WO2009113194A1 - 有機トランジスタ - Google Patents
有機トランジスタ Download PDFInfo
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- WO2009113194A1 WO2009113194A1 PCT/JP2008/066544 JP2008066544W WO2009113194A1 WO 2009113194 A1 WO2009113194 A1 WO 2009113194A1 JP 2008066544 W JP2008066544 W JP 2008066544W WO 2009113194 A1 WO2009113194 A1 WO 2009113194A1
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- organic transistor
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/649—Aromatic compounds comprising a hetero atom
- H10K85/657—Polycyclic condensed heteroaromatic hydrocarbons
- H10K85/6576—Polycyclic condensed heteroaromatic hydrocarbons comprising only sulfur in the heteroaromatic polycondensed ring system, e.g. benzothiophene
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/464—Lateral top-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/484—Insulated gate field-effect transistors [IGFETs] characterised by the channel regions
Definitions
- the present invention relates to an organic transistor. More specifically, the present invention relates to an organic transistor using a specific organic compound in an organic semiconductor layer.
- TFTs thin film transistors
- amorphous silicon or polycrystalline silicon are widely used as switching elements for flat panel displays such as liquid crystal display devices.
- a CVD apparatus used for manufacturing a thin film transistor using silicon is expensive, and manufacturing a large-sized thin film transistor element has a drawback of increasing manufacturing cost.
- an organic transistor also referred to as an organic thin film transistor or an organic TFT
- an organic compound for a channel semiconductor layer hereinafter referred to as an organic semiconductor layer
- an organic semiconductor layer instead of amorphous silicon or polycrystalline silicon
- a vacuum deposition method or a coating method is known. According to these film formation methods, it is easy to increase the size of the organic transistor element while suppressing the manufacturing cost. .
- the temperature required for film formation can be lowered, and organic transistors using organic compounds can use plastic materials for the substrate, which can be applied to flexible display elements. Expectations are gathered for the transformation.
- on / off ratio means the ratio of the current between the source electrode and the drain electrode when the organic transistor is on to the current between the source electrode and the drain electrode when the organic transistor is off.
- Non-Patent Document 2 organic transistors using, for example, pentacene as the organic semiconductor layer have been proposed.
- an organic transistor using pentacene has a problem that it has a low function as an organic transistor in the atmosphere and low storage stability.
- Non-patent Document 3 an organic transistor using a thiophene oligomer ( ⁇ -hexathienylene) as an organic semiconductor layer has been proposed (Non-patent Document 3).
- the organic transistor also has a drawback that its storage stability in air is low.
- dibenzo [a, j] naphthacene and dibenzo [de, qr] naphthacene are useful for an organic semiconductor layer of an organic transistor (Patent Document 1).
- Patent Document 1 it has been found that organic transistors using these dibenzonaphthacenes in the organic semiconductor layer have a problem of low charge mobility.
- the present invention is to provide an organic transistor having high charge mobility, a large current on / off ratio, and excellent storage stability.
- an organic transistor containing a compound represented by the general formula (1) in an organic semiconductor layer has high charge mobility and a large current on-state.
- the present invention has been completed by finding that it has an / off ratio and is excellent in storage stability.
- An organic transistor having an organic semiconductor layer is an organic transistor comprising at least one compound represented by the general formula (1) in the organic semiconductor layer.
- X 1 to X 4 are each independently a hydrogen atom, a halogen atom, a linear, branched or cyclic alkyl group, a linear, branched or cyclic alkoxy group, a linear, branched or cyclic alkoxyalkyl group Or a substituted or unsubstituted aryl group, ring A represents a substituted or unsubstituted thiophene ring, ring B represents a substituted or unsubstituted benzene ring, or a substituted or unsubstituted thiophene ring)
- the present invention makes it possible to provide an organic transistor having a high charge mobility, a large current on / off ratio, and excellent storage stability.
- Substrate 21 Gate electrode 31: Gate insulating layer 41: Drain electrode 51: Organic semiconductor layer 61: Source electrode 12: Substrate 22: Gate electrode 32: Gate insulating layer 42: Drain electrode 52: Organic semiconductor layer 62: Source electrode 13: Substrate 23: Gate electrode 33: Gate insulating layer 43: Drain electrode 53: Organic semiconductor layer 63: Source electrode 14: Substrate 24: Gate electrode 34: Gate insulating layer 44: Drain electrode 54: Organic semiconductor layer 64: Source electrode
- the organic transistor of the present invention comprises an organic semiconductor layer containing at least one compound represented by the general formula (1).
- X 1 to X 4 are each independently a hydrogen atom, a halogen atom, a linear, branched or cyclic alkyl group, a linear, branched or cyclic alkoxy group, a linear, branched or cyclic alkoxyalkyl group Or a substituted or unsubstituted aryl group, ring A represents a substituted or unsubstituted thiophene ring, ring B represents a substituted or unsubstituted benzene ring, or a substituted or unsubstituted thiophene ring)
- X 1 to X 4 are each independently a hydrogen atom, a halogen atom, a linear, branched or cyclic alkyl group, a linear, branched or cyclic alkoxy group, or a linear chain Represents a branched or cyclic alkoxyalkyl group, or a substituted or unsubstituted aryl group.
- the aryl group represents a carbocyclic aromatic group such as a phenyl group or a naphthyl group, for example, a heterocyclic aromatic group such as a furyl group, a thienyl group or a pyridyl group.
- examples of the substituent of the aryl group include a halogen atom, a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, a linear, branched or cyclic alkoxy group having 1 to 20 carbon atoms, or a carbon number of 4 to
- the aryl group which may be substituted by 20 said halogen atoms, an alkyl group, and an alkoxy group etc. are mentioned.
