WO2009096386A1 - Resistor and method of manufacturing resistor - Google Patents

Resistor and method of manufacturing resistor Download PDF

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Publication number
WO2009096386A1
WO2009096386A1 PCT/JP2009/051261 JP2009051261W WO2009096386A1 WO 2009096386 A1 WO2009096386 A1 WO 2009096386A1 JP 2009051261 W JP2009051261 W JP 2009051261W WO 2009096386 A1 WO2009096386 A1 WO 2009096386A1
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Prior art keywords
resistor
electrode
resistance
metal material
cylindrical
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PCT/JP2009/051261
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French (fr)
Japanese (ja)
Inventor
Keishi Nakamura
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Koa Corporation
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Publication of WO2009096386A1 publication Critical patent/WO2009096386A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/148Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element

Definitions

  • the present invention relates to a current detection resistor that can detect a large current with high accuracy, and has electrodes made of an electrode metal material such as copper at both ends of a resistor made of a resistance alloy material such as a copper nickel alloy. .
  • a resistor described in Patent Document 1 is known as an example of the current detection resistor.
  • This resistor includes a plate-like electrode made of a highly conductive electrode metal material such as copper joined to the lower surfaces of both ends of a plate-like resistor made of a resistance alloy material such as a copper nickel alloy by rolling or the like. Further, a molten solder layer is disposed on the lower surfaces of both electrodes. According to the resistor having such a structure, it has a low resistance value of several m ⁇ or less, a good TCR, and no trimming cut, so that it can function as a surface mount type current detection resistor having a low series inductance. it can.
  • the above-described resistor has a problem that when mounted on a printed wiring board or the like, the mounting surface is limited only to the molten solder layer on the lower surface of the electrode, and it is difficult to connect the wiring to the other surface.
  • the present invention has been made based on the above-described circumstances, and can produce a low-resistance resistor with a simple manufacturing process with high accuracy and can be connected to a wiring pattern on a mounting board in addition to the lower surface of the resistor. It is an object of the present invention to provide a resistor having a simple electrode and a method for manufacturing the same.
  • the resistor of the present invention includes a rod-shaped resistor made of a resistance alloy material and a cylindrical electrode made of a metal material joined to the outer peripheral surfaces of both ends of the resistor, and the electrode and the resistor are connected to a rotary swage. It is characterized by being joined by processing.
  • the resistor has a small-diameter portion and a large-diameter portion larger in diameter than the small-diameter portion at both ends, and an electrode is joined to the outer peripheral surface of the large-diameter portion by rotary swaging.
  • the method of manufacturing a resistor according to the present invention comprises preparing a cylindrical resistance material made of a resistance alloy and a cylindrical electrode metal material, inserting the resistance material into the electrode metal material, and performing rotary swaging.
  • a joined body in which the resistance material and the electrode metal material are joined and cutting the joined body while rotating, a part of the resistance material is exposed around the joined body, and the electrode metal material is removed from the joined body.
  • a resistor and an electrode are formed separately in the axial direction.
  • the present invention it is possible to easily obtain a joined body in which a rod-shaped resistor made of a resistance alloy material is covered with a cylindrical electrode metal material by using a rotary swaging technique for a metal tube material, A highly conductive metal electrode can be bonded with a high bonding strength to a rod-shaped resistor made of a resistance alloy material by a simple manufacturing process without requiring expensive capital investment. Then, by cutting the rod-shaped joined body while rotating it, the electrode metal material is separated in the axial direction of the joined body to form a small diameter portion of the resistor. Therefore, it is possible to easily achieve a high finished dimensional accuracy and to produce a resistor with little variation in resistance value.
  • FIG. 1A is a perspective view showing a resistor according to a first embodiment of the present invention.
  • FIG. 1B is a cross-sectional view of the resistor.
  • FIG. 2A is a perspective view showing a resistor of the modified example.
  • FIG. 2B is a cross-sectional view of the resistor.
  • FIG. 3A is a perspective view showing a resistor of the modified example.
  • FIG. 3B is a cross-sectional view of the resistor.
  • FIG. 4A is a perspective view showing a resistor of the modified example.
  • FIG. 4B is a cross-sectional view of the resistor.
  • FIG. 5A is a perspective view showing a resistor of the modified example.
  • FIG. 5B is a cross-sectional view of the resistor.
  • FIG. 6 is a cross-sectional view showing an example of mounting the resistor on a multilayer board.
  • FIG. 7A shows the manufacturing process of the resistor according to the first embodiment in the order of steps, the left side is a perspective view and the right side is a sectional view thereof.
  • FIG. 7B shows the manufacturing process of the resistor of the first embodiment in the order of steps, the left side is a perspective view, and the right side is a sectional view thereof.
  • FIG. 7C shows the manufacturing process of the resistor of the first embodiment in the order of steps, the left side is a perspective view, and the right side is a sectional view thereof.
  • FIG. 7A shows the manufacturing process of the resistor according to the first embodiment in the order of steps, the left side is a perspective view and the right side is a sectional view thereof.
  • FIG. 7B shows the manufacturing process of the resistor of the first embodiment in the order of steps, the left side is a perspective view, and the right side is a sectional view thereof.
  • FIG. 7D shows a manufacturing process of the resistor according to the first embodiment in order of steps, the left side is a perspective view, and the right side is a sectional view thereof.
  • FIG. 8 is a perspective view showing a resistor according to the second embodiment of the present invention.
  • FIG. 9A is a cross-sectional view showing the resistor.
  • FIG. 9B is a plan view showing the resistor.
  • FIG. 9C is a side view showing the resistor.
  • FIG. 10 is a perspective view showing a modification of the resistor.
  • FIG. 11A is a perspective view illustrating the manufacturing process of the resistor according to the second embodiment in the order of processes.
  • FIG. 11B is a perspective view illustrating the manufacturing process of the resistor according to the second embodiment in the order of processes.
  • FIG. 11C is a perspective view illustrating the manufacturing process of the resistor according to the second embodiment in the order of processes.
  • FIG. 1A is a perspective view showing a resistor according to a first embodiment of the present invention
  • FIG. 1B is a sectional view thereof.
  • the resistor 10 includes a columnar (rod-like) resistor 11 made of a resistance alloy material having a low resistivity and a good resistance temperature coefficient (TCR), such as copper nickel, nichrome, manganin, and iron chromium, and the resistor. 11 are provided with cylindrical (tubular) electrodes 12a and 12b made of a metal material having a high conductivity such as copper or copper alloy joined to the outer peripheral surfaces of both ends.
  • the resistivity of the electrode metal material is preferably 1/50 or less of the resistivity of the resistance alloy material.
  • the resistor 11 has a narrow diameter portion 11a and thick diameter portions 11b and 11c that are larger in diameter than the narrow diameter portion at both ends.
  • Cylindrical electrodes 12a and 11c are formed on the outer peripheral surfaces of the large diameter portions 11b and 11c. 12b is joined.
  • the inner peripheral surfaces of the electrodes 12a and 12b and the outer peripheral surfaces of the resistor large-diameter portions 11b and 11c are joined by applying pressure to the interface by a rotary sledge process (metal compression plastic deformation process) and performing a heat treatment.
  • a metal compression plastic deformation technique as disclosed in Japanese Patent Application Laid-Open No. 2002-158044 and Japanese Patent Application Laid-Open No. 5-74323 can be used. It is a technology to compress and plastically deform the work metal radially inward by striking (compressing) the work metal outer peripheral surface in the radial direction (toward the center of the work metal) with dies arranged around For example, it is used when caulking a core wire portion made up of a number of electric wires arranged inside a metal cylinder (see Japanese Patent Application Laid-Open No. 2002-158044).
  • a cylindrical resistor 11 and electrodes 12a and 12b made of an electrode metal material (copper) are fixed by caulking (pressure welding) using a rotary swaging process and subsequent heat treatment.
  • caulking pressure welding
  • a rotary swaging process and subsequent heat treatment.
  • a diffusion state between the metals is formed at the interface between the inner peripheral surface of the electrodes 12a and 12b and the outer peripheral surface of the resistor 11, and a good joint state is obtained both electrically and mechanically.
  • a uniform and strong bonding state of the metal electrode to the resistor important for the resistor for current detection having a low resistance value can be obtained.
  • the small-diameter portion 11a of the resistor 11 is a portion that forms the resistance value of the resistor 10, and the resistance value of the resistor 10 is proportional to the length of the small-diameter portion 11a and inversely proportional to the cross-sectional area. For this reason, since the required resistance value accuracy can be obtained by processing the length and diameter of the small-diameter portion 11a with high accuracy, by cutting the resistor 11 while rotating the round bar-shaped resistor 11, The small-diameter portion 11a can be easily machined to a required diameter with high accuracy, whereby a low-resistance resistor can be manufactured with a simple manufacturing process and with good finishing accuracy.
