 아니라 측면부, 상면부 및 하면부가 일체형으로 이루어진다. 1 to 10, a magazine for a semiconductor package according to a preferred embodiment of the present invention includes a first body 10a, a second body 10b, a first body 10a, and a second body ( And a coupling means 20 for coupling 10b). The first body 10a and the second body 10b each include a side portion, an upper surface portion, and a lower surface portion, and the side portion, the upper surface portion, and the lower surface portion are integrally formed instead of the side portion, the upper surface portion, and the lower surface portion being joined by a coupling means. .
제1 몸체(10a)의 측면부(12a)는 반도체 스트립을 수납하는 다수의 가이드채널(18)이 형성되고, 제1 몸체(10a)의 상면부(14a)와 하면부(16a)는 측면부(12a)로부터 수직방향으로 서로 엇갈리게 돌출된 돌출판(38)이 형성되어 있으며, 제1 몸체(10a)의 단면 모양은 'ㄷ'자형을 이룬다. 제2 몸체(10b)는 제1 몸체(10a)와 동일한 구조를 갖되 제1 몸체(10a)에 마주보게 배치된다. 제1 몸체(10a)의 상면부(14a)와 제2 몸체(10b)의 상면부(14b)는 돌출판(38)이 서로 엇갈리도록 배치되고, 제1 몸체(10a)의 하면부(16a)와 제2 몸체(10b)의 하면부(16b)는 돌출판(38)이 서로 엇갈리도록 배치된다. 제1 및 제2 몸체(10a, 10b)의 상면부(14a, 14b)에 형성된 돌출판(38) 하부에 위치하는 하면부(16a, 16b)에는 돌출판(38)이 형성되어 있지 않고, 반대로 제1 및 제2 몸체(10a, 10b)의 하면부(16a, 16b)에 형성된 돌출판(38) 상부에 위치하는 상면부(14a, 14b)에는 돌출판(38)이 형성되어 있지 않은 구조로 이루어진다. The side portion 12a of the first body 10a is formed with a plurality of guide channels 18 for receiving a semiconductor strip, and the upper surface portion 14a and the lower surface portion 16a of the first body 10a have side portions 12a. Protruding plate 38 protruding from each other in the vertical direction from the () is formed, the cross-sectional shape of the first body (10a) forms a 'c' shape. The second body 10b has the same structure as the first body 10a but is disposed to face the first body 10a. The upper surface portion 14a of the first body 10a and the upper surface portion 14b of the second body 10b are arranged such that the protruding plates 38 are alternate with each other, and the lower surface portion 16a of the first body 10a is disposed. The lower surface portion 16b of the second body 10b is disposed such that the protrusion plates 38 are alternate with each other. Protrusion plates 38 are not formed on the lower surface portions 16a and 16b positioned below the protruding plate 38 formed on the upper surface portions 14a and 14b of the first and second bodies 10a and 10b. The protrusions 38 are not formed on the upper surface portions 14a and 14b positioned above the protrusion plates 38 formed on the lower surface portions 16a and 16b of the first and second bodies 10a and 10b. Is done.
제1 및 제2 몸체(10a, 10b)의 상면부(14a, 14b) 및 하면부(16a, 16b)는 적어도 2개의 돌출판(38)을 가질 수 있다. 제1 몸체(10a)의 상면부(14a)와 하면부(16a)에 형성된 돌출판(38)은 측면부(12a)로부터 수직방향으로 서로 엇갈리게 돌출되어 형성되어 있으며, 일정 간격(D)만큼 서로 이격되어 있다. 예컨대, 상면부(14a)는 일정 거리(H1) 만큼 측면부(12a)로부터 돌출된 돌출판(38)이 형성되어 있고 이에 대응하는 하면부(16a)는 돌출판(38)보다 작은 거리(H2) 만큼 돌출된 지지 플레이트(46)로 이루어진다. 상면부(14a)의 돌출판(38)으로부터 가이드채널(18)과 평행한 방향으로 일정 간격(D) 만큼은 상면부(14a)가 돌출판(38)보다 작은 거리(H2) 만큼 돌출되어 있고 이에 대응하는 하면부(16a)는 측면부(12a)로부터 수직방향으로 일정 거리(H1) 만큼 돌출된 돌출판(38)으로 이루어진다. 이와 같이 제1 몸체(10a)의 상면부(14a) 및 하면부(16a)는 측면부(12a)로부터 수직방향으로 서로 엇갈리게 돌출된 돌출판(38)이 형성되어 있으며, 돌출판(38)은 일정 간격(D)만큼 서로 이격되어 있다. 도 1 내지 도 3에서는 3개의 돌출판(38)을 갖는 경우를 예로 들어 도시하였다. The upper surface portions 14a and 14b and the lower surface portions 16a and 16b of the first and second bodies 10a and 10b may have at least two protrusion plates 38. The protruding plates 38 formed on the upper surface portion 14a and the lower surface portion 16a of the first body 10a are formed to alternately protrude from each other in the vertical direction from the side portion 12a, and are spaced apart from each other by a predetermined distance D. It is. For example, the upper surface portion 14a has a protrusion plate 38 protruding from the side portion 12a by a predetermined distance H1, and the lower surface portion 16a corresponding thereto has a smaller distance H2 than the protrusion plate 38. It consists of a support plate 46 which protrudes. The upper surface portion 14a protrudes by a distance H2 smaller than the protrusion plate 38 by a predetermined distance D in a direction parallel to the guide channel 18 from the protrusion plate 38 of the upper surface portion 14a. The corresponding lower surface portion 16a consists of a protruding plate 38 protruding from the side portion 12a in the vertical direction by a predetermined distance H1. As described above, the upper surface portion 14a and the lower surface portion 16a of the first body 10a are provided with protrusion plates 38 protruding from each other in the vertical direction from the side portions 12a, and the protrusion plates 38 are fixed. Spaced apart from each other by a distance (D). 1 to 3 illustrate an example in which three protrusion plates 38 are provided.