- X 1 to X 4 are more preferably a hydrogen atom, a halogen atom, a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, or a carbon atom having 1 to 20 carbon atoms.
- a linear, branched or cyclic alkoxy group, a linear, branched or cyclic alkoxyalkyl group having 2 to 20 carbon atoms, or a substituted or unsubstituted aryl group having 4 to 20 carbon atoms is represented.
- X 1 to X 4 in the general formula (1) include, for example, a hydrogen atom; a halogen atom such as a fluorine atom, a chlorine atom and a bromine atom; for example, a methyl group, an ethyl group, an n-propyl group, Isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, isopentyl, neopentyl, tert-pentyl, n-hexyl, 1-methylpentyl, 4- Methyl-2-pentyl group, 3,3-dimethylbutyl group, 2-ethylbutyl group, n-heptyl group, 1-methylhexyl group, cyclohexylmethyl group, n-octyl group, tert-octyl group, 1-methylheptyl group 2-ethyl group
- phenyl group 2-methylphenyl group, 3-methylphenyl group, 4-methylphenyl group, 4-ethylphenyl group, 4-n-propylphenyl group, 4-isopropylphenyl group, 4-n-butylphenyl group 4-isobutylphenyl group, 4-tert-butylphenyl group, 4-isopentylphenyl group, 4-tert-pentylphenyl group, 4-n-hexylphenyl group, 4-cyclohexylphenyl group, 4-n-heptylphenyl Group, 4-n-octylphenyl group, 4-n-nonylphenyl group, 4-n-decylphenyl group, 4-n-undecylphenyl group, 4-n-dodecylphenyl group, 4-n-tetradecylphenyl group Group, 2,3-dimethylphenyl group, 2,4-dimethylphenyl group
- X 1 to X 4 are a hydrogen atom, a fluorine atom, a chlorine atom, an alkyl group having 1 to 16 carbon atoms, an alkoxy group having 1 to 16 carbon atoms, an alkoxyalkyl group having 2 to 16 carbon atoms, or carbon It is an aryl group of formula 6-20.
- ring A represents a substituted or unsubstituted thiophene ring, for example, a halogen atom, a linear, branched or cyclic alkyl group, a linear, branched or cyclic alkoxy group, It represents a thiophene ring which may be substituted with a linear, branched or cyclic alkoxyalkyl group, or a substituted or unsubstituted aryl group.
- the ring A is a halogen atom exemplified by X 1 to X 4 , a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, a linear, branched or cyclic alkoxy group having 1 to 20 carbon atoms.
- This thiophene ring is preferably a thiophene ring condensed at the 2-position and 3-position, or a thiophene ring condensed at the 3-position and 4-position.
- the compound represented by the general formula (1) is represented by the following general formula (1-A) or general formula (1-B) depending on the type of the ring A.
- X 1 to X 4 and ring B represent the same meaning as in the general formula (1), and A 1 to A 4 each independently represent a hydrogen atom, a halogen atom, a linear, branched or cyclic group. It represents an alkyl group, a linear, branched or cyclic alkoxy group, a linear, branched or cyclic alkoxyalkyl group, or a substituted or unsubstituted aryl group.
- ring B represents a substituted or unsubstituted benzene ring, or a substituted or unsubstituted thiophene ring, such as a halogen atom, a linear, branched or cyclic alkyl group, A chain, branched or cyclic alkoxy group, a linear, branched or cyclic alkoxyalkyl group, or a benzene ring optionally substituted with a substituted or unsubstituted aryl group, or a halogen atom, linear, branched or cyclic alkyl Represents a thiophene ring optionally substituted with a group, a linear, branched or cyclic alkoxy group, a linear, branched or cyclic alkoxyalkyl group, or a substituted or unsubstituted aryl group.
- the ring B is a halogen atom exemplified as X 1 to X 4 , a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, a linear, branched or cyclic alkoxy group having 1 to 20 carbon atoms.
- a benzene ring optionally substituted with a linear, branched or cyclic alkoxyalkyl group having 2 to 20 carbon atoms, or a substituted or unsubstituted aryl group having 4 to 20 carbon atoms,
- a halogen atom exemplified as X 1 to X 4 , a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, a linear, branched or cyclic alkoxy group having 1 to 20 carbon atoms, or a C 2 to 20 carbon atom
- a linear, branched or cyclic alkoxyalkyl group, or a thiophene ring which may be substituted with a substituted or unsubstituted aryl group having 4 to 20 carbon atoms.
- the benzene ring is a benzene ring condensed at the ortho position
- the thiophene ring is preferably a thiophene ring condensed at the 2-position and 3-position, or a thiophene ring condensed at the 3-position and 4-position.
- the organic transistor of the present invention is characterized in that the organic semiconductor layer contains at least one compound represented by the general formula (1), which has a high charge mobility, which is unconventional, It is possible to provide an organic transistor having a large on / off ratio and excellent storage stability.
- the compound represented by the general formula (1) according to the present invention can be produced by referring to a method known per se.
- a compound represented by the general formula (2) or the general formula (3) is produced by reacting a compound represented by the general formula (2) or the general formula (3) with a palladium catalyst (for example, triphenylphosphine palladium chloride, palladium acetate) in the presence of a base.
- a palladium catalyst for example, triphenylphosphine palladium chloride, palladium acetate
- the compound represented by the general formula (2) is, for example, a compound represented by the general formula (4) in the presence of, for example, a palladium catalyst (for example, triphenylphosphine palladium chloride) and a base.
- a palladium catalyst for example, triphenylphosphine palladium chloride
- the compound represented by the general formula (3) is, for example, a compound represented by the general formula (7) in the presence of, for example, a palladium catalyst (for example, triphenylphosphine palladium chloride) and a base.