  • the finished dimensional accuracy of flat plate cutting is usually about ⁇ 10 to 30 ⁇ m.
  • the finished dimensional accuracy of rotary cutting processing determines the diameter of the resistor material by bite machining while rotating the workpiece itself.
  • the finishing accuracy of ⁇ (diameter) can be ⁇ 5 ⁇ m or less. For this reason, in the rotational cutting process, the machining accuracy is higher than that in the plane cutting process, and the finish accuracy of the resistance value is improved. For example, a high resistance value accuracy within ⁇ 1% can be easily realized. .
  • the resistor 10a includes molten solder layers 13a and 13b on the entire outer peripheral surface of cylindrical electrodes 12a and 12b made of a metal material such as copper.
  • the molten solder layers 13a and 13b are formed by bringing the outer peripheral surface of the electrodes 12a and 12b into contact with the molten solder liquid and rotating the cylindrical electrodes 12a and 12b, thereby applying the molten solder liquid to the entire outer peripheral surface. Then, the molten solder layers 13a and 13b solidified by cooling can be applied.
  • a molten tin layer may be used instead of the molten solder layer.
  • the resistor 10a By providing the molten solder layers 13a and 13b on the surfaces of the cylindrical electrodes 12a and 12b, when the resistor 10a is surface-mounted on a mounting board such as a printed board, it can be easily soldered to a wiring pad on the mounting board. Thus, the electrodes 12a and 12b can be fixed, and the mountability of the resistor 10 can be improved.
  • 3A and 3B are a perspective view and a cross-sectional view showing a further modification of the resistor 10 shown in FIGS. 1A and 1B.
  • the molten solder layers 13a and 13b are provided so as to cover not only the outer peripheral surfaces of the cylindrical electrodes 12a and 12b but also the entire end surfaces of the round bar-shaped resistor 10b.
  • solder fillets can be formed on both end faces of the electrodes 12a and 12b, thereby further improving the mountability of the resistor. it can.
  • the molten solder layers 13a and 13b may be formed by plating.
  • the resistor 10 of this embodiment includes a protective film 14 made of a resin film or the like that covers the entire outer peripheral surface of the small diameter portion 11 a of the resistor 11. Thereby, even if a foreign substance adheres to the small-diameter portion 11a of the resistor 11, any influence on the small-diameter portion 11a of the resistor 11 is prevented, and the resistor 11 can be protected.
  • FIGS. 4A and 4B are a perspective view and a cross-sectional view showing a further modification of the resistor 10 shown in FIGS. 1A and 1B.
  • the resistor 10 shown in FIGS. 1A and 1B includes cylindrical electrodes 12a and 12b on the outer periphery of the large-diameter portions 11b and 11c of the columnar resistor 11. 10c is formed by pressing the electrode portion from above and below by pressing or the like to form a flat surface 12f on the surfaces of the electrodes 12a and 12b.
  • FIGS. 5A and 5B are a perspective view and a cross-sectional view showing a further modification of the resistor 10 shown in FIGS. 4A and 4B.
  • the upper and lower portions of the electrodes 12a and 12b are removed by cutting to form the flat surface 12f as in the resistor 10d of this modification. Good.
  • FIG. 6 shows an example of mounting the resistor 10 (10a-10d) on a multilayer board.
  • the multilayer substrate is a substrate 21 provided with wiring patterns 21a and 21b, a substrate 22 provided with openings 22a, vias 23a and 23b, and wiring patterns 23c and 23d including conductors passing through the vias. Etc., and the resistor 10 (10a-10d) is accommodated in the opening 22a.
  • the resistor 10 (10a-10d) the lower portions of the electrodes 12a and 12b are connected to the current supply wiring patterns 21a and 21b, and the upper portions of the electrodes 12a and 12b are connected to the voltage detection wiring patterns 23c and 23d. ing.
  • the resistor 10 (10a-10d) includes the cylindrical electrodes 12a and 12b disposed on the outer circumferences of both ends of the rod-shaped resistor 11, so that the electrodes having the same potential in any direction from top to bottom and from side to side. Can be provided, and a current detecting resistor showing the same stable resistance value can be provided no matter which direction is joined to the wiring pattern of the mounting substrate. Therefore, the wiring pattern provided on the mounting board can be connected not only from the lower surface but also from the upper surface of the resistor, which is effective when used as an embedded component on a multilayer mounting board or the like.
  • a cylindrical resistance material 11m made of a resistance alloy material having a low resistivity and a good temperature coefficient of resistance (TCR), such as copper nickel, nichrome, manganin, and iron chromium, and the resistance material
  • TCR temperature coefficient of resistance
  • a cylindrical electrode metal material 12m made of copper or a copper alloy capable of inserting 11m inside is prepared.
  • the resistance material 11m is inserted into the cylindrical electrode metal material 12m, and a cylindrical shape is formed on the outer peripheral surface of the columnar resistance material 11m by rotary sledge processing (metal compression plastic deformation processing).
  • the inner peripheral surface of the electrode metal material 12m is joined by caulking to form a joined body 16 subjected to heat treatment.
  • a part along the axial direction of the joined body 16 is cut in the radial direction while rotating the joined body 16 using a lathe or the like. That is, the electrode metal material 12m is cut from the surface in the radial direction so that a portion along the axial direction of the resistance material 11m is exposed over the periphery of the joined body, and further cut to a required diameter for resistance. A small-diameter portion 11a of the body 11 is formed. As a result, the electrode metal material 12m is separated in the axial direction of the joined body 16 across the small-diameter portion 11a of the resistor 11, and the cylindrical electrode 12 is formed.
  • the resistor 11 has a small-diameter portion 11a and a large-diameter portion. A portion 11d is formed.
  • the electrode 12 is separated into electrodes 12a and 12b, and as shown in FIG. 1A and FIG. 1B). Furthermore, the resistor 10a shown to FIG. 2A and FIG. 2B is obtained by providing the molten solder layers 13a and 13b in the outer peripheral surface of electrode 12a, 12b as needed. Further, if necessary, a protective film 14 is provided on the outer periphery of the small-diameter portion 11a of the resistor 11, and molten solder layers 13a and 13b are provided on the outer peripheral surfaces of the electrodes 12a and 12b and the resistor end surfaces. The resistor 10b shown in 3B is obtained.
  • FIG. 8 is a perspective view showing a resistor according to a second embodiment of the present invention
  • FIG. 9A is a sectional view thereof
  • FIG. 9B is a plan view thereof
  • FIG. 9C is a side view thereof.
  • the resistor 30 includes a plate-like resistor 31 having flat front and back surfaces and arcs at both ends, and electrodes 32a and 32b made of a metal material joined to both ends of the resistor 31 by rotary swaging.
  • the resistor 31 is made of a resistance alloy material having a low resistivity and a good resistance temperature coefficient (TCR), such as copper nickel, nichrome, manganin, and iron chromium, as in the first embodiment, and the electrodes 32a and 32b. Is made of a high conductivity metal material such as copper or copper alloy as in the first embodiment.
  • TCR resistance temperature coefficient
  • the resistor 31 includes a thin plate portion 31a whose front and back surfaces are flat and thick plate portions 31b and 31c having arcs at both ends.
  • the outer periphery of the thick plate portions 31b and 31c of the resistor 31 is subjected to rotary swaging.
  • Electrodes 32a and 32b made of bonded high conductivity metal materials are provided.
  • rotary swaging and heat treatment By rotary swaging and heat treatment, a diffusion state of mutual metals is formed at the interface between the inner peripheral surfaces of the electrodes 32a and 32b and the outer peripheral surfaces of the resistors 31a and 31b, which is good both electrically and mechanically.
  • a junction state is obtained, and a uniform and strong junction state of the electrode to the resistor important for a resistor for detecting a current having a low resistance value is obtained.
  • the thin plate portion 31a of the resistor 31 is a portion that forms the resistance value of the resistor 30, and the resistance value of the resistor 30 is proportional to the length of the thin plate portion 31a (interval between the electrodes 32a and 32b). It is inversely proportional to the cross-sectional area of 31a (the cross-sectional area of the plane perpendicular to the length of the thin plate portion 31a). For this reason, a highly accurate resistance value is obtained by processing the length and cross-sectional area of the thin plate portion 31a with high accuracy.
  • FIG. 10 is a perspective view showing a modification of the resistor according to the second embodiment of the present invention.
  • the electrodes 32a and 32b of the resistor 30 are further provided with grooves 37z in which the resistance material (the surface of the resistor 31) is exposed, further separating the electrodes, the electrode 32a into the electrodes 32c and 32d, and the electrode 32b. Is separated into electrodes 32e and 32f.
