WO2009120376A3 - Thermally enhanced electrically insulative adhesive paste - Google Patents
Thermally enhanced electrically insulative adhesive paste Download PDFInfo
- Publication number
- WO2009120376A3 WO2009120376A3 PCT/US2009/001935 US2009001935W WO2009120376A3 WO 2009120376 A3 WO2009120376 A3 WO 2009120376A3 US 2009001935 W US2009001935 W US 2009001935W WO 2009120376 A3 WO2009120376 A3 WO 2009120376A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrically insulative
- adhesive paste
- binder
- insulative adhesive
- thermally enhanced
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title 1
- 230000001070 adhesive effect Effects 0.000 title 1
- 239000002245 particle Substances 0.000 abstract 5
- 239000011230 binding agent Substances 0.000 abstract 3
- 239000007788 liquid Substances 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- 241000276425 Xiphophorus maculatus Species 0.000 abstract 1
- 238000005054 agglomeration Methods 0.000 abstract 1
- 230000002776 aggregation Effects 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 229920001169 thermoplastic Polymers 0.000 abstract 1
- 229920001187 thermosetting polymer Polymers 0.000 abstract 1
- 239000004416 thermosoftening plastic Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Die Bonding (AREA)
- Inorganic Insulating Materials (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA2719639A CA2719639A1 (en) | 2008-03-26 | 2009-03-26 | Thermally enhanced electrically insulative adhesive paste |
EP09724991A EP2257610A2 (en) | 2008-03-26 | 2009-03-26 | Thermally enhanced electrically insulative adhesive paste |
CN200980117568.9A CN102027091B (en) | 2008-03-26 | 2009-03-26 | Thermally enhanced electrically insulative adhesive paste |
JP2011501823A JP5774472B2 (en) | 2008-03-26 | 2009-03-26 | Thermally reinforced electrical insulating adhesive paste |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/079,483 | 2008-03-26 | ||
US12/079,483 US7906373B1 (en) | 2008-03-26 | 2008-03-26 | Thermally enhanced electrically insulative adhesive paste |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009120376A2 WO2009120376A2 (en) | 2009-10-01 |
WO2009120376A3 true WO2009120376A3 (en) | 2010-01-21 |
Family
ID=41114544
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2009/001935 WO2009120376A2 (en) | 2008-03-26 | 2009-03-26 | Thermally enhanced electrically insulative adhesive paste |
Country Status (8)
Country | Link |
---|---|
US (1) | US7906373B1 (en) |
EP (1) | EP2257610A2 (en) |
JP (1) | JP5774472B2 (en) |
KR (1) | KR20100133449A (en) |
CN (1) | CN102027091B (en) |
CA (1) | CA2719639A1 (en) |
MY (1) | MY156252A (en) |
WO (1) | WO2009120376A2 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8344523B2 (en) | 2006-05-08 | 2013-01-01 | Diemat, Inc. | Conductive composition |
JP2012049496A (en) * | 2010-01-29 | 2012-03-08 | Nitto Denko Corp | Heat radiation structure |
WO2015022956A1 (en) * | 2013-08-14 | 2015-02-19 | 電気化学工業株式会社 | Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate |
US9464214B2 (en) | 2014-02-25 | 2016-10-11 | The Boeing Company | Thermally conductive flexible adhesive for aerospace applications |
CN104479291A (en) * | 2014-12-04 | 2015-04-01 | 中国科学院过程工程研究所 | Heat-conducting insulated epoxy resin composition and preparation method and use thereof |
MY183994A (en) * | 2014-12-05 | 2021-03-17 | Honeywell Int Inc | High performance thermal interface materials with low thermal impedance |
CN106032460B (en) * | 2015-03-10 | 2019-05-24 | 常州市武进区半导体照明应用技术研究院 | Adhesive and its application, high-power LED bulb and preparation method thereof |
CN107735439B (en) * | 2015-07-02 | 2020-03-17 | 株式会社钟化 | Thermally conductive resin composition |
CN111557128A (en) | 2017-12-27 | 2020-08-18 | 3M创新有限公司 | Cured epoxy resin compositions, articles, and methods suitable for electronic device housings |
CN113403020A (en) * | 2021-06-05 | 2021-09-17 | 昆山纳诺新材料科技有限公司 | Heat-conducting PA insulating hot melt adhesive |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3142800B2 (en) * | 1996-08-09 | 2001-03-07 | 信越化学工業株式会社 | Thermal conductive silicone composition, thermal conductive material, and thermal conductive silicone grease |