- a palladium catalyst for example, triphenylphosphine palladium chloride
- a base for example, a palladium catalyst (for example, triphenylphosphine palladium chloride)
- (8) and a compound represented by the general formula (9) can be produced by acting [for example, Chem. Rev. , 95, 2457 (1995) can be referred to].
- the halogen atom represented by Z 1 to Z 8 is preferably a chlorine atom, a bromine atom, or an iodine atom.
- the compound represented by the general formula (1) according to the present invention may be produced in a mold that forms a solvate with a solvent used (for example, an aromatic hydrocarbon solvent such as toluene).
- a solvent used for example, an aromatic hydrocarbon solvent such as toluene.
- such a solvate as well as a non-solvate of the compound represented by the general formula (1) can be used.
- a purification method such as a recrystallization method, a column chromatography method, a sublimation purification method, or a combination of these methods increases the purity. It is preferred to use
- the organic transistor usually has a source electrode, a drain electrode and a gate electrode, a gate insulating layer, and an organic semiconductor layer.
- the organic semiconductor layer has the general formula (1). It contains at least one compound represented by
- FIG. 1 is a schematic cross-sectional view showing an embodiment of the organic transistor of the present invention.
- a gate electrode 21 is provided on a substrate 11
- a gate insulating layer 31 is laminated on the gate electrode
- a source electrode 61 and a drain electrode formed on the gate electrode at predetermined intervals. 41 is formed, and an organic semiconductor layer 51 is further stacked thereon (bottom gate / bottom contact structure).
- the gate electrode 22 is provided on the substrate 12, the gate insulating layer 32 is laminated on the gate electrode, and the organic semiconductor layer 52 is laminated thereon. Further, a source electrode 62 and a drain electrode 42 are formed at a predetermined interval thereon (bottom gate / top contact structure).
- the source electrode 63 and the drain electrode 43 are formed on the substrate 13 at a predetermined interval, and the organic semiconductor layer 53 is laminated thereon, A gate insulating layer 33 is laminated thereon, and a gate electrode 23 is further provided thereon (top gate / bottom contact structure).
- the organic semiconductor layer 54 is laminated on the substrate 14, and the source electrode 64 and the drain electrode 44 are formed on the substrate 14 at a predetermined interval.
- a gate insulating layer 34 is laminated thereon, and a gate electrode 24 is further provided thereon (top gate / top contact structure).
- the organic semiconductor layer forms a channel region, and the current flowing between the source electrode and the drain electrode is controlled by the voltage applied to the gate electrode, thereby turning on / off. Operate.
- the substrate used in the organic transistor of the present invention is not particularly limited, but generally glass, quartz, silicon single crystal, polycrystalline silicon, amorphous silicon, plastic substrate, or the like can be used. Furthermore, a composite substrate in which these are combined can be used, and may have a single-layer structure or a multilayer structure.
- plastic substrate examples include polyethylene terephthalate, polyethylene naphthalate, polyethersulfone, polyetherimide, polyetheretherketone, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, triacetylcellulose, and cellulose acetate propionate.
- a substrate is mentioned.
- the substrate can also serve as the gate electrode.
- materials used for the source electrode, drain electrode, and gate electrode are not particularly limited, and any material can be used as long as it is a conductive material.
- the electrode material examples include indium tin oxide alloy (ITO), tin oxide (NESA), gold, silver, platinum, copper, indium, aluminum, magnesium, nickel, chromium, iron, tin, tantalum, palladium, tellurium, and iridium.
- ITO indium tin oxide alloy
- NESA tin oxide
- gold silver
- platinum platinum
- copper indium, aluminum, magnesium, nickel, chromium, iron, tin, tantalum, palladium, tellurium, and iridium.
- a conductive polymer whose conductivity has been improved by doping treatment eg, polyaniline, polypyrrole, polythiophene, polyacetylene, polyparaphenylene, polyethylenedioxythiophene (PEDOT) and polystyrene sulfonic acid complex, etc.
- doping treatment eg, polyaniline, polypyrrole, polythiophene, polyacetylene, polyparaphenylene, polyethylenedioxythiophene (PEDOT) and polystyrene sulfonic acid complex, etc.
- these electrode materials may be used alone or in combination.
- the source electrode and the drain electrode are preferably those having a low electrical resistance at the contact surface with the organic semiconductor layer among the electrode materials listed above.
- a method for forming each electrode is not particularly limited.
- a conductive material can be formed using a method such as vapor deposition or sputtering, and patterned into a desired shape by lithograph or etching treatment. it can.
- a conductive polymer solution or dispersion, or a conductive fine particle dispersion may be patterned by an ink jet method. It may be formed by lithography or laser ablation. Furthermore, a method of patterning an ink containing a conductive polymer or conductive fine particles, a conductive paste (silver paste, carbon paste, etc.) by a printing method such as relief printing, intaglio printing, planographic printing, and screen printing can also be used.
- the film thickness of the source electrode and the drain electrode is not particularly limited, but in general, it is preferably set in the range of several nm to several hundred ⁇ m, more preferably 1 nm to 100 ⁇ m, and still more preferably 10 nm. ⁇ 20 ⁇ m.
- the source electrode and the drain electrode are arranged so as to face each other, and the interval (channel length) is generally preferably set in the range of several hundred nm to several mm, more preferably 100 nm to It is 1 mm, more preferably 1 ⁇ m to 500 ⁇ m.
- the material used for the gate insulating layer various insulating materials can be used, and an inorganic insulator or an organic polymer compound is preferable.