  • an electrode can be isolate
  • the manufacturing method of the resistor of 2nd Embodiment of this invention is demonstrated.
  • the first half of this resistor manufacturing method is the same as the first half of the resistor manufacturing method of the first embodiment shown in FIGS. 7A and 7B. That is, a cylindrical resistance material 11m made of a resistance alloy material having a low resistivity and a good resistance temperature coefficient (TCR), such as copper nickel, nichrome, manganin, and iron chromium, and the resistance material 11m can be inserted therein.
  • TCR resistance temperature coefficient
  • a cylindrical electrode metal material 12m made of copper or a copper alloy is prepared, a resistance material 11m is inserted into the cylindrical electrode metal material 12m, and a cylindrical resistance is obtained by rotary swaging (metal compression plastic deformation processing).
  • the inner peripheral surface of the cylindrical electrode metal material 12m is joined to the outer peripheral surface of the material 11m by caulking to form a joined body 16 subjected to heat treatment.
  • the joined body 16 is pressed in a vertical direction by pressing or the like to compress and plastically deform the joined body, and the outer periphery of the joined body.
  • a flat surface 36f is formed above and below.
  • the cylindrical resistance material 11m is deformed into a plate-shaped resistance material 31m having flat front and back surfaces and arcuate ends, and the cylindrical electrode metal material 12m is circular at both ends. It is deformed into a cylindrical electrode metal material 32m joined to the outer periphery of an arc-shaped plate-shaped resistance material 31m.
  • a groove 37 by cutting is formed on each of the flat surfaces 36f to expose the resistance material 31m, and a pair of elongated shapes are formed at both ends of the plate-shaped resistance material 31m.
  • the electrodes 32a and 32b are formed separately.
  • the resistive material 31m is formed with a thin plate portion 31a having flat front and back surfaces and thick plate portions 31b and 31c having arcs at both ends (see FIG. 11C). Since it is a part that forms a resistance value, it is cut so as to obtain a thickness corresponding to the required resistance value.
  • the joined body 36 is cut to a required length to be separated into individual resistors 30.
  • the resistor 30 according to the second embodiment of the present invention shown in FIG. 8 is obtained. It is done.
  • Each of the electrodes 32a and 32b of this resistor is further provided with a groove in which the resistance material 31m is exposed, so that each of the electrodes 32a and 32b is further separated, and the four-terminal structure current detecting resistor shown in FIG. It can also be.
  • the thickness of the thin plate portion 31a of the resistor 31 may be adjusted to trim the resistance value.
  • the elongate joined body 36 is cut
  • a rod-shaped resistance alloy material is inserted into a cylindrical electrode metal material, and a joined body is formed by pressure welding (swaging) and heat treatment. Crushing is performed to form flat surfaces above and below the outer periphery of the joined body, and grooves are formed by cutting on each of the flat surfaces to expose the resistance material and to form a pair of electrodes.
  • a metal plate resistor having an arc-shaped electrode on the end face can be easily obtained by cutting to a size of.
  • the metal electrodes with flat shapes on the upper and lower surfaces can be formed on the left and right sides of the plate-shaped resistor at the arc-shaped end surface, it is a surface-mount type metal plate resistor, and easy to form fillets when soldering
  • the stress can be relieved by the arc-shaped metal electrode against the stress accompanying the expansion and contraction of the mounting substrate due to thermal stress such as heat cycle, and a metal plate resistor resistant to stress can be realized.
  • the resistor of the present invention is a current detection resistor capable of detecting a large current with high accuracy, having electrodes made of an electrode metal material such as copper at both ends of a resistor made of a resistance alloy material such as a copper nickel alloy. It can be used in a vessel.

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  • Manufacturing & Machinery (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

This object aims to provide the structure of a resistor in which a resistor with a low resistant value can be precisely manufactured in a simple production process and a method of manufacturing the resistor. A resistor (10) is provided with a rod-like resistance member (11) made from a resistance alloy material and cylindrical electrodes (12a, 12b) comprised of a metallic material jointed to circumferences of both ends of the resistance member, wherein the electrodes (12a, 12b) and the resistance member (11) are jointed by a rotary swaging process. The resistor (11) has a small diameter portion (11a) and a large diameter portions (11b, 11c) that is larger in diameter than the small diameter portion and is arranged at the both edges of the small diameter portion. The electrodes (12a, 12b) are jointed with the outer circumferential surface of the large diameter portion by the rotary swaging process.

Description

抵抗器およびその製造方法Resistor and manufacturing method thereof
 本発明は、銅ニッケル合金等の抵抗合金材料からなる抵抗体の両端に、銅等の電極金属材料からなる電極を備えた、大電流を高精度で検出することができる電流検出用抵抗器に関する。 The present invention relates to a current detection resistor that can detect a large current with high accuracy, and has electrodes made of an electrode metal material such as copper at both ends of a resistor made of a resistance alloy material such as a copper nickel alloy. .
 上記電流検出用抵抗器の一例として、特許文献1に記載された抵抗器が知られている。この抵抗器は、銅ニッケル合金等の抵抗合金材料からなる板体状の抵抗体の両端部下面に圧延等により接合した銅等の高導電性の電極金属材料からなる板体状の電極を備え、さらに両電極下面に溶融ハンダ層を配設したものである。係る構造の抵抗器によれば、数mΩ以下の低抵抗値であり、TCRも良好で、且つトリミングカットを設けないことから低直列インダクタンスの面実装型の電流検出用抵抗器として機能することができる。 A resistor described in Patent Document 1 is known as an example of the current detection resistor. This resistor includes a plate-like electrode made of a highly conductive electrode metal material such as copper joined to the lower surfaces of both ends of a plate-like resistor made of a resistance alloy material such as a copper nickel alloy by rolling or the like. Further, a molten solder layer is disposed on the lower surfaces of both electrodes. According to the resistor having such a structure, it has a low resistance value of several mΩ or less, a good TCR, and no trimming cut, so that it can function as a surface mount type current detection resistor having a low series inductance. it can.
 しかしながら、上記抵抗器の製作においては、抵抗合金材料からなる板体に電極金属材料からなる板体を圧延等により接合した後、通板しながら回転刃で平面状に切削加工して板体状の抵抗体を形成しているため、切削加工による抵抗合金材料の厚み精度には限界があり、抵抗値バラツキの精度を保つためには、製品形状にした後に、再度加工が必要であった。このため、高精度の低抵抗値を得るためには、加工工程が複雑となるという問題があった。また、上記抵抗器では、プリント配線基板等に実装するに際して、実装面が電極下面の溶融ハンダ層のみに限定されていて、その他の面に配線接続するのが困難であるという問題があった。
特開2002-57009号公報
However, in the manufacture of the resistor, after joining a plate made of an electrode metal material to a plate made of a resistance alloy material by rolling or the like, it is cut into a flat shape with a rotary blade while passing through the plate. Therefore, there is a limit to the thickness accuracy of the resistance alloy material by cutting, and in order to maintain the accuracy of the resistance value variation, it was necessary to process again after making the product shape. For this reason, in order to obtain a highly accurate low resistance value, there has been a problem that the machining process becomes complicated. Further, the above-described resistor has a problem that when mounted on a printed wiring board or the like, the mounting surface is limited only to the molten solder layer on the lower surface of the electrode, and it is difficult to connect the wiring to the other surface.
JP 2002-57009 A
 本発明は上述した事情に基づいてなされたもので、低抵抗値の抵抗器を簡単な製造工程で精度良く製作できると共に、抵抗器の下面以外にも実装基板の配線パターンと接続することが可能な電極を備えた抵抗器およびその製造方法を提供することを目的とする。 The present invention has been made based on the above-described circumstances, and can produce a low-resistance resistor with a simple manufacturing process with high accuracy and can be connected to a wiring pattern on a mounting board in addition to the lower surface of the resistor. It is an object of the present invention to provide a resistor having a simple electrode and a method for manufacturing the same.
 本発明の抵抗器は、抵抗合金材料からなる棒状の抵抗体と、該抵抗体の両端の外周面に接合した金属材料からなる筒状の電極とを備え、電極と抵抗体とをロータリスェージ加工により接合したことを特徴とする。そして、抵抗体は、細径部分と、その両端に細径部分よりも太径の太径部分とを有し、該太径部分の外周面に電極がロータリスェージ加工により接合されている。 The resistor of the present invention includes a rod-shaped resistor made of a resistance alloy material and a cylindrical electrode made of a metal material joined to the outer peripheral surfaces of both ends of the resistor, and the electrode and the resistor are connected to a rotary swage. It is characterized by being joined by processing. The resistor has a small-diameter portion and a large-diameter portion larger in diameter than the small-diameter portion at both ends, and an electrode is joined to the outer peripheral surface of the large-diameter portion by rotary swaging.
