WO2009131364A2 - Printed circuit board for electronic devices and method of manufacturing the same - Google Patents

Printed circuit board for electronic devices and method of manufacturing the same Download PDF

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Publication number
WO2009131364A2
WO2009131364A2 PCT/KR2009/002083 KR2009002083W WO2009131364A2 WO 2009131364 A2 WO2009131364 A2 WO 2009131364A2 KR 2009002083 W KR2009002083 W KR 2009002083W WO 2009131364 A2 WO2009131364 A2 WO 2009131364A2
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Prior art keywords
substrate
conductive film
film
pattern
conductive
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PCT/KR2009/002083
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French (fr)
Korean (ko)
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WO2009131364A3 (en
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이충훈
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(주)모디스텍
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Publication of WO2009131364A2 publication Critical patent/WO2009131364A2/en
Publication of WO2009131364A3 publication Critical patent/WO2009131364A3/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer

Definitions

  • the present invention relates to a substrate for an electronic device capable of forming a patterned conductive film in a simple process and a method of manufacturing the same.
  • devices such as flat panel displays, solar cells, flexible displays, plastic electronics, lighting, and touch panels require a conductive film patterned on a substrate.
  • the conductive film 13 is deposited on the substrate 14, and then the photoresist 12 is coated on the conductive film 13, and the shadow mask 11 and the exposure apparatus ( A photoresist pattern 15 is formed as shown in FIG. 2 by a photolithography technique using 19).
  • the conductive film 13 is etched by a wet etching method or a dry etching method using the photoresist pattern 15 as a mask to form the conductive film pattern 16.
  • the photoresist pattern 15 is removed to form a conductive film pattern 16 as shown in FIG. 4 on the substrate 14.
  • the conventional technology of forming the above-described conductive film pattern has a disadvantage in that the process is very complicated by performing a photolithography process, requires expensive equipment for performing the photolithography process, and takes as much time as the number of processes.
  • the substrate is a flexible substrate
  • the flexible substrate is selectively used according to the etching liquid that performs the wet etching process, and in the dry etching process, the etching equipment is expensive and the deformation of the flexible substrate during the etching process should also be considered.
  • the etching equipment is expensive and the deformation of the flexible substrate during the etching process should also be considered.
  • An object of the present invention is to provide a substrate for an electronic device and a method of manufacturing the same, which is very simple and does not perform an existing etching process, and can reduce the investment cost, processing cost, and processing time of equipment for patterning. There is this.
  • Another object of the present invention is to provide a substrate for an electronic device and a method of manufacturing the same, which do not perform the wet etching process of the conventional photolithography process and thus do not cause a problem with moisture absorption.
  • an object of the present invention is to provide a substrate for an electronic device and a method of manufacturing the same that can reduce the occurrence of substrate deformation by not performing the dry etching process of the conventional photolithography process.
  • a first preferred aspect for achieving the above objects of the present invention is
  • a substrate for an electronic device composed of a conductive film pattern adhered to the support portion is provided.
  • a second preferred aspect for achieving the above objects of the present invention is
  • a method of forming a substrate for an electronic device comprising leaving the conductive film and the adhesive film of the predetermined pattern, and leaving the conductive film and the adhesive film other than the predetermined pattern from the support.
  • a third preferred aspect for achieving the above objects of the present invention is
  • a method of forming a substrate for an electronic device comprising the step of adhering the conductive film pattern to the substrate for an electronic device is provided.
  • 1 to 4 are schematic cross-sectional views illustrating a method for forming a conductive film pattern on a substrate for a device according to the prior art.
  • 5 to 8 are schematic cross-sectional views for explaining a method of forming a substrate for an electronic device according to the present invention.
  • FIG. 9 is a schematic cross-sectional view of a substrate for an electronic device according to the present invention.
  • FIGS. 10 and 11 are schematic cross-sectional views for explaining a conductive film applied according to the present invention.
  • FIG. 12 is a schematic cross-sectional view illustrating a method of forming a substrate for an electronic device according to the present invention.
