WO2009096771A2 - A method of removing a high pressure laminate top cover from a composite panel in a raised floor and a heater plate device thereof - Google Patents

A method of removing a high pressure laminate top cover from a composite panel in a raised floor and a heater plate device thereof Download PDF

Info

Publication number
WO2009096771A2
WO2009096771A2 PCT/MY2009/000021 MY2009000021W WO2009096771A2 WO 2009096771 A2 WO2009096771 A2 WO 2009096771A2 MY 2009000021 W MY2009000021 W MY 2009000021W WO 2009096771 A2 WO2009096771 A2 WO 2009096771A2
Authority
WO
WIPO (PCT)
Prior art keywords
composite panel
top cover
high pressure
pressure laminate
plate device
Prior art date
Application number
PCT/MY2009/000021
Other languages
French (fr)
Other versions
WO2009096771A3 (en
Inventor
Kek Hing Kow
Original Assignee
Kek Hing Kow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kek Hing Kow filed Critical Kek Hing Kow
Publication of WO2009096771A2 publication Critical patent/WO2009096771A2/en
Publication of WO2009096771A3 publication Critical patent/WO2009096771A3/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B09DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09BDISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
    • B09B5/00Operations not covered by a single other subclass or by a single other group in this subclass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006Delaminating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2607/00Walls, panels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0036Heat treatment
    • B32B38/004Heat treatment by physically contacting the layers, e.g. by the use of heated platens or rollers

Definitions

  • TECHNICAL FIELD Tha present invention relates generally to a composite panel in a raised floor. It relates specifically to a method of removing a high pressure laminate top cover from the composite panel, with the assistance of a heater plate device, and the heater plate device thereof.
  • Raised floor concept is implemented in the form of modular panels built on raised pedestals. The environment becomes neat, which enhances productivity, and provides flexibility and ease of cable upgrading work.
  • a composite pane! in a raised floor normally consists, of a high pressure laminate top cover, an intermediate glue layer and a support floor board.
  • Current methods of removing the high pressure laminate top cover employs a chisel-like tooling to scrap off the used top cover, or using a flame to scorch directly the used top cover. These are tedious, destructive and stow. Current methods also damage the high pressure laminate top cover which often was strongly bonded with the support floor board due to aging and hardening of the intermediate glue layer over time.
  • the present Invention has therefore a primary object to remove the high pressure laminate top cover from a composite panel in a raised floor.
  • the composite panel consists of , a high pressure laminate top cover, an Intermediate glue layer and a support floor board.
  • Another object of the present invention is to provide a cost effective end environment-friendly method of removing the high pressure laminate top cover from the composite panel.
  • a heater pfate device which comprises a
  • the metallic plate assumes substantially the shape and size of the composite panel.
  • the metallic pfate is electrically connected to a power source with the assistance of cables or wiring and a power control box.
  • the intermediate glue layer is softened due to heating by the heater plate device after the power source has been switched0 on.
  • the removal method comprises the steps of; identifying a piece of the composite panel in a raised floor; placing a heater plate device, which matches substantially the shape and size of the composite panel, over trie composite panel; switching on a power source connected to the heater plate device fora predetermined ⁇ me; and removing the high pressure laminate top cover from the composite panel thereafter.
  • the heater plate device is used to soften an intermediate glue layer in between a high pressure laminate top cover and a support floor board, making up the composite panel In a raised floor.
  • Figure 1 shows a cross-sectional view of a composite panel in a raised floor, comprising a hfgh pressure faminate top cover, an intermediate glue layer and a support floor board.
  • Figure 2 shows a perspective view of a heater ptate device connected to a - power source, with the assistance of cables, wiring and a power control box.
  • FIG. 3 illustrates how the heater plate device being placed over the composite panel, as shown In Figure 1.
  • a piece of composite panel (10) comprises a high pressure laminate top cover (11), an intermediate glue layer ⁇ 12 ⁇ and a support floor board (13).
  • Composite panels.(10) form a raised floor, being placed on vertical pedestals (not shown) supporting the composite panels (10). .
  • a heater plate device (20) comprises a metallic plate (21) and a non-metaltic handle (22), with electrical circuitry connecting the metallic plate (21) to a power source, with the assistance of cables or wiring and a power control box (30),
  • the power source is of a single phase or three-phase.
  • the metallic plate (21) assumes substantially the shape and size of the composite panel (10).
  • the power control box (30) is equipped with a temperature controller device (32) and a power on-off switch (31).
  • a thermocouple (23) is further attached to the metallic plate (21 ).
  • the electrical circuitry is of known technology.
  • the composite panel (10) is first identified from the raised floor, The composite panel (10) may be removed or left in situ.
  • the heater plate device (20) is next placed over the composite panel (10), The power source is switched on for a predetermined time, The intermediate glue layer (12) will be softened subsequently.
  • the used high pressure laminate top cover (11) can then be removed easily.
  • the used high pressure laminate top cover (11) will not be dry and brittle as a result of elevated heat transferred from the heater plate device (20).
  • a lot of used high pressure laminate top covers (11) can be saved from damage during refurbishment work.
  • the used high pressure laminate top covers (11) can be recycled and reused for other applications.
  • the present invention is therefore cost effective and environment-friendly.

