WO2009096742A2 - 핀 타입형 파워 엘이디(led) 방열구조 - Google Patents
핀 타입형 파워 엘이디(led) 방열구조 Download PDFInfo
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- WO2009096742A2 WO2009096742A2 PCT/KR2009/000474 KR2009000474W WO2009096742A2 WO 2009096742 A2 WO2009096742 A2 WO 2009096742A2 KR 2009000474 W KR2009000474 W KR 2009000474W WO 2009096742 A2 WO2009096742 A2 WO 2009096742A2
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- WO
- WIPO (PCT)
- Prior art keywords
- heat dissipation
- led
- lead frame
- lead
- heat
- Prior art date
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- 230000017525 heat dissipation Effects 0.000 claims description 86
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10871—Leads having an integral insert stop
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
Definitions
- the present invention relates to a fin type power LED heat dissipation structure used in automobiles, lighting, billboards, etc., and in particular, to effectively dissipate heat generated through the lead frame connected to the LED chip, to extend the service life of the component element, It is a fin type power LED heat dissipation structure that not only minimizes the characteristic change of components but also improves the radiation efficiency by increasing the current application, and can be applied to existing LED manufacturing processes, thereby enabling significant cost reduction.
- LED Lighting Emitting Diode
- LED Lighting Emitting Diode
- LED is a semiconductor pn junction. It is a light emitting semiconductor that converts electrical energy into light energy. By emitting light, various colors (wavelengths) can be realized according to the change of the energy band gap, which is inherent in semiconductors.
- the indirect transition type includes horizontal transitions by heat and vibration, it is not suitable for achieving an efficient light emission transition, and the direct transition type is widely used as an LED material because all transitions are made of light emission.
- the technology in the LED field can be largely classified into a manufacturing technology of a chip (CHIP), which is a source of a light source, and a package technology so that it can be used for a demanding purpose.
- a manufacturing technology of a chip which is a source of a light source
- a package technology so that it can be used for a demanding purpose.
- LED package functions include electrical connection to the outside, protection against mechanical, electrical and environmental factors from the outside, heat dissipation, increased luminous efficiency, and optimization of directivity.
- materials for packaging include metal stems, lead frames, ceramics, printed boards (PC prints), and the like, and may or may not be resin coated.
- LED chips are mounted on silver-plated lead frames.
- This process is called die bond, and conductive resin containing silver or gold is used to bond the LED chip or die to the base.
- the LED chip is fixed and the lower electrode is connected.
- the upper electrode is usually formed by connecting a thin wire made of gold using thermocompression or ultrasonic wave and then molding using resin. Done.
- LED PACKAGE products are insert type that has been used in the past (INSERT TYPE or THROUGH HOLE TYPE). Commonly referred to as SMD TYPE and mounted by SMT).
- Insertion type LED is divided into lamp type and 4-PIN LED (also known as Piranha Type LED), and has been progressing in response to surface-mount type LED with excellent directivity characteristics and low investment cost.
- the core technologies of the LED packaging process are chip design, structural design, optical design, thermal design, and packaging process technology. Among them, the design of a heat dissipation structure that maximizes heat dissipation is most important.
- a representative form of the development of heat dissipation technology is the improvement of heat dissipation characteristics that deform the lead frame.
- the rated driving current is 20mA for LED lamps, but these days, it is designed to improve heat dissipation so that it can flow up to 50mA-6OmA and increase the heat dissipation of 4-PIN LED. Products have been developed that can increase from 30-50mA to 30-100mA.
- Another method is to make the slug with very low thermal resistance so that heat can be directly released from the heat generating chip to improve heat dissipation or attach heat seal directly to the heat generating area.
- the development of a package technology to shorten the heat release path generated by the power supply and to apply more power is being completed or in progress.
- the present invention for solving the above problems, minimizing the reliability problem caused by the problem of LED chip deterioration due to failure to apply a certain current due to the heat generated when the LED is turned on, and to various applications
- Provide heat sink of PIN TYPE LED which can be easily applied but can use existing package as it is, and secure economic efficiency by securing mass productivity by minimum investment and compatibility.
