WO2009137447A3 - Debris-extraction exhaust system - Google Patents

Debris-extraction exhaust system Download PDF

Info

Publication number
WO2009137447A3
WO2009137447A3 PCT/US2009/042796 US2009042796W WO2009137447A3 WO 2009137447 A3 WO2009137447 A3 WO 2009137447A3 US 2009042796 W US2009042796 W US 2009042796W WO 2009137447 A3 WO2009137447 A3 WO 2009137447A3
Authority
WO
WIPO (PCT)
Prior art keywords
debris
extraction
exhaust system
workpiece
lifting force
Prior art date
Application number
PCT/US2009/042796
Other languages
French (fr)
Other versions
WO2009137447A2 (en
Inventor
Benjamin Johnston
Shinichi Kurita
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to CN200980116308XA priority Critical patent/CN102017067A/en
Publication of WO2009137447A2 publication Critical patent/WO2009137447A2/en
Publication of WO2009137447A3 publication Critical patent/WO2009137447A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

Systems and methods for debris extraction reduce the lifting force on a workpiece (104) through a supply air feature. The supply air feature can be implemented through an extraction nozzle (116), which has an outer supply duct (122) surrounding an inner exhaust duct (120). Further reduction of the lifting force can be realized through the use of multiple extraction nozzles (116) which limit exhaust airflow to areas of the workpiece (104) with active laser scribing.
PCT/US2009/042796 2008-05-06 2009-05-05 Debris-extraction exhaust system WO2009137447A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200980116308XA CN102017067A (en) 2008-05-06 2009-05-05 Debris-extraction exhaust system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US5094408P 2008-05-06 2008-05-06
US61/050,944 2008-05-06

Publications (2)

Publication Number Publication Date
WO2009137447A2 WO2009137447A2 (en) 2009-11-12
WO2009137447A3 true WO2009137447A3 (en) 2010-02-25

Family

ID=41265341

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/042796 WO2009137447A2 (en) 2008-05-06 2009-05-05 Debris-extraction exhaust system

Country Status (3)

Country Link
CN (1) CN102017067A (en)
TW (1) TW201009892A (en)
WO (1) WO2009137447A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112013007505B4 (en) * 2013-10-15 2023-06-07 Mitsubishi Electric Corporation Semiconductor Element Manufacturing Process
CN105298830B (en) * 2015-09-17 2018-10-23 沈阳拓荆科技有限公司 A kind of structure of pass sheet chamber room exhaust pipe front end filtering fragment
EP3398709B1 (en) * 2017-05-03 2020-12-16 Agathon AG, Maschinenfabrik Laser machining system with a thermo-concept

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4121317A (en) * 1975-04-25 1978-10-24 Hubert Sohler Gmbh Mobile pneumatic apparatus for sucking and blowing fiber dust from textile machines
JPH09150120A (en) * 1995-11-29 1997-06-10 Nec Kagoshima Ltd Dust attracting device for glass surface
JPH1099978A (en) * 1996-09-27 1998-04-21 Hitachi Ltd Laser beam machine
US20040195223A1 (en) * 2002-05-13 2004-10-07 Kazuma Sekiya Finishing machine using laser beam

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4121317A (en) * 1975-04-25 1978-10-24 Hubert Sohler Gmbh Mobile pneumatic apparatus for sucking and blowing fiber dust from textile machines
JPH09150120A (en) * 1995-11-29 1997-06-10 Nec Kagoshima Ltd Dust attracting device for glass surface
JPH1099978A (en) * 1996-09-27 1998-04-21 Hitachi Ltd Laser beam machine
US20040195223A1 (en) * 2002-05-13 2004-10-07 Kazuma Sekiya Finishing machine using laser beam

Also Published As

Publication number Publication date
CN102017067A (en) 2011-04-13
TW201009892A (en) 2010-03-01
WO2009137447A2 (en) 2009-11-12

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