  • FIG. 13 is a photograph photographing a process of forming a cutting line having a pattern shape on a conductive film with a pinnacle die according to the present invention.
  • 5 to 8 are schematic cross-sectional views for explaining a method of forming a substrate for an electronic device according to the present invention.
  • the conductive film 21 is adhered to the support 23 with an adhesive film 22. 5)
  • the support 23 may be applied as a flexible substrate.
  • the support 23 may be one of a metal substrate, a glass substrate, and a polymer substrate.
  • the cutting line 29 is preferably formed of a pinnacle die (Pinnacle die) of a roll method.
  • the conductive film and the adhesive film of the predetermined pattern are left, and the conductive film and the adhesive film other than the predetermined pattern are separated from the support portion.
  • the conductive film region and the adhesive film region of the predetermined pattern are left in the supporting portion, and the conductive film region and the adhesive film region other than the predetermined pattern are removed from the supporting portion.
  • the conductive film and the adhesive film other than the predetermined pattern are cut by the cutting line 29 so that separation is easy.
  • the support part 23 is exposed in a region where the conductive film and the adhesive film other than the predetermined pattern are separated.
  • a substrate for an electronic device having a conductive film pattern 28 formed on the support 23 may be obtained.
  • Such a method of patterning the conductive film of the present invention does not perform the wet etching process of the conventional photolithography process, there is an advantage that does not cause a problem for moisture absorption.
  • the method for patterning the conductive film of the present invention has an advantage of reducing substrate deformation by not performing a dry etching process of a conventional photolithography process.
  • the flexible substrate is deformed.
  • the present invention does not perform the conventional etching process is very simple process, there is an advantage that can reduce the investment cost, process cost and process time of the equipment for patterning.
  • the present invention has an advantage that it is easy to cope with the change of the pattern is relatively simple compared to the photo etching process to replace the pattern shape to perform a variety of pattern shapes.
  • the present invention has the advantage that can be applied to the roll to roll (Roll to Roll) method.
  • FIG. 9 is a schematic cross-sectional view of a substrate for an electronic device according to the present invention, wherein the substrate for an electronic device includes a support 23; It consists of a conductive film pattern 28 adhered to the support 23.
  • the adhesive film 22a is interposed between the support part 23 and the conductive film pattern 28.
  • the substrate for such an electronic device is used as one of flat panel displays, solar cells, flexible displays, plastic electronics, lighting, and touch panels.
  • FIG. 10 and 11 are schematic cross-sectional views for explaining a conductive film applied according to the present invention.
  • the conductive film applied to the present invention may be formed of a conductive film 21a made of a single conductive material as shown in FIG. 10.
  • this conductive film 21a is the same as copper foil.
  • the conductive film 21 may be formed in a structure in which a conductive material coating film 21b is formed on the insulating film 21c.
  • the conductive material coating film 21b is made of one of a metal, a conductive ceramic, and a conductive organic material.
  • the conductive material coating layer 21b may be formed of a transparent conductive oxide (TCO) such as ITO or IZO.
  • TCO transparent conductive oxide
  • step S10 is a schematic cross-sectional view for explaining a method of forming a substrate for an electronic device according to the present invention, and prepares a substrate for an electronic device (step S10).
  • the conductive film pattern is a film as shown in Figure 3a and 3b, it is preferable that the adhesive film pattern is attached to the lower portion of the conductive film pattern.
  • FIG. 13 is a photograph photographing a process of forming a patterned cutting line on a conductive film with a pinnacle die according to the present invention, wherein the pinnacle die has a rotating cutter machine 100; It consists of a conveying apparatus (not shown).
  • the conductive film is positioned between the transfer device and the cutter 100, and when the conductive film is placed on the transfer device and transferred, the conductive film passes through the cutter 100, and the cutter 100 cuts a pattern-shaped cut line on the conductive film. To form.
  • the patterned cutting line 29 is formed in the conductive film 21 which has passed through the cutter 100.
  • a substrate having a conductive film pattern formed thereon which can be formed by performing a simple process and not performing an etching process, can reduce the investment cost, process cost, and process time of equipment for patterning, such as a flat panel display, a solar cell, and a flexible substrate. It can be applied to devices such as displays, plastic electronics, lighting and touch panels.