제2 몸체(10b)는 제1 몸체(10a)와 동일한 구조를 갖되 상기 제1 몸체(10a)에 마주보게 배치된다. 제1 몸체(10a)의 상면부(14a)와 제2 몸체(10b)의 상면부(14b)는 돌출된 부분(돌출판)이 서로 엇갈리도록 배치되고, 제1 몸체(10a)의 하면부(16a)와 제2 몸체(10b)의 하면부(16b)는 돌출된 부분이 서로 엇갈리도록 배치된다. The second body 10b has the same structure as the first body 10a but is disposed to face the first body 10a. The upper surface portion 14a of the first body 10a and the upper surface portion 14b of the second body 10b are arranged so that the protruding portions (protrusion plates) are alternate with each other, and the lower surface portion of the first body 10a ( The lower surface part 16b of 16a) and the 2nd body 10b are arrange | positioned so that the protruding part may mutually cross | intersect.
플라스틱 재질로 반도체 패키지용 매거진의 몸체 부분을 형성하는 경우, 구조상의 문제로 인해 플라스틱 사출 가공 이후에 휨 문제가 발생하게 되는데, 이러한 휨 현상이 발생하게 되면 반도체 스트립을 가이드채널(18)에 로딩(loading)하거나 언로딩(unloading)할 때 반도체 스트립에 불량을 초래할 수 있다. 본 발명에서는 이러한 문제를 해결하기 위하여 반도체 패키지용 매거진은 2개의 'ㄷ'자형 몸체를 결합하여 설치된 구조를 갖는다. 2개의 몸체(10a, 10b)가 조립될 때 상부면 및 하부면의 돌출판(38)이 서로 엇갈리며 조립되는 과정에서 물리적으로 몸체(10a, 10b)의 휨이 개선될 수 있다. When forming the body portion of the magazine for semiconductor packages made of plastic material, the structural problems cause a warping problem after the plastic injection process, if the bending occurs, the semiconductor strip is loaded into the guide channel 18 ( Loading or unloading may cause defects in the semiconductor strip. In the present invention, in order to solve this problem, the semiconductor package magazine has a structure installed by combining two 'c' shaped bodies. When the two bodies 10a and 10b are assembled, the bending of the bodies 10a and 10b may be physically improved while the protrusion plates 38 of the upper and lower surfaces are alternately assembled.
또한, 본 발명의 바람직한 다른 실시예에 따른 반도체 패키지용 매거진은, 측면부(12a)에 반도체 스트립을 수납하는 다수의 가이드채널(18)이 형성되고 상면부(14a)와 하면부(16a)는 측면부(12a)의 일부로부터 수직방향으로 돌출된 돌출판(38)이 형성되어 있으며 단면 모양이 'ㄷ'자형인 제1 몸체와, 측면부(12b)는 반도체 스트립을 수납하는 다수의 가이드채널(18)이 형성되고 상면부(14b)와 하면부(16b)는 측면부(12b)의 일부로부터 수직방향으로 돌출된 돌출판(38)이 형성된 제2 몸체(10b)와, 제1 몸체(10a)와 제2 몸체(10b)를 결합하는 결합수단을 포함하며, 제2 몸체(10b)의 상면부(14b)에 형성된 돌출판(38)은 제1 몸체(10a)의 상면부(14a)에 형성된 돌출판(38)에 대하여 엇갈려 돌출되게 형성되고 제2 몸체(10b)의 하면부(16b)에 형성된 돌출판(38)은 제1 몸체(10a)의 하면부(16a)에 형성된 돌출판(38)에 대하여 엇갈려 돌출되게 형성된 것일 수도 있다. 이 경우는 제1 몸체(10a)와 제2 몸체(10b)가 동일한 구조가 아닌 다른 구조를 가질 수도 있음을 나타낸다. 예를 들면, 제1 몸체(10a)의 상면부(14a)와 하면부(16a)에 형성된 돌출판(38)이 상하로 대향되게 구비되고, 제2 몸체(10b)의 상면부(14b)와 하면부(16b)에 형성된 돌출판(38)이 상하로 대향되게 구비되며, 제2 몸체(10b)의 상면부(14b)에 형성된 돌출판(38)은 제1 몸체(10a)의 상면부(14a)에 형성된 돌출판(38)에 대하여 엇갈려 돌출되게 형성되고 제2 몸체(10b)의 하면부(16b)에 형성된 돌출판(38)은 제1 몸체(10a)의 하면부(16a)에 형성된 돌출판(38)에 대하여 엇갈려 돌출되게 형성된다.In addition, in the magazine for semiconductor package according to another preferred embodiment of the present invention, a plurality of guide channels 18 for storing semiconductor strips are formed in the side surface portion 12a, and the upper surface portion 14a and the lower surface portion 16a are formed on the side surface portion. A protruding plate 38 protruding in a vertical direction from a portion of the portion 12a is formed, and a first body having a cross-sectional shape of a 'c' shape, and the side portion 12b includes a plurality of guide channels 18 for receiving a semiconductor strip. The upper surface portion 14b and the lower surface portion 16b are formed, and the second body 10b and the first body 10a and the first protrusion 10 formed with a protruding plate 38 protruding in a vertical direction from a part of the side portion 12b. 2 includes a coupling means for coupling the body (10b), the protrusion plate 38 formed on the upper surface portion 14b of the second body (10b) is a protrusion plate formed on the upper surface portion (14a) of the first body (10a) The protruding plate 38 formed to be staggered with respect to the 38 and formed on the lower surface portion 16b of the second body 10b is shaped on the lower surface portion 16a of the first body 10a. The stone can also be formed to protrude staggered with respect to the publication (38). This case indicates that the first body 10a and the second body 10b may have other structures than the same structure. For example, the upper surface portion 14a of the first body 10a and the protruding plate 38 formed on the lower surface portion 16a are provided to face up and down, and the upper surface portion 14b of the second body 10b Protruding plate 38 formed on the lower surface portion 16b is provided to face up and down, and the protruding plate 38 formed on the upper surface portion 14b of the second body 10b is the upper surface portion (1) of the first body 10a. Protruding plate 38 formed on the lower surface portion 16b of the second body 10b is formed on the lower surface portion 16a of the first body 10a. The protrusions 38 are alternately formed to protrude.