- silicon oxide SiO 2
- silicon nitride aluminum oxide, aluminum nitride, tantalum oxide, titanium oxide, tin oxide, vanadium oxide, barium strontium titanate, barium zirconate titanate, lead zirconate titanate , Lead lanthanum titanate, strontium titanate, barium titanate, barium magnesium fluoride, bismuth titanate, strontium bismuth titanate, strontium bismuth tantalate, bismuth tantalate niobate, trioxide yttrium, and more Preferred are silicon oxide, silicon nitride, aluminum oxide, tantalum oxide, and titanium oxide.
- Examples of the method for forming a gate insulating layer made of an inorganic insulator include a vacuum deposition method, a molecular beam epitaxial growth method, an ion cluster beam method, a low energy ion beam method, an ion plating method, a CVD method, a sputtering method, and atmospheric pressure plasma. Dry processes such as spray coating, spray coating, spin coating, blade coating, dip coating, casting, roll coating, bar coating, die coating, air knife, slide hopper, and extrusion Examples thereof include a wet process such as a coating method, various printing methods, and an inkjet method, and can be appropriately selected and applied according to the characteristics of the material to be used. In the case where a silicon-based material is used as the gate electrode and the gate insulating layer is formed before forming the organic semiconductor, it may be formed by a thermal oxidation method.
- Examples of the organic polymer compound used for the gate insulating layer include polyimide, polyamide, polyester, polyacrylate, a photo-radical polymerization photo-curing resin, a photo-cation polymerization photo-curing resin, or a copolymer containing an acrylonitrile component.
- Polyvinylphenol, polyvinyl alcohol, polystyrene, novolac resin, polyvinylidene fluoride, cyanoethyl pullulan, and the like can be used.
- a wet process is preferable.
- the insulating material used for the gate insulating layer may be used alone or in combination.
- the interface between the gate insulating layer and the organic semiconductor layer may be treated with, for example, hexamethyldisilazane, octadecyltrimethoxysilane, octyltrichlorosilane, octadecyltrichlorosilane, benzyltrichlorosilane, or the like.
- the organic semiconductor layer is formed after the rubbing treatment is performed on the gate insulating layer made of the organic polymer compound. May be.
- the thickness of the gate insulating layer is not particularly limited, but in general, it is preferably set in the range of several nm to several tens of ⁇ m, more preferably 5 nm to 10 ⁇ m, and still more preferably 10 nm to 5 ⁇ m. It is.
- the organic transistor of the present invention comprises at least one compound represented by the general formula (1) in the organic semiconductor layer, and the compound represented by the general formula (1) is used alone. Or a plurality of them may be used in combination.
- the organic semiconductor layer includes a compound represented by the general formula (1) and other compounds (for example, polyacetylene derivatives, polythiophene derivatives, polythienylene vinylene derivatives, polyphenylene derivatives, polyphenylene vinylene derivatives, polypyrrole derivatives, polyaniline derivatives, A polyquinoline derivative, a perylene derivative, a tetracene derivative, a pentacene derivative, a phthalocyanine derivative, or the like).
- the content of the compound represented by the general formula (1) is preferably 20% by weight or more, and more preferably 50% by weight or more.
- the organic transistor of the present invention functions as a p-type (holes function as a carrier) organic transistor or an n-type (electrons function as a carrier) organic transistor, preferably as a p-type organic transistor. It is preferred to use.
- the formation method of the organic semiconductor layer is not particularly limited, and a known formation method can be used.
- a vacuum deposition method for example, a vacuum deposition method, a molecular beam epitaxial growth method, an ion cluster beam method, a low energy ion beam method, an ion plating method, a CVD method, a sputtering method, a plasma polymerization method and other dry processes, a spray coating method, Mention wet processes such as spin coating, blade coating, dip coating, casting, roll coating, bar coating, die coating, LB (Langmuir / Blodget method), various printing methods, and inkjet methods. it can.
- a vacuum deposition method for example, a vacuum deposition method, a molecular beam epitaxial growth method, an ion cluster beam method, a low energy ion beam method, an ion plating method, a CVD method, a sputtering method, a plasma polymerization method and other dry processes, a spray coating method, Mention wet processes such as spin coating, blade coating, dip coating, casting, roll coating, bar
- solvents examples include alcohol solvents such as water, methanol, ethanol, isopropyl alcohol, and butanol; ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ester solvents such as ethyl acetate and butyl acetate; Ether solvents such as ether, dioxane, tetrahydrofuran, anisole, hydrocarbon solvents such as hexane, octane, toluene, xylene, ethylbenzene, cumene, dichloromethane, chloroform, dichloroethane, tetrachloroethane, tetrachloroethylene, chlorobenzene, fluorobenzene, dichlorobenzene, Halogenated hydrocarbon solvents such as trichlorobenzene, acetonitrile, propionitrile, me
- the thickness of the organic semiconductor layer is not particularly limited, but in general, it is preferably set in the range of several nm to several tens of ⁇ m, more preferably 1 nm to 10 ⁇ m, and still more preferably 5 nm to 1 ⁇ m.
- the organic semiconductor layer may be subjected to a doping treatment if desired.
- both a donor-type dopant and an acceptor-type dopant can be used, and it is preferable to use an acceptor-type dopant.
- any compound having a function of donating electrons to the organic compound of the organic semiconductor layer can be preferably used.
- the donor dopant examples include alkali metals such as Li, Na, K, Rb, and Cs, alkaline earth metals such as Ca, Sr, and Ba, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Rb, Dy, Ho, Er, Yb and other rare earth metals, ammonium ions, R 4 P + (R represents an alkyl group), R 4 As + (R represents an alkyl group), R 3 S + (R represents Represents an alkyl group), and acetylcholine.
