WO2009131364A3 - Printed circuit board for electronic devices and method of manufacturing the same - Google Patents

Printed circuit board for electronic devices and method of manufacturing the same Download PDF

Info

Publication number
WO2009131364A3
WO2009131364A3 PCT/KR2009/002083 KR2009002083W WO2009131364A3 WO 2009131364 A3 WO2009131364 A3 WO 2009131364A3 KR 2009002083 W KR2009002083 W KR 2009002083W WO 2009131364 A3 WO2009131364 A3 WO 2009131364A3
Authority
WO
WIPO (PCT)
Prior art keywords
manufacturing
electronic devices
same
circuit board
printed circuit
Prior art date
Application number
PCT/KR2009/002083
Other languages
French (fr)
Korean (ko)
Other versions
WO2009131364A2 (en
Inventor
이충훈
Original Assignee
(주)모디스텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)모디스텍 filed Critical (주)모디스텍
Publication of WO2009131364A2 publication Critical patent/WO2009131364A2/en
Publication of WO2009131364A3 publication Critical patent/WO2009131364A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer

Abstract

The present invention concerns a PCB for electronic devices and a method for manufacturing the same.  That is to say, the method of manufacturing a PCB for use in electronic devices of the present invention comprises a step wherein a conducting film is bonded to a substrate with a bonding film, a step wherein the cutting lines of the pre-determined pattern are formed in order to form the pre-determined pattern in said conductive film and bonding film, and a step wherein the conductive film and bonding film outside of the pre-determined pattern are removed, leaving said fixed pattern.
PCT/KR2009/002083 2008-04-21 2009-04-21 Printed circuit board for electronic devices and method of manufacturing the same WO2009131364A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0036675 2008-04-21
KR1020080036675A KR20090111091A (en) 2008-04-21 2008-04-21 Conductive film structure and patterning method

Publications (2)

Publication Number Publication Date
WO2009131364A2 WO2009131364A2 (en) 2009-10-29
WO2009131364A3 true WO2009131364A3 (en) 2010-01-21

Family

ID=41217256

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/002083 WO2009131364A2 (en) 2008-04-21 2009-04-21 Printed circuit board for electronic devices and method of manufacturing the same

Country Status (2)

Country Link
KR (1) KR20090111091A (en)
WO (1) WO2009131364A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2780324A1 (en) 2009-12-04 2011-06-09 Colgate-Palmolive Company Oral compositions containing a combination of natural extracts and related methods

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3322128B2 (en) * 1996-07-05 2002-09-09 凸版印刷株式会社 Laminated body and method for manufacturing thick film circuit using the same
JP2003015286A (en) * 2001-06-28 2003-01-15 Tdk Corp Substrate where functional layer pattern is formed and method for forming functional layer pattern
KR20050109604A (en) * 2003-03-27 2005-11-21 이 아이 듀폰 디 네모아 앤드 캄파니 Processes and donor elements for transferring thermally sensitive materials to substrates
KR100610629B1 (en) * 1996-05-30 2006-10-31 히다치 덴센 가부시키 가이샤 Circuit tapes with adhesive films, semiconductor devices and manufacturing methods thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100610629B1 (en) * 1996-05-30 2006-10-31 히다치 덴센 가부시키 가이샤 Circuit tapes with adhesive films, semiconductor devices and manufacturing methods thereof
JP3322128B2 (en) * 1996-07-05 2002-09-09 凸版印刷株式会社 Laminated body and method for manufacturing thick film circuit using the same
JP2003015286A (en) * 2001-06-28 2003-01-15 Tdk Corp Substrate where functional layer pattern is formed and method for forming functional layer pattern
KR20050109604A (en) * 2003-03-27 2005-11-21 이 아이 듀폰 디 네모아 앤드 캄파니 Processes and donor elements for transferring thermally sensitive materials to substrates

Also Published As

Publication number Publication date
KR20090111091A (en) 2009-10-26
WO2009131364A2 (en) 2009-10-29

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