Landscapes

  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Central Heating Systems (AREA)

Abstract

Composite panels form a raised floor. A piece of a composite panel (10) consists of a high pressure laminate top cover (11), an intermediate glue layer (12) and a support floor board (13). According to the present invention, a method of removing the high pressure laminate top cover (11) from the composite panel (10) and a heater plate device (20) are disclosed. The removal method comprises the steps of: Identifying a piece of the composite panel (10) fa a raised floor; placing the heater plate device (20), which matches substantially the shape and size of the composite panel (10), over the composite panel (10); switching on a power source connected to the heater plate device (20) for a predetermined time; and removing the high pressure laminate top cover (11) from the composite panel (10) thereafter. The heater plate device (20) comprises a metallic plate (21) and a non-metallic handle (22). The metallic plate (21) assumes substantially the shape and size of the composite panel (10). The metallic plate (21) is electrically connected to a power source with the assistance of cables or wiring, and a power control box (30), The intermediate glue layer (12) is softened due to heating by the heater pfats device (20) after the power source has been switched on. The high pressure laminate top cover (11) cart then be removed from the composite panel (10) thereafter.

Description

A METHOD OF REWOVlNG A HIGH PRESSURE LAMINATE TOP COVER FROM A COMPOSITE PANEL IN A RAISED FLOOR AND A HEATER PlATE DEVICE THEREOF
TECHNICAL FIELD Tha present invention relates generally to a composite panel in a raised floor. It relates specifically to a method of removing a high pressure laminate top cover from the composite panel, with the assistance of a heater plate device, and the heater plate device thereof.
BACKGROUND ART The concept of raised floor was developed Initially to meet the needs of the etectronic and computer Industries. Cabte management and heat load distribution consideration become key issues in the design of new building and renovation of existing rooms. Raised floor concept is implemented in the form of modular panels built on raised pedestals. The environment becomes neat, which enhances productivity, and provides flexibility and ease of cable upgrading work.
A composite pane! in a raised floor normally consists, of a high pressure laminate top cover, an intermediate glue layer and a support floor board. Current methods of removing the high pressure laminate top cover employs a chisel-like tooling to scrap off the used top cover, or using a flame to scorch directly the used top cover. These are tedious, destructive and stow. Current methods also damage the high pressure laminate top cover which often was strongly bonded with the support floor board due to aging and hardening of the intermediate glue layer over time.
SUMMARY OF THE INVENTION
The present Invention has therefore a primary object to remove the high pressure laminate top cover from a composite panel in a raised floor. The composite panel consists of , a high pressure laminate top cover, an Intermediate glue layer and a support floor board. Another object of the present invention is to provide a cost effective end environment-friendly method of removing the high pressure laminate top cover from the composite panel.
To achieve the above objects, a heater pfate device, which comprises a
5 metallic plate and a πon-metaliic handle, Is used. The metallic plate assumes substantially the shape and size of the composite panel. The metallic pfate is electrically connected to a power source with the assistance of cables or wiring and a power control box. The intermediate glue layer is softened due to heating by the heater plate device after the power source has been switched0 on.
The removal method comprises the steps of; identifying a piece of the composite panel in a raised floor; placing a heater plate device, which matches substantially the shape and size of the composite panel, over trie composite panel; switching on a power source connected to the heater plate device fora predetermined ϋme; and removing the high pressure laminate top cover from the composite panel thereafter.