 また、本発明の抵抗器の製造方法は、抵抗合金からなる円柱状の抵抗材料と、円筒状の電極金属材料とを準備し、抵抗材料を電極金属材料内に挿入し、ロータリスェージ加工により抵抗材料と電極金属材料を接合した接合体を形成し、接合体を回転させながら切削することにより、抵抗材料の一部を接合体の周囲に渡って露出させるとともに、電極金属材料を接合体の軸方向に分離して、抵抗体と電極を形成することを特徴とする。 Also, the method of manufacturing a resistor according to the present invention comprises preparing a cylindrical resistance material made of a resistance alloy and a cylindrical electrode metal material, inserting the resistance material into the electrode metal material, and performing rotary swaging. By forming a joined body in which the resistance material and the electrode metal material are joined, and cutting the joined body while rotating, a part of the resistance material is exposed around the joined body, and the electrode metal material is removed from the joined body. A resistor and an electrode are formed separately in the axial direction.
 本発明によれば、金属管材料のロータリスェージング加工技術を用いることで、容易に抵抗合金材料からなる棒状の抵抗体が筒状の電極金属材料に被覆された接合体を得ることができ、高価な設備投資を必要とせず、簡単な製造工程で抵抗合金材料からなる棒状の抵抗体に対して高い接合強度で高導電性金属電極を接合することができる。そして、棒状の接合体を回転させながら切削することにより、電極金属材料を接合体の軸方向に分離して、抵抗体細径部分を形成するので、回転切削加工の仕上がり寸法精度は平板切削加工の仕上がり寸法精度よりも高いため、これにより容易に高い仕上がり寸法精度を実現でき、また、抵抗値バラツキの少ない抵抗器を製作できる。 According to the present invention, it is possible to easily obtain a joined body in which a rod-shaped resistor made of a resistance alloy material is covered with a cylindrical electrode metal material by using a rotary swaging technique for a metal tube material, A highly conductive metal electrode can be bonded with a high bonding strength to a rod-shaped resistor made of a resistance alloy material by a simple manufacturing process without requiring expensive capital investment. Then, by cutting the rod-shaped joined body while rotating it, the electrode metal material is separated in the axial direction of the joined body to form a small diameter portion of the resistor. Therefore, it is possible to easily achieve a high finished dimensional accuracy and to produce a resistor with little variation in resistance value.
図1Aは、本発明の第1実施形態の抵抗器を示す斜視図である。FIG. 1A is a perspective view showing a resistor according to a first embodiment of the present invention. 図1Bは、その抵抗器の断面図である。FIG. 1B is a cross-sectional view of the resistor. 図2Aは、その変形例の抵抗器を示す斜視図である。FIG. 2A is a perspective view showing a resistor of the modified example. 図2Bは、その抵抗器の断面図である。FIG. 2B is a cross-sectional view of the resistor. 図3Aは、その変形例の抵抗器を示す斜視図である。FIG. 3A is a perspective view showing a resistor of the modified example. 図3Bは、その抵抗器の断面図である。FIG. 3B is a cross-sectional view of the resistor. 図4Aは、その変形例の抵抗器を示す斜視図である。FIG. 4A is a perspective view showing a resistor of the modified example. 図4Bは、その抵抗器の断面図である。FIG. 4B is a cross-sectional view of the resistor. 図5Aは、その変形例の抵抗器を示す斜視図である。FIG. 5A is a perspective view showing a resistor of the modified example. 図5Bは、その抵抗器の断面図である。FIG. 5B is a cross-sectional view of the resistor. 図6は、その抵抗器の多層基板への実装例を示す断面図である。FIG. 6 is a cross-sectional view showing an example of mounting the resistor on a multilayer board. 図7Aは、第1実施形態の抵抗器の製造工程を工程順に示す、左側は斜視図であり、右側はその断面図である。FIG. 7A shows the manufacturing process of the resistor according to the first embodiment in the order of steps, the left side is a perspective view and the right side is a sectional view thereof. 図7Bは、第1実施形態の抵抗器の製造工程を工程順に示す、左側は斜視図であり、右側はその断面図である。FIG. 7B shows the manufacturing process of the resistor of the first embodiment in the order of steps, the left side is a perspective view, and the right side is a sectional view thereof. 図7Cは、第1実施形態の抵抗器の製造工程を工程順に示す、左側は斜視図であり、右側はその断面図である。FIG. 7C shows the manufacturing process of the resistor of the first embodiment in the order of steps, the left side is a perspective view, and the right side is a sectional view thereof. 図7Dは、第1実施形態の抵抗器の製造工程を工程順に示す、左側は斜視図であり、右側はその断面図である。FIG. 7D shows a manufacturing process of the resistor according to the first embodiment in order of steps, the left side is a perspective view, and the right side is a sectional view thereof. 図8は、本発明の第2実施形態の抵抗器を示す斜視図である。FIG. 8 is a perspective view showing a resistor according to the second embodiment of the present invention. 図9Aは、その抵抗器を示す断面図である。FIG. 9A is a cross-sectional view showing the resistor. 図9Bは、その抵抗器を示す平面図である。FIG. 9B is a plan view showing the resistor. 図9Cは、その抵抗器を示す側面図である。FIG. 9C is a side view showing the resistor. 図10は、その抵抗器の変形例を示す斜視図である。FIG. 10 is a perspective view showing a modification of the resistor. 図11Aは、第2実施形態の抵抗器の製造工程を工程順に示す斜視図である。FIG. 11A is a perspective view illustrating the manufacturing process of the resistor according to the second embodiment in the order of processes. 図11Bは、第2実施形態の抵抗器の製造工程を工程順に示す斜視図である。FIG. 11B is a perspective view illustrating the manufacturing process of the resistor according to the second embodiment in the order of processes. 図11Cは、第2実施形態の抵抗器の製造工程を工程順に示す斜視図である。FIG. 11C is a perspective view illustrating the manufacturing process of the resistor according to the second embodiment in the order of processes.
 以下、本発明の抵抗器およびその製造方法の実施形態について、添付図面を参照して説明する。なお、各図中、同一または相当する部材または要素には、同一の符号を付して説明する。 Hereinafter, an embodiment of a resistor and a manufacturing method thereof according to the present invention will be described with reference to the accompanying drawings. In addition, in each figure, the same code | symbol is attached | subjected and demonstrated to the same or equivalent member or element.
 図1Aは本発明の第1実施形態の抵抗器を示す斜視図であり、図1Bはその断面図である。この抵抗器10は、銅ニッケル、ニクロム、マンガニン、鉄クロムなどの低抵抗率で且つ抵抗温度係数(TCR)が良好な抵抗合金材料からなる円柱状(棒状)の抵抗体11と、該抵抗体11の両端の外周面に接合した銅または銅合金などの高導電率の金属材料からなる円筒状(筒状)の電極12a、12bとを備える。ここで、電極金属材料の抵抗率は抵抗合金材料の抵抗率の1/50以下が好ましい。 FIG. 1A is a perspective view showing a resistor according to a first embodiment of the present invention, and FIG. 1B is a sectional view thereof. The resistor 10 includes a columnar (rod-like) resistor 11 made of a resistance alloy material having a low resistivity and a good resistance temperature coefficient (TCR), such as copper nickel, nichrome, manganin, and iron chromium, and the resistor. 11 are provided with cylindrical (tubular) electrodes 12a and 12b made of a metal material having a high conductivity such as copper or copper alloy joined to the outer peripheral surfaces of both ends. Here, the resistivity of the electrode metal material is preferably 1/50 or less of the resistivity of the resistance alloy material.
 抵抗体11は、細径部分11aと、その両端に細径部分よりも太径の太径部分11b,11cとを有し、該太径部分11b,11cの外周面に円筒状の電極12a,12bが接合されている。電極12a,12bの内周面と抵抗体太径部分11b,11cの外周面とは、ロータリスェージ加工(金属圧縮塑性変形加工)により界面に圧力を加え、熱処理することで接合されている。 The resistor 11 has a narrow diameter portion 11a and thick diameter portions 11b and 11c that are larger in diameter than the narrow diameter portion at both ends. Cylindrical electrodes 12a and 11c are formed on the outer peripheral surfaces of the large diameter portions 11b and 11c. 12b is joined. The inner peripheral surfaces of the electrodes 12a and 12b and the outer peripheral surfaces of the resistor large- diameter portions 11b and 11c are joined by applying pressure to the interface by a rotary sledge process (metal compression plastic deformation process) and performing a heat treatment.
