WO2009109391A1 - Non-etching non-resist adhesion composition and method of preparing a work piece - Google Patents
Non-etching non-resist adhesion composition and method of preparing a work piece Download PDFInfo
- Publication number
- WO2009109391A1 WO2009109391A1 PCT/EP2009/001605 EP2009001605W WO2009109391A1 WO 2009109391 A1 WO2009109391 A1 WO 2009109391A1 EP 2009001605 W EP2009001605 W EP 2009001605W WO 2009109391 A1 WO2009109391 A1 WO 2009109391A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- copper
- treatment
- resist composition
- etching
- work piece
- Prior art date
Links
- 0 *c1nc(*)n[n]1* Chemical compound *c1nc(*)n[n]1* 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/02—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using non-aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/12—Oxygen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/12—Oxygen-containing compounds
- C23F11/128—Esters of carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/16—Sulfur-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/16—Sulfur-containing compounds
- C23F11/165—Heterocyclic compounds containing sulfur as hetero atom
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/173—Macromolecular compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
- H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/867,112 US8945298B2 (en) | 2008-03-07 | 2009-02-27 | Non-etching non-resist adhesion composition and method of preparing a work piece |
JP2010549061A JP5538243B2 (en) | 2008-03-07 | 2009-02-27 | Non-etching and non-resist adhesive composition and processing method of processed parts |
EP09717965.9A EP2248402B1 (en) | 2008-03-07 | 2009-02-27 | Non-etching non-resist adhesion composition and method of preparing a work piece |
CN2009801028321A CN101926235B (en) | 2008-03-07 | 2009-02-27 | Non-etching non-resist adhesion composition and method of preparing work piece |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08075181.1 | 2008-03-07 | ||
EP08075181A EP2099268A1 (en) | 2008-03-07 | 2008-03-07 | Non-etching adhesion composition, method of preparing a work piece and method of forming coppper structures on a circuit carrier substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009109391A1 true WO2009109391A1 (en) | 2009-09-11 |
Family
ID=39666196
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2009/001605 WO2009109391A1 (en) | 2008-03-07 | 2009-02-27 | Non-etching non-resist adhesion composition and method of preparing a work piece |
Country Status (7)
Country | Link |
---|---|
US (1) | US8945298B2 (en) |
EP (2) | EP2099268A1 (en) |
JP (1) | JP5538243B2 (en) |
KR (1) | KR101614169B1 (en) |
CN (1) | CN101926235B (en) |
TW (1) | TWI457469B (en) |
WO (1) | WO2009109391A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140102910A1 (en) * | 2011-06-22 | 2014-04-17 | Atotech Deutschland Gmbh | Method for copper plating |
EP2754732A1 (en) * | 2013-01-15 | 2014-07-16 | ATOTECH Deutschland GmbH | Aqueous composition for etching of copper and copper alloys |
EP3567993A1 (en) | 2018-05-08 | 2019-11-13 | ATOTECH Deutschland GmbH | A method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5599506B2 (en) | 2010-05-26 | 2014-10-01 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | Compositions and methods for microetching of copper and copper alloys |
JP6225467B2 (en) * | 2012-06-06 | 2017-11-08 | 三菱瓦斯化学株式会社 | Copper foil for printed wiring board, method for producing the same, and printed wiring board using the copper foil |
JP5615401B1 (en) * | 2013-05-14 | 2014-10-29 | 石原ケミカル株式会社 | Copper fine particle dispersion, conductive film forming method, and circuit board |
US10506723B2 (en) | 2014-12-02 | 2019-12-10 | International Business Machines Corporation | Enhanced substrate includes a carbene-coated metal foil laminated to a substrate that includes glass fiber impregnated with a base polymer |
