CN113403020A - Heat-conducting PA insulating hot melt adhesive - Google Patents
Heat-conducting PA insulating hot melt adhesive Download PDFInfo
- Publication number
- CN113403020A CN113403020A CN202110651064.8A CN202110651064A CN113403020A CN 113403020 A CN113403020 A CN 113403020A CN 202110651064 A CN202110651064 A CN 202110651064A CN 113403020 A CN113403020 A CN 113403020A
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- Prior art keywords
- parts
- hot melt
- melt adhesive
- heat
- conducting
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
- C09J177/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
- C09J193/04—Rosin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to the technical field of hot melt adhesives, in particular to a heat-conducting PA insulating hot melt adhesive. The product mainly uses PA (polyamide) hot melt adhesive, and heat conducting powder is filled in the PA plastic, so that heat conducting fillers are uniformly and orderly distributed in the PA plastic to form a heat conducting path, and the heat conducting performance of the hot melt adhesive is improved.
Description
Technical Field
Relate to hot melt adhesive technical field, especially relate to a heat conduction PA insulation hot melt adhesive.
Background
The hot melt adhesive has the advantages of low price, excellent bonding property and the like, and is widely applied to the bonding aspect of electronic and electric appliances. Electronic apparatus can produce a large amount of heats at long-time working process, and the hot melt adhesive on the market at present uses macromolecular material as the main part mostly, and the cohesiveness is good but the heat conductivity is not enough, influences the electrical apparatus and uses.
In the prior art, high polymer resin, synthetic wax, a plasticizer, an antioxidant and a filler are mixed and heated to a molten state, and a hot melt adhesive is obtained after cooling, so that the heat generated by an electric appliance cannot be dissipated in time when the hot melt adhesive is used in the electric appliance due to poor heat conductivity of the added raw materials, and the service life of the electric appliance is influenced.
Disclosure of Invention
In order to overcome the defects in the background art, the PA (polyamide) hot melt adhesive is mainly used, and the heat-conducting powder is filled in the PA plastic, so that the heat-conducting filler is uniformly and orderly distributed in the PA plastic to form a heat-conducting passage, and the heat-conducting property of the hot melt adhesive is improved.
The technical scheme adopted by the invention for solving the technical problems is as follows: the formula of the heat-conducting PA insulating hot melt adhesive is provided, and the heat-conducting PA insulating hot melt adhesive is prepared from the following components in parts by weight:
20-30 parts of PA;
20-30 parts of tackifying resin;
10-20 parts of synthetic wax;
10-20 parts of boron nitride;
10-20 parts of aluminum nitride;
5-15 parts of a plasticizer;
1-2 parts of antioxidant
The PA is nylon 6, and the relative viscosity is 2.0-2.4; the tackifying resin is 138 rosin glyceride particles; the synthetic wax is coal-based synthetic wax; the plasticizer is polyethylene wax; the antioxidant is 1010; the boron nitride is powder, and the particle size is 50-70 um; the aluminum nitride is powder with a particle size of 10-20 um.
The preparation method of the heat-conducting PA insulating hot melt adhesive comprises the following steps:
a. the following components are taken according to parts by weight:
20-30 parts of PA (polyamide),
20-30 parts of tackifying resin,
10-20 parts of synthetic wax,
10-20 parts of boron nitride, namely,
10-20 parts of aluminum nitride,
5-15 parts of a plasticizer, namely,
1-2 parts of an antioxidant;
b. sequentially adding PA, tackifying resin, boron nitride, aluminum nitride, synthetic wax and an antioxidant into a reaction kettle, uniformly stirring, and heating to a molten state to obtain a molten state mixture;
c. b, pouring the mixture obtained in the step b into an extruder, and extruding the mixture into a water tank by using the extruder to obtain a glue stick;
d. and c, cutting the hot melt adhesive rod obtained in the step c to obtain the hot melt adhesive.
