WO2009121426A3 - Wegbausensor und verfahren zur herstellung eines wegbausensors mittels einlegen und kraft-/formschlüssiger verbindung - Google Patents

Wegbausensor und verfahren zur herstellung eines wegbausensors mittels einlegen und kraft-/formschlüssiger verbindung Download PDF

Info

Publication number
WO2009121426A3
WO2009121426A3 PCT/EP2008/065390 EP2008065390W WO2009121426A3 WO 2009121426 A3 WO2009121426 A3 WO 2009121426A3 EP 2008065390 W EP2008065390 W EP 2008065390W WO 2009121426 A3 WO2009121426 A3 WO 2009121426A3
Authority
WO
WIPO (PCT)
Prior art keywords
encoder sensor
distance encoder
force
form fit
producing
Prior art date
Application number
PCT/EP2008/065390
Other languages
English (en)
French (fr)
Other versions
WO2009121426A2 (de
Inventor
Thorsten Uelzen
Boris Adam
Martin Griebel
Timo Nachtrab
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2009121426A2 publication Critical patent/WO2009121426A2/de
Publication of WO2009121426A3 publication Critical patent/WO2009121426A3/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/142—Multiple part housings
    • G01L19/143—Two part housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)

Abstract

Wegbausensor für die Verwendung im Automobil mit einem Sensormodul, einem Gehäuse, wenigstens einem elektrischen Anschluss des Sensormoduls (Kontaktelement), dadurch gekennzeichnet, dass das wenigstens eine Kontaktelement des Sensormoduls eine jeweilige elektrische Verbindung zu einem jeweiligen Kontaktelement des Gehäuses kraft- oder formschlüssig herstellt, das Sensormodul in das Gehäuse ein- oder angelegt ist und das Sensormodul im oder am Gehäuse kraft- oder formschlüssig fixiert ist.
PCT/EP2008/065390 2008-03-31 2008-11-12 Wegbausensor und verfahren zur herstellung eines wegbausensors mittels einlegen und kraft-/formschlüssiger verbindung WO2009121426A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008000889.3A DE102008000889B4 (de) 2008-03-31 2008-03-31 Wegbausensor und Verfahren zur Herstellung eines Wegbausensors mittels Einlegen und kraft-/formschlüssiger Verbindung
DE102008000889.3 2008-03-31

Publications (2)

Publication Number Publication Date
WO2009121426A2 WO2009121426A2 (de) 2009-10-08
WO2009121426A3 true WO2009121426A3 (de) 2010-04-08

Family

ID=41050382

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/065390 WO2009121426A2 (de) 2008-03-31 2008-11-12 Wegbausensor und verfahren zur herstellung eines wegbausensors mittels einlegen und kraft-/formschlüssiger verbindung

Country Status (2)

Country Link
DE (1) DE102008000889B4 (de)
WO (1) WO2009121426A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011079446A1 (de) 2011-07-20 2013-02-07 Robert Bosch Gmbh Sensoreinrichtung, insbesondere für die Verwendung in einem Kraftfahrzeug
DE102014219030B4 (de) * 2014-09-22 2016-07-07 Robert Bosch Gmbh Steckermodul
DE102014225861A1 (de) * 2014-12-15 2016-06-16 Robert Bosch Gmbh Sensoreinrichtung, insbesondere für die Verwendung in einem Kraftfahrzeug
US10690524B2 (en) 2017-10-19 2020-06-23 Veoneer Us, Inc. Lock clip for electrical sensor connection

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6435882B1 (en) * 2001-07-27 2002-08-20 Agilent Technologies, Inc. Socketable flexible circuit based electronic device module and a socket for the same
US20030107491A1 (en) * 2001-12-10 2003-06-12 Keiji Sasaki Pressure sensor
EP1584911A1 (de) * 2004-03-30 2005-10-12 Nagano Keiki Co., Ltd. Drucksensorgehäuse und Herstellungsverfahren

