WO2009138435A1 - Matériau abrasif, meule et outil pour meuler des substrats semi-conducteurs, et procédé de fabrication associé - Google Patents

Matériau abrasif, meule et outil pour meuler des substrats semi-conducteurs, et procédé de fabrication associé Download PDF

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Publication number
WO2009138435A1
WO2009138435A1 PCT/EP2009/055786 EP2009055786W WO2009138435A1 WO 2009138435 A1 WO2009138435 A1 WO 2009138435A1 EP 2009055786 W EP2009055786 W EP 2009055786W WO 2009138435 A1 WO2009138435 A1 WO 2009138435A1
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WO
WIPO (PCT)
Prior art keywords
grinding
wheel
hub
abrasive material
faces
Prior art date
Application number
PCT/EP2009/055786
Other languages
English (en)
Inventor
Micheal O'ceallaigh
Original Assignee
Micheal O'ceallaigh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micheal O'ceallaigh filed Critical Micheal O'ceallaigh
Publication of WO2009138435A1 publication Critical patent/WO2009138435A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental

Definitions

  • An abrasive material, wheel and tool for grinding semiconductor substrates, and method of manufacture of same is an abrasive material, wheel and tool for grinding semiconductor substrates, and method of manufacture of same.
  • the present invention relates to techniques for increasing the quality and uniformity of the machining process of substrates. In particular, it relates to the reduction of scratches and chatter marks when machining substrate surfaces.
  • Abrasive tools are commonly used for the precision grinding of hard brittle materials such as ceramic wafers. Various methods are used for the production of these grinding wheels and in the constituent components of the abrasive elements. Abrasive tools generally take the form of a wheel core attached to an abrasive rim of dense, metal bonded super abrasive segments by means of a thermally stable bond. However these grinding wheels with an abrasive rim comprised of segments with an face substantially parallel to its direction of travel i.e. the tangential direction, contributes substantially to the incidence of scratching and chatter marks on the surface of machined wafers.
  • Ishihara discloses a method of producing grinding wheels comprised of porous metal bonded grinding elements bonded to a hub. This is achieved by sintering the metal bond and abrasive mixed with granular salt, which was used as a sacrificial filler. After sintering, the grinding segments are submerged in water, which dissolves the salt, leaving a metal bond structure with open porosity behind. Ishihara recommends that the porosity level be kept below 50% in order to keep good structural strength in the metal matrix.
  • JP60-118,469 discloses a method of forming pores by immersing the metal matrix and salt composite in water. This method was followed in US 6,685,755.
  • this immersion technique has disadvantages. It is slow, and can be difficult to implement. Most especially, it has been found that the surface tension of the liquid solvent used, can make it difficult to produce matrices with small pores of less than 50 microns, and especially less than 25 microns. The presence of trapped air in the pores can stop the dissolving process. Furthermore, the immersion technique limits the depth from which the sacrificial filler may be removed to a few millimetres, in the case of pores of about 100 microns in size.
  • bonds with porosity levels below 50% as disclosed in Japanese patent 60 118,469 can also display unfavourable characteristics and tend to behave in what is commonly called a 'hard' state, where scratching, vibration, and chatter can develop when grinding hard materials. Bonds with higher porosities as disclosed in US 6,685,755 can be very fragile.
  • Keat discloses the use of fillers, such as graphite, in metal bonded cup grinding wheels for dry grinding cemented carbides. He also discloses how useful brittle intermetallics bonds are in the grinding of such hard brittle materials. He particularly discloses a brittle bronze alloy based on the brittle intermetallics Cu3Sn, (equivalent to approximately 62% copper / 38% tin, by weight) and discloses how this gave longer life and lower power consumption than previous wheels when grinding cemented carbide. He discloses how using copper and tin powders give a low sintering temperature, with obvious economic advantages.
  • Sioui discloses a metal-resin composite, which consists of two interlocking phases - one metal the other resin. It is manufactured by selecting materials with similar sintering temperatures and then sintering both phases together.
  • the metal typically includes brittle intermetallics, and the resin is typically a high temperature resistant resin such as polyamide.
  • a cup wheel for a grinding tool for use in grinding semiconductor substrates comprising: a hub having a pair of opposing faces and a peripheral rim linking said faces; and at least one grinding segment mounted on and upstanding from at least one face of the hub; wherein in use, as the wheel is rotated, the face of the hub on which the at least one grinding segment is mounted is directed towards the substrate to be ground, to bring the at least one grinding segment into contact with the substrate, and wherein at least one pair of side faces of the at least one grinding segment intersect at a leading edge which substantially faces the direction of travel of the grinding segment as the wheel rotates.