- alkali metals such as Li, Na, K, Rb, and Cs
- alkaline earth metals such as Ca, Sr, and Ba
- Y La, Ce, Pr, Nd, Sm, Eu, Gd, Rb, Dy, Ho, Er, Yb and other rare earth metals, ammonium ions
- R 4 P + represents an alkyl group
- R 4 As + R represents an alkyl group
- R 3 S + R
- any compound having a function of removing electrons from the organic compound of the organic semiconductor layer can be suitably used.
- acceptor dopant examples include halogen compounds such as Cl 2 , Br 2 , I 2 , ICl, ICl 3 , IBr 3 and IF, PF 5 , AsF 5 , SbF 5 , BF 3 , BCl 3 , BBr 3 , SO 3.
- halogen compounds such as Cl 2 , Br 2 , I 2 , ICl, ICl 3 , IBr 3 and IF, PF 5 , AsF 5 , SbF 5 , BF 3 , BCl 3 , BBr 3 , SO 3.
- a method of introducing a dopant after forming an organic semiconductor layer, or a method of introducing a dopant at the time of forming the organic semiconductor layer can be applied.
- the organic transistor of the present invention can also be provided with a gas barrier layer on the whole or a part of the outer peripheral surface of the organic transistor for the purpose of reducing the influence of oxygen, moisture, etc. in the atmosphere.
- a gas barrier layer examples include polyvinyl alcohol, ethylene-vinyl alcohol copolymer, polyvinyl chloride, and polyvinylidene chloride.
- the inorganic insulator mentioned as a material used for a gate insulating layer can also be used for formation of a gas barrier layer.
- the organic transistor of this invention can be used for a liquid crystal display element, an organic electroluminescent element, electronic paper, various sensors, RFIDs (radio frequency identification cards), etc., for example.
- Example 1 A thermal oxide film (SiO 2 ) having a thickness of 200 nm was formed on a silicon substrate having a resistivity of 0.02 ⁇ ⁇ cm as a gate electrode.
- the silicon substrate itself becomes the gate electrode, and the SiO 2 layer formed on the surface of the silicon substrate becomes the gate insulating layer.
- the compound of Exemplified Compound No. 2 was deposited to a thickness of 30 nm at a deposition rate of 0.03 nm / sec to form an organic semiconductor layer. Further, a source electrode and a drain electrode were formed thereon by vapor-depositing gold using a mask.
- the source electrode and drain electrode had a thickness of 40 nm, a channel width of 5 mm, and a channel length of 20 ⁇ m.
- the organic transistor manufactured as described above exhibited characteristics as a p-type transistor element.
- the charge mobility was determined from the saturation region of the current-voltage (IV) characteristics of the organic transistor. Further, the drain current value was measured when the drain bias was ⁇ 50 V and the gate bias was ⁇ 50 V and 0 V, and the on / off ratio of the current was obtained. Furthermore, after storing the produced organic transistor element in the atmosphere at 25 ° C. for one month, the charge mobility and the on / off ratio of the current were measured again. The measurement results are shown in Table 1.
- Example 1 when forming the organic semiconductor layer, instead of using the compound of Example Compound No. 2, the compound of Example Compound No. 5 (Example 2), the compound of Example Compound No. 10 (Example 3), and the Example Compound Compound No. 17 (Example 4), Compound No. 20 (Example 5), Compound No. 32 (Example 6), Compound No. 34 (Example 7), Example No. 45 Compound of Example Compound No. 48 (Example 9), Compound of Example Compound No. 50 (Example 10), Compound of Example Compound No. 54 (Example 11), Compound of Example Compound No. 65 (Example 12), Compound of Example Compound No.
- Example 13 Compound of Example Compound No. 92 (Example 14), Compound of Example Compound No. 101 (Example 15), Example Compound No. 110 (Example 16), Example Compound No. 117 (Example 17), Example Compound No. 125 (Example 18), Example Compound No. 137 (Example 19), Example Compound An organic transistor was produced by the method described in Example 1 except that the compound of No. 145 (Example 20) was used. Further, the characteristics of the organic transistor were examined by the method described in Example 1, and the results are shown in Table 1.
- Example 1 An organic transistor was fabricated by the method described in Example 1 except that pentacene was used instead of using the compound of Exemplary Compound No. 2 when forming the organic semiconductor layer. Further, the characteristics of the organic transistor were examined by the method described in Example 1, and the results are shown in Table 1. In addition, the characteristic as an organic transistor was not shown after leaving for one month.
- Example 2 (Comparative Example 2) In Example 1, an organic transistor was produced by the method described in Example 1 except that ⁇ -hexathienylene was used instead of the compound of Example Compound No. 2 in forming the organic semiconductor layer. Further, the characteristics of the organic transistor were examined by the method described in Example 1, and the results are shown in Table 1.
- Example 3 an organic transistor was produced by the method described in Example 1 except that dibenzo [a, j] naphthacene was used instead of the compound of Exemplified Compound No. 2 when forming the organic semiconductor layer. did. Further, the characteristics of the organic transistor were examined by the method described in Example 1, and the results are shown in Table 1.
- Example 4 an organic transistor was prepared by the method described in Example 1 except that dibenzo [de, qr] naphthacene was used instead of the compound of Exemplified Compound No. 2 when forming the organic semiconductor layer. did. Further, the characteristics of the organic transistor were examined by the method described in Example 1, and the results are shown in Table 1.
- Example 21 A thermal oxide film (SiO 2 ) having a thickness of 200 nm was formed on a silicon substrate having a resistivity of 0.02 ⁇ ⁇ cm as a gate electrode.
- the silicon substrate itself becomes the gate electrode, and the SiO 2 layer formed on the surface of the silicon substrate becomes the gate insulating layer.
- a chlorobenzene solution concentration: 0.3% by weight
- the chlorobenzene evaporated to give an exemplary compound having a thickness of 50 nm.