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3706168A1 (de) 1987-02-26 1988-09-08 Bosch Gmbh Robert Messaufnehmer
AT403962B (de) 1996-10-30 1998-07-27 Avl Verbrennungskraft Messtech Vorrichtung zur durchführung von elektrochemischen und/oder optischen messvorgängen in flüssigkeiten
DE19964218C2 (de) 1999-10-08 2003-04-10 Hahn Schickard Ges Elektromechanisches Bauelement mit einem Polymerkörper und Verfahren zur Herstellung desselben
DE20106750U1 (de) 2001-04-19 2002-08-29 Robert Bosch Gmbh, 70469 Stuttgart Kleinbauender Kupplungsstecker, insbesondere für eine planare Breitband-Lamda-Sonde mit einer Sicherung für das Deckelelement
DE20304461U1 (de) 2002-04-09 2003-06-12 MBS Sulzbach Messwandler GmbH, 74429 Sulzbach-Laufen Elektronischer Messwertumformer mit integriertem Stromwandler
DE102004021931A1 (de) 2004-03-16 2005-10-06 Robert Bosch Gmbh Gehäuse für eine elektronische Schaltung
DE102004027094A1 (de) 2004-06-02 2005-12-29 Infineon Technologies Ag Halbleitermodul mit einem Halbleiter-Sensorchip und einem Kunststoffgehäuse sowie Verfahren zu dessen Herstellung

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6435882B1 (en) * 2001-07-27 2002-08-20 Agilent Technologies, Inc. Socketable flexible circuit based electronic device module and a socket for the same
US20030107491A1 (en) * 2001-12-10 2003-06-12 Keiji Sasaki Pressure sensor
EP1584911A1 (de) * 2004-03-30 2005-10-12 Nagano Keiki Co., Ltd. Drucksensorgehäuse und Herstellungsverfahren

Also Published As

Publication number Publication date
DE102008000889B4 (de) 2022-10-27
DE102008000889A1 (de) 2009-10-15
WO2009121426A2 (de) 2009-10-08

Similar Documents

Publication Publication Date Title
WO2010057623A3 (de) Vorrichtung und verfahren für ein schienenfahrzeug
WO2011076181A3 (de) Sensor bei welchem das sensorelement teil des sensorgehäuses ist
WO2010037812A3 (de) Sensorelement und trägerelement zur herstellung eines sensors
GB2470265B (en) Motor vehicle having an environmental sensor and method for operating the environmental sensor
WO2010089261A3 (de) Sensormodul und verfahren zum herstellen von sensormodulen
WO2006111679A3 (fr) Procede et dispositif de surveillance d'une structure d'un avion
WO2013012658A3 (en) Electrical connector having positioning assembly
WO2008145081A3 (de) Kabelbaumherstellungssystem
EP1929588A4 (de) Elektrische verbinderanordnung mit verbindungshilfe
GB0803973D0 (en) Automotive vehicle electrical system diagnostic device
WO2008152240A3 (fr) Module indicateur de tableau de bord formé d'un moteur et de moyens de connexion électrique
EG25666A (en) An electric sensor web, system and a method for its manufacture
WO2010044997A3 (en) Snap-in water sensor
WO2010033673A3 (en) Cable connector
GB201014660D0 (en) Magneto-strictive torque sensor, method for manufacturing the same, and electric power steering device
WO2011107497A3 (en) Connection device for a solar module
WO2009121426A3 (de) Wegbausensor und verfahren zur herstellung eines wegbausensors mittels einlegen und kraft-/formschlüssiger verbindung
WO2013127535A3 (de) Elektromotor
WO2010072476A3 (de) Förderaggregat
WO2011069712A3 (de) Positionssensor
WO2012000485A3 (de) Komponententräger, insbesondere kraftfahrzeugtürschloss
WO2013087047A3 (de) Vorrichtung zum elektrischen aufladen eines elektrisch angetriebenen kraftfahrzeugs
WO2008017556A3 (de) Moldgehäuse in einpresstechnik
WO2009087323A3 (fr) Procede de demontage d'un dispositif comportant au moins un article noye au moins partiellement dans une resine
WO2011064279A3 (de) Anordnung eines verschlussstopfens in einer montagebohrung eines motorengehäuses und verfahren zur anbringung eines verschlussstopfens in einer montagebohrung eines motorengehäuses

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08873761

Country of ref document: EP

Kind code of ref document: A2

122 Ep: pct application non-entry in european phase

Ref document number: 08873761

Country of ref document: EP

Kind code of ref document: A2