본 발명의 바람직한 실시예에 따른 반도체 패키지용 매거진은, 제1 및 제2 몸체(10a, 10b)의 측면부(12a, 12b)의 내측면에는 일정 간격으로 분리된 다수의 섬 모양의 받침돌기(22)가 형성되어 있다. 받침돌기(22)들이 일정하게 배열되어 열을 이루고, 이러한 받침돌기(22)의 열이 일정한 간격으로 다수 배열된 구조로 이루어진다. 받침돌기(22)와 받침돌기(22) 사이는 반도체 스트립을 수납하는 가이드채널(18)을 이룬다. 가이드채널(18)에 수직한 방향으로 받침돌기(22)와 받침돌기(22) 사이는 슬롯홈(24)이 형성되어 있고, 슬롯홈(24)은 일정 간격으로 다수 개 형성되어 있다. 섬 모양의 받침돌기(22)로 인해 반도체 패키지용 매거진과 반도체 스트립이 접촉되는 부분이 최소화됨으로써 반도체 패키지용 매거진과 반도체 스트립 간의 마찰로 발생되는 마모를 최소화할 수 있다. In the magazine for semiconductor package according to the preferred embodiment of the present invention, a plurality of island-shaped support protrusions 22 separated at regular intervals on inner surfaces of the side parts 12a and 12b of the first and second bodies 10a and 10b. ) Is formed. The supporting protrusions 22 are arranged in a row to form a row, and the rows of the supporting protrusions 22 are formed in a plurality of structures at regular intervals. The support protrusion 22 and the support protrusion 22 form a guide channel 18 for receiving a semiconductor strip. Slot grooves 24 are formed between the support protrusions 22 and the support protrusions 22 in a direction perpendicular to the guide channel 18, and a plurality of slot grooves 24 are formed at predetermined intervals. The island-shaped support protrusion 22 minimizes the contact between the semiconductor package magazine and the semiconductor strip, thereby minimizing wear caused by friction between the semiconductor package magazine and the semiconductor strip.
상기 반도체 스트립이 가이드채널(18)에 삽입될 때 걸리지 않도록 받침돌기(22)의 코너 부분은 둥글게 라운딩되어 있고, 슬롯홈(24)의 내측 코너 부분도 둥글게 라운딩되어 있다. 받침돌기(22)의 코너 부분을 둥글게 라운딩(rounging) 가공처리 함으로써 반도체 스트립을 가이드채널(18)에 로딩(loading)하거나 언로딩(unloading) 시에 발생될 수 있는 걸림 현상을 억제하였고, 또한 슬롯홈(24)의 내측 코너 부분을 둥글레 라운딩 가공처리하여 슬롯홈(24) 측면에서 발생될 수 있는 걸림 문제도 억제하였다. The corner portion of the support protrusion 22 is rounded and the inner corner portion of the slot groove 24 is rounded so as not to be caught when the semiconductor strip is inserted into the guide channel 18. By rounding the corners of the support protrusion 22, a jamming phenomenon that may occur when loading or unloading the semiconductor strip into the guide channel 18 is suppressed, and the slot The inner corner portion of the groove 24 was rounded to reduce the problem of jamming that may occur in the slot groove 24 side.
본 발명의 바람직한 실시예에 따른 반도체 패키지용 매거진은, 제1 몸체(10a)의 상면부(14a) 및 하면부(16a)에는 관통공(26)을 갖는 삽입판(28)이 형성되어 있고, 삽입판(28)이 형성된 제1 몸체(10a)의 상면부(14a) 및 하면부(16a)에 대향하는 제2 몸체(10b)의 상면부(14b) 및 하면부(16b)에는 삽입판(28)이 삽착되는 삽입홈(30)과, 삽입홈(30)까지 관통되게 형성된 체결공(32)과, 체결공(32) 하부에 연장되게 형성되고 관통공(26)보다 큰 직경을 갖는 체결홀(34)과, 체결홀(34) 내에 상방향으로 돌출되고 내경이 하방향으로 갈수록 커지는 원뿔기둥 형상의 고정돌기(36)가 형성되어 있다. 삽입판(28)은 제1 몸체(10a)의 상면부(14a) 및 하면부(16b)에 형성된 돌출판(38)에 연결되어 형성되어 있을 수 있다. In the magazine for semiconductor package according to the preferred embodiment of the present invention, an insertion plate 28 having a through hole 26 is formed in the upper surface portion 14a and the lower surface portion 16a of the first body 10a. An insertion plate (14b) and a lower surface portion 16b of the second body 10b facing the upper surface portion 14a and the lower surface portion 16a of the first body 10a on which the insertion plate 28 is formed. 28 is inserted into the insertion groove 30, the fastening hole 32 formed to penetrate to the insertion groove 30, the fastening hole formed to extend below the fastening hole 32 and having a diameter larger than the through hole 26 In the hole 34 and the fastening hole 34, a conical pillar-shaped fixing protrusion 36 is formed which protrudes upward and becomes larger in the downward direction. The insertion plate 28 may be connected to the protrusion plate 38 formed on the upper surface portion 14a and the lower surface portion 16b of the first body 10a.
또한, 제2 몸체(10b)의 상면부(14b) 및 하면부(16b)에는 관통공(26)을 갖는 삽입판(28)이 형성되어 있고, 삽입판(28)이 형성된 제2 몸체(10b)의 상면부(14b) 및 하면부(16b)에 대향하는 제1 몸체(10a)의 상면부(14a) 및 하면부(16a)에는 삽입판(28)이 삽착되는 삽입홈(30)과, 삽입홈(30)까지 관통되게 형성된 체결공(32)과, 체결공(32) 하부에 연장되게 형성되고 관통공(26)보다 큰 직경을 갖는 체결홀(34)과, 체결홀(34) 내에 상방향으로 돌출되고 내경(d1)이 하방향으로 갈수록 커지는 원뿔기둥 형상의 고정돌기(36)가 형성되어 있다. 삽입판(28)은 제2 몸체(10b)의 상면부(14b) 및 하면부(16b)에 형성된 돌출판(38)에 연결되어 형성되어 있을 수 있다. In addition, an insertion plate 28 having a through hole 26 is formed in the upper surface portion 14b and the lower surface portion 16b of the second body 10b, and the second body 10b in which the insertion plate 28 is formed. An insertion groove 30 into which the insertion plate 28 is inserted into the upper surface portion 14a and the lower surface portion 16a of the first body 10a opposed to the upper surface portion 14b and the lower surface portion 16b of A fastening hole 32 formed to penetrate the insertion groove 30, a fastening hole 34 formed to extend below the fastening hole 32, and having a diameter larger than that of the through hole 26, and in the fastening hole 34. The fixing projection 36 is formed in a conical column shape which protrudes upward and becomes larger as the inner diameter d1 goes downward. The insertion plate 28 may be connected to the protrusion plate 38 formed on the upper surface portion 14b and the lower surface portion 16b of the second body 10b.