- An organic semiconductor layer made of the compound of No. 35 was formed.
- a source electrode and a drain electrode were formed thereon by vapor-depositing gold using a mask.
- the source electrode and drain electrode had a thickness of 40 nm, a channel width of 5 mm, and a channel length of 20 ⁇ m. Further, when the characteristics of the organic transistor were examined by the method described in Example 1, the mobility was 4.1 ⁇ 10 ⁇ 2 (cm 2 / Vsec), and the current on / off ratio was 3.0. ⁇ 10 5
- Example 22 In Example 21, an organic transistor was produced by the method described in Example 21 except that the compound of exemplary compound number 67 was used instead of the compound of exemplary compound number 35 in forming the organic semiconductor layer. . Further, when the characteristics of the organic transistor were examined by the method described in Example 1, the mobility was 3.0 ⁇ 10 ⁇ 2 (cm 2 / Vsec), and the current on / off ratio was 3.6. ⁇ 10 5
- Example 23 In Example 21, an organic transistor was produced by the method described in Example 21 except that the compound of exemplary compound number 79 was used instead of the compound of exemplary compound number 35 in forming the organic semiconductor layer. . Further, when the characteristics of the organic transistor were examined by the method described in Example 1, the mobility was 3.9 ⁇ 10 ⁇ 2 (cm 2 / Vsec), and the current on / off ratio was 2.7. ⁇ 10 5
- Example 24 an organic transistor was produced by the method described in Example 21 except that the compound of exemplary compound number 138 was used instead of the compound of exemplary compound number 35 in forming the organic semiconductor layer. . Further, when the characteristics of the organic transistor were examined by the method described in Example 1, the mobility was 2.8 ⁇ 10 ⁇ 2 (cm 2 / Vsec), and the current on / off ratio was 3.5. ⁇ 10 5
- the organic transistor of the present invention has a high charge mobility, a large current on / off ratio, has excellent characteristics as an organic transistor, and further has a stable change with time. It is clear that it is an excellent organic transistor.
- the organic transistor of the present invention has high charge mobility, a large current on / off ratio, and excellent storage stability.
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Abstract
Description
Appl.Phys.Lett.,63,1372(1993) Appl.Phys.Lett.,72,1854(1998) Science,268,270(1995)
有機半導体層を有する有機トランジスタにおいて、該有機半導体層に一般式(1)で表される化合物を少なくとも1種含有してなる有機トランジスタである。
21:ゲート電極
31:ゲート絶縁層
41:ドレイン電極
51:有機半導体層
61:ソース電極
12:基板
22:ゲート電極
32:ゲート絶縁層
42:ドレイン電極
52:有機半導体層
62:ソース電極
13:基板
23:ゲート電極
33:ゲート絶縁層
43:ドレイン電極
53:有機半導体層
63:ソース電極
14:基板
24:ゲート電極
34:ゲート絶縁層
44:ドレイン電極
54:有機半導体層
64:ソース電極
例えば、メトキシ基、エトキシ基、n-プロポキシ基、イソプロポキシ基、n-ブトキシ基、イソブトキシ基、sec-ブトキシ基、n-ペンチルオキシ基、ネオペンチルオキシ基、シクロペンチルオキシ基、n-ヘキシルオキシ基、3,3-ジメチルブチルオキシ基、2-エチルブチルオキシ基、シクロヘキシルオキシ基、n-ヘプチルオキシ基、n-オクチルオキシ基、2-エチルヘキシルオキシ基、n-ノニルオキシ基、n-デシルオキシ基、n-ウンデシルオキシ基、n-ドデシルオキシ基、n-トリデシルオキシ基、n-テトラデシルオキシ基、n-ペンタデシルオキシ基、n-ヘキサデシルオキシ基、n-ヘプタデシルオキシ基、n-オクタデシルオキシ基、n-エイコシルオキシ基などの直鎖、分岐または環状のアルコキシ基;
2-メトキシフェニル基、3-メトキシフェニル基、4-メトキシフェニル基、3-エトキシフェニル基、4-エトキシフェニル基、4-n-プロポキシフェニル基、4-イソプロポキシフェニル基、4-n-ブトキシフェニル基、4-イソブトキシフェニル基、4-n-ペンチルオキシフェニル基、4-n-ヘキシルオキシフェニル基、4-シクロヘキシルオキシフェニル基、4-n-ヘプチルオキシフェニル基、4-n-オクチルオキシフェニル基、4-n-ノニルオキシフェニル基、4-n-デシルオキシフェニル基、4-n-ウンデシルオキシフェニル基、4-n-ドデシルオキシフェニル基、4-n-テトラデシルオキシフェニル基、2,3-ジメトキシフェニル基、2,4-ジメトキシフェニル基、2,5-ジメトキシフェニル基、3,4-ジメトキシフェニル基、3,5-ジメトキシフェニル基、3,5-ジエトキシフェニル基、2-メトキシ-4-メチルフェニル基、2-メトキシ-5-メチルフェニル基、2-メチル-4-メトキシフェニル基、3-メチル-4-メトキシフェニル基、3-メチル-5-メトキシフェニル基、