US10481496B2 (en) * | 2017-06-28 | 2019-11-19 | International Business Machines Corporation | Forming conductive vias using a light guide |
CN111748816B (en) * | 2019-03-29 | 2022-12-02 | 东友精细化工有限公司 | Silver thin film etching solution composition, etching method and metal pattern forming method |
EP3922755A1 (en) | 2020-06-12 | 2021-12-15 | ATOTECH Deutschland GmbH | An aqueous basic etching composition for the treatment of surfaces of metal substrates |
CN114231982B (en) * | 2021-12-20 | 2023-07-18 | 昆山市板明电子科技有限公司 | Self-etching copper surface bonding agent and preparation method thereof |
EP4279634A1 (en) * | 2022-05-17 | 2023-11-22 | Atotech Deutschland GmbH & Co. KG | Method for nano etching of copper and copper alloy surfaces |
Citations (7)
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---|---|---|---|---|
US3645772A (en) * | 1970-06-30 | 1972-02-29 | Du Pont | Process for improving bonding of a photoresist to copper |
FR2337890A1 (en) * | 1975-12-23 | 1977-08-05 | Dymachem Corp | Photopolymerisable compsns contg. heterocyclic mercaptan - as adhesion promoter and polymn. accelerator, uses as photoresistors |
US4372913A (en) * | 1965-09-20 | 1983-02-08 | Max Klein | Polymerization, and corrosion resistance, enhancement by acid addition salts of methacrylic acid and a 2-mono (lower) alkylaminoethyl methacrylate or polymers of these salts |
EP1209253A2 (en) * | 2000-11-28 | 2002-05-29 | Shipley Co. L.L.C. | Process for treating adhesion promoted metal surfaces with epoxy resins |
WO2005033364A1 (en) * | 2003-09-30 | 2005-04-14 | Basf Aktiengesellschaft | Method for pickling metallic surfaces by using alkoxylated alkynols |
US20060210819A1 (en) * | 2005-03-15 | 2006-09-21 | Dueber Thomas E | Polyimide composite coverlays and methods and compositions relating thereto |
US20070003860A1 (en) * | 2003-04-11 | 2007-01-04 | Takashi Takeda | Substrate adhesion improver for photosensitive resin composition and photosensitive resin composition containing the same |
Family Cites Families (11)
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JPS61266241A (en) | 1985-05-21 | 1986-11-25 | 株式会社日立製作所 | Surface treating method of copper |
US4649025A (en) * | 1985-09-16 | 1987-03-10 | W. R. Grace & Co. | Anti-corrosion composition |
JPH02196851A (en) * | 1989-01-25 | 1990-08-03 | Nippon Petrochem Co Ltd | Adhesive resin composition and production thereof, laminate using the same composition |
JPH1129883A (en) | 1997-07-08 | 1999-02-02 | Mec Kk | Microetching agent for copper and copper alloy |
DE10066028C2 (en) | 2000-07-07 | 2003-04-24 | Atotech Deutschland Gmbh | Copper substrate with roughened surfaces |
JP4309602B2 (en) | 2001-04-25 | 2009-08-05 | メック株式会社 | Method for improving adhesion between copper or copper alloy and resin, and laminate |
DE10345801A1 (en) * | 2003-09-30 | 2005-04-14 | Basf Ag | Pickling metal surface, e.g. iron, steel, zinc, brass or aluminum, especially strip, uses acid aqueous composition containing ethoxylated or propoxylated prop-1-yn-3-ol or but-2-yn-1,4-diol as inhibitor |
JP2005290495A (en) * | 2004-04-01 | 2005-10-20 | Asahi Denka Kogyo Kk | Surface roughening agent for copper-containing material, method for surface-roughening copper-containing material, additive for producing surface-roughening agent to copper-containing material and method for producing surface roughening agent of copper-containing material |
JP2006080324A (en) | 2004-09-10 | 2006-03-23 | Sumitomo Bakelite Co Ltd | Lead frame for semiconductor, and semiconductor device |
JP2006182019A (en) | 2004-11-30 | 2006-07-13 | Nippon Steel Chem Co Ltd | Copper-clad laminate |
TW200626358A (en) | 2004-11-30 | 2006-08-01 | Nippon Steel Chemical Co | Copper-clad laminate |
-
2008