 なお、ロータリスェージ加工は、例えば特開2002-158044号公報、特開平5-74323号公報に見られる金属圧縮塑性変形技術を用いることができ、被加工金属を回転させつつ、被加工金属の周囲に配置されたダイスで被加工金属外周面を半径方向に(被加工金属の中心に向かって)叩く(圧縮する)ことで、被加工金属を半径方向内方に圧縮塑性変形させる技術であり、例えば金属円筒の内部に配置した多数の電線からなる芯線部を加締める場合(特開2002-158044号公報参照)などに用いられる。 For the rotary swaging, for example, a metal compression plastic deformation technique as disclosed in Japanese Patent Application Laid-Open No. 2002-158044 and Japanese Patent Application Laid-Open No. 5-74323 can be used. It is a technology to compress and plastically deform the work metal radially inward by striking (compressing) the work metal outer peripheral surface in the radial direction (toward the center of the work metal) with dies arranged around For example, it is used when caulking a core wire portion made up of a number of electric wires arranged inside a metal cylinder (see Japanese Patent Application Laid-Open No. 2002-158044).
 本発明の抵抗器10においては、円柱状の抵抗体11と電極金属材料(銅)からなる電極12a、12bとがロータリスェージ加工を用いた加締め(圧接)およびその後の熱処理により固定されているので、電極12a,12bの内周面と抵抗体11の外周面との界面に相互の金属同士の拡散状態が形成され、電気的にも機械的にも良好な接合状態が得られ、特に低抵抗値の電流検出用抵抗器にとって重要な抵抗体への金属電極の均一な且つ強固な接合状態が得られる。 In the resistor 10 of the present invention, a cylindrical resistor 11 and electrodes 12a and 12b made of an electrode metal material (copper) are fixed by caulking (pressure welding) using a rotary swaging process and subsequent heat treatment. As a result, a diffusion state between the metals is formed at the interface between the inner peripheral surface of the electrodes 12a and 12b and the outer peripheral surface of the resistor 11, and a good joint state is obtained both electrically and mechanically. A uniform and strong bonding state of the metal electrode to the resistor important for the resistor for current detection having a low resistance value can be obtained.
 抵抗体11の細径部分11aは抵抗器10の抵抗値を形成する部分であり、抵抗器10の抵抗値は、細径部分11aの長さに比例し、断面積に反比例する。このため、細径部分11aの長さと直径を精度高く加工することで、所要の抵抗値精度が得られるので、丸棒状の抵抗体11を回転させながら切削刃を押し当てて切削することで、容易に細径部分11aを所要直径に高精度で加工でき、これにより低抵抗値の抵抗器を簡単な製造工程で、且つ良好な抵抗値の仕上がり精度で製作できる。 The small-diameter portion 11a of the resistor 11 is a portion that forms the resistance value of the resistor 10, and the resistance value of the resistor 10 is proportional to the length of the small-diameter portion 11a and inversely proportional to the cross-sectional area. For this reason, since the required resistance value accuracy can be obtained by processing the length and diameter of the small-diameter portion 11a with high accuracy, by cutting the resistor 11 while rotating the round bar-shaped resistor 11, The small-diameter portion 11a can be easily machined to a required diameter with high accuracy, whereby a low-resistance resistor can be manufactured with a simple manufacturing process and with good finishing accuracy.
 なお、平板切削の仕上がり寸法精度は通常±10~30μm程度であるが、回転切削加工の仕上がり寸法精度は、被加工物自体を回転させながらバイト加工で抵抗体材料の径を決めていくため、φ(直径)の仕上がり精度で±5μm以下が可能である。このため、回転切削加工では、平面切削加工と比較して、加工精度が高く、抵抗値の仕上がり精度が向上し、例えば±1%以内の高い抵抗値精度を容易に実現することが可能となる。 The finished dimensional accuracy of flat plate cutting is usually about ± 10 to 30 μm. However, the finished dimensional accuracy of rotary cutting processing determines the diameter of the resistor material by bite machining while rotating the workpiece itself. The finishing accuracy of φ (diameter) can be ± 5μm or less. For this reason, in the rotational cutting process, the machining accuracy is higher than that in the plane cutting process, and the finish accuracy of the resistance value is improved. For example, a high resistance value accuracy within ± 1% can be easily realized. .
 図2A及び図2Bは、図1A及び図1Bに示す抵抗器10の変形例を示す斜視図と断面図である。この抵抗器10aは、図1A及び図1Bに示す抵抗器の構成に加え、銅等の金属材料からなる円筒状の電極12a,12bの外周面全面に溶融ハンダ層13a,13bを備えている。溶融ハンダ層13a,13bは、溶融状態のハンダ液に電極12a,12bの外周面を接触させ、円筒状の電極12a,12bを回転させることで、その外周面全体に溶融状態のハンダ液を塗布し、冷却することで固化した溶融ハンダ層13a,13bを被着することができる。なお、溶融ハンダ層に代えて、溶融スズ層を用いても勿論良い。 2A and 2B are a perspective view and a cross-sectional view showing a modification of the resistor 10 shown in FIGS. 1A and 1B. In addition to the resistor configuration shown in FIGS. 1A and 1B, the resistor 10a includes molten solder layers 13a and 13b on the entire outer peripheral surface of cylindrical electrodes 12a and 12b made of a metal material such as copper. The molten solder layers 13a and 13b are formed by bringing the outer peripheral surface of the electrodes 12a and 12b into contact with the molten solder liquid and rotating the cylindrical electrodes 12a and 12b, thereby applying the molten solder liquid to the entire outer peripheral surface. Then, the molten solder layers 13a and 13b solidified by cooling can be applied. Of course, a molten tin layer may be used instead of the molten solder layer.
 円筒状の電極12a,12bの表面に、溶融ハンダ層13a,13bを備えることで、抵抗器10aをプリント基板等の実装基板に表面実装するに際して、実装基板上の配線パッド等に容易にハンダ接合により電極12a、12bを固定することができ、抵抗器10の実装性を良好なものとすることができる。 By providing the molten solder layers 13a and 13b on the surfaces of the cylindrical electrodes 12a and 12b, when the resistor 10a is surface-mounted on a mounting board such as a printed board, it can be easily soldered to a wiring pad on the mounting board. Thus, the electrodes 12a and 12b can be fixed, and the mountability of the resistor 10 can be improved.
 図3A及び図3Bは、図1A及び図1Bに示す抵抗器10のさらなる変形例を示す斜視図と断面図である。この実施形態においては、溶融ハンダ層13a,13bは円筒状の電極12a,12bの外周面のみならず、丸棒状の抵抗器10bの両端面の全面を覆うように設けられている。これにより、抵抗器をプリント基板等の実装基板に表面実装するに際して、電極12a,12bの両端面にもハンダフィレットを形成することができ、抵抗器の実装性をさらに良好なものとすることができる。なお、溶融ハンダ層13a,13bは、メッキにより形成してもよい。 3A and 3B are a perspective view and a cross-sectional view showing a further modification of the resistor 10 shown in FIGS. 1A and 1B. In this embodiment, the molten solder layers 13a and 13b are provided so as to cover not only the outer peripheral surfaces of the cylindrical electrodes 12a and 12b but also the entire end surfaces of the round bar-shaped resistor 10b. As a result, when the resistor is surface-mounted on a mounting board such as a printed circuit board, solder fillets can be formed on both end faces of the electrodes 12a and 12b, thereby further improving the mountability of the resistor. it can. Note that the molten solder layers 13a and 13b may be formed by plating.
 また、この実施形態の抵抗器10では、抵抗体11の細径部分11aの外周面全面を被覆する樹脂膜等からなる保護膜14を備えている。これにより、抵抗体11の細径部分11aに異物が付着しても、抵抗体11の細径部分11aに対して何らかの影響を及ぼすことが防止され、抵抗体11を保護することができる。 Further, the resistor 10 of this embodiment includes a protective film 14 made of a resin film or the like that covers the entire outer peripheral surface of the small diameter portion 11 a of the resistor 11. Thereby, even if a foreign substance adheres to the small-diameter portion 11a of the resistor 11, any influence on the small-diameter portion 11a of the resistor 11 is prevented, and the resistor 11 can be protected.
 図4A及び図4Bは、図1A及び図1Bに示す抵抗器10のさらなる変形例を示す斜視図と断面図である。すなわち、図1A及び図1Bに示す抵抗器10は円柱状の抵抗体11の太径部分11b,11cの外周に円筒状の電極12a,12bを備えたものであるが、この変形例の抵抗器10cは、電極部分を上下からプレス等により押圧して電極12a,12bの表面に平坦な面12fを形成したものである。これにより、丸棒状の抵抗器を表面実装するに際して、丸棒状の抵抗器の転動を防止し、表面実装の安定性を高めることができる。 4A and 4B are a perspective view and a cross-sectional view showing a further modification of the resistor 10 shown in FIGS. 1A and 1B. In other words, the resistor 10 shown in FIGS. 1A and 1B includes cylindrical electrodes 12a and 12b on the outer periphery of the large- diameter portions 11b and 11c of the columnar resistor 11. 10c is formed by pressing the electrode portion from above and below by pressing or the like to form a flat surface 12f on the surfaces of the electrodes 12a and 12b. Thereby, when surface-mounting a round bar-shaped resistor, rolling of a round-bar-shaped resistor can be prevented and the stability of surface mounting can be improved.