Abstract

The present invention concerns a PCB for electronic devices and a method for manufacturing the same.  That is to say, the method of manufacturing a PCB for use in electronic devices of the present invention comprises a step wherein a conducting film is bonded to a substrate with a bonding film, a step wherein the cutting lines of the pre-determined pattern are formed in order to form the pre-determined pattern in said conductive film and bonding film, and a step wherein the conductive film and bonding film outside of the pre-determined pattern are removed, leaving said fixed pattern.

Description

전자 디바이스용 기판 및 그를 제조하는 방법 Substrate for electronic device and method of manufacturing same
본 발명은 간단한 공정으로 패터닝된 도전 필름을 형성할 수 있는 전자 디바이스용 기판 및 그를 제조하는 방법에 관한 것이다.The present invention relates to a substrate for an electronic device capable of forming a patterned conductive film in a simple process and a method of manufacturing the same.
일반적으로 평판디스플레이, 솔라셀, 플렉서블 디스플레이, 플라스틱 일렉트로닉스, 조명, 터치 패널 등의 디바이스(Device)는 기판에 패터닝된 도전막을 필요로 한다. In general, devices such as flat panel displays, solar cells, flexible displays, plastic electronics, lighting, and touch panels require a conductive film patterned on a substrate.
이러한 디바이스용 기판에 도전막 패턴을 형성하는 방법의 종래 기술은 도 1 내지 도 4를 참조하여 설명한다. The prior art of the method of forming a conductive film pattern on such a device substrate is demonstrated with reference to FIGS.
먼저, 도 1에 도시된 바와 같이 기판(14)상에 도전막(13)을 증착한 뒤 상기 도전막(13) 상에 포토레지스트(12)를 도포하고, 쉐도우 마스크(11)와 노광 장치(19)를 이용한 사진 식각 기술로 도 2에 도시된 바와 같이 포토레지스트 패턴(15)을 형성한다. First, as shown in FIG. 1, the conductive film 13 is deposited on the substrate 14, and then the photoresist 12 is coated on the conductive film 13, and the shadow mask 11 and the exposure apparatus ( A photoresist pattern 15 is formed as shown in FIG. 2 by a photolithography technique using 19).
그 후, 도 3에 도시된 바와 같이 상기 포토레지스트 패턴(15)을 마스크로 하여, 습식 식각 방법 또는 건식 식각 방법으로 상기 도전막(13)을 식각하여 도전막 패턴(16)을 형성한다. Thereafter, as illustrated in FIG. 3, the conductive film 13 is etched by a wet etching method or a dry etching method using the photoresist pattern 15 as a mask to form the conductive film pattern 16.
이어서, 상기 포토레지스트 패턴(15)을 제거하여 도 4와 같은 도전막 패턴(16)을 상기 기판(14) 상부에 형성한다. Subsequently, the photoresist pattern 15 is removed to form a conductive film pattern 16 as shown in FIG. 4 on the substrate 14.
전술된 도전막 패턴을 형성하는 종래 기술은 사진 식각 공정을 수행하여 공정이 매우 복잡하고, 사진 식각 공정을 수행하기 위한 고가의 장비를 사용해야 하며 공정 수만큼 시간도 많이 소요되는 단점이 있다.The conventional technology of forming the above-described conductive film pattern has a disadvantage in that the process is very complicated by performing a photolithography process, requires expensive equipment for performing the photolithography process, and takes as much time as the number of processes.
또한, 기판이 플렉서블 기판인 경우, 습식 식각 공정을 수행하는 식각액에 따라 플렉서블 기판을 선택적으로 사용해야하는 단점이 있으며, 건식 식각 공정은 식각 장비가 고가이며, 식각 공정 중 플렉서블 기판의 변형도 고려해야하는 하는 단점이 있다.In addition, in the case where the substrate is a flexible substrate, there is a disadvantage in that the flexible substrate is selectively used according to the etching liquid that performs the wet etching process, and in the dry etching process, the etching equipment is expensive and the deformation of the flexible substrate during the etching process should also be considered. There are disadvantages.