제1 몸체(10a)와 제2 몸체(10b)는 고정핀(20)에 의해 결합된다. 고정핀(20)는 헤드부(20a)와 조립부(20b)로 이루어지며, 조립부(20b)는 고정돌기(36)의 상부 외경(d2)보다는 크고 고정돌기(36)의 하부 외경(d3)보다는 작은 내경(d1)을 갖는다. The first body 10a and the second body 10b are coupled by the fixing pin 20. The fixing pin 20 is composed of a head portion 20a and an assembling portion 20b, and the assembling portion 20b is larger than the upper outer diameter d2 of the fixing protrusion 36 and the lower outer diameter d3 of the fixing protrusion 36. Has an inner diameter d1 rather than
고정핀(20)의 조립부(20b)은 체결공(32), 관통공(26) 및 체결홀(34)에 순차 삽입되어 제1 몸체(10a)와 제2 몸체(10b)를 결합시킨다. 조립부(20b)는 체결홀(34)에 삽입되면서 내경(d1)이 하방향으로 갈수록 커지는 원뿔기둥 형상의 고정돌기(36)에 의해 도 10에 도시된 바와 같이 외곽 방향으로 벌어져서 외곡되게 된다. 이렇게 조립부(20b)가 외곽 방향으로 외곡된 부분은 삽입판(28)에 의해 생긴 단턱(44)에 걸리게 되어 고정핀(20)이 빠지지 않게 된다. 이로 인하여 충격에 의해 고정핀(20)이 이탈하거나 헐거워지는 등의 문제를 해결할 수 있고, 한층 견고한 매거진을 보장하여 내구성이 충분히 확보되게 된다. 고정핀(20)의 조립부(20b)는 체결홀(34)에 삽입되면서 고절돌기(36)의 외면을 따라 외곽 방향으로 용이하게 벌어지도록 하기 위하여 도 7에 도시된 바와 같이 적어도 2개의 부분으로 분할되게 형성되는 것이 바람직하다. The assembly portion 20b of the fixing pin 20 is sequentially inserted into the fastening hole 32, the through hole 26, and the fastening hole 34 to couple the first body 10a and the second body 10b. The assembly portion 20b is inserted into the fastening hole 34 and is bent in the outer direction as shown in FIG. 10 by the fixing projection 36 having a conical column shape that increases in the downward direction. The assembly portion 20b is bent in the outward direction is caught by the step 44 caused by the insertion plate 28 so that the fixing pin 20 does not fall. As a result, problems such as detachment or loosening of the fixing pin 20 due to the impact can be solved, and a more stable magazine is ensured to ensure sufficient durability. The assembly portion 20b of the fixing pin 20 is inserted into the fastening hole 34 to be at least two parts as shown in FIG. 7 so as to be easily opened in the outward direction along the outer surface of the high protrusion 36. It is preferably formed to be divided.
또한, 본 발명의 바람직한 실시예에 따른 반도체 패키지용 매거진은 플라즈마 클리닝 시에 과도한 플라즈마에 의해 반도체 스트립이 변색되는 것을 억제하도록 다수 개의 천공(42)이 고르게 분포되게 형성된 엔드캡(40)을 더 포함할 수 있다. 넓은 면적의 창으로 설계된 종래의 엔드캡(end cap)은 플라즈마 클리닝(cleaning) 시에 과도한 플라즈마에 의해 반도체 스트립이 변색되는 등의 불량이 발생되고 있다. 이를 해결하기 위하여 다수 개의 천공(42)이 전면에 고르게 분포되도록 엔드캡(40)을 설계하여 플라즈마가 반도체 스트립의 일부 영역에만 집중되는 것을 방지할 수 있다. In addition, the magazine for semiconductor packages according to a preferred embodiment of the present invention further includes an end cap 40 formed so that a plurality of perforations 42 are evenly distributed so as to prevent the semiconductor strip from discoloring by excessive plasma during plasma cleaning. can do. Conventional end caps designed with large area windows have defects such as discoloration of semiconductor strips due to excessive plasma during plasma cleaning. In order to solve this problem, the end cap 40 may be designed such that the plurality of perforations 42 are evenly distributed on the front surface, thereby preventing the plasma from concentrating only on a part of the semiconductor strip.
또한, 본 발명의 바람직한 실시예에 따른 반도체 패키지용 매거진은 반도체 패키지용 매거진의 일련 번호를 확인하기 위한 위한 바코드, 시리얼번호 또는 RFID가 삽입되는 식별인식부(미도시)를 더 포함할 수 있다. In addition, the magazine for semiconductor package according to a preferred embodiment of the present invention may further include an identification recognition unit (not shown) to insert a barcode, serial number or RFID for confirming the serial number of the magazine for semiconductor package.
또한, 본 발명의 바람직한 실시예에 따른 반도체 패키지용 매거진은 탄소나노튜브가 함유된 전도성 플라스틱으로 형성되고, 상기 전도성 플라스틱의 입자는 1㎛보다 작은 크기를 갖는 것이 바람직하다. 엔지니어링 플라스틱에 전도성 부여하기 위하여 카본섬유 또는 금속섬유를 첨가하게 되는데, 플라스틱의 마모로 인한 분진이 발생되면서 카본섬유 또는 금속섬유와 같은 전도성 충진제들이 반도체 조립 공정 중에 반도체 스트립 위에 떨어져 심각한 불량이 자주 발생하게 된다. 이러한 문제를 해결하기 위하여 본 발명의 바람직한 실시예에서는 종래에 사용되던 카본섬유 또는 금속섬유와 같은 전도성 충진제 대신에 탄소나노튜브(carbon nano tube; CNT)를 사용하여 분진 발생을 억제하였으며, 동시에 불가피한 미세 분진의 발생하는 경우에도 반도체 스트립에 영향을 주지 않기 위해 전도성 플라스틱 입자가 1㎛보다 작은 나노 크기를 갖도록 전도성 플라스틱을 제작한다. In addition, the magazine for semiconductor packages according to a preferred embodiment of the present invention is formed of a conductive plastic containing carbon nanotubes, it is preferable that the particles of the conductive plastic has a size smaller than 1㎛. Carbon fibers or metal fibers are added to give conductivity to engineering plastics. As dust generated by abrasion of plastics causes conductive fillers such as carbon fibers or metal fibers to fall on the semiconductor strip during the semiconductor assembly process, causing serious defects frequently. do. In order to solve this problem, in the preferred embodiment of the present invention, carbon nanotubes (CNTs) are used instead of conductive fillers such as carbon fibers or metal fibers, which have been used in the past, to suppress dust generation, and at the same time, inevitable fineness. Conductive plastics are manufactured so that the conductive plastic particles have a nano size of less than 1 μm so as not to affect the semiconductor strip even when dust is generated.