 図5A及び図5Bは、図4A及び図4Bに示す抵抗器10のさらなる変形例を示す斜視図と断面図である。電極12a,12bの表面に平坦面12fを形成するには、この変形例の抵抗器10dのように、電極12a,12bの上下部分を切削により除去し、平坦面12fを形成するようにしてもよい。 FIGS. 5A and 5B are a perspective view and a cross-sectional view showing a further modification of the resistor 10 shown in FIGS. 4A and 4B. In order to form the flat surface 12f on the surfaces of the electrodes 12a and 12b, the upper and lower portions of the electrodes 12a and 12b are removed by cutting to form the flat surface 12f as in the resistor 10d of this modification. Good.
 図6は、上記抵抗器10(10a-10d)の多層基板への実装例を示す。多層基板は、この例では、配線パターン21a,21bを備えた基板21、開口22aを備えた基板22、ビア23a,23bおよび該ビアを貫通する導体を含む配線パターン23c,23dを備えた基板24等が積層して構成され、上記抵抗器10(10a-10d)が開口22aの内部に収容されている。上記抵抗器10(10a-10d)は、電極12a,12bの下部が電流供給用の配線パターン21a,21bに接続され、電極12a,12bの上部が電圧検出用の配線パターン23c,23dに接続されている。 FIG. 6 shows an example of mounting the resistor 10 (10a-10d) on a multilayer board. In this example, the multilayer substrate is a substrate 21 provided with wiring patterns 21a and 21b, a substrate 22 provided with openings 22a, vias 23a and 23b, and wiring patterns 23c and 23d including conductors passing through the vias. Etc., and the resistor 10 (10a-10d) is accommodated in the opening 22a. In the resistor 10 (10a-10d), the lower portions of the electrodes 12a and 12b are connected to the current supply wiring patterns 21a and 21b, and the upper portions of the electrodes 12a and 12b are connected to the voltage detection wiring patterns 23c and 23d. ing.
 このように本発明の抵抗器10(10a-10d)においては、棒状の抵抗体11の両端外周に配置した筒状の電極12a,12bを備えるので、上下左右どの方向からも同じ電位を持つ電極が形成され、どの方向から実装基板の配線パターンと接合しても、安定した同じ抵抗値を示す電流検出用抵抗器を提供できる。従って、抵抗器の下面のみならず上面からも実装基板に設けた配線パターンに接続することができ、多層の実装基板などへ埋め込み部品として使用する際に有効である。 As described above, the resistor 10 (10a-10d) according to the present invention includes the cylindrical electrodes 12a and 12b disposed on the outer circumferences of both ends of the rod-shaped resistor 11, so that the electrodes having the same potential in any direction from top to bottom and from side to side. Can be provided, and a current detecting resistor showing the same stable resistance value can be provided no matter which direction is joined to the wiring pattern of the mounting substrate. Therefore, the wiring pattern provided on the mounting board can be connected not only from the lower surface but also from the upper surface of the resistor, which is effective when used as an embedded component on a multilayer mounting board or the like.
 次に、図7A乃至図7Dを参照して、本発明の第1実施形態の抵抗器の製造方法について説明する。まず、図7Aに示すように、銅ニッケル、ニクロム、マンガニン、鉄クロムなどの低抵抗率で且つ抵抗温度係数(TCR)が良好な抵抗合金材料からなる円柱状の抵抗材料11mと、この抵抗材料11mを内部に挿入可能な銅または銅合金からなる円筒状の電極金属材料12mを準備する。 Next, with reference to FIG. 7A thru | or FIG. 7D, the manufacturing method of the resistor of 1st Embodiment of this invention is demonstrated. First, as shown in FIG. 7A, a cylindrical resistance material 11m made of a resistance alloy material having a low resistivity and a good temperature coefficient of resistance (TCR), such as copper nickel, nichrome, manganin, and iron chromium, and the resistance material A cylindrical electrode metal material 12m made of copper or a copper alloy capable of inserting 11m inside is prepared.
 そして、図7Bに示すように、抵抗材料11mを円筒状の電極金属材料12m内に挿入し、ロータリスェージ加工(金属圧縮塑性変形加工)により、円柱状の抵抗材料11mの外周面に円筒状の電極金属材料12mの内周面を加締めにより接合し、熱処理を施した接合体16を形成する。 Then, as shown in FIG. 7B, the resistance material 11m is inserted into the cylindrical electrode metal material 12m, and a cylindrical shape is formed on the outer peripheral surface of the columnar resistance material 11m by rotary sledge processing (metal compression plastic deformation processing). The inner peripheral surface of the electrode metal material 12m is joined by caulking to form a joined body 16 subjected to heat treatment.
 次に、図7Cに示すように、旋盤等を用いて、接合体16を回転させながら接合体16の軸方向に沿った一部を半径方向に切削する。すなわち、電極金属材料12mをその表面から半径方向に切削して抵抗材料11mの軸方向に沿った一部を接合体の周囲に渡って露出させ、さらに所要の直径となるように切削して抵抗体11の細径部分11aを形成する。これにより、電極金属材料12mが接合体16の軸方向に抵抗体11の細径部分11aを隔てて分離され、円筒状の電極12が形成され、抵抗体11には細径部分11aと太径部分11dとが形成される。 Next, as shown in FIG. 7C, a part along the axial direction of the joined body 16 is cut in the radial direction while rotating the joined body 16 using a lathe or the like. That is, the electrode metal material 12m is cut from the surface in the radial direction so that a portion along the axial direction of the resistance material 11m is exposed over the periphery of the joined body, and further cut to a required diameter for resistance. A small-diameter portion 11a of the body 11 is formed. As a result, the electrode metal material 12m is separated in the axial direction of the joined body 16 across the small-diameter portion 11a of the resistor 11, and the cylindrical electrode 12 is formed. The resistor 11 has a small-diameter portion 11a and a large-diameter portion. A portion 11d is formed.
 そして、電極12の中央で切断線17(図7C右図参照)に沿って切断することで、電極12が電極12a,12bに分離され、図7Dに示すように、個々の抵抗器10(図1A及び図1B参照)が得られる。さらに必要に応じて電極12a,12bの外周面に溶融ハンダ層13a,13bを設けることで、図2A及び図2Bに示す抵抗器10aが得られる。さらに必要に応じて、抵抗体11の細径部分11aの外周に保護膜14を設け、電極12a,12bの外周面と抵抗器端面に溶融ハンダ層13a,13bを設けることで、図3A及び図3Bに示す抵抗器10bが得られる。 Then, by cutting along the cutting line 17 (see the right figure in FIG. 7C) at the center of the electrode 12, the electrode 12 is separated into electrodes 12a and 12b, and as shown in FIG. 1A and FIG. 1B). Furthermore, the resistor 10a shown to FIG. 2A and FIG. 2B is obtained by providing the molten solder layers 13a and 13b in the outer peripheral surface of electrode 12a, 12b as needed. Further, if necessary, a protective film 14 is provided on the outer periphery of the small-diameter portion 11a of the resistor 11, and molten solder layers 13a and 13b are provided on the outer peripheral surfaces of the electrodes 12a and 12b and the resistor end surfaces. The resistor 10b shown in 3B is obtained.
 図8は本発明の第2実施形態の抵抗器を示す斜視図であり、図9Aはその断面図であり、図9Bはその平面図であり、図9Cはその側面図である。この抵抗器30は、表裏面が平坦で両端が円弧状を成した板体状の抵抗体31と、抵抗体31の両端にロータリスェージ加工により接合した金属材料からなる電極32a,32bとを備える。抵抗体31は、銅ニッケル、ニクロム、マンガニン、鉄クロムなどの低抵抗率で且つ抵抗温度係数(TCR)が良好な抵抗合金材料からなることは第1実施形態と同様であり、電極32a,32bは、銅または銅合金等の高導電率金属材料からなることも第1実施形態と同様である。 8 is a perspective view showing a resistor according to a second embodiment of the present invention, FIG. 9A is a sectional view thereof, FIG. 9B is a plan view thereof, and FIG. 9C is a side view thereof. The resistor 30 includes a plate-like resistor 31 having flat front and back surfaces and arcs at both ends, and electrodes 32a and 32b made of a metal material joined to both ends of the resistor 31 by rotary swaging. Prepare. The resistor 31 is made of a resistance alloy material having a low resistivity and a good resistance temperature coefficient (TCR), such as copper nickel, nichrome, manganin, and iron chromium, as in the first embodiment, and the electrodes 32a and 32b. Is made of a high conductivity metal material such as copper or copper alloy as in the first embodiment.