본 발명은 기존의 식각 공정을 수행하지 않아 공정이 매우 간단하고, 패터닝을 위한 장비의 투자 비용, 공정 비용 및 공정 시간 등을 감소시킬 수 있는 전자 디바이스용 기판 및 그를 제조하는 방법을 제공하는 데 목적이 있다. An object of the present invention is to provide a substrate for an electronic device and a method of manufacturing the same, which is very simple and does not perform an existing etching process, and can reduce the investment cost, processing cost, and processing time of equipment for patterning. There is this.
또, 본 발명은 종래의 사진 식각 공정의 습식 식각 공정을 수행하지 않아, 흡습에 대한 문제점을 야기시키지 않는 전자 디바이스용 기판 및 그를 제조하는 방법을 제공하는 데 목적이 있다. Another object of the present invention is to provide a substrate for an electronic device and a method of manufacturing the same, which do not perform the wet etching process of the conventional photolithography process and thus do not cause a problem with moisture absorption.
더불어, 본 발명은 종래의 사진 식각 공정의 건식 식각 공정을 수행하지 않아 기판 변형이 발생되는 것을 감소시킬 수 있는 전자 디바이스용 기판 및 그를 제조하는 방법을 제공하는 데 목적이 있다. In addition, an object of the present invention is to provide a substrate for an electronic device and a method of manufacturing the same that can reduce the occurrence of substrate deformation by not performing the dry etching process of the conventional photolithography process.
상기한 본 발명의 목적들을 달성하기 위한 바람직한 제 1 양태(樣態)는,  A first preferred aspect for achieving the above objects of the present invention is
지지부와;  A support;
상기 지지부에 접착된 도전 필름 패턴으로 구성된 전자 디바이스용 기판이 제공된다. A substrate for an electronic device composed of a conductive film pattern adhered to the support portion is provided.
상기한 본 발명의 목적들을 달성하기 위한 바람직한 제 2 양태(樣態)는,  A second preferred aspect for achieving the above objects of the present invention is
지지부에 도전 필름을 접착 필름으로 접착하는 단계와; Bonding the conductive film to the support portion with an adhesive film;
상기 도전 필름 및 상기 접착 필름에 소정 패턴을 형성하기 위한 패턴 형상의 절단선을 형성하는 단계와; Forming a cutting line having a pattern shape for forming a predetermined pattern on the conductive film and the adhesive film;
상기 소정 패턴의 도전 필름 및 접착 필름은 남겨 놓고, 상기 소정 패턴 이외의 도전 필름 및 접착 필름을 상기 지지부에서 이탈시키는 단계를 포함하여 구성된 전자 장치용 기판을 형성하는 방법이 제공된다. Provided is a method of forming a substrate for an electronic device, comprising leaving the conductive film and the adhesive film of the predetermined pattern, and leaving the conductive film and the adhesive film other than the predetermined pattern from the support.
상기한 본 발명의 목적들을 달성하기 위한 바람직한 제 3 양태(樣態)는, A third preferred aspect for achieving the above objects of the present invention is
전자 디바이스용 기판을 준비하는 단계와; Preparing a substrate for an electronic device;
도전 필름 패턴을 준비하는 단계와; Preparing a conductive film pattern;
상기 도전 필름 패턴을 상기 전자 디바이스용 기판에 접착하는 단계를 포함하여 구성된 전자 장치용 기판을 형성하는 방법이 제공된다. A method of forming a substrate for an electronic device comprising the step of adhering the conductive film pattern to the substrate for an electronic device is provided.
도 1 내지 4는 종래 기술에 따른 디바이스용 기판에 도전막 패턴 형성 방법을 설명하기 개략적인 단면도1 to 4 are schematic cross-sectional views illustrating a method for forming a conductive film pattern on a substrate for a device according to the prior art.
도 5 내지 8은 본 발명에 따른 전자 장치용 기판을 형성하는 방법을 설명하기 위한 개략적인 단면도5 to 8 are schematic cross-sectional views for explaining a method of forming a substrate for an electronic device according to the present invention.