- 2008-03-07 EP EP08075181A patent/EP2099268A1/en not_active Withdrawn
-
2009
- 2009-02-27 JP JP2010549061A patent/JP5538243B2/en active Active
- 2009-02-27 EP EP09717965.9A patent/EP2248402B1/en active Active
- 2009-02-27 WO PCT/EP2009/001605 patent/WO2009109391A1/en active Application Filing
- 2009-02-27 TW TW098106406A patent/TWI457469B/en active
- 2009-02-27 US US12/867,112 patent/US8945298B2/en active Active
- 2009-02-27 CN CN2009801028321A patent/CN101926235B/en active Active
- 2009-02-27 KR KR1020107019893A patent/KR101614169B1/en active IP Right Grant
Patent Citations (7)
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US4372913A (en) * | 1965-09-20 | 1983-02-08 | Max Klein | Polymerization, and corrosion resistance, enhancement by acid addition salts of methacrylic acid and a 2-mono (lower) alkylaminoethyl methacrylate or polymers of these salts |
US3645772A (en) * | 1970-06-30 | 1972-02-29 | Du Pont | Process for improving bonding of a photoresist to copper |
FR2337890A1 (en) * | 1975-12-23 | 1977-08-05 | Dymachem Corp | Photopolymerisable compsns contg. heterocyclic mercaptan - as adhesion promoter and polymn. accelerator, uses as photoresistors |
EP1209253A2 (en) * | 2000-11-28 | 2002-05-29 | Shipley Co. L.L.C. | Process for treating adhesion promoted metal surfaces with epoxy resins |
US20070003860A1 (en) * | 2003-04-11 | 2007-01-04 | Takashi Takeda | Substrate adhesion improver for photosensitive resin composition and photosensitive resin composition containing the same |
WO2005033364A1 (en) * | 2003-09-30 | 2005-04-14 | Basf Aktiengesellschaft | Method for pickling metallic surfaces by using alkoxylated alkynols |
US20060210819A1 (en) * | 2005-03-15 | 2006-09-21 | Dueber Thomas E | Polyimide composite coverlays and methods and compositions relating thereto |
Non-Patent Citations (1)
Title |
---|
SHERIF ET AL: "Corrosion of copper in aerated acidic pickling solutions and its inhibition by 3-amino-1,2,4-triazole-5-thiol", JOURNAL OF COLLOID AND INTERFACE SCIENCE, ACADEMIC PRESS, NEW YORK, NY, US, vol. 306, no. 1, 1 December 2006 (2006-12-01), pages 96 - 104, XP005748160, ISSN: 0021-9797 * |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140102910A1 (en) * | 2011-06-22 | 2014-04-17 | Atotech Deutschland Gmbh | Method for copper plating |
US9506158B2 (en) * | 2011-06-22 | 2016-11-29 | Atotech Deutschland Gmbh | Method for copper plating |
EP2754732A1 (en) * | 2013-01-15 | 2014-07-16 | ATOTECH Deutschland GmbH | Aqueous composition for etching of copper and copper alloys |
WO2014111173A1 (en) * | 2013-01-15 | 2014-07-24 | Atotech Deutschland Gmbh | Aqueous composition for etching of copper and copper alloys |
US9441304B2 (en) | 2013-01-15 | 2016-09-13 | Atotech Deutschland Gmbh | Aqueous composition for etching of copper and copper alloys |
EP3567993A1 (en) | 2018-05-08 | 2019-11-13 | ATOTECH Deutschland GmbH | A method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer |
WO2019215072A1 (en) | 2018-05-08 | 2019-11-14 | Atotech Deutschland Gmbh | A method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer |
US11963308B2 (en) | 2018-05-08 | 2024-04-16 | Atotech Deutschland GmbH & Co. KG | Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer |
Also Published As
Publication number | Publication date |
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KR20100126355A (en) | 2010-12-01 |
TW200944616A (en) | 2009-11-01 |
EP2099268A1 (en) | 2009-09-09 |
KR101614169B1 (en) | 2016-04-20 |
CN101926235B (en) | 2013-04-10 |
EP2248402A1 (en) | 2010-11-10 |
JP5538243B2 (en) | 2014-07-02 |
US20100323099A1 (en) | 2010-12-23 |
EP2248402B1 (en) | 2019-05-01 |
US8945298B2 (en) | 2015-02-03 |
CN101926235A (en) | 2010-12-22 |
TWI457469B (en) | 2014-10-21 |
JP2011517324A (en) | 2011-06-02 |
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