US6649012B2 (en) * | 1999-12-17 | 2003-11-18 | Polymatech Co., Ltd. | Adhesion method and electronic component |
JP2004168870A (en) * | 2002-11-19 | 2004-06-17 | Hitachi Chem Co Ltd | Adhesive composition, adhesive film using the same and semiconductor device |
JP2007254527A (en) * | 2006-03-22 | 2007-10-04 | Toray Ind Inc | Adhesive composition for electronic equipment and adhesive sheet for electronic equipment using the same |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5991137A (en) * | 1982-11-15 | 1984-05-25 | Matsushita Electric Works Ltd | Resin composition |
US5204399A (en) * | 1989-03-09 | 1993-04-20 | National Starch And Chemical Investment Holding Corporation | Thermoplastic film die attach adhesives |
US5391604A (en) * | 1993-07-30 | 1995-02-21 | Diemat, Inc. | Adhesive paste containing polymeric resin |
US5781412A (en) * | 1996-11-22 | 1998-07-14 | Parker-Hannifin Corporation | Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size |
US5852092A (en) * | 1997-02-11 | 1998-12-22 | Johnson Matthey, Inc. | Organosilicon-containing compositions having enhanced adhesive properties |
JP4043103B2 (en) * | 1998-06-17 | 2008-02-06 | 日本化学工業株式会社 | Fused spherical silica and method for producing the same |
US6117930A (en) * | 1998-07-02 | 2000-09-12 | Johnson Matthey, Inc. | Resin systems for organosilicon-containing compositions |
US6057402A (en) * | 1998-08-12 | 2000-05-02 | Johnson Matthey, Inc. | Long and short-chain cycloaliphatic epoxy resins with cyanate ester |
US20060121068A1 (en) * | 1999-08-31 | 2006-06-08 | General Electric Company | Boron nitride particles of spherical geometry and process for making thereof |
JP2002121393A (en) * | 2000-10-12 | 2002-04-23 | Sekisui Chem Co Ltd | Thermally conductive resin composition and thermally conductive sheet |
US6946190B2 (en) * | 2002-02-06 | 2005-09-20 | Parker-Hannifin Corporation | Thermal management materials |
US6822018B2 (en) * | 2002-02-15 | 2004-11-23 | Delphi Technologies, Inc. | Thermally-conductive electrically-insulating polymer-base material |
US6888257B2 (en) * | 2002-06-28 | 2005-05-03 | Lord Corporation | Interface adhesive |
CN1271165C (en) * | 2003-09-03 | 2006-08-23 | 中国科学院化学研究所 | Liquid epoxy packaging material and its preparation method and application |
KR101261064B1 (en) * | 2004-08-23 | 2013-05-06 | 제너럴 일렉트릭 캄파니 | Thermally conductive composition and method for preparing the same |
CN1880399B (en) * | 2005-06-16 | 2010-09-29 | 鸿富锦精密工业(深圳)有限公司 | Thermally conductive glue and method of manufacturing same |
CN1927988A (en) * | 2005-09-05 | 2007-03-14 | 鸿富锦精密工业(深圳)有限公司 | Heat interfacial material and method for making the same |
JP4735492B2 (en) * | 2006-01-27 | 2011-07-27 | 新神戸電機株式会社 | Prepress and laminate for heat and pressure molding |
TW200833752A (en) * | 2006-10-23 | 2008-08-16 | Lord Corp | Highly filled polymer materials |
JP2008153430A (en) * | 2006-12-18 | 2008-07-03 | Mitsubishi Electric Corp | Heatsink substrate and heat conductive sheet, and power module using these |
JP5608371B2 (en) * | 2007-01-10 | 2014-10-15 | モメンティブ パフォーマンス マテリアルズ インコーポレイテッド | Thermal interface material and manufacturing method thereof |
-
2008
- 2008-03-26 US US12/079,483 patent/US7906373B1/en active Active
-
2009
- 2009-03-26 KR KR1020107023828A patent/KR20100133449A/en not_active Application Discontinuation
- 2009-03-26 WO PCT/US2009/001935 patent/WO2009120376A2/en active Application Filing
- 2009-03-26 MY MYPI2010004497A patent/MY156252A/en unknown
- 2009-03-26 JP JP2011501823A patent/JP5774472B2/en active Active
- 2009-03-26 CA CA2719639A patent/CA2719639A1/en not_active Abandoned
- 2009-03-26 CN CN200980117568.9A patent/CN102027091B/en active Active
- 2009-03-26 EP EP09724991A patent/EP2257610A2/en not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3142800B2 (en) * | 1996-08-09 | 2001-03-07 | 信越化学工業株式会社 | Thermal conductive silicone composition, thermal conductive material, and thermal conductive silicone grease |