 抵抗体31は、表裏面が平坦な薄板部分31aと、両端が円弧状を成した厚板部分31b,31cとからなり、抵抗体31の厚板部分31b,31cの外周にロータリスェージ加工により接合した高導電率金属材料からなる電極32a,32bを備える。ロータリスェージ加工および熱処理により、電極32a,32bの内周面と抵抗体31a,31bの外周面との界面に相互の金属同士の拡散状態が形成され、電気的にも機械的にも良好な接合状態が得られ、特に低抵抗値の電流検出用抵抗器にとって重要な抵抗体への電極の均一な且つ強固な接合状態が得られる。 The resistor 31 includes a thin plate portion 31a whose front and back surfaces are flat and thick plate portions 31b and 31c having arcs at both ends. The outer periphery of the thick plate portions 31b and 31c of the resistor 31 is subjected to rotary swaging. Electrodes 32a and 32b made of bonded high conductivity metal materials are provided. By rotary swaging and heat treatment, a diffusion state of mutual metals is formed at the interface between the inner peripheral surfaces of the electrodes 32a and 32b and the outer peripheral surfaces of the resistors 31a and 31b, which is good both electrically and mechanically. A junction state is obtained, and a uniform and strong junction state of the electrode to the resistor important for a resistor for detecting a current having a low resistance value is obtained.
 抵抗体31の薄板部分31aは抵抗器30の抵抗値を形成する部分であり、抵抗器30の抵抗値は、薄板部分31aの長さ(電極32a,32b間の間隔)に比例し、薄板部分31aの断面積(薄板部分31aの長さに垂直な面の断面積)に反比例する。このため、薄板部分31aの長さと断面積を精度高く加工することで、高精度の抵抗値が得られる。 The thin plate portion 31a of the resistor 31 is a portion that forms the resistance value of the resistor 30, and the resistance value of the resistor 30 is proportional to the length of the thin plate portion 31a (interval between the electrodes 32a and 32b). It is inversely proportional to the cross-sectional area of 31a (the cross-sectional area of the plane perpendicular to the length of the thin plate portion 31a). For this reason, a highly accurate resistance value is obtained by processing the length and cross-sectional area of the thin plate portion 31a with high accuracy.
 図10は、本発明の第2実施形態の抵抗器の変形例を示す斜視図である。この抵抗器30aは、抵抗器30の電極32a,32bに抵抗材料(抵抗体31の面)が露出する溝37zを更に設け、電極を更に分離し、電極32aを電極32c,32dに、電極32bを電極32e,32fに分離したものである。これにより、電極を電流供給端子と電圧検出端子とに分離することができ、4端子構造の電流検出用抵抗器を作成することができる。 FIG. 10 is a perspective view showing a modification of the resistor according to the second embodiment of the present invention. In this resistor 30a, the electrodes 32a and 32b of the resistor 30 are further provided with grooves 37z in which the resistance material (the surface of the resistor 31) is exposed, further separating the electrodes, the electrode 32a into the electrodes 32c and 32d, and the electrode 32b. Is separated into electrodes 32e and 32f. Thereby, an electrode can be isolate | separated into a current supply terminal and a voltage detection terminal, and the resistor for current detection of a 4 terminal structure can be created.
 次に、図11A乃至図11Cを参照して、本発明の第2実施形態の抵抗器の製造方法について説明する。この抵抗器の製造方法の前半は、図7A及び図7Bに示す第1実施形態の抵抗器の製造方法の前半と同じである。すなわち、銅ニッケル、ニクロム、マンガニン、鉄クロムなどの低抵抗率で且つ抵抗温度係数(TCR)が良好な抵抗合金材料からなる円柱状の抵抗材料11mと、この抵抗材料11mを内部に挿入可能な銅または銅合金からなる円筒状の電極金属材料12mを準備し、抵抗材料11mを円筒状の電極金属材料12m内に挿入し、ロータリスェージ加工(金属圧縮塑性変形加工)により、円柱状の抵抗材料11mの外周面に円筒状の電極金属材料12mの内周面を加締めにより接合し、熱処理を施した接合体16を形成する。 Next, with reference to FIG. 11A thru | or FIG. 11C, the manufacturing method of the resistor of 2nd Embodiment of this invention is demonstrated. The first half of this resistor manufacturing method is the same as the first half of the resistor manufacturing method of the first embodiment shown in FIGS. 7A and 7B. That is, a cylindrical resistance material 11m made of a resistance alloy material having a low resistivity and a good resistance temperature coefficient (TCR), such as copper nickel, nichrome, manganin, and iron chromium, and the resistance material 11m can be inserted therein. A cylindrical electrode metal material 12m made of copper or a copper alloy is prepared, a resistance material 11m is inserted into the cylindrical electrode metal material 12m, and a cylindrical resistance is obtained by rotary swaging (metal compression plastic deformation processing). The inner peripheral surface of the cylindrical electrode metal material 12m is joined to the outer peripheral surface of the material 11m by caulking to form a joined body 16 subjected to heat treatment.
 以降の工程は、第1実施形態の抵抗器の製造方法と異なり、図11Aに示すように、まず接合体16を上下方向にプレス等により押圧して接合体を圧縮塑性変形し、接合体外周の上下に平坦な面36fを形成する。圧縮塑性変形した接合体36では、円柱状の抵抗材料11mが表裏面が平坦で両端が円弧状を成した板体状の抵抗材料31mに変形し、円筒状の電極金属材料12mが両端が円弧状を成した板体状の抵抗材料31mの外周に接合した筒状の電極金属材料32mに変形している。 In the subsequent steps, unlike the resistor manufacturing method of the first embodiment, as shown in FIG. 11A, first, the joined body 16 is pressed in a vertical direction by pressing or the like to compress and plastically deform the joined body, and the outer periphery of the joined body. A flat surface 36f is formed above and below. In the compression-deformed joint 36, the cylindrical resistance material 11m is deformed into a plate-shaped resistance material 31m having flat front and back surfaces and arcuate ends, and the cylindrical electrode metal material 12m is circular at both ends. It is deformed into a cylindrical electrode metal material 32m joined to the outer periphery of an arc-shaped plate-shaped resistance material 31m.
 次に、図11Bに示すように、平坦な面36fのそれぞれに切削による溝37を形成して、抵抗材料31mを露出させるとともに板体状の抵抗材料31mの両端部に一対の長尺状の電極32a,32bを分離形成する。この時、抵抗材料31mには、表裏面が平坦な薄板部分31aと、両端が円弧状を成した厚板部分31b,31cとが形成され(図11C参照)、薄板部分31aは抵抗器30の抵抗値を形成する部分であるので、所要抵抗値に対応した厚さが得られるように切削される。 Next, as shown in FIG. 11B, a groove 37 by cutting is formed on each of the flat surfaces 36f to expose the resistance material 31m, and a pair of elongated shapes are formed at both ends of the plate-shaped resistance material 31m. The electrodes 32a and 32b are formed separately. At this time, the resistive material 31m is formed with a thin plate portion 31a having flat front and back surfaces and thick plate portions 31b and 31c having arcs at both ends (see FIG. 11C). Since it is a part that forms a resistance value, it is cut so as to obtain a thickness corresponding to the required resistance value.
 次に、図11Cに示すように、接合体36を所要の長さで切断することで、個々の抵抗器30に分離され、図8に示す本発明の第2実施形態の抵抗器30が得られる。この抵抗器の電極32a,32bのそれぞれに、抵抗材料31mが露出する溝を更に設けることで、電極32a,32bのそれぞれを更に分離して、図10に示す4端子構造の電流検出用抵抗器とすることもできる。また、図3,4に示す第1実施形態の抵抗器と同様に抵抗体31の薄板部分31aを取り囲む保護膜と、電極部分に溶融ハンダ層またはハンダメッキ電極を設けるようにしてもよい。 Next, as shown in FIG. 11C, the joined body 36 is cut to a required length to be separated into individual resistors 30. Thus, the resistor 30 according to the second embodiment of the present invention shown in FIG. 8 is obtained. It is done. Each of the electrodes 32a and 32b of this resistor is further provided with a groove in which the resistance material 31m is exposed, so that each of the electrodes 32a and 32b is further separated, and the four-terminal structure current detecting resistor shown in FIG. It can also be. Moreover, you may make it provide a molten solder layer or a solder plating electrode in the protective film surrounding the thin-plate part 31a of the resistor 31, and an electrode part similarly to the resistor of 1st Embodiment shown to FIG.