- the purpose is to.
- the LED device (1) A first lead frame 7 electrically connected to the LED element 1 and having a plurality of leads 5, 5 ′ extending toward the substrate 3 to supply power to the LED element 1. and; A second lead frame (6) provided to face the first lead frame (7) and having a plurality of leads (5) (5 ') extending toward the substrate (3); A molding part 8 including the LED element 1 and molding an upper side of the first and second lead frames 7 and 6 with a transparent body; Each lead 5, 5 ′ of the first and second lead frames 7 and 6 penetrates through a space between the molding part 8 and the substrate 3, but the first lead frame 7 is disposed therethrough. And a heat dissipation unit 10 that is in contact with the lead 5 of the heat dissipation unit 10 and receives heat generated from the LED element 1 and discharges the heat to the outside.
- the heat dissipation unit 10a may extend through one end to protrude through the substrate 3.
- the heat dissipating part 10a may be provided at one end of the protruding part 14, and a coupling part 19 may be provided to which the rod or plate heat dissipating member 15 provided on the opposite side of the substrate 3 is coupled.
- the heat dissipation unit 10b includes four heat dissipation pieces 16 that receive heat from each other by contacting the leads 5 and 5 'of the first and second lead frames 7 and 6, respectively, and each heat dissipation piece. It is provided between the (16), each of the heat dissipation pieces 16 can be connected to the non-conductive member (17).
- the heat dissipation unit 10c may be separated into two so as to contact each of the first lead frame 7 and the second lead frame 6 independently, and may be spaced apart at predetermined intervals between the heat dissipation units 10c.
- the first lead frame 7 and the second lead frame 6 may be bent to extend and tape the leads 5 and 5 ′ from the bottom surface of the heat dissipating portion 10c to allow surface mounting on the substrate. Can be prepared.
- the heat dissipation unit 10 may allow the leads 5 and 5 'of the first and second lead frames 7 and 6 to be electrically separated from each other.
- the insulating member 18 may be installed such that both ends of the heat dissipation unit 10 are connected to each other.
- the heat dissipation unit 10, 10 a, 10 b, 10 c may be provided by selecting any one of copper, aluminum, and iron.
- the heat dissipating portions 10, 10 a, 10 b, and 10 c may have uneven portions 13 formed on an outer circumference thereof to increase the heat dissipation area.
- FIG. 3 is a plan view of FIG.
- FIG. 4 is a longitudinal sectional view of a second embodiment according to the present invention.
- FIG. 5 is a plan view of FIG.
- FIG. 6 is a plan view taken from the heat dissipation unit in FIG.
- FIG. 7 is a side view of FIG. 6
- FIG. 8 is a front view of FIG. 6
- FIG. 9 is a longitudinal sectional view of a third embodiment according to the present invention.
- FIG. 10 is a top view of FIG. 9
- FIG. 11 is a plan view taken from the heat dissipation unit in FIG.
- FIG. 12 is a side view of FIG.
- FIG. 13 is a front view of FIG. 11
- FIG. 14 is a longitudinal sectional view of a fourth embodiment according to the present invention.
- FIG. 15 is a top view of FIG. 14.
- FIG. 16 is a perspective view of the heat dissipation unit in FIG.
- FIG. 17 is a longitudinal sectional view of a fifth embodiment according to the present invention.
- FIG. 18 is a right longitudinal cross-sectional view of FIG. 17.
- FIG. 19 is a top view of FIG. 17.
- FIG. 20 is a perspective view taken from the heat dissipation unit in FIG.
- 21 is a longitudinal sectional view of the sixth embodiment according to the present invention.
- FIG. 22 is a top view of FIG. 21
- FIG. 1 is an exploded perspective view according to the present invention
- Figure 2 is a longitudinal cross-sectional view of the present invention
- Figure 3 is a plan view of FIG.