  • the cup wheel comprises a plurality of grinding segments.
  • At least one of said plurality of grinding segments may have a triangular cross- section.
  • At least one of said plurality of grinding segments may have a square cross-section.
  • At least one of said plurality of grinding segments may have a rectanglar cross-section.
  • the invention further provides a cup wheel for a grinding tool for use in grinding semiconductor substrates, the wheel comprising: a hub having a pair of opposing faces and a peripheral rim linking said faces; and a plurality of cylindrical grinding segments mounted on and upstanding from at least one face of the hub.
  • the segments may be substantially cylindrical or have another curved-edged form.
  • the invention further provides a cup wheel for a grinding tool for use in grinding semiconductor substrates, the wheel comprising: a hub having a pair of opposing faces and a peripheral rim linking said faces; and at least one grinding segment mounted on and upstanding from at least one face of the hub, wherein said at least one grinding segments is an arcuate segment having at least one serrated side edge.
  • leading profile i.e. in the direction of travel in use
  • leading profile is non planar. It will be appreciated that the leading profile could be curved or an apex of two faces. In other words, the leading face extends non-radially.
  • the invention further provides a peripheral wheel for a grinding tool for use in grinding semiconductor substrates, the wheel comprising: a hub having a pair of opposing faces and a peripheral rim linking said faces; and at least one grinding segment mounted on and upstanding from said peripheral rim of the hub; wherein in use, as the wheel is rotated, the rim of the hub is directed towards the substrate to be ground, to bring the at least one grinding segment into contact with the substrate, and wherein at least one side edge of the at least one grinding segment is serrated.
  • the plurality of grinding segments are positioned end-to-end around the circumference of the wheel to form a serrated grinding rim.
  • the invention further provides an abrasive material for use in grinding semiconductor substrates comprising: a metal bond matrix containing friable fillers and a network of open pores such that the open porosity level is from about 0% to about 50% by volume, and the friable filler content is from about 5% to about 65% by volume, and where the combined total of friable filler and open porosity is from about 50% to about 80% by volume, and where the balance is composed of a network of abrasive- containing metal.
  • the friable filler content is from about 50% to about 65% by volume.
  • the friable filler is selected from the group consisting of graphite, hexagonal boron nitride, petroleum coke, volcanic stone.
  • the abrasive may be either diamond or CBN or a combination thereof, or any other suitable material.
  • the pores have been produced by a sacrificial filler method.
  • the sacrificial fillers may have been substantially removed by dissolving in a gas.
  • the invention further provides a grinding tool comprising the aforementioned abrasive material of the invention.
  • the at least one grinding segment of the cup wheel of the invention may comprises the aforementioned abrasive material according to the present invention.
  • the at least one grinding segment of the peripheral wheel of the invention may comprises the aforementioned abrasive material according to the present invention.
  • Either wheel may be embodied in a grinding tool.
  • the present invention further comprises a cup wheel substantially as described herein with reference to and as shown in any one or more of the accompanying drawings.
  • the present invention further comprises a peripheral wheel substantially as described herein with reference to and as shown in any one or more of the accompanying drawings.
  • the present invention further comprises an abrasive material substantially as described herein with reference to and as shown in any one or more of the accompanying drawings.
  • the present invention further comprises a grinding tool substantially as described herein with reference to and as shown in any one or more of the accompanying drawings.
  • the present invention further comprises a method of producing a cup wheel substantially as described herein with reference to and as shown in any one or more of the accompanying drawings.
  • the present invention further comprises a method of producing a peripheral wheel substantially as described herein with reference to and as shown in any one or more of the accompanying drawings.
  • the present invention further comprises a method of producing an abrasive material substantially as described herein with reference to and as shown in any one or more of the accompanying drawings.
  • the present invention further comprises a method of producing a grinding tool substantially as described herein with reference to and as shown in any one or more of the accompanying drawings.
  • the present invention discloses that segments, whose faces are at an angle substantially reduces the incidence of scratching.
