WO2009091140A3 - Conditioner for chemical mechanical planarization pad - Google Patents

Conditioner for chemical mechanical planarization pad Download PDF

Info

Publication number
WO2009091140A3
WO2009091140A3 PCT/KR2008/007788 KR2008007788W WO2009091140A3 WO 2009091140 A3 WO2009091140 A3 WO 2009091140A3 KR 2008007788 W KR2008007788 W KR 2008007788W WO 2009091140 A3 WO2009091140 A3 WO 2009091140A3
Authority
WO
WIPO (PCT)
Prior art keywords
abrasive particles
conditioner
abrasive
fixing
fixing frame
Prior art date
Application number
PCT/KR2008/007788
Other languages
French (fr)
Other versions
WO2009091140A2 (en
Inventor
Jung-Soo An
Original Assignee
Ehwa Diamond Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ehwa Diamond Industrial Co., Ltd. filed Critical Ehwa Diamond Industrial Co., Ltd.
Publication of WO2009091140A2 publication Critical patent/WO2009091140A2/en
Publication of WO2009091140A3 publication Critical patent/WO2009091140A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

A CMP pad conditioner is used in global planar izat ion of wafers for high integration of semiconductor devices. The CMP pad conditioner includes a frame fixing abrasive particles to prevent the abrasive particles from being detached from the conditioner, the abrasive particles protruding from the fixing frame at a predetermined height, and a molding material fixing the fixing frame and the abrasive materials to each other. The abrasive particles are placed inside the through-holes, by one abrasive particle in one through-hole, and each of the abrasive particles is partially exposed from the underside surface of the fixing frame. The conditioner can ensure stability of prevent abrasive particles from being detached, realize uniform dressing, excellent dressing efficiency and excellent performance reproducibility, and remarkably remove the probability of scratches.
PCT/KR2008/007788 2008-01-15 2008-12-30 Conditioner for chemical mechanical planarization pad WO2009091140A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0004573 2008-01-15
KR1020080004573A KR20090078647A (en) 2008-01-15 2008-01-15 Conditioner for chemical mechanical planarization pad.

Publications (2)

Publication Number Publication Date
WO2009091140A2 WO2009091140A2 (en) 2009-07-23
WO2009091140A3 true WO2009091140A3 (en) 2009-10-08

Family

ID=40885767

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/007788 WO2009091140A2 (en) 2008-01-15 2008-12-30 Conditioner for chemical mechanical planarization pad

Country Status (2)

Country Link
KR (1) KR20090078647A (en)
WO (1) WO2009091140A2 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013032089A1 (en) * 2011-08-30 2013-03-07 Shinhan Diamond Ind. Co., Ltd. Cmp pad conditioner and method of manufacturing the same
US9242342B2 (en) * 2012-03-14 2016-01-26 Taiwan Semiconductor Manufacturing Company, Ltd. Manufacture and method of making the same
KR101517348B1 (en) 2013-01-07 2015-05-04 주식회사 홍인터내셔날 A dart game apparatus comprising a recording apparatus for recording a dart game
KR101530365B1 (en) * 2013-10-16 2015-06-18 새솔다이아몬드공업 주식회사 Method of manufacturing the polishing pad conditioner
KR101484706B1 (en) * 2014-03-25 2015-01-20 새솔다이아몬드공업 주식회사 Manufacturing method of pad conditioner
KR101558449B1 (en) * 2014-03-25 2015-10-07 새솔다이아몬드공업 주식회사 Manufacturing method of pad conditioner
TWI636854B (en) * 2017-06-12 2018-10-01 中國砂輪企業股份有限公司 Grinding tool and method of fabricating the same
WO2019102312A1 (en) * 2017-11-27 2019-05-31 3M Innovative Properties Company Abrasive article
KR102229135B1 (en) * 2018-11-16 2021-03-18 이화다이아몬드공업 주식회사 CMP pad conditioner with individually attached tips and method for producing the same
KR102608901B1 (en) 2018-12-24 2023-12-01 삼성전자주식회사 Wafer Grinding Wheel
US20210299816A1 (en) * 2020-03-25 2021-09-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp polishing pad with protruding structures having engineered open void space
KR102596862B1 (en) * 2021-07-30 2023-11-02 새솔다이아몬드공업 주식회사 The manufacturing method of the upright diamond conditioner using etching process
KR102610216B1 (en) * 2021-07-30 2023-12-06 새솔다이아몬드공업 주식회사 The manufacturing method of the upright diamond conditioner using the pressing process
KR102610217B1 (en) * 2021-07-30 2023-12-06 새솔다이아몬드공업 주식회사 The manufacturing method of the upright diamond conditioner using plating process
KR20240011952A (en) 2022-07-20 2024-01-29 새솔다이아몬드공업 주식회사 Pad conditioner
DE102022211514A1 (en) 2022-10-31 2024-05-02 Robert Bosch Gesellschaft mit beschränkter Haftung Grinding element, abrasive and method for producing the grinding element and/or the abrasive

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003080457A (en) * 2001-09-07 2003-03-18 Ebara Corp Cutting tool and manufacturing method therefor
JP2004066409A (en) * 2002-08-07 2004-03-04 Mitsubishi Materials Corp Cmp conditioner
JP2005219152A (en) * 2004-02-04 2005-08-18 Ebara Corp Dresser and method of manufacturing the same
JP4000060B2 (en) * 2001-02-21 2007-10-31 スリーエム イノベイティブ プロパティズ カンパニー Abrasive article having optimally oriented abrasive particles and method for producing the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4000060B2 (en) * 2001-02-21 2007-10-31 スリーエム イノベイティブ プロパティズ カンパニー Abrasive article having optimally oriented abrasive particles and method for producing the same
JP2003080457A (en) * 2001-09-07 2003-03-18 Ebara Corp Cutting tool and manufacturing method therefor
JP2004066409A (en) * 2002-08-07 2004-03-04 Mitsubishi Materials Corp Cmp conditioner
JP2005219152A (en) * 2004-02-04 2005-08-18 Ebara Corp Dresser and method of manufacturing the same

Also Published As

Publication number Publication date
KR20090078647A (en) 2009-07-20
WO2009091140A2 (en) 2009-07-23

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