 また、必要に応じて抵抗体31の薄板部分31aの厚さを調整して抵抗値のトリミングを行うようにしてもよい。なお、長尺状の接合体36に溝37を形成してから個々の抵抗器30に切断分離する例について説明したが、長尺状の接合体36を切断して個々の抵抗器30に分離した後で、溝37を形成して電極32a,32bを分離形成するようにしてもよい。 Further, if necessary, the thickness of the thin plate portion 31a of the resistor 31 may be adjusted to trim the resistance value. In addition, although the example which cuts and separates to each resistor 30 after forming the groove | channel 37 in the elongate joined body 36 was demonstrated, the elongate joined body 36 is cut | disconnected and separated to each resistor 30 After that, the groove 37 may be formed to separate the electrodes 32a and 32b.
 本発明の第2実施形態の抵抗器の製造方法によれば、筒状の電極金属材料に、棒状の抵抗合金材料を挿入して、圧接(スェージング)および熱処理により接合体を形成し、プレスにてつぶし加工を行い、接合体の外周の上下に平坦な面を形成し、平坦な面のそれぞれに切削による溝を形成して抵抗材料を露出させるとともに一対の電極を形成し、接合体を所要の寸法に切断することによって、簡単に端面に円弧状電極を有する金属板抵抗器を得ることができる。 According to the method of manufacturing a resistor of the second embodiment of the present invention, a rod-shaped resistance alloy material is inserted into a cylindrical electrode metal material, and a joined body is formed by pressure welding (swaging) and heat treatment. Crushing is performed to form flat surfaces above and below the outer periphery of the joined body, and grooves are formed by cutting on each of the flat surfaces to expose the resistance material and to form a pair of electrodes. A metal plate resistor having an arc-shaped electrode on the end face can be easily obtained by cutting to a size of.
 従って、電子ビーム溶接など高価な設備投資の必要も無く、線材として容易に熱処理ができるため、カシメ工法などに比べて、電極金属材料の抵抗合金材料に対する接合性を飛躍的に向上させることができる。そして、円弧状の端面で、上下面は平らな形状の金属電極が板体状の抵抗体の左右に形成できるため、面実装タイプの金属板抵抗器であり、ハンダ実装時のフィレット形成も容易に確認でき、ヒートサイクルなどの熱応力による実装基板の伸び縮みにともなうストレスに対して、円弧状の金属電極により応力を緩和することができ、ストレスに強い金属板抵抗器を実現できる。 Therefore, since there is no need for expensive equipment investment such as electron beam welding, and heat treatment can be easily performed as a wire rod, it is possible to dramatically improve the bondability of the electrode metal material to the resistance alloy material as compared with the caulking method. . And since the metal electrodes with flat shapes on the upper and lower surfaces can be formed on the left and right sides of the plate-shaped resistor at the arc-shaped end surface, it is a surface-mount type metal plate resistor, and easy to form fillets when soldering The stress can be relieved by the arc-shaped metal electrode against the stress accompanying the expansion and contraction of the mounting substrate due to thermal stress such as heat cycle, and a metal plate resistor resistant to stress can be realized.
 これまで本発明の一実施形態について説明したが、本発明は上述の実施形態に限定されず、その技術的思想の範囲内において種々異なる形態にて実施されてよいことは言うまでもない。 Although one embodiment of the present invention has been described so far, it is needless to say that the present invention is not limited to the above-described embodiment, and may be implemented in various forms within the scope of the technical idea.
 本発明の抵抗器は、銅ニッケル合金等の抵抗合金材料からなる抵抗体の両端に銅等の電極金属材料からなる電極を備えた、大電流を高精度で検出することができる電流検出用抵抗器に利用が可能である。 The resistor of the present invention is a current detection resistor capable of detecting a large current with high accuracy, having electrodes made of an electrode metal material such as copper at both ends of a resistor made of a resistance alloy material such as a copper nickel alloy. It can be used in a vessel.

Claims (10)

  1.  抵抗合金材料からなる棒状の抵抗体と、
     該抵抗体の両端の外周面に接合した金属材料からなる筒状の電極とを備え、
     前記電極と前記抵抗体とをロータリスェージ加工により接合したことを特徴とする抵抗器。
    A rod-shaped resistor made of a resistance alloy material;
    A cylindrical electrode made of a metal material joined to the outer peripheral surfaces of both ends of the resistor,
    A resistor comprising the electrode and the resistor joined by rotary swaging.
  2.  前記抵抗体は、細径部分と、その両端に細径部分よりも太径の太径部分とを有し、該太径部分の外周面に前記電極が接合されていることを特徴とする請求項1記載の抵抗器。 The resistor has a narrow-diameter portion and a thick-diameter portion having a diameter larger than that of the thin-diameter portion at both ends thereof, and the electrode is joined to an outer peripheral surface of the large-diameter portion. Item 1. The resistor according to item 1.
  3.  前記抵抗体は円柱状であり、前記電極は円筒状であることを特徴とする請求項1記載の抵抗器。 2. The resistor according to claim 1, wherein the resistor is cylindrical and the electrode is cylindrical.
  4.  前記電極の表面に平坦面を形成したことを特徴とする請求項1記載の抵抗器。 The resistor according to claim 1, wherein a flat surface is formed on the surface of the electrode.
  5.  抵抗合金からなる円柱状の抵抗材料と、円筒状の電極金属材料とを準備し、
     前記抵抗材料を前記電極金属材料内に挿入し、
     ロータリスェージ加工により前記抵抗材料と前記電極金属材料を接合した接合体を形成し、
     前記接合体を回転させながら切削することにより、前記抵抗材料の一部を接合体の周囲に渡って露出させるとともに、前記電極金属材料を前記接合体の軸方向に分離して、抵抗体と電極を形成することを特徴とする抵抗器の製造方法。
    Prepare a cylindrical resistance material made of a resistance alloy and a cylindrical electrode metal material,
    Inserting the resistive material into the electrode metal material;
    Forming a joined body obtained by joining the resistance material and the electrode metal material by rotary swaging;
    By cutting while cutting the joined body, a part of the resistance material is exposed around the joined body, and the electrode metal material is separated in the axial direction of the joined body, so that the resistor and the electrode are separated. Forming a resistor.
  6.  前記電極に平坦な面を形成することを特徴とする請求項5記載の抵抗器の製造方法。 6. The method of manufacturing a resistor according to claim 5, wherein a flat surface is formed on the electrode.
  7.  表裏面が平坦で両端が円弧状を成した板体状の抵抗体と、
     前記抵抗体の両端にロータリスェージ加工により接合した電極金属材料からなる電極とを備えたことを特徴とする抵抗器。
    A plate-like resistor whose front and back surfaces are flat and arc-shaped at both ends;
    A resistor comprising an electrode made of an electrode metal material joined to both ends of the resistor by rotary swaging.
  8.  前記電極は、前記抵抗体の両端において更に分離されていることを特徴とする請求項7記載の抵抗器。 The resistor according to claim 7, wherein the electrode is further separated at both ends of the resistor.
  9.  抵抗合金からなる円柱状の抵抗材料と、円筒状の電極金属材料とを準備し、
     前記抵抗材料を前記電極金属材料内に挿入し、
     ロータリスェージ加工により前記抵抗材料と前記電極金属材料を接合した接合体を形成し、
     前記接合体を押圧して前記接合体の外周の上下に平坦な面を形成し、
     前記平坦な面のそれぞれに切削による溝を形成して前記抵抗材料を露出させるとともに一対の電極を形成することを特徴とする抵抗器の製造方法。
    Prepare a cylindrical resistance material made of a resistance alloy and a cylindrical electrode metal material,
    Inserting the resistive material into the electrode metal material;
    Forming a joined body obtained by joining the resistance material and the electrode metal material by rotary swaging;
    Pressing the joined body to form flat surfaces above and below the outer periphery of the joined body,
    A method for manufacturing a resistor, comprising: forming a groove by cutting on each of the flat surfaces to expose the resistance material and forming a pair of electrodes.
  10.  前記電極に前記抵抗材料が露出する溝を更に設け、前記電極を更に分離することを特徴とする請求項9記載の抵抗器の製造方法。 10. The method of manufacturing a resistor according to claim 9, wherein the electrode is further provided with a groove in which the resistance material is exposed, and the electrode is further separated.
PCT/JP2009/051261 2008-01-30 2009-01-27 Resistor and method of manufacturing resistor WO2009096386A1 (en)

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WO2022124255A1 (en) * 2020-12-09 2022-06-16 Koa株式会社 Shunt resistor and mounting structure therefor

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