반도체 패키지의 제조에 사용되는 자동화된 반도체 장비들 중에는 금속으로 이루어진 반도체 패키지용 매거진만을 인식하는 경우가 있다. 따라서, 플라스틱 재질로 이루어진 반도체 패키지용 매거진은 이들 자동화된 장비에서 인식되지 못하여 반도체 패키지 공정이 이루어지지 못하는 경우가 발생할 수 있다. 본 발명에서는 이를 해결하기 위하여 반도체 패키지용 매거진의 표면을 전도성 금속 코팅층으로 코팅하여 자동화된 장비가 인식될 수 있도록 한다. 일반적으로 금속 코팅층과 플라스틱은 접착성이 떨어지기 때문에 금속 코팅층의 접착력을 높이기 위하여 접착부를 먼저 형성하고, 상기 접착부 상에 전도성 금속 코팅층을 형성한다. 상기 전도성 금속 코팅층은 금(Au), 은(Ag), 알루미늄(Al), 구리(Cu)와 같은 금속 분말을 이용하여 스프레이 분사법, 딥코팅 등을 이용하여 형성할 수 있다. 또한, 상기 전도성 금속 코팅층을 보호하기 위하여 전도성 금속 코팅층 상에는 세라믹 코팅층을 형성하는 것이 바람직하다. 상기 세라믹 코팅층은 알루미나, 지르코니아와 같은 세라믹 분말을 도료에 섞어 스프레이 분사법 등을 이용하여 형성할 수 있다. Among the automated semiconductor equipments used in the manufacture of semiconductor packages, only a magazine for a semiconductor package made of metal is recognized. Accordingly, a magazine for semiconductor package made of plastic may not be recognized by these automated equipments, and thus the semiconductor package process may not be performed. In the present invention, to solve this problem, the surface of the magazine for semiconductor package is coated with a conductive metal coating layer so that the automated equipment can be recognized. In general, since the metal coating layer and the plastic are inferior in adhesion, an adhesion part is first formed in order to increase the adhesion of the metal coating layer, and then a conductive metal coating layer is formed on the adhesion part. The conductive metal coating layer may be formed by spray spraying, dip coating, or the like using metal powders such as gold (Au), silver (Ag), aluminum (Al), and copper (Cu). In addition, in order to protect the conductive metal coating layer, it is preferable to form a ceramic coating layer on the conductive metal coating layer. The ceramic coating layer may be formed by mixing a ceramic powder, such as alumina and zirconia, into the paint using a spray spraying method or the like.
이상, 본 발명의 바람직한 실시예를 들어 상세하게 설명하였으나, 본 발명은 상기 실시예에 한정되는 것은 아니며, 본 발명의 기술적 사상의 범위내에서 당 분야에서 통상의 지식을 가진 자에 의하여 여러 가지 변형이 가능하다.As mentioned above, although preferred embodiment of this invention was described in detail, this invention is not limited to the said embodiment, A various deformation | transformation by a person of ordinary skill in the art within the scope of the technical idea of this invention is carried out. This is possible.
플라스틱 재질에 주로 발생하는 휨 현상을 억제할 수 있고, 반도체 스트립과 반도체 패키지용 매커진의 접촉면적을 최소화하여 마찰에 의한 마모를 최소화할 수 있으며, 외부로부터의 충격이나 진동 등에 의해 고정핀이 이탈하거나 헐거워지는 등의 현상을 억제하여 내구성이 우수한 반도체 패키지용 매거진으로서 산업상 이용이 가능하다.It is possible to suppress the warpage phenomenon that occurs mainly in plastic materials, minimize the contact area between the semiconductor strip and the magazine for the semiconductor package, thereby minimizing abrasion due to friction. It is possible to use industrially as a magazine for semiconductor packages which is excellent in durability by suppressing a phenomenon such as being loosened or loosened.

Claims (18)

  1. 반도체 스트립이 수납되는 반도체 패키지용 매거진에 있어서, In the magazine for semiconductor packages in which the semiconductor strip is stored,
    측면부는 반도체 스트립을 수납하는 다수의 가이드채널이 형성되고 상면부와 하면부는 상기 측면부로부터 수직방향으로 서로 엇갈리게 돌출된 돌출판이 형성되어 있으며 단면 모양이 'ㄷ'자형인 제1 몸체;The first side is formed with a plurality of guide channels for receiving the semiconductor strip and the upper surface and the lower surface is formed with a protrusion plate protruding from each other in the vertical direction from the side portion and the cross-sectional shape of the first body;
    상기 제1 몸체와 동일한 구조를 갖되 상기 제1 몸체에 마주보게 배치된 제2 몸체; 및A second body having the same structure as the first body and disposed to face the first body; And
    상기 제1 몸체와 상기 제2 몸체를 결합하는 결합수단을 포함하며, It includes a coupling means for coupling the first body and the second body,
    상기 제1 몸체의 상면부와 상기 제2 몸체의 상면부는 상기 돌출판이 서로 엇갈리도록 배치되고, 제1 몸체의 하면부와 상기 제2 몸체의 하면부는 상기 돌출판이 서로 엇갈리도록 배치된 것을 특징으로 하는 반도체 패키지용 매거진.The upper surface portion of the first body and the upper surface portion of the second body is disposed so that the protruding plate is alternated with each other, the lower surface portion of the first body and the lower surface portion of the second body is arranged so that the protruding plate is alternated with each other. Magazine for semiconductor packages.