- the fin type power LED (LED) heat dissipation structure of the present invention comprises: an LED element (1); A first lead frame (7) electrically connected to the LED element (1) and having a plurality of leads (5) extending toward the substrate (3) to supply power to the LED element (1); A second lead frame (6) provided to face the first lead frame (7) and having a plurality of leads (5 ') extending toward the substrate (3); A molding part 8 including the LED element 1 and molding an upper side of the first and second lead frames 7 and 6 with a transparent body; Each lead 5, 5 ′ of the first and second lead frames 7 and 6 penetrates through a space between the molding part 8 and the substrate 3, but the first lead frame 7 is disposed therethrough. It is configured to include a heat dissipation unit 10 in contact with the lead (5) of the) receives the heat generated from the LED element (1) and discharges it to the outside.
- a heat dissipation unit 10 in contact with the lead (5) of the) receives the heat generated from the LED element (1) and discharges it to the outside
- the LED element 1 is mounted on a seating portion extending from the first lead frame 7 and supplies power to the first lead frame 7 from the outside through the lead 5.
- the stopper 4 is formed at one end of the leads 5 and 5 'of the first and second lead frames 7 and 6, and there is no stopper 4 therein.
- the stopper 4 formed at one end of the leads 5 and 5 'of the first and second lead frames 7 and 6 is a stopper when the leads 5 and 5' penetrate the substrate 3. As 4 is seated on the substrate, a space is formed between the LED molding part 8 and the substrate 3.
- heat generated from the LED element 1 is transferred to the lead 5 of the first lead frame 7, and the transferred heat is radiated in contact with the lead 5. It is delivered to the part 10 and released.
- the stopper 4 is not formed at one end of the leads 5 and 5 'of the first and second lead frames 7 and 6 to artificially form a space between the substrate and the molding part 8 of the LED package. Make and install the heat dissipation unit 10 in the same way as above.
- the LED package 9 is completed by molding a transparent material including the LED element 1 and emitting light to the outside on the first and second lead frames 7 and 6.
- the molding treatment generally uses epoxy resin.
- the first and second lead frames 7 and 6 are made of copper, aluminum, or iron, and form two or more leads 5, 5 ′ to form two electrodes, that is, a positive electrode (+ pole). And negative electrode (-pole).
- the heat dissipation part 10 corresponds to the leads 5 and 5 ′ so that the leads 5 and 5 ′ of the first and second lead frames 7 and 6 pass through, respectively. Holes are formed at each position, and since the width of the lead is somewhat variable, the holes are drilled into the holes 11 so that the leads are all applied.
- the notch 12 is formed to a predetermined size.
- the heat dissipation unit 10 is to increase the heat dissipation speed by placing the concave-convex (13) around the side portion, that is, the edge to increase the heat dissipation speed.
- the material of the heat dissipation unit 10 was copper (Cu), aluminum (Al), or iron (Fe), which is advantageous in thermal conductivity. However, any material may be used as long as the thermal conductivity is high and the processing is easy.
- a metal material with good thermal conductivity for example, a metal material with good thermal conductivity, a molded article mixed with carbon, a ceramic material with good thermal conductivity, and the like are used.
- the shape of the heat dissipation unit 10 may also use a porous shape, perforation, pipe shape, fiber, or the like using a polygonal, star or porous material that can increase the surface area depending on the intended use.
- the material in the case of copper (Cu) or aluminum (AI), the material is soft and easily manufactured by using a press working method, but cast, sheet metal in consideration of mass productivity, etc. It can be manufactured by other processing methods, such as LED package (9) (assembly method of assembly) by hand by simply tapping or tapping (TAPING) surface mounted with SMT equipment on PCB (3) After that, you can use the method of inserting the LED on it automatically.
- LED package (9) assembly method of assembly
- TAPING tapping
- the heat generated by the LED element 1 is transferred to the heat dissipation unit 10 having a large discharge area through the lead 5 of the lead frame in contact with the heat dissipation unit 10 and quickly discharges it.
- the heat dissipation part 10a is provided by extending one end to protrude through the substrate 3 and then forming a coupling part 19 at one end of the extended protrusion 14. .