  • the present invention discloses a grinding tool for grinding semiconductor substrates consisting of a hub with a one or more grinding segments attached so that the segments form an abrasive rim, with at least two faces with respect to the direction of travel during the machining operation, such that at least one of the rim faces is substantially not parallel to the direction of travel to its direction of travel during the machining process.
  • the substrate to be machined may be either the front side or the backside of a semiconductor wafer. In one embodiment the substrate to be machined is a prime wafer.
  • the grinding tool of the present invention may be either a cup grinding wheel or a peripheral grinding wheel.
  • the semiconductor substrate to be machined usually consists of one of the following materials GaAs, sapphire, silicon carbide, AlTiC, glass or GaN. In a preferred embodiment, the substrate consists of the device layer on a semiconductor wafer.
  • Abrasives may be either diamond or CBN or a combination of both. Pores are generally formed by the sacrificial filler method as in JP60-118,469
  • the present invention discloses that a more advantageous method is to use a dissolving gas to dissolve the sacrificial filler.
  • the gas can penetrate even small-sized pores, and is not affected by trapped air bubbles in the pores. It can penetrate to a depth of 4mm or more, and so makes it possible to sinter large blanks in one mould.
  • the gas is preferably used at a pressure of one atmosphere or above.
  • the blanks can then undergo other production processes such as machining to thickness or further impregnation.
  • the blank can then be machined into individual grinding segments ready for bonding to the machine hub.
  • Pores have drawbacks in certain grinding applications. They reduce the structural strength of the bond. Furthermore, if grinding soft, long-chipping materials such as metal, the pores can clog, leading to significant reduction in grinding performance.
  • the present invention discloses that one method of avoiding this is to pump liquid through the porous network. As the grinding wheel usually operates in the presence of a cooling liquid, this coolant can be readily supplied via channels to the base of the grinding segments. The faces of the grinding segments can be sealed off with an epoxy to ensure the coolant flows to the grinding face. In one embodiment centrifugal force is sufficient to force the coolant through the pores, though additional pressure may be applied by using a pressurised water supply.
  • Brittle bronze bonds made from copper and tin and optionally copper phosphorous powders have been used since Keat disclosed them in US 3,925,035.
  • the present invention discloses that using pre-alloyed bronze powder, particularly pre-alloyed 60/40 bronze powder, is advantageous as it reduces the number of powders to be kept in storage, and simplifies weighing and mixing of powders. It does however have the disadvantage that it has to be sintered at a higher temperature. A sintering temperature of approximately 600 0 C is required for satisfactory sintering results.
  • the present inventor has tested grinding wheels based on this bond with varying compositions, and has found that all offer improved manufacturing characteristics relative to those made from separate metal powders.
  • the friable fillers of the present invention may be selected from one of the following: graphite, hexaganol boron nitride, petroleum coke, volcanic stone etc.
  • the present invention discloses that using friable fillers in quantities between 35% and 75%, and most favourably between 50% and 70% is advantageous when grinding hard brittle materials.
  • the higher % filler reduces the occurrence of scratching, chatter and vibration, and ensures satisfactory performance when grinding hard brittle materials such as glass, silicon, sapphire, silicon carbide and other ceramics.
  • a preferred embodiment of the present invention uses a metal matrix with a combination of open pores and friable fillers is especially advantageous.
  • a favourable combination of metal bond matrix is where the open porosity level is from 0% to 50%, and the friable filler content is from 5% to 65%, and where the combined total of friable filler and open porosity is from 50% to 80%. This region offers a continuum of performance characteristics from 'hard' through to 'soft' wheels, which is very useful to the wheel designer.
  • Micro machining holes in segments is technically feasible, and is becoming economically viable.
  • an array of holes may be drilled, typically by laser.
  • FIG. 1 shows a conventional cup wheel with series of arcurate segments as common in industry and similar to those shown in US 6,685,755, 6,755,729, US 6,102,789 and US 6,093,092.
  • FIG 2 shows a conventional peripheral wheel.
  • FIG.3 shows the rim formed with a series of substantially square shaped segments with their faces set at 45 degrees to the tangent.
  • FIG 4 shows a face view of a quarter of the wheel rim.
  • Fig 5 shows a pattern made with individual segments, each with a serrated edge.
  • Fig 6 shows a pattern made with triangular segments, where only one wheel rim edge is substantially not parallel to the direction of travel.