  2. 반도체 스트립이 수납되는 반도체 패키지용 매거진에 있어서, In the magazine for semiconductor packages in which the semiconductor strip is stored,
    측면부는 반도체 스트립을 수납하는 다수의 가이드채널이 형성되고 상면부와 하면부는 상기 측면부의 일부로부터 수직방향으로 돌출된 돌출판이 상하로 대향되게 형성되어 있으며 단면 모양이 'ㄷ'자형인 제1 몸체;The side surface portion is formed with a plurality of guide channels for receiving the semiconductor strip, and the upper surface portion and the lower surface portion is formed with the protruding plate protruding vertically from a portion of the side portion facing up and down, the first body having a cross-sectional shape '' 'shaped ;
    측면부는 반도체 스트립을 수납하는 다수의 가이드채널이 형성되고 상면부와 하면부는 상기 측면부의 일부로부터 수직방향으로 돌출된 돌출판이 상하로 대향되게 형성된 제2 몸체; 및The second side body is formed with a plurality of guide channels for receiving the semiconductor strip and the upper surface portion and the lower surface portion protruding plate protruding in a vertical direction from a portion of the side portion; And
    상기 제1 몸체와 상기 제2 몸체를 결합하는 결합수단을 포함하며, It includes a coupling means for coupling the first body and the second body,
    상기 제2 몸체의 상면부에 형성된 돌출판은 상기 제1 몸체의 상면부에 형성된 돌출판에 대하여 엇갈려 돌출되게 형성되고 상기 제2 몸체의 하면부에 형성된 돌출판은 상기 제1 몸체의 하면부에 형성된 돌출판에 대하여 엇갈려 돌출되게 형성된 것을 특징으로 하는 반도체 패키지용 매거진.The protruding plate formed on the upper surface of the second body is formed to protrude alternately with respect to the protruding plate formed on the upper surface of the first body, and the protruding plate formed on the lower surface of the second body is provided on the lower surface of the first body. Magazine for a semiconductor package, characterized in that formed to project alternately with respect to the formed protrusion plate.
  3. 반도체 스트립을 수납하는 다수의 가이드채널이 형성된 한쌍의 측면부와, 상면부 및 하면부를 포함하는 반도체 패키지용 매거진에 있어서, In a magazine for semiconductor packages comprising a pair of side portions, a top portion and a bottom portion formed with a plurality of guide channels for receiving a semiconductor strip,
    상기 측면부의 내측면에 일정 간격으로 분리된 섬 모양으로 형성된 다수의 받침돌기;A plurality of support protrusions formed in island shapes separated at predetermined intervals on an inner surface of the side portion;
    상기 받침돌기와 받침돌기 사이에 형성되고 반도체 스트립을 수납하는 다수의 가이드채널; 및A plurality of guide channels formed between the pedestal and the pedestal and receiving the semiconductor strips; And
    상기 가이드채널에 수직한 방향으로 상기 받침돌기와 받침돌기 사이에 형성된 다수의 슬롯홈을 포함하는 반도체 패키지용 매거진.Magazine for a semiconductor package including a plurality of slot grooves formed between the support projection and the support projection in a direction perpendicular to the guide channel.
  4. 반도체 스트립을 수납하는 다수의 가이드채널이 형성된 측면부와, 관통공을 갖는 삽입판이 형성된 상면부 및 하면부를 포함하는 제1 몸체; 및A first body including a side portion having a plurality of guide channels for accommodating a semiconductor strip, and an upper surface portion and a lower surface portion having an insertion plate having a through hole; And
    반도체 스트립을 수납하는 다수의 가이드채널이 형성된 측면부, 상면부 및 하면부를 포함하는 제2 몸체를 포함하며, A second body including a side portion, an upper surface portion, and a lower surface portion formed with a plurality of guide channels for receiving the semiconductor strip,
    상기 삽입판이 형성된 상면부 및 하면부에 대향하는 상기 제2 몸체의 상면부 및 하면부에는 상기 삽입판이 삽착되는 삽입홈과, 상기 삽입홈까지 관통되게 형성된 체결공과, 상기 체결공 하부에 연장되게 형성되고 상기 관통공보다 큰 직경을 갖는 체결홀과, 상기 체결홀 내에 상방향으로 돌출되고 내경이 하방향으로 갈수록 커지는 원뿔기둥 형상의 고정돌기가 형성되어 있고, The upper and lower surfaces of the second body facing the upper and lower surfaces of the insertion plate are formed with insertion grooves into which the insertion plate is inserted, fastening holes formed to penetrate through the insertion grooves, and extending below the fastening holes. And a fastening hole having a diameter larger than that of the through hole, and a convex column-shaped fixing protrusion protruding upward in the fastening hole and increasing inwardly downward.
    상기 고정돌기의 상부 외경보다는 크고 상기 고정돌기의 하부 외경보다는 작은 내경을 갖고, 상기 체결공, 상기 관통공 및 상기 체결홀에 순차 삽입되어 상기 제1 몸체와 상기 제2 몸체를 결합시키는 고정핀을 포함하는 반도체 패키지용 매거진.A fixing pin having an inner diameter larger than an upper outer diameter of the fixing protrusion and smaller than a lower outer diameter of the fixing protrusion and sequentially inserted into the fastening hole, the through hole, and the fastening hole to couple the first body and the second body. Magazine for semiconductor package containing.
  5. 제1항, 제2항 또는 제4항 중 어느 하나의 항에 있어서, 상기 제1 및 제2 몸체의 측면부의 내측면에는 일정 간격으로 분리된 다수의 섬 모양의 받침돌기가 형성되어 있고, 받침돌기와 받침돌기 사이는 반도체 스트립을 수납하는 가이드채널을 이루며, 상기 가이드채널에 수직한 방향으로 상기 받침돌기와 받침돌기 사이에 다수의 슬롯홈이 형성되어 있는 것을 특징으로 하는 반도체 패키지용 매거진.According to any one of claims 1, 2 or 4, wherein the inner surface of the side portion of the first and second body is formed with a plurality of island-like support protrusions separated at regular intervals, Magazines for semiconductor packages comprising a guide channel for receiving a semiconductor strip between the supporting protrusions, a plurality of slot grooves formed between the supporting protrusions and the supporting protrusions in a direction perpendicular to the guide channel.
  6. 제5항에 있어서, 상기 반도체 스트립이 상기 가이드채널에 삽입될 때 걸리지 않도록 상기 받침돌기의 코너 부분 및 상기 슬롯홈의 내측 코너 부분은 둥글게 라운딩되어 있는 것을 특징으로 하는 반도체 패키지용 매거진.The magazine according to claim 5, wherein the corner portion of the support protrusion and the inner corner portion of the slot groove are rounded so as not to be caught when the semiconductor strip is inserted into the guide channel.