The invention takes PA (polyamide) hot melt adhesive as a main material, and aluminum nitride heat conduction powder is filled in PA plastic, so that heat conduction fillers are uniformly and orderly distributed in the PA plastic to form a heat conduction path, and the heat conduction performance of the hot melt adhesive is improved. When the heat dissipation device is used in an electric appliance, the total heat of the electric appliance can be dissipated in time. The product fills the technical blank field of the heat-conducting hot melt adhesive.
Detailed Description
Detailed description of the preferred embodiment
The invention provides a heat-conducting PA insulating hot melt adhesive with a special formula, which comprises the following components in parts by weight: 20-30 parts of PA, 20-30 parts of tackifying resin, 10-20 parts of synthetic wax, 10-20 parts of boron nitride, 10-20 parts of aluminum nitride, 5-15 parts of plasticizer and 1-2 parts of antioxidant. According to the insulating hot melt adhesive, aluminum nitride is added as a heat conducting agent, so that heat conducting fillers are uniformly and orderly distributed in PA plastic to form a heat conducting passage, and particularly, aluminum oxide is uniformly distributed in a colloid to form a three-dimensional heat conducting passage so that the hot melt adhesive shows the characteristic of heat conduction.
As a preferable scheme, the specific proportion of each component of the hot melt adhesive is that each component comprises the following components in parts by weight: 30 parts of PA nylon 6, wherein the relative viscosity of the nylon 6 is 2.0-2.4, 23 parts of 138 rosin glyceride particles, 10 parts of coal-based synthetic wax, 15 parts of boron nitride with the particle size of 50-70um, 15 parts of aluminum nitride with the particle size of 10-20um, 6 parts of polyethylene wax and 1 part of antioxidant 1010.
The preparation method comprises the following steps:
a. sequentially adding PA, tackifying resin, boron nitride, aluminum nitride, synthetic wax and antioxidant into a reaction kettle, stirring uniformly, and heating to a molten state to obtain a molten state mixture.
b. And (c) pouring the mixture obtained in the step a into an extruder, and extruding the mixture into a water tank by using the extruder to obtain the glue stick.
c. And c, cutting the hot melt adhesive rod obtained in the step b to obtain the hot melt adhesive.
The heat-conducting PA insulating hot melt adhesive prepared according to the scheme has the main properties that: viscosity number at 180 ℃ of 12000 cps; the thermal conductivity was 2.5w/(m deg.C).
Detailed description of the invention
Preferably, the formula of the hot melt adhesive can be prepared according to the following parts by weight: 23 parts of PA nylon 6, wherein the relative viscosity of the nylon 6 is 2.0-2.4, 30 parts of 138 rosin glyceride particles, 10 parts of coal-based synthetic wax, 10 parts of aluminum nitride with the particle size of 50-70um and 20 parts of aluminum nitride with the particle size of 10-20um, 6 parts of polyethylene wax plasticizer and 1 part of antioxidant 1010.
The preparation method comprises the following steps:
a. sequentially adding PA, tackifying resin, boron nitride, aluminum nitride, synthetic wax and antioxidant into a reaction kettle, stirring uniformly, and heating to a molten state to obtain a molten state mixture.
b. And (c) pouring the mixture obtained in the step a into an extruder, and extruding the mixture into a water tank by using the extruder to obtain the glue stick.
c. And c, cutting the hot melt adhesive rod obtained in the step b to obtain the hot melt adhesive.
The heat-conducting PA insulating hot melt adhesive prepared by the steps has the main properties that: viscosity number of 11000cps at 180 deg.C; thermal conductivity 3w/(m × DEG C)
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (4)
1. The utility model provides a heat conduction PA insulation hot melt adhesive which characterized in that: comprises the following components in parts by weight:
20-30 parts of PA;
20-30 parts of tackifying resin;
10-20 parts of synthetic wax;
10-20 parts of boron nitride;
10-20 parts of aluminum nitride;
5-15 parts of a plasticizer;
1-2 parts of an antioxidant.