도 9는 본 발명에 따른 전자 디바이스용 기판의 개략적인 단면도9 is a schematic cross-sectional view of a substrate for an electronic device according to the present invention.
도 10 및 11은 본 발명에 따라 적용된 도전 필름을 설명하기 위한 개략적인 단면도10 and 11 are schematic cross-sectional views for explaining a conductive film applied according to the present invention.
도 12는 본 발명에 따른 전자 장치용 기판을 형성하는 방법을 설명하기 위한 개략적인 단면도12 is a schematic cross-sectional view illustrating a method of forming a substrate for an electronic device according to the present invention.
도 13은 본 발명에 따라 피나클 다이(Pinnacle die)로 도전 필름에 패턴 형상의 절단선을 형성하는 공정을 촬영한 사진도FIG. 13 is a photograph photographing a process of forming a cutting line having a pattern shape on a conductive film with a pinnacle die according to the present invention. FIG.
이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 설명하면 다음과 같다. Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.
도 5 내지 8은 본 발명에 따른 전자 장치용 기판을 형성하는 방법을 설명하기 위한 개략적인 단면도로서, 먼저, 지지부(23)에 도전 필름(21)을 접착 필름(22)으로 접착한다.(도 5) 5 to 8 are schematic cross-sectional views for explaining a method of forming a substrate for an electronic device according to the present invention. First, the conductive film 21 is adhered to the support 23 with an adhesive film 22. 5)
상기 지지부(23)는 플렉서블 기판으로 적용할 수 있다. The support 23 may be applied as a flexible substrate.
그리고, 상기 지지부(23)는 금속 기판, 글래스 기판 및 고분자 기판 중 하나인 것이 바람직하다. In addition, the support 23 may be one of a metal substrate, a glass substrate, and a polymer substrate.
그 후, 상기 도전 필름(21) 및 상기 접착 필름(22)에 소정 패턴을 형성하기 위한 패턴 형상의 절단선(29)을 형성한다.(도 6) Thereafter, a cut line 29 having a pattern shape for forming a predetermined pattern is formed on the conductive film 21 and the adhesive film 22. (FIG. 6)
여기서, 상기 절단선(29)은 롤 방식의 피나클 다이(Pinnacle die)로 형성하는 것이 바람직하다. Here, the cutting line 29 is preferably formed of a pinnacle die (Pinnacle die) of a roll method.
연이어, 상기 소정 패턴의 도전 필름 및 접착 필름은 남겨 놓고, 소정 패턴 이외의 도전 필름 및 접착 필름을 상기 지지부에서 이탈시킨다.(도 7) Subsequently, the conductive film and the adhesive film of the predetermined pattern are left, and the conductive film and the adhesive film other than the predetermined pattern are separated from the support portion.
즉, 상기 소정 패턴의 도전 필름 영역 및 접착 필름 영역은 상기 지지부에 남겨 놓고, 상기 소정 패턴 이외의 도전 필름 영역 및 접착 필름 영역은 상기 지지부에서 제거되는 것이다. That is, the conductive film region and the adhesive film region of the predetermined pattern are left in the supporting portion, and the conductive film region and the adhesive film region other than the predetermined pattern are removed from the supporting portion.
여기서, 상기 소정 패턴 이외의 도전 필름 및 접착 필름은 상기 절단선(29)에 의해 절단되어 이탈이 용이하다. Here, the conductive film and the adhesive film other than the predetermined pattern are cut by the cutting line 29 so that separation is easy.
그리고, 상기 소정 패턴 이외의 도전 필름 및 접착 필름이 이탈된 영역은 상기 지지부(23)가 노출된다. In addition, the support part 23 is exposed in a region where the conductive film and the adhesive film other than the predetermined pattern are separated.
이로써, 도 8과 같이 지지부(23) 상부에 도전 필름 패턴(28)이 형성된 전자 디바이스용 기판을 획득할 수 있게 된다.  As a result, as shown in FIG. 8, a substrate for an electronic device having a conductive film pattern 28 formed on the support 23 may be obtained.