- the coupling unit 19 formed on the protrusion 14 of the heat dissipating unit 10a is selected by combining one of the heat dissipating member 15 having a rod, plate, or piece shape.
- the heat dissipation unit 10a of the above embodiment may induce a more reliable heat dissipation or a resin applied to the surface of the substrate (PCB) 3 to prevent heat or corrosion by a method of dissipating heat back to a wider surface.
- the radiating unit 10a is pulled out to the rear surface of the PCB so as to protrude, and the coupling unit 19 is formed to easily insert the radiating member 15 such as a plate, piece or rod made of conductive material into the protrusion 14. Through the heat dissipation member 15 fitted to the coupling portion 19 was to be quickly released heat.
- the heat dissipation part 10b includes four heat dissipation pieces 16 so that the terminals of the first and second lead frames 7 and 6 independently discharge heat. Each of the heat dissipation pieces 16 by the non-conductive member 17
- PLASTIC used is 7 ⁇ 20% of heat inside package without metal alone. The degree can be lowered and the manufacturing is convenient.
- thermal resistance is too high to use only plastics, so a large effect cannot be expected.
- packaging and fixing materials with high thermal conductivity and electrically separating the used metal materials allow the current to be dispersed while preventing electric current from conducting. .
- a two-stage mold plastic injection method is used as the manufacturing method thereof, but the metal may be preliminarily processed by a casting method such as a heat press method or a die casting.
- the heat dissipation unit 10c is divided into two portions such that the first lead frame 7 and the second lead frame 6 independently contact the leads 5 and 5 ′, respectively. It is separated into but is spaced apart at a predetermined interval between the heat dissipating portion (10c) and the heat dissipating portion (10c).
- the first lead frame 7 and the second lead frame 6 may be bent and extended from the bottom surface of the heat dissipation portion 10c and may be tapped so that the surface mount is formed on the substrate 3. In this way, it is possible to secure the convenience of the user's work and cope with mass production.
- the heat dissipating portion 10 is opposed to electrically separate the respective leads 5 and 5 '. It is provided by installing the insulating member 18 capable of heat conduction on the heat dissipation unit 10 installed opposite to each other, and when the LEDs are continuously arranged regularly, on the heat dissipation unit 10 assembled on the PCB. By simply attaching a thermally conductive metal, continuous heat dissipation is achieved.
- the present invention is not a method of integrally manufacturing the heat generated from the LED element in the lead package, but instead of producing a separate heat sink and attaching the completed LED package to release heat,
- the OPEN TOOL It can be easily assembled while using the mass-produced product as it is, but in consideration of the heat resistance being inversely proportional to the area, the size of the heat sink can be freely adjusted to maximize heat dissipation. It was.
- the heat dissipating part of the present invention uses copper (Cu), aluminium (Al), or iron (Fe), which have high thermal and electrical conductivity, and does not conduct electric current due to contact between the leads. ) To maximize heat dissipation.
- the present invention provides a heat dissipation portion in the space between the substrate and the molding portion of the LED to effectively dissipate heat generated through the first lead frame connected to the LED element, thereby extending the service life of the LED element, Minimize the change in the characteristics of the components, and also improves the radiation efficiency while increasing the application of current compared to the existing pin LED.