  7. 제3항에 있어서, 상기 반도체 스트립이 상기 가이드채널에 삽입될 때 걸리지 않도록 상기 받침돌기의 코너 부분 및 상기 슬롯홈의 내측 코너 부분은 둥글게 라운딩되어 있는 것을 특징으로 하는 반도체 패키지용 매거진.The magazine of claim 3, wherein the corner portion of the support protrusion and the inner corner portion of the slot groove are rounded so as not to be caught when the semiconductor strip is inserted into the guide channel.
  8. 제1항 또는 제2항에 있어서, 상기 제1 몸체의 상면부 및 하면부에는 관통공을 갖는 삽입판이 형성되어 있고, 상기 제2 몸체의 상면부 및 하면부에는 상기 삽입판이 삽착되는 삽입홈과, 상기 삽입홈까지 관통되게 형성된 체결공과, 상기 체결공 하부에 연장되게 형성되고 상기 관통공보다 큰 직경을 갖는 체결홀과, 상기 체결홀 내에 상방향으로 돌출되고 내경이 하방향으로 갈수록 커지는 원뿔기둥 형상의 고정돌기가 형성되어 있으며, 상기 고정돌기의 상부 외경보다는 크고 상기 고정돌기의 하부 외경보다는 작은 내경을 갖고 상기 체결공, 상기 관통공 및 상기 체결홀에 순차 삽입되어 상기 제1 몸체와 상기 제2 몸체를 결합시키는 고정핀을 포함하는 반도체 패키지용 매거진.According to claim 1 or 2, wherein the upper and lower portions of the first body is formed with an insertion plate having a through hole, the upper and lower portions of the second body and the insertion groove into which the insertion plate is inserted; A fastening hole formed to penetrate the insertion groove, a fastening hole extending below the fastening hole, the fastening hole having a diameter larger than the through hole, and a conical column protruding upward in the fastening hole and increasing inwardly downward. The fixing protrusion has a shape, and has an inner diameter larger than the upper outer diameter of the fixing protrusion and smaller than the lower outer diameter of the fixing protrusion and is sequentially inserted into the fastening hole, the through hole, and the fastening hole, so that the first body and the first fixing protrusion are formed. 2 Magazine for semiconductor package including a fixing pin for engaging the body.
  9. 제3항에 있어서, 상기 반도체용 패키지 매거진은, The method of claim 3, wherein the semiconductor package magazine,
    측면부, 상면부 및 하면부를 포함하는 제1 몸체와, 측면부, 상면부 및 하면부를 포함하는 제2 몸체가 상기 제1 몸체에 대향되게 배치되며, A first body including a side portion, an upper surface portion and a lower surface portion, and a second body including a side portion, an upper surface portion and a lower surface portion are disposed to face the first body,
    상기 제1 몸체의 상면부 및 하면부에는 관통공을 갖는 삽입판이 형성되어 있고, 상기 제2 몸체의 상면부 및 하면부에는 상기 삽입판이 삽착되는 삽입홈과, 상기 삽입홈까지 관통되게 형성된 체결공과, 상기 체결공 하부에 연장되게 형성되고 상기 관통공보다 큰 직경을 갖는 체결홀과, 상기 체결홀 내에 상방향으로 돌출되고 내경이 하방향으로 갈수록 커지는 원뿔기둥 형상의 고정돌기가 형성되어 있으며, 상기 고정돌기의 상부 외경보다는 크고 상기 고정돌기의 하부 외경보다는 작은 내경을 갖고 상기 체결공, 상기 관통공 및 상기 체결홀에 순차 삽입되어 상기 제1 몸체와 상기 제2 몸체를 결합시키는 고정핀을 포함하는 반도체 패키지용 매거진.Insertion plates having through holes are formed in the upper and lower surfaces of the first body, and insertion grooves into which the insertion plates are inserted, and fastening holes formed to penetrate the insertion grooves, respectively. A fastening hole formed in the lower part of the fastening hole and having a diameter larger than that of the through hole, and a convex column-shaped fixing protrusion protruding upward in the fastening hole and increasing inwardly in the downward direction. And a fixing pin having an inner diameter larger than the upper outer diameter of the fixing protrusion and smaller than the lower outer diameter of the fixing protrusion and sequentially inserted into the fastening hole, the through hole, and the fastening hole to couple the first body and the second body. Magazine for semiconductor packages.
  10. 제3항 또는 제4항에 있어서, 측면부는 반도체 스트립을 수납하는 다수의 가이드채널이 형성되고 상면부와 하면부는 상기 측면부로부터 수직방향으로 서로 엇갈리게 돌출된 돌출판이 형성되어 있으며 단면 모양이 'ㄷ'자형인 제1 몸체;The side surface portion is formed with a plurality of guide channels for receiving the semiconductor strip, the upper surface portion and the lower surface portion is formed with a protrusion plate protruding from each other in the vertical direction from the side portion and the cross-sectional shape 'c' 'Shaped first body;
    상기 제1 몸체와 동일한 구조를 갖되 상기 제1 몸체에 마주보게 배치된 제2 몸체; 및A second body having the same structure as the first body and disposed to face the first body; And
    상기 제1 몸체와 상기 제2 몸체를 결합하는 결합수단을 포함하며, It includes a coupling means for coupling the first body and the second body,
    상기 제1 몸체의 상면부와 상기 제2 몸체의 상면부는 상기 돌출판이 서로 엇갈리도록 배치되고, 상기 제1 몸체의 하면부와 상기 제2 몸체의 하면부는 상기 돌출판이 서로 엇갈리도록 배치된 것을 특징으로 하는 반도체 패키지용 매거진.The upper surface portion of the first body and the upper surface portion of the second body is disposed so that the protruding plate is alternated with each other, the lower surface portion of the first body and the lower surface portion of the second body are arranged so that the protruding plate Magazine for semiconductor packages characterized in that.
  11. 제10항에 있어서, 상기 제1 및 제2 몸체의 상기 상면부 및 하면부는 적어도 2개의 돌출판을 갖는 것을 특징으로 하는 반도체 패키지용 매거진.The magazine according to claim 10, wherein the upper and lower surfaces of the first and second bodies have at least two protruding plates.
  12. 제1항 또는 제2항에 있어서, 상기 제1 및 제2 몸체의 상기 상면부 및 하면부는 적어도 2개의 돌출판을 갖는 것을 특징으로 하는 반도체 패키지용 매거진.The magazine for semiconductor packages according to claim 1 or 2, wherein the upper and lower surfaces of the first and second bodies have at least two protruding plates.