이러한, 본 발명의 도전 필름을 패터닝하는 방법은 종래의 사진 식각 공정의 습식 식각 공정을 수행하지 않아, 흡습에 대한 문제점을 야기시키지 않는 장점이 있다. Such a method of patterning the conductive film of the present invention does not perform the wet etching process of the conventional photolithography process, there is an advantage that does not cause a problem for moisture absorption.
또한, 본 발명의 도전 필름을 패터닝하는 방법은 종래의 사진 식각 공정의 건식 식각 공정을 수행하지 않아 기판 변형이 발생되는 것을 감소시킬 수 있는 장점이 있다. In addition, the method for patterning the conductive film of the present invention has an advantage of reducing substrate deformation by not performing a dry etching process of a conventional photolithography process.
즉, 플라즈마를 이용한 건식 식각 공정에서 플렉서블 기판은 변형이 발생한다. That is, in the dry etching process using plasma, the flexible substrate is deformed.
더불어, 본 발명은 기존의 식각 공정을 수행하지 않아 공정이 매우 간단하고, 패터닝을 위한 장비의 투자 비용, 공정 비용 및 공정 시간 등을 감소시킬 수 있는 장점이 있다. In addition, the present invention does not perform the conventional etching process is very simple process, there is an advantage that can reduce the investment cost, process cost and process time of the equipment for patterning.
게다가, 본 발명은 다양한 패턴 형상을 수행하기 위하여 패턴 모양의 교체도 사진 식각 공정에 비하여 비교적 단순하여 패턴의 변화에 대응하기가 용이한 장점이 있다. In addition, the present invention has an advantage that it is easy to cope with the change of the pattern is relatively simple compared to the photo etching process to replace the pattern shape to perform a variety of pattern shapes.
또, 본 발명은 롤투롤(Roll to Roll) 방식을 적용할 수 있는 장점이 있다. In addition, the present invention has the advantage that can be applied to the roll to roll (Roll to Roll) method.
도 9는 본 발명에 따른 전자 디바이스용 기판의 개략적인 단면도로서, 전자 디바이스용 기판은 지지부(23)와; 상기 지지부(23)에 접착된 도전 필름 패턴(28)으로 구성된다. 9 is a schematic cross-sectional view of a substrate for an electronic device according to the present invention, wherein the substrate for an electronic device includes a support 23; It consists of a conductive film pattern 28 adhered to the support 23.
여기서, 상기 지지부(23)과 상기 도전 필름 패턴(28) 사이에는 접착 필름(22a)이 개재되어 있는 것이 바람직하다. Here, it is preferable that the adhesive film 22a is interposed between the support part 23 and the conductive film pattern 28.
그리고, 이런 전자 디바이스용 기판은 평판디스플레이, 솔라셀, 플렉서블 디스플레이, 플라스틱 일렉트로닉스, 조명, 터치 패널 중 하나의 기판으로 사용된다. The substrate for such an electronic device is used as one of flat panel displays, solar cells, flexible displays, plastic electronics, lighting, and touch panels.
도 10 및 11은 본 발명에 따라 적용된 도전 필름을 설명하기 위한 개략적인 단면도로서, 본 발명에 적용된 도전 필름은 도 10과 같이, 단일 도전성 물질로 이루어진 도전 필름(21a)으로 구성할 수 있다. 10 and 11 are schematic cross-sectional views for explaining a conductive film applied according to the present invention. The conductive film applied to the present invention may be formed of a conductive film 21a made of a single conductive material as shown in FIG. 10.
예컨대, 이 도전 필름(21a)은 동박(Copper foil)과 같은 것이다. For example, this conductive film 21a is the same as copper foil.
그리고, 도 11과 같이, 도전 필름(21)은 절연 필름(21c) 상부에 도전성 물질 코팅막(21b)이 형성된 구조로 형성할 수 있다. As illustrated in FIG. 11, the conductive film 21 may be formed in a structure in which a conductive material coating film 21b is formed on the insulating film 21c.