  • Fig 7 shows a peripheral wheel designed according to this invention.
  • Fig.8 shows a rim consisting of more than one row of segments.
  • cup wheels 1 comprise of a series of arcurate segments 101 bonded to a metal core 102.
  • these segments are discontinuous, however in other embodiments, they may form a continuous rim as shown on the peripheral wheel 2 in Figure 2.
  • the continuous rim may comprise one segment or at least two segments, separately sintered and then mounted on the core 202.
  • Discontinuous rims as in Figure 1 are manufactured from at least two segments 101 and the segments are separated by slots or gaps 103 in the rim. These gaps 103 in the rim facilitate the removal of waste product which could scratch the work piece surface, particularly useful in low speed surface finishing operations.
  • a conventional cup wheel 3 is shown, but the discontinuous rim 302 is formed from a series of substantially square shaped segments 301 with their faces set at 45° to the tangent.
  • the discontinuous rim 302 is formed from a series of substantially square shaped segments 301 with their faces set at 45° to the tangent.
  • only one segment in figures 3 to 8 is shown as porous, however, it should be understood that all remaining segments on the rim are also porous. These faces which are at an angle, substantially reduce the incidence of scratching.
  • the segments are spaced along the rim 302.
  • the segments are not uniformly spaced as shown by the gaps 304 a and b which are different dimensions. However, it will be appreciated that uniformly sized gaps are also possible.
  • These segments 301 are composed of a metal bond matrix containing friable fillers and a network of open pores.
  • a preferred embodiment of the present invention has an open porosity level from 0% to 50% by volume and the friable fillers content of 5% to 65% by volume, resulting in a combined total of friable filler and open porosity from 50% to 60% by volume, and where the remainder is composed of a network of abrasive containing metal.
  • the friable filler in the present invention is selected from a group consisting of graphite, hexagonal boron nitride, petroleum coke, or volcanic stone.
  • the abrasive used is either diamond or CBN or a combination thereof.
  • the pores 303 have been produced by the sacrificial filler method.
  • Pores 303 are typically formed by sintering the metal bond and abrasive mixed with a sacrificial filler such as granular salt.
  • a sacrificial filler such as granular salt.
  • gas is used to dissolve the sacrificial filler.
  • the gas can penetrate even small-sized pores, and is not affected by trapped air bubbles in the pores. It can penetrate to a depth of 4mm or more, and so makes it possible to sinter large blanks in one mould.
  • the blanks can then undergo other production processes such as machining to thickness or impregnation. In the embodiment shown in Fig 3. the blanks have been machined into individual grinding segments ready for bonding to the machine hub.
  • a metal matrix with a combination of open pores and friable fillers is especially advantageous.
  • a particular combination of metal bond matrix that is favoured is where the open porosity level is from 0% to 50%, and the friable filler content is from 5% to 65%, and where the combined total of friable filler and open porosity is from 50% to 80%.
  • This offers a continuum of performance characteristics from 'hard' through to 'soft' wheels, which is very useful to the wheel designer.
  • a preferable embodiment of the present invention includes compositions containing from 30% up to 70% friable fillers, from 35% to 70% open porosity, and from 0% to 20% wear resistant fillers.
  • the segments can take various forms such as squares 301 in Fig 3 or rectangles 401 in Fig 4.
  • the rim 402 is composed of substantially rectangular segments set to form a rim which has a jagged face at an angle to the direction of travel as indicated by the arrow in Fig. 4. These faces which are at an angle substantially reduce the incidence of scratching.
  • each segment can be formed with a number of serrated faces.
  • the segments may be triangular in shape as in figure 6.
  • the segment face 1062 is parallel to the direction of travel.
  • Segment face 1601 is not.
  • Segments on a grinding rim my be substantially the same and set in a regular geometric pattern as shown in Figure 7 where the segments 701 substantially abut each other.
  • Figure 7 shows an arrangement where the grinding wheel is a peripheral wheel with the outer circumference of the wheel having a smooth surface.
  • Segments may however vary in size, geometry, orientation on the rim, or spacing from each other along the rim.
  • the variances may be either consistent or random. Wheels with random variances have been tested, and found to work satisfactorily. It is suspected that random variations in the rim may have beneficial effects in helping to suppress resonant vibrations, regardless of the segment composition.
  • the rim may consist of more than one row of segments allowing a configuration useful for wide peripheral wheels. In Figure 8, three rows 801a, 801b and 801c are visible with segments spaced out at intervals along these rows.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