BRIEF DESCRIPTION OF THE DRAWINGS In order that the present Invention may be more readily understood, the following description is given, by way of example, of one specific embodiment of a heater plate device. The heater plate device is used to soften an intermediate glue layer in between a high pressure laminate top cover and a support floor board, making up the composite panel In a raised floor.
Figure 1 shows a cross-sectional view of a composite panel in a raised floor, comprising a hfgh pressure faminate top cover, an intermediate glue layer and a support floor board.
Figure 2 shows a perspective view of a heater ptate device connected to a - power source, with the assistance of cables, wiring and a power control box.
Figure 3 illustrates how the heater plate device being placed over the composite panel, as shown In Figure 1. DETAILED DESCRIPTION
As seen In Figure 1, a piece of composite panel (10) comprises a high pressure laminate top cover (11), an intermediate glue layer {12} and a support floor board (13). Composite panels.(10) form a raised floor, being placed on vertical pedestals (not shown) supporting the composite panels (10). .
According to the present Invention as shown in Figure 2, a heater plate device (20) comprises a metallic plate (21) and a non-metaltic handle (22), with electrical circuitry connecting the metallic plate (21) to a power source, with the assistance of cables or wiring and a power control box (30), The power source is of a single phase or three-phase. The metallic plate (21) assumes substantially the shape and size of the composite panel (10). The power control box (30) is equipped with a temperature controller device (32) and a power on-off switch (31). A thermocouple (23) is further attached to the metallic plate (21 ). The electrical circuitry is of known technology.
To service a composite panel (10) as shown In Figure 3, the composite panel (10) is first identified from the raised floor, The composite panel (10) may be removed or left in situ. The heater plate device (20) is next placed over the composite panel (10), The power source is switched on for a predetermined time, The intermediate glue layer (12) will be softened subsequently. The used high pressure laminate top cover (11) can then be removed easily. The used high pressure laminate top cover (11) will not be dry and brittle as a result of elevated heat transferred from the heater plate device (20). A lot of used high pressure laminate top covers (11) can be saved from damage during refurbishment work. The used high pressure laminate top covers (11) can be recycled and reused for other applications. The present invention is therefore cost effective and environment-friendly.

Claims

1} A method of removing a high pressure laminate top cover (11), from a composite panel (10) consisting of a high pressure laminate top cover (11), an intermediate glue layer (12) and a support floor board (13), for use In a raised floor covered by such composite panels (10), |is characterized in which the method comprises the steps of: Identifying a piece of the composite panel (10) in the raised floor, placing a heater plate device {20), which matches substantially the shape and size of the composite panel (10), over the composite panel (10); switching on a power source connected to the heater plate device (20) for a predetermined time; and removing the high pressure laminate top cover (11) from the composite panel (10) thereafter.
2)- A heater plate device (20) suitable for use to remove a high pressure laminate top cover (11), from a composite panel (10) consisting of a high pressure laminate top cover (11), an intermediate glue layer (12) and a support floor board (13). for use in a raised floor covered by such composite panels (10), is characterized In which the heater plate device (20) comprises a metallic plate (21) and a non metallic handle (22); the metallic plate (21) assumes substantially the shape and size of the composite panel (10); and the metallic plate (21) is electrically connected to a power source with the assistance of cables or wiring and a power control box (30), whereby the intermediate glue layer (12) Is softened due to heating by the healer plate device (20) after the power source has been switched on for a predetermined time.
PCT/MY2009/000021 2008-01-31 2009-01-30 A method of removing a high pressure laminate top cover from a composite panel in a raised floor and a heater plate device thereof WO2009096771A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
MYPI20080183 2008-01-31
MYPI20080183 2008-01-31