상기 도전성 물질 코팅막(21b)은 금속, 도전성 세라믹, 도전성 유기 물질 중 하나도 이루어진 것이 바람직하다. Preferably, the conductive material coating film 21b is made of one of a metal, a conductive ceramic, and a conductive organic material.
그리고, 상기 도전성 물질 코팅막(21b)은 ITO, IZO와 같은 투명 전도성 산화막(TCO, Transparent conductive oxide)으로 형성할 수 있다. The conductive material coating layer 21b may be formed of a transparent conductive oxide (TCO) such as ITO or IZO.
도 12는 본 발명에 따른 전자 장치용 기판을 형성하는 방법을 설명하기 위한 개략적인 단면도로서, 전자 디바이스용 기판을 준비한다.(S10단계) 12 is a schematic cross-sectional view for explaining a method of forming a substrate for an electronic device according to the present invention, and prepares a substrate for an electronic device (step S10).
이 후, 도전 필름 패턴을 준비한다.(S20단계) Thereafter, a conductive film pattern is prepared. (S20 step)
여기서, 상기 도전 필름 패턴은 도 3a와 도 3b와 같은 필름이며, 상기 도전 필름 패턴 하부에 접착 필름 패턴이 부착되어 있는 것이 바람직하다. Here, the conductive film pattern is a film as shown in Figure 3a and 3b, it is preferable that the adhesive film pattern is attached to the lower portion of the conductive film pattern.
계속, 상기 도전 필름 패턴을 상기 전자 디바이스용 기판에 접착한다.(S30단계) Subsequently, the conductive film pattern is adhered to the electronic device substrate. (S30 step)
도 13은 본 발명에 따라 피나클 다이(Pinnacle die)로 도전 필름에 패턴 형상의 절단선을 형성하는 공정을 촬영한 사진도로서, 피나클 다이는 회전하는 커터기(100)와; 이송 장치(미도시)로 구성된다. FIG. 13 is a photograph photographing a process of forming a patterned cutting line on a conductive film with a pinnacle die according to the present invention, wherein the pinnacle die has a rotating cutter machine 100; It consists of a conveying apparatus (not shown).
이 이송 장치와 커터기(100) 사이에 도전 필름이 위치되며, 상기 이송 장치에 도전 필름이 올려져 이송되면서 커터기(100)를 통과하면, 상기 커터기(100)에서 도전 필름에 패턴 형상의 절단선을 형성하게 된다. The conductive film is positioned between the transfer device and the cutter 100, and when the conductive film is placed on the transfer device and transferred, the conductive film passes through the cutter 100, and the cutter 100 cuts a pattern-shaped cut line on the conductive film. To form.
그러므로, 도 13과 같이, 커터기(100)를 통과한 도전 필름(21)에는 패턴 형상의 절단선(29)이 형성되는 것이다. Therefore, as shown in FIG. 13, the patterned cutting line 29 is formed in the conductive film 21 which has passed through the cutter 100.
이상, 본 발명의 실시 예에 따른 발명의 구성을 상세히 설명하였지만, 본 발명은 반드시 이러한 실시 예로 국한되는 것이 아니고, 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 다양하게 변형 실시될 수 있다.While the configuration of the invention according to the embodiment of the present invention has been described in detail, the present invention is not necessarily limited to these embodiments, and various modifications can be made without departing from the spirit of the present invention.
본 발명은 간단한 공정을 수행하여 형성하고 식각 공정을 수행하지 않아, 패터닝을 위한 장비의 투자 비용, 공정 비용 및 공정 시간 등을 감소시킬 수 있는 도전 필름 패턴이 형성된 기판을 평판디스플레이, 솔라셀, 플렉서블 디스플레이, 플라스틱 일렉트로닉스, 조명, 터치 패널 등의 디바이스에 적용할 수 있다.According to the present invention, a substrate having a conductive film pattern formed thereon, which can be formed by performing a simple process and not performing an etching process, can reduce the investment cost, process cost, and process time of equipment for patterning, such as a flat panel display, a solar cell, and a flexible substrate. It can be applied to devices such as displays, plastic electronics, lighting and touch panels.

