WO2009107940A3 - 신호처리블록을 구비하는 적층형 마이크로폰과 그 제조방법 - Google Patents

신호처리블록을 구비하는 적층형 마이크로폰과 그 제조방법 Download PDF

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Publication number
WO2009107940A3
WO2009107940A3 PCT/KR2009/000695 KR2009000695W WO2009107940A3 WO 2009107940 A3 WO2009107940 A3 WO 2009107940A3 KR 2009000695 W KR2009000695 W KR 2009000695W WO 2009107940 A3 WO2009107940 A3 WO 2009107940A3
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WO
WIPO (PCT)
Prior art keywords
microphone
processing block
signal processing
stacked
manufacturing same
Prior art date
Application number
PCT/KR2009/000695
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English (en)
French (fr)
Other versions
WO2009107940A2 (ko
Inventor
이병수
Original Assignee
(주)실리콘화일
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by (주)실리콘화일 filed Critical (주)실리콘화일
Publication of WO2009107940A2 publication Critical patent/WO2009107940A2/ko
Publication of WO2009107940A3 publication Critical patent/WO2009107940A3/ko

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/04Microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/005Electrostatic transducers using semiconductor materials
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/02Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04Structural association of microphone with electric circuitry therefor
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Pressure Sensors (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

본 발명은 마이크로폰 및 그 제조방법에 관한 것으로, 보다 상세하게는 CMOS 공정에 의해 신호처리블록이 형성된 반도체 기판의 상부에 마이크로폰이 적층되어 있는 신호처리블록을 구비하는 적층형 마이크로폰 및 그 제조 방법에 관한 것이다. 본 발명에 따른 신호처리블록을 구비하는 적층형 마이크로폰 및 그 제조방법에 의하면 진동판의 진동에 의하여 적층형 마이크로폰에서 발생된 신호가 하부에 위치하는 신호처리블록에서 필요한 형태로 가공되어 출력되므로, 마이크로폰과 신호처리장치가 별도로 있는 경우에 비하여 외부의 잡음에 강하며, 별도의 신호처리장치 없이 원하는 형태의 신호로 출력할 수 있으며, 마이크로폰을 제작하는데 있어서 CMOS의 공정을 사용함으로써 제작비용이 낮으며 소형으로 제작이 가능하다는 장점이 있다.
PCT/KR2009/000695 2008-02-28 2009-02-13 신호처리블록을 구비하는 적층형 마이크로폰과 그 제조방법 WO2009107940A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0018083 2008-02-28
KR1020080018083A KR100878454B1 (ko) 2008-02-28 2008-02-28 신호처리블록을 구비하는 적층형 마이크로폰과 그 제조방법

Publications (2)

Publication Number Publication Date
WO2009107940A2 WO2009107940A2 (ko) 2009-09-03
WO2009107940A3 true WO2009107940A3 (ko) 2009-11-26

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/000695 WO2009107940A2 (ko) 2008-02-28 2009-02-13 신호처리블록을 구비하는 적층형 마이크로폰과 그 제조방법

Country Status (2)

Country Link
KR (1) KR100878454B1 (ko)
WO (1) WO2009107940A2 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9499392B2 (en) 2013-02-05 2016-11-22 Butterfly Network, Inc. CMOS ultrasonic transducers and related apparatus and methods
CA2905040C (en) 2013-03-15 2021-10-19 Butterfly Network, Inc. Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same
TWI708368B (zh) 2014-04-18 2020-10-21 美商蝴蝶網路公司 在互補式金屬氧化物半導體晶圓中的超音波轉換器及相關設備和方法
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
US9987661B2 (en) 2015-12-02 2018-06-05 Butterfly Network, Inc. Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods
US10196261B2 (en) 2017-03-08 2019-02-05 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
CA3064088A1 (en) 2017-06-21 2018-12-27 Butterfly Network, Inc. Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5573679A (en) * 1995-06-19 1996-11-12 Alberta Microelectronic Centre Fabrication of a surface micromachined capacitive microphone using a dry-etch process
KR20030004944A (ko) * 2001-07-07 2003-01-15 주식회사 비에스이 칩 마이크로폰
KR20040026756A (ko) * 2002-09-26 2004-04-01 삼성전자주식회사 플렉서블 mems 트랜스듀서와 그 제조방법 및 이를채용한 플렉서블 mems 무선 마이크로폰
KR20040061586A (ko) * 2002-12-31 2004-07-07 전자부품연구원 음향 감지 소자의 제조방법
KR100765149B1 (ko) * 2005-10-05 2007-10-15 전자부품연구원 초소형 음향 감지 장치 및 그 제조 방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100513424B1 (ko) * 2002-11-27 2005-09-09 전자부품연구원 음향 감지 소자의 제조방법
US6943448B2 (en) 2003-01-23 2005-09-13 Akustica, Inc. Multi-metal layer MEMS structure and process for making the same
DE102006001493B4 (de) * 2006-01-11 2007-10-18 Austriamicrosystems Ag MEMS-Sensor und Verfahren zur Herstellung

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5573679A (en) * 1995-06-19 1996-11-12 Alberta Microelectronic Centre Fabrication of a surface micromachined capacitive microphone using a dry-etch process
KR20030004944A (ko) * 2001-07-07 2003-01-15 주식회사 비에스이 칩 마이크로폰
KR20040026756A (ko) * 2002-09-26 2004-04-01 삼성전자주식회사 플렉서블 mems 트랜스듀서와 그 제조방법 및 이를채용한 플렉서블 mems 무선 마이크로폰
KR20040061586A (ko) * 2002-12-31 2004-07-07 전자부품연구원 음향 감지 소자의 제조방법
KR100765149B1 (ko) * 2005-10-05 2007-10-15 전자부품연구원 초소형 음향 감지 장치 및 그 제조 방법

Also Published As

Publication number Publication date
WO2009107940A2 (ko) 2009-09-03
KR100878454B1 (ko) 2009-01-13

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