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- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims (9)
- 엘이디 소자와;상기 엘이디 소자에 전기적으로 연결되며, 상기 엘이디 소자에 전원을 공급하도록 기판을 향하여연장된 복수의 리드를 갖는 제1리드프레임과;상기 제1리드프레임과 대향되게 마련되며, 상기 기판을 향하여 연장된 복수의 리드를 갖는 제2리드프레임과;상기 엘이디 소자를 포함하고 , 상기 제1,2리드프레임 상부측을 투명체로 몰딩처리한 몰딩부와;상기 몰딩부와 기판의 사이 공간에 상기 제1,2리드프레임의 각 리드가 관통되게 마련되되 상기 제1리드프레임의 리드와 접촉되어 상기 엘이디 소자로 부터 발생되는 열을 전달받아 외부로 방출하는 방열부;를 포함하는 핀 타입형 파워 엘이디 방열구조
- 제1항에 있어서, 상기 방열부는 일단을 연장하여 기판을 관통하여 돌출되는 것을 특징으로 하는 핀 타입형 파워 엘이디 방열구조
- 제2항에 있어서, 상기 방열부는 돌출부의 일단에 마련되어 상기 기판의 반대쪽에 마련된 봉 또는 판 형상의 방열부재가 결합되는 결합부가 마련되는 것을 특징으로 하는 핀 타입형 파워 엘이디 방열구조
- 제1항에 있어서, 상기 방열부는 상기 제1,2 리드프레임의 리드에 각각 접촉하여 열을 전달받는 4개의 방열편과, 각 방열편 사이에 마련되어 각 방열편을 부전도성 부재로 연결한 것을 특징으로 하는 핀 타입형 파워 엘이디 방열구조
- 제1항에 있어서, 상기 방열부는 제1리드프레임과 제2리드프레임이 각각 독립적으로 리드와 접촉되도록 2개로 분리되되 상기 방열부간에는 소정의 간격으로 이격을 두고 있는 것임을 특징으로 하는 핀 타입형 파워 엘이디 방열구조
- 제5항에 있어서, 상기 제1리드프레임과 제2리드프레임은 방열부 저면에서 리드를 각각 절곡 연장하며 테이핑(taping)하여 기판 상부에 표면실장이 가능하도록 함을 특징으로 하는 핀 타입형 파워 엘이디 방열구조
- 제1항에 있어서, 적어도 2개 이상의 엘이디가 연속적으로 배열된 경우 상기 방열부는 각각의 리드가 전기적으로 분리되도록 대향되게 설치한 다음 상기 방열부의 양단부가 서로 연결되도록 절연성 부재를 설치한 것을 특징으로 하는 핀 타입형 파워 엘이디 방열구조
- 제1항 내지 제7항에 있어서, 상기 방열부는 구리 또는 알루미늄, 철 중에서 어느 하나를 선택하여 마련함을 특징으로 하는 핀 타입형 파워 엘이디 방열구조
- 제1항 내지 제7항에 있어서, 상기 방열부는 방열면적을 증가시키기 위해 외부 둘레에 요철부가 형성됨을 특징으로 하는 4핀 타입형 파워 엘이디 방열구조
Priority Applications (2)
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CN200980102092.1A CN101952983B (zh) | 2008-01-30 | 2009-01-30 | 针式大功率发光二极管散热结构 |
US12/865,388 US20110084303A1 (en) | 2008-01-30 | 2009-01-30 | Radiant heat structure for pin type power led |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020080009835A KR100892224B1 (ko) | 2008-01-30 | 2008-01-30 | 핀 타입형 파워 엘이디(led) 방열구조 |
KR10-2008-0009835 | 2008-01-30 |
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WO2009096742A2 true WO2009096742A2 (ko) | 2009-08-06 |
WO2009096742A3 WO2009096742A3 (ko) | 2009-11-05 |
WO2009096742A4 WO2009096742A4 (ko) | 2010-04-15 |
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PCT/KR2009/000474 WO2009096742A2 (ko) | 2008-01-30 | 2009-01-30 | 핀 타입형 파워 엘이디(led) 방열구조 |
Country Status (4)
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US (1) | US20110084303A1 (ko) |
KR (1) | KR100892224B1 (ko) |
CN (1) | CN101952983B (ko) |
WO (1) | WO2009096742A2 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101901863A (zh) * | 2010-05-04 | 2010-12-01 | 高安市汉唐高晶光电有限公司 | 大功率低光衰高抗静电发光二极管及其制备方法 |
CN102644888A (zh) * | 2012-04-01 | 2012-08-22 | 深圳市华星光电技术有限公司 | 带静电防护功能的led灯及用该led灯的背光模组 |
TWI729453B (zh) * | 2019-08-14 | 2021-06-01 | 華暉興業有限公司 | 功率模組之結構改良 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2286145A4 (en) * | 2008-06-05 | 2012-01-04 | Relume Corp | SECTION COVERED LIGHT EMITTING ARRANGEMENT |