2-フルオロフェニル基、3-フルオロフェニル基、4-フルオロフェニル基、2-クロロフェニル基、3-クロロフェニル基、4-クロロフェニル基、4-ブロモフェニル基、4-トリフルオロメチルフェニル基、2,4-ジフルオロフェニル基、2,4-ジクロロフェニル基、3,4-ジクロロフェニル基、3,5-ジクロロフェニル基、2-メチル-4-クロロフェニル基、2-クロロ-4-メチルフェニル基、3-クロロ-4-メチルフェニル基、2-クロロ-4-メトキシフェニル基、3-メトキシ-4-フルオロフェニル基、3-メトキシ-4-クロロフェニル基、3-フルオロ-4-メトキシフェニル基、2,3,4,5,6-ペンタフルオロフェニル基、4-フェニルフェニル基、3-フェニルフェニル基、4-(4’-メチルフェニル)フェニル基、4-(4’-メトキシフェニル)フェニル基、1-ナフチル基、2-ナフチル基、4-メチル-1-ナフチル基、4-エトキシ-1-ナフチル基、6-n-ブチル-2-ナフチル基、6-メトキシ-2-ナフチル基、7-エトキシ-2-ナフチル基、2-フリル基、2-チエニル基、5-n-プロピル-2-チエニル基、5-n-ヘキシル-2-チエニル基、5-n-デシル-2-チエニル基、5-フェニル-2-チエニル基、5-(2’-チエニル)-2-チエニル基、3-チエニル基、2-ピリジル基、3-ピリジル基、4-ピリジル基などの置換または未置換のアリール基を挙げることができる。
あるいはX1~X4で例示したハロゲン原子、炭素数1~20の直鎖、分岐または環状のアルキル基、炭素数1~20の直鎖、分岐または環状のアルコキシ基、炭素数2~20の直鎖、分岐または環状のアルコキシアルキル基、あるいは炭素数4~20の置換または未置換のアリール基で置換されていてもよいチオフェン環を表す。
ゲート電極としての抵抗率0.02Ω・cmのシリコン基板に、厚さ200nmの熱酸化膜(SiO2)を形成した。ここで、シリコン基板自体がゲート電極となり、シリコン基板表面に形成されたSiO2層がゲート絶縁層となる。この上に、真空下(5×10-4Pa)で、例示化合物番号2の化合物を、蒸着速度0.03nm/secの速度で、30nmの厚さに蒸着し、有機半導体層を形成した。さらに、この上に、マスクを用いて、金を蒸着してソース電極およびドレイン電極を形成した。尚、ソース電極およびドレイン電極の厚みは40nmであり、チャネル幅は5mm、チャネル長は20μmであった。
以上のように作製した有機トランジスタは、p型のトランジスタ素子としての特性を示した。有機トランジスタの電流-電圧(I-V)特性の飽和領域から、電荷移動度を求めた。
さらに、ドレインバイアス-50Vとし、ゲートバイアス-50Vおよび0Vにした時のドレイン電流値を測定し、電流のオン/オフ比を求めた。
さらに、作製した有機トランジスタ素子を大気中で、25℃で、1ヶ月保存した後、再度、電荷移動度と電流のオン/オフ比を測定した。測定結果を第1表に示した。
実施例1において、有機半導体層の形成に際して、例示化合物番号2の化合物を使用する代わりに、例示化合物番号5の化合物(実施例2)、例示化合物番号10の化合物(実施例3)、例示化合物番号17の化合物(実施例4)、例示化合物番号20の化合物(実施例5)、例示化合物番号32の化合物(実施例6)、例示化合物番号34の化合物(実施例7)、例示化合物番号45の化合物(実施例8)、例示化合物番号48の化合物(実施例9)、例示化合物番号50の化合物(実施例10)、例示化合物番号54の化合物(実施例11)、例示化合物番号65の化合物(実施例12)、例示化合物番号78の化合物(実施例13)、例示化合物番号92の化合物(実施例14)、例示化合物番号101の化合物(実施例15)、例示化合物番号110の化合物(実施例16)、例示化合物番号117の化合物(実施例17)、例示化合物番号125の化合物(実施例18)、例示化合物番号137の化合物(実施例19)、例示化合物番号145の化合物(実施例20)を使用した以外は、実施例1に記載の方法により、有機トランジスタを作製した。
さらに、実施例1に記載の方法により、有機トランジスタの特性を調べ、結果を第1表に示した。
実施例1において、有機半導体層の形成に際して、例示化合物番号2の化合物を使用する代わりに、ペンタセンを使用した以外は、実施例1に記載の方法により、有機トランジスタを作製した。
さらに、実施例1に記載の方法により、有機トランジスタの特性を調べ、結果を第1表に示した。
尚、1ヶ月放置後には、有機トランジスタとしての特性を示さなかった。
実施例1において、有機半導体層の形成に際して、例示化合物番号2の化合物を使用する代わりに、α-ヘキサチエニレンを使用した以外は、実施例1に記載の方法により、有機トランジスタを作製した。
さらに、実施例1に記載の方法により、有機トランジスタの特性を調べ、結果を第1表に示した。
実施例1において、有機半導体層の形成に際して、例示化合物番号2の化合物を使用する代わりに、ジベンゾ[a,j]ナフタセンを使用した以外は、実施例1に記載の方法により、有機トランジスタを作製した。
さらに、実施例1に記載の方法により、有機トランジスタの特性を調べ、結果を第1表に示した。
実施例1において、有機半導体層の形成に際して、例示化合物番号2の化合物を使用する代わりに、ジベンゾ[de,qr]ナフタセンを使用した以外は、実施例1に記載の方法により、有機トランジスタを作製した。
さらに、実施例1に記載の方法により、有機トランジスタの特性を調べ、結果を第1表に示した。
ゲート電極としての抵抗率0.02Ω・cmのシリコン基板に、厚さ200nmの熱酸化膜(SiO2)を形成した。ここで、シリコン基板自体がゲート電極となり、シリコン基板表面に形成されたSiO2層がゲート絶縁層となる。シリコン基板を80℃に加熱しておき、その上に、例示化合物番号35の化合物のクロロベンゼン溶液(濃度:0.3重量%)を塗布したところ、クロロベンゼンが蒸発し、50nmの厚さの例示化合物番号35の化合物からなる有機半導体層を形成した。さらに、この上に、マスクを用いて、金を蒸着してソース電極およびドレイン電極を形成した。尚、ソース電極およびドレイン電極の厚みは40nmであり、チャネル幅は5mm、チャネル長は20μmであった。
さらに、実施例1に記載の方法により、有機トランジスタの特性を調べたところ、移動度は、4.1×10-2(cm2/Vsec)であり、電流のオン/オフ比は3.0×105であった。
実施例21において、有機半導体層の形成に際して、例示化合物番号35の化合物を使用する代わりに、例示化合物番号67の化合物を使用した以外は、実施例21に記載の方法により、有機トランジスタを作製した。
さらに、実施例1に記載の方法により、有機トランジスタの特性を調べたところ、移動度は、3.0×10-2(cm2/Vsec)であり、電流のオン/オフ比は3.6×105であった。
実施例21において、有機半導体層の形成に際して、例示化合物番号35の化合物を使用する代わりに、例示化合物番号79の化合物を使用した以外は、実施例21に記載の方法により、有機トランジスタを作製した。
さらに、実施例1に記載の方法により、有機トランジスタの特性を調べたところ、移動度は、3.9×10-2(cm2/Vsec)であり、電流のオン/オフ比は2.7×105であった。