  13. 제3항 또는 제4항에 있어서, 측면부는 반도체 스트립을 수납하는 다수의 가이드채널이 형성되고 상면부와 하면부는 상기 측면부의 일부로부터 수직방향으로 돌출된 돌출판이 상하로 대향되게 형성되어 있으며 단면 모양이 'ㄷ'자형인 제1 몸체;The side surface portion is formed with a plurality of guide channels for receiving the semiconductor strip, the upper surface portion and the lower surface portion is formed so that the protruding plate protruding vertically from a portion of the side portion facing up and down A first body having a 'c' shape;
    측면부는 반도체 스트립을 수납하는 다수의 가이드채널이 형성되고 상면부와 하면부는 상기 측면부의 일부로부터 수직방향으로 돌출된 돌출판이 상하로 대향되게 형성된 제2 몸체; 및The second side body is formed with a plurality of guide channels for receiving the semiconductor strip and the upper surface portion and the lower surface portion protruding plate protruding in a vertical direction from a portion of the side portion; And
    상기 제1 몸체와 상기 제2 몸체를 결합하는 결합수단을 포함하며, It includes a coupling means for coupling the first body and the second body,
    상기 제2 몸체의 상면부에 형성된 돌출판은 상기 제1 몸체의 상면부에 형성된 돌출판에 대하여 엇갈려 돌출되게 형성되고 상기 제2 몸체의 하면부에 형성된 돌출판은 상기 제1 몸체의 하면부에 형성된 돌출판에 대하여 엇갈려 돌출되게 형성된 것을 특징으로 하는 반도체 패키지용 매거진.The protruding plate formed on the upper surface of the second body is formed to protrude alternately with respect to the protruding plate formed on the upper surface of the first body, and the protruding plate formed on the lower surface of the second body is provided on the lower surface of the first body. Magazine for a semiconductor package, characterized in that formed to project alternately with respect to the formed protrusion plate.
  14. 제13항에 있어서, 상기 제1 및 제2 몸체의 상기 상면부 및 하면부는 적어도 2개의 돌출판을 갖는 것을 특징으로 하는 반도체 패키지용 매거진.The magazine according to claim 13, wherein the upper and lower surfaces of the first and second bodies have at least two protrusion plates.
  15. 제1항 내지 제4항 중 어느 하나의 항에 있어서, 플라즈마 클리닝 시에 과도한 플라즈마에 의해 반도체 스트립이 변색되는 것을 억제하도록 다수 개의 천공이 고르게 분포되게 형성된 엔드캡을 더 포함하는 반도체 패키지용 매거진.The magazine according to any one of claims 1 to 4, further comprising an end cap in which a plurality of perforations are evenly distributed so as to suppress discoloration of the semiconductor strip by excessive plasma during plasma cleaning.
  16. 제1항 내지 제4항 중 어느 하나의 항에 있어서, 반도체 패키지용 매거진의 일련 번호를 확인하기 위한 바코드, 시리얼번호 또는 RFID가 삽입되는 식별인식부를 더 포함하는 반도체 패키지용 매거진.The magazine for semiconductor packages according to any one of claims 1 to 4, further comprising an identification recognition unit for inserting a barcode, a serial number, or an RFID for confirming the serial number of the magazine for the semiconductor package.
  17. 제1항 내지 제4항 중 어느 하나의 항에 있어서, 상기 반도체 패키지용 매거진은 탄소나노튜브가 함유된 전도성 플라스틱으로 형성되고, 상기 전도성 플라스틱의 입자는 1㎛보다 작은 크기를 갖는 것을 특징으로 하는 반도체 패키지용 매거진.The method of claim 1, wherein the semiconductor package magazine is formed of a conductive plastic containing carbon nanotubes, and the particles of the conductive plastic have a size smaller than 1 μm. Magazine for semiconductor packages.
  18. 제1항 내지 제4항 중 어느 하나의 항에 있어서, 상기 반도체 패키지용 매거진의 표면은, 전도성 금속 코팅층의 접착력을 높이기 위한 접착부와, 상기 접착부 상에 형성된 전도성 금속 코팅층 및 상기 전도성 금속 코팅층을 보호하기 위한 세라믹 코팅층을 포함하는 것을 특징으로 하는 반도체 패키지용 매거진.The surface of the magazine for semiconductor package according to any one of claims 1 to 4, wherein the surface of the magazine for semiconductor package, the adhesive portion for increasing the adhesion of the conductive metal coating layer, the conductive metal coating layer formed on the adhesive portion and the conductive metal coating layer Magazine for a semiconductor package comprising a ceramic coating layer for.
PCT/KR2009/003910 2008-07-17 2009-07-16 Magazine for semiconductor package WO2010008212A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0069413 2008-07-17
KR1020080069413A KR100971011B1 (en) 2008-07-17 2008-07-17 Magazine for semiconductor package

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WO2010008212A2 true WO2010008212A2 (en) 2010-01-21
WO2010008212A3 WO2010008212A3 (en) 2010-05-27

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KR102074572B1 (en) 2018-04-06 2020-02-06 (주)시스템케이 Magazine Assembly

Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2003012079A (en) * 2001-06-27 2003-01-15 High Mold:Kk Storage disk storing case
KR100724551B1 (en) * 2004-10-19 2007-06-04 주식회사 엘지화학 Magazine for semiconductor package
US20070215516A1 (en) * 2004-05-17 2007-09-20 Shin-Etsu Polyer Co., Ltd. Substrate Storage Container And Positioning Method Of The Same

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Publication number Priority date Publication date Assignee Title
JPH07300172A (en) * 1994-05-10 1995-11-14 Toppan Printing Co Ltd Sheet glass storing case
JPH1067404A (en) * 1996-08-27 1998-03-10 Sony Corp Magazine rack and magazine releasing device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003012079A (en) * 2001-06-27 2003-01-15 High Mold:Kk Storage disk storing case
US20070215516A1 (en) * 2004-05-17 2007-09-20 Shin-Etsu Polyer Co., Ltd. Substrate Storage Container And Positioning Method Of The Same
KR100724551B1 (en) * 2004-10-19 2007-06-04 주식회사 엘지화학 Magazine for semiconductor package

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WO2010008212A3 (en) 2010-05-27
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