KR100898314B1 (ko) | 2008-06-20 | 2009-05-20 | (주)썬웨이브 | 가로등에 연결되는 헤드 어셈블리 |
KR101152885B1 (ko) | 2009-04-08 | 2012-06-07 | 김선미 | 방열수단을 갖는 양면기판 어셈블리 및 그의 제조방법 |
KR101300577B1 (ko) | 2012-07-26 | 2013-08-27 | 주식회사 이노렉스테크놀러지 | 자동차용 led 램프 및 그 제조방법 |
CN204084030U (zh) * | 2014-09-11 | 2015-01-07 | 深圳Tcl新技术有限公司 | Led模组及显示器 |
US10505078B2 (en) * | 2016-07-08 | 2019-12-10 | Effulgent Inc. | Methods and apparatus for illuminating gemstones |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200278353Y1 (ko) * | 2002-02-18 | 2002-06-21 | 이종현 | 발광다이오드 신호등의 냉각장치 |
US20050110027A1 (en) * | 2003-11-25 | 2005-05-26 | Park Seung M. | LED lamp having heat dissipating portion |
US20060268550A1 (en) * | 2005-05-24 | 2006-11-30 | Kuang-Tseng Lin | High-power LED lamp having heat dissipation assembly |
KR100791594B1 (ko) * | 2006-08-31 | 2008-01-03 | 원광대학교산학협력단 | 방열부를 갖는 조명장치 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005513815A (ja) * | 2001-12-29 | 2005-05-12 | 杭州富陽新穎電子有限公司 | 発光ダイオード及び発光ダイオード・ランプ |
TW200737539A (en) * | 2006-03-23 | 2007-10-01 | Ind Tech Res Inst | Light-emitting device and manufacturing method |
KR100908965B1 (ko) * | 2007-08-22 | 2009-07-22 | 김순자 | 이동가능한 차음판 조립체 |
-
2008
- 2008-01-30 KR KR1020080009835A patent/KR100892224B1/ko not_active IP Right Cessation
-
2009
- 2009-01-30 WO PCT/KR2009/000474 patent/WO2009096742A2/ko active Application Filing
- 2009-01-30 US US12/865,388 patent/US20110084303A1/en not_active Abandoned
- 2009-01-30 CN CN200980102092.1A patent/CN101952983B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200278353Y1 (ko) * | 2002-02-18 | 2002-06-21 | 이종현 | 발광다이오드 신호등의 냉각장치 |
US20050110027A1 (en) * | 2003-11-25 | 2005-05-26 | Park Seung M. | LED lamp having heat dissipating portion |
US20060268550A1 (en) * | 2005-05-24 | 2006-11-30 | Kuang-Tseng Lin | High-power LED lamp having heat dissipation assembly |
KR100791594B1 (ko) * | 2006-08-31 | 2008-01-03 | 원광대학교산학협력단 | 방열부를 갖는 조명장치 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101901863A (zh) * | 2010-05-04 | 2010-12-01 | 高安市汉唐高晶光电有限公司 | 大功率低光衰高抗静电发光二极管及其制备方法 |
CN102644888A (zh) * | 2012-04-01 | 2012-08-22 | 深圳市华星光电技术有限公司 | 带静电防护功能的led灯及用该led灯的背光模组 |
TWI729453B (zh) * | 2019-08-14 | 2021-06-01 | 華暉興業有限公司 | 功率模組之結構改良 |
Also Published As
Publication number | Publication date |
---|---|
CN101952983A (zh) | 2011-01-19 |
KR100892224B1 (ko) | 2009-04-06 |
WO2009096742A4 (ko) | 2010-04-15 |
US20110084303A1 (en) | 2011-04-14 |
WO2009096742A3 (ko) | 2009-11-05 |
CN101952983B (zh) | 2012-05-23 |
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