実施例21において、有機半導体層の形成に際して、例示化合物番号35の化合物を使用する代わりに、例示化合物番号138の化合物を使用した以外は、実施例21に記載の方法により、有機トランジスタを作製した。
さらに、実施例1に記載の方法により、有機トランジスタの特性を調べたところ、移動度は、2.8×10-2(cm2/Vsec)であり、電流のオン/オフ比は3.5×105であった。
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EP08873339A EP2259355B1 (en) | 2008-03-10 | 2008-09-12 | Organic transistor |
CN2008801289666A CN102017212B (zh) | 2008-03-10 | 2008-09-12 | 有机晶体管 |
US12/921,757 US8294144B2 (en) | 2007-03-23 | 2008-09-12 | Organic transistor |
KR1020107022601A KR101176397B1 (ko) | 2008-03-10 | 2008-09-12 | 유기 트랜지스터 |
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JP2008059378A JP5209996B2 (ja) | 2007-03-23 | 2008-03-10 | 有機トランジスタ |
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EP (1) | EP2259355B1 (ja) |
KR (1) | KR101176397B1 (ja) |
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JP2010074076A (ja) * | 2008-09-22 | 2010-04-02 | Yamamoto Chem Inc | 有機電界発光素子およびチオフェン化合物 |
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JP6375952B2 (ja) * | 2013-01-07 | 2018-08-22 | 株式会社ニコン | 組成物、積層体、積層体の製造方法、トランジスタおよびトランジスタの製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US6291621B1 (en) * | 1999-02-23 | 2001-09-18 | The United States Of America As Represented By The Secretary Of The Air Force | Bithienylnaphthalene-based monomers and polymers |
JP2005519486A (ja) | 2002-03-07 | 2005-06-30 | スリーエム イノベイティブ プロパティズ カンパニー | ゲート絶縁膜の改質した表面を有する有機薄膜トランジスタ |
JP2005347661A (ja) * | 2004-06-07 | 2005-12-15 | Japan Science & Technology Agency | チオフェン環縮合アントラセン化合物を含む可溶型新規有機半導体材料および有機トランジスタ素子 |
JP2007099736A (ja) * | 2005-10-07 | 2007-04-19 | Ricoh Co Ltd | ベンゾジチオフェン化合物 |
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2008
- 2008-09-12 EP EP08873339A patent/EP2259355B1/en not_active Not-in-force
- 2008-09-12 CN CN2008801289666A patent/CN102017212B/zh not_active Expired - Fee Related
- 2008-09-12 KR KR1020107022601A patent/KR101176397B1/ko not_active IP Right Cessation
- 2008-09-12 WO PCT/JP2008/066544 patent/WO2009113194A1/ja active Application Filing
- 2008-09-22 TW TW097136303A patent/TW200939549A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US6291621B1 (en) * | 1999-02-23 | 2001-09-18 | The United States Of America As Represented By The Secretary Of The Air Force | Bithienylnaphthalene-based monomers and polymers |
JP2005519486A (ja) | 2002-03-07 | 2005-06-30 | スリーエム イノベイティブ プロパティズ カンパニー | ゲート絶縁膜の改質した表面を有する有機薄膜トランジスタ |
JP2005347661A (ja) * | 2004-06-07 | 2005-12-15 | Japan Science & Technology Agency | チオフェン環縮合アントラセン化合物を含む可溶型新規有機半導体材料および有機トランジスタ素子 |
JP2007099736A (ja) * | 2005-10-07 | 2007-04-19 | Ricoh Co Ltd | ベンゾジチオフェン化合物 |
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APPL. PHYS. LETT., vol. 72, 1998, pages 1854 |
CHEM. REV., vol. 107, 2007, pages 174 |
CHEM. REV., vol. 95, 1995, pages 2457 |
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See also references of EP2259355A4 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2010074076A (ja) * | 2008-09-22 | 2010-04-02 | Yamamoto Chem Inc | 有機電界発光素子およびチオフェン化合物 |
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CN102017212A (zh) | 2011-04-13 |
EP2259355A4 (en) | 2011-05-18 |
KR101176397B1 (ko) | 2012-08-27 |
KR20100134649A (ko) | 2010-12-23 |
EP2259355A1 (en) | 2010-12-08 |
EP2259355B1 (en) | 2013-02-20 |
TW200939549A (en) | 2009-09-16 |
CN102017212B (zh) | 2012-10-10 |
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