La présente invention se rapporte à une meule boisseau pour un outil de meulage à utiliser pour meuler des substrats semi-conducteurs, la meule comprenant : un moyeu comportant deux faces opposées et un bord périphérique reliant lesdites faces ; et au moins un segment de meulage monté sur au moins une face du moyeu et se dressant depuis celle-ci ; en utilisation, lorsque la meule tourne, la face du moyeu sur laquelle le ou les segments de meulage sont montés est orientée vers le substrat à meuler, afin d’amener le ou les segments de meulage en contact avec le substrat, et au moins une paire de faces latérales du ou des segments de meulage se croisent au niveau d’un bord d’attaque qui est sensiblement tourné dans la direction de déplacement du segment de meulage lorsque la meule tourne.
PCT/EP2009/055786 2008-05-13 2009-05-13 Matériau abrasif, meule et outil pour meuler des substrats semi-conducteurs, et procédé de fabrication associé WO2009138435A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IES2008/0376 2008-05-13
IES20080376 IES20080376A2 (en) 2008-05-13 2008-05-13 An abrasive material, wheel and tool for grinding semiconductor substrates, and method of manufacture of same

Publications (1)

Publication Number Publication Date
WO2009138435A1 true WO2009138435A1 (fr) 2009-11-19

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WO (1) WO2009138435A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3037230A1 (fr) * 2014-12-22 2016-06-29 HILTI Aktiengesellschaft Procédé de fabrication d'une bague de forage fermée pour une couronne de carottage
JP2017132033A (ja) * 2016-01-27 2017-08-03 周 景星Ｃｈｉｎ−Ｈｓｉｎ ＣＨＯＵ 研削装置及びそれを用いた研削方法
JP2017213664A (ja) * 2016-06-02 2017-12-07 株式会社ディスコ 砥石及び研削ホイール

Citations (7)

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Publication number Priority date Publication date Assignee Title
JPS60118469A (ja) * 1983-11-30 1985-06-25 Disco Abrasive Sys Ltd メタルボンド砥石の製造方法
WO1999048646A1 (fr) * 1998-03-27 1999-09-30 Norton Company Outils abrasifs
WO2000073023A1 (fr) * 1999-05-28 2000-12-07 Saint-Gobain Abrasives, Inc. Outils abrasifs permettant l'abrasion de composants electroniques
WO2002053324A1 (fr) * 2001-01-08 2002-07-11 3M Innovative Properties Company Tampon a polir et procede d'utilisation correspondant
US20030003858A1 (en) * 2000-09-13 2003-01-02 Takahiro Hirata Superabrasive wheel for mirror finishing
US20060130823A1 (en) * 2003-03-06 2006-06-22 Kim Soo K Gear type machining tip and tool attaching the same thereon
US20080139090A1 (en) * 2006-12-12 2008-06-12 Oki Electric Industry Co., Ltd. Grinding machine having grinder head and method of manufacturing semiconductor device by using the grinding machine

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60118469A (ja) * 1983-11-30 1985-06-25 Disco Abrasive Sys Ltd メタルボンド砥石の製造方法
WO1999048646A1 (fr) * 1998-03-27 1999-09-30 Norton Company Outils abrasifs
WO2000073023A1 (fr) * 1999-05-28 2000-12-07 Saint-Gobain Abrasives, Inc. Outils abrasifs permettant l'abrasion de composants electroniques
US20030003858A1 (en) * 2000-09-13 2003-01-02 Takahiro Hirata Superabrasive wheel for mirror finishing
WO2002053324A1 (fr) * 2001-01-08 2002-07-11 3M Innovative Properties Company Tampon a polir et procede d'utilisation correspondant
US20060130823A1 (en) * 2003-03-06 2006-06-22 Kim Soo K Gear type machining tip and tool attaching the same thereon
US20080139090A1 (en) * 2006-12-12 2008-06-12 Oki Electric Industry Co., Ltd. Grinding machine having grinder head and method of manufacturing semiconductor device by using the grinding machine

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3037230A1 (fr) * 2014-12-22 2016-06-29 HILTI Aktiengesellschaft Procédé de fabrication d'une bague de forage fermée pour une couronne de carottage
WO2016102525A1 (fr) * 2014-12-22 2016-06-30 Hilti Aktiengesellschaft Procédé de fabrication d'une bague de carottage pour couronne de carottage
CN107107379A (zh) * 2014-12-22 2017-08-29 喜利得股份公司 用于制作取芯钻头用的封闭的钻环体的方法
JP2017132033A (ja) * 2016-01-27 2017-08-03 周 景星Ｃｈｉｎ−Ｈｓｉｎ ＣＨＯＵ 研削装置及びそれを用いた研削方法
JP2017213664A (ja) * 2016-06-02 2017-12-07 株式会社ディスコ 砥石及び研削ホイール

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