2. The heat-conducting PA insulating hot melt adhesive as claimed in claim 1, wherein PA is nylon 6 and has a relative viscosity of 2.0-2.4; the tackifying resin is 138 rosin glyceride particles; the synthetic wax is coal-based synthetic wax; the plasticizer is polyethylene wax; the antioxidant is 1010; the boron nitride is powder, and the particle size is 50-70 um;
the aluminum nitride is powder with a particle size of 10-20 um.
3. A preparation method of a heat-conducting PA insulating hot melt adhesive is characterized by comprising the following steps,
a. the following components are taken according to parts by weight:
20-30 parts of PA (polyamide),
20-30 parts of tackifying resin,
10-20 parts of synthetic wax,
10-20 parts of boron nitride, namely,
10-20 parts of aluminum nitride,
5-15 parts of a plasticizer, namely,
1-2 parts of an antioxidant;
b. sequentially adding PA, tackifying resin, boron nitride, aluminum nitride, synthetic wax and an antioxidant into a reaction kettle, uniformly stirring, and heating to a molten state to obtain a molten state mixture;
c. b, pouring the mixture obtained in the step b into an extruder, and extruding the mixture into a water tank by using the extruder to obtain a glue stick;
d. and c, cutting the hot melt adhesive rod obtained in the step c to obtain the hot melt adhesive.
4. The preparation method of the heat-conducting PA insulating hot melt adhesive is characterized by comprising the following components in parts by weight: 23 parts of PA nylon 6, 30 parts of tackifying resin, 10 parts of synthetic wax, 10 parts of boron nitride and 20 parts of aluminum nitride 6 parts of plasticizer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110651064.8A CN113403020A (en) | 2021-06-05 | 2021-06-05 | Heat-conducting PA insulating hot melt adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110651064.8A CN113403020A (en) | 2021-06-05 | 2021-06-05 | Heat-conducting PA insulating hot melt adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113403020A true CN113403020A (en) | 2021-09-17 |
Family
ID=77683560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110651064.8A Pending CN113403020A (en) | 2021-06-05 | 2021-06-05 | Heat-conducting PA insulating hot melt adhesive |
Country Status (1)
| Country | Link |
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| CN (1) | CN113403020A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102027091A (en) * | 2008-03-26 | 2011-04-20 | 迪美特公司 | Thermally enhanced electrically insulative adhesive paste |
| CN104789151A (en) * | 2014-01-22 | 2015-07-22 | 浙江三元电子科技有限公司 | Hot melt adhesive composition and preparation method thereof, and hot melt adhesive heat-conducting strip and preparation method thereof |
| CN106574155A (en) * | 2014-06-26 | 2017-04-19 | 阿莫绿色技术有限公司 | Heat radiation adhesive, heat radiation sheet using same, and electronic device having same |
| CN107406735A (en) * | 2015-03-05 | 2017-11-28 | 汉高股份有限及两合公司 | Heat conductive adhesive |
| WO2020136525A1 (en) * | 2018-12-28 | 2020-07-02 | Seveso Enrico Luigi | Hot-melt resin for dissipating heat and electrically insulating |
-
2021
- 2021-06-05 CN CN202110651064.8A patent/CN113403020A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102027091A (en) * | 2008-03-26 | 2011-04-20 | 迪美特公司 | Thermally enhanced electrically insulative adhesive paste |
| CN104789151A (en) * | 2014-01-22 | 2015-07-22 | 浙江三元电子科技有限公司 | Hot melt adhesive composition and preparation method thereof, and hot melt adhesive heat-conducting strip and preparation method thereof |
| CN106574155A (en) * | 2014-06-26 | 2017-04-19 | 阿莫绿色技术有限公司 | Heat radiation adhesive, heat radiation sheet using same, and electronic device having same |
| CN107406735A (en) * | 2015-03-05 | 2017-11-28 | 汉高股份有限及两合公司 | Heat conductive adhesive |
| WO2020136525A1 (en) * | 2018-12-28 | 2020-07-02 | Seveso Enrico Luigi | Hot-melt resin for dissipating heat and electrically insulating |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210917 |
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| RJ01 | Rejection of invention patent application after publication |