Publications (2)

Publication Number Publication Date
WO2009096771A2 true WO2009096771A2 (en) 2009-08-06
WO2009096771A3 WO2009096771A3 (en) 2009-10-15

Family

ID=40913447

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/MY2009/000021 WO2009096771A2 (en) 2008-01-31 2009-01-30 A method of removing a high pressure laminate top cover from a composite panel in a raised floor and a heater plate device thereof

Country Status (1)

Country Link
WO (1) WO2009096771A2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001009455A1 (en) * 1999-07-29 2001-02-08 Donati Group S.P.A. Constructional sandwich panel for high strength wall and covering assemblies, and method for making said panel
JP2004083603A (en) * 2002-06-24 2004-03-18 Mitsui Chemicals Inc Method for releasing composite panel using readily releasable aqueous adhesive

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS503867U (en) * 1973-05-09 1975-01-16
JP2678548B2 (en) * 1992-11-02 1997-11-17 株式会社テラックス Plate heater
JPH07314559A (en) * 1994-05-30 1995-12-05 Fujipura Seiko:Kk Flat plate type ih resin heater

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001009455A1 (en) * 1999-07-29 2001-02-08 Donati Group S.P.A. Constructional sandwich panel for high strength wall and covering assemblies, and method for making said panel
JP2004083603A (en) * 2002-06-24 2004-03-18 Mitsui Chemicals Inc Method for releasing composite panel using readily releasable aqueous adhesive

Also Published As

Publication number Publication date
WO2009096771A3 (en) 2009-10-15

Similar Documents

Publication Publication Date Title
US6288375B1 (en) Conformable loop induction heating apparatus and method for accelerated curing of bonded members
KR102584763B1 (en) Heating module and method of manufacturing the same
WO2009096771A2 (en) A method of removing a high pressure laminate top cover from a composite panel in a raised floor and a heater plate device thereof
CN206323062U (en) A kind of cable connector protective layer deposition apparatus
CN102489455A (en) Glue removing method of rejected capacitive screen and device used by glue removing method
CN208656327U (en) A kind of steel box-girder panel electricity consumption cable support
CN209024590U (en) A kind of mobile mechanical arm normalizing device
JP2018181844A (en) Planar heater and snow melting system using planar heater
CN103395537A (en) Convenient transport device for substations
CN202551397U (en) Convenient-mounting electromagnetic heating coil and electromagnetic oven
ITRM20060099A1 (en) PROTECTION DEVICE FOR ELECTRIC APPLIANCES AND GROUP OF PARTS INCLUDING SUCH DEVICE
EP3499645B1 (en) Method of preparing epoxy coated bus bars for use in electrical distribution equipment
TWM593709U (en) Induction heating equipment
CN215825285U (en) A installation appurtenance for workshop construction
CN205452830U (en) Modular high -voltage board
KR20070045393A (en) Induction heat adhesion type construction materials
JP4876925B2 (en) Separate floor heating system
JP2003253822A (en) Sheet waterproof structure, sheet waterproof method, and sheet waterproof member
KR101617961B1 (en) Metal Copper Clad laminate and Manufacturing Method therof
CN213425723U (en) Bus duct convenient to installation and tear out
CN211508021U (en) Electric automation equipment connects electric auxiliary line board of using
CN209881136U (en) Electricity-saving coating carrier for optimized construction of power distribution system
CN216904192U (en) Wire conduit ground reserved joint protection device
CN210828228U (en) Supplementary erection equipment of integrated board is decorated in heat preservation
JP2018063087A (en) Electric type heating system, electric heating panel, manufacturing method of the same, laying structure of the same, and laying method of the same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09706314

Country of ref document: EP

Kind code of ref document: A2

DPE2 Request for preliminary examination filed before expiration of 19th month from priority date (pct application filed from 20040101)
DPE2 Request for preliminary examination filed before expiration of 19th month from priority date (pct application filed from 20040101)
NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09706314

Country of ref document: EP

Kind code of ref document: A2