Claims (10)

  1. 지지부와;  A support;
    상기 지지부에 접착된 도전 필름 패턴으로 구성된 전자 디바이스용 기판. The board | substrate for electronic devices comprised by the conductive film pattern adhering to the said support part.
  2. 청구항 1에 있어서, The method according to claim 1,
    상기 지지부는, The support portion,
    플렉서블 기판인 것을 특징으로 하는 전자 디바이스용 기판. It is a flexible substrate, The board | substrate for electronic devices characterized by the above-mentioned.
  3. 청구항 1에 있어서, The method according to claim 1,
    상기 지지부는,The support portion,
    금속 기판, 글래스 기판 및 고분자 기판 중 하나인 것을 특징으로 하는 전자 디바이스용 기판.A substrate for an electronic device, which is one of a metal substrate, a glass substrate, and a polymer substrate.
  4. 청구항 1에 있어서, The method according to claim 1,
    상기 지지부와 상기 도전 필름 패턴 사이에는 접착 필름이 개재되어 있는 것을 특징으로 하는 전자 디바이스용 기판.The adhesive film is interposed between the said support part and the said conductive film pattern, The board | substrate for electronic devices characterized by the above-mentioned.
  5. 지지부에 도전 필름을 접착 필름으로 접착하는 단계와; Bonding the conductive film to the support portion with an adhesive film;
    상기 도전 필름 및 상기 접착 필름에 소정 패턴을 형성하기 위한 패턴 형상의 절단선을 형성하는 단계와; Forming a cutting line having a pattern shape for forming a predetermined pattern on the conductive film and the adhesive film;
    상기 소정 패턴의 도전 필름 및 접착 필름은 남겨 놓고, 상기 소정 패턴 이외의 도전 필름 및 접착 필름을 상기 지지부에서 이탈시키는 단계를 포함하여 구성된 전자 장치용 기판을 형성하는 방법. Leaving the conductive film and the adhesive film of the predetermined pattern, and leaving the conductive film and the adhesive film other than the predetermined pattern from the support portion.
  6. 청구항 5에 있어서, The method according to claim 5,
    상기 절단선은,The cutting line is,
    롤 방식의 피나클 다이(Pinnacle die)로 형성하는 것을 특징으로 하는 전자 장치용 기판을 형성하는 방법.A method for forming a substrate for an electronic device, characterized in that it is formed by a pinnacle die of a roll method.
  7. 청구항 5에 있어서, The method according to claim 5,
    상기 도전 필름은,The conductive film,
    단일 도전성 물질로 이루어진 도전 필름인 것을 특징으로 하는 전자 장치용 기판을 형성하는 방법. A conductive film made of a single conductive material.
  8. 청구항 5에 있어서, The method according to claim 5,
    상기 도전 필름은,The conductive film,
    절연 필름 상부에 도전성 물질 코팅막이 형성된 구조로 이루어진 것을 특징으로 하는 전자 장치용 기판을 형성하는 방법. A method for forming a substrate for an electronic device, characterized in that the conductive material coating film is formed on the insulating film.
  9. 청구항 8에 있어서, The method according to claim 8,
    상기 도전성 물질 코팅막은 금속, 도전성 세라믹, 도전성 유기 물질, 투명 전도성 산화막(TCO, Transparent conductive oxide) 중 하나도 이루어진 것을 특징으로 하는 전자 장치용 기판을 형성하는 방법. The conductive material coating film is a method for forming a substrate for an electronic device, characterized in that the metal, conductive ceramic, conductive organic material, transparent conductive oxide (TCO), also made of one.
  10. 전자 디바이스용 기판을 준비하는 단계와; Preparing a substrate for an electronic device;
    도전 필름 패턴을 준비하는 단계와; Preparing a conductive film pattern;
    상기 도전 필름 패턴을 상기 전자 디바이스용 기판에 접착하는 단계를 포함하여 구성된 전자 장치용 기판을 형성하는 방법. Adhering the conductive film pattern to the substrate for an electronic device.
PCT/KR2009/002083 2008-04-21 2009-04-21 Printed circuit board for electronic devices and method of manufacturing the same WO2009131364A2 (en)

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