US6649012B2 (en) * | 1999-12-17 | 2003-11-18 | Polymatech Co., Ltd. | Adhesion method and electronic component |
JP2004168870A (en) * | 2002-11-19 | 2004-06-17 | Hitachi Chem Co Ltd | Adhesive composition, adhesive film using the same and semiconductor device |
JP2007254527A (en) * | 2006-03-22 | 2007-10-04 | Toray Ind Inc | Adhesive composition for electronic equipment and adhesive sheet for electronic equipment using the same |
Also Published As
Publication number | Publication date |
---|---|
CN102027091B (en) | 2014-07-09 |
EP2257610A2 (en) | 2010-12-08 |
US7906373B1 (en) | 2011-03-15 |
JP2011515559A (en) | 2011-05-19 |
MY156252A (en) | 2016-01-29 |
WO2009120376A2 (en) | 2009-10-01 |
KR20100133449A (en) | 2010-12-21 |
JP5774472B2 (en) | 2015-09-09 |
CA2719639A1 (en) | 2009-10-01 |
CN102027091A (en) | 2011-04-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2009120376A3 (en) | Thermally enhanced electrically insulative adhesive paste | |
EP2216790A4 (en) | Electrically conductive paste, and electrical and electronic device comprising the same | |
WO2009035906A3 (en) | Composite, thermal interface material containing the composite, and methods for their preparation and use | |
WO2009058630A3 (en) | Thermally conductive adhesives and adhesive tape using the same | |
WO2009092064A3 (en) | Electrically conductive adhesive | |
TWI347348B (en) | Anisotropic conductive adhesive and connecting method of electrodes using the same | |
WO2007130358A3 (en) | Plastic led bulb | |
WO2012071123A3 (en) | Rfid tag including environmentally sensitive materials | |
WO2007019183A3 (en) | Electric tile modules | |
WO2009054387A1 (en) | Coated conductive powder and conductive adhesive using the same | |
EP2196514A4 (en) | Adhesive composition, electronic component-mounted substrate using the adhesive composition, and semiconductor device | |
PL2281022T3 (en) | Thermally conductive adhesive mass | |
WO2009022461A1 (en) | Circuit device, circuit device manufacturing method and portable device | |
EP2559717A4 (en) | Curable resin composition, adhesive epoxy resin paste, die-bonding agent, non-conductive paste, adhesive epoxy resin film, non-conductive epoxy resin film, anisotropic conductive paste, and anisotropic conductive film | |
TW200719358A (en) | Composite conductive film and semiconductor package using such film | |
EP2148393A4 (en) | Circuit-connecting material, and connection structure for circuit member | |
MX2010003823A (en) | Wo 2009087295 a1 20090716. | |
EP2432013A3 (en) | Sealing member for electronic component package and electronic component package | |
EP2040268A4 (en) | Conductive particle, adhesive composition, circuit-connecting material, circuit-connecting structure, and method for connection of circuit member | |
WO2010030890A3 (en) | Thermal resistor material | |
WO2008133037A1 (en) | Electrically conductive particle, anisotropic conductive connection material, and method for production of electrically conductive particle | |
WO2008143358A1 (en) | Electric device, connecting method and adhesive film | |
EP2154501A3 (en) | Laminated temperature sensor | |
WO2009057691A1 (en) | Connection terminal, package using the same, and electronic device | |
WO2011159397A3 (en) | Solar cell structure and composition and method for forming the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200980117568.9 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 09724991 Country of ref document: EP Kind code of ref document: A2 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2719639 Country of ref document: CA Ref document number: 2011501823 Country of ref document: JP Ref document number: 12010502189 Country of ref document: PH |
|
WWE | Wipo information: entry into national phase |
Ref document number: PI 2010004497 Country of ref document: MY |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2009724991 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 20107023828 Country of ref document: KR Kind code of ref document: A |