WO2009083148A2 - Matrice-outil permettant de réaliser une microstructure - Google Patents

Matrice-outil permettant de réaliser une microstructure Download PDF

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Publication number
WO2009083148A2
WO2009083148A2 PCT/EP2008/010744 EP2008010744W WO2009083148A2 WO 2009083148 A2 WO2009083148 A2 WO 2009083148A2 EP 2008010744 W EP2008010744 W EP 2008010744W WO 2009083148 A2 WO2009083148 A2 WO 2009083148A2
Authority
WO
WIPO (PCT)
Prior art keywords
embossing
mold
microstructure
foil
master
Prior art date
Application number
PCT/EP2008/010744
Other languages
German (de)
English (en)
Other versions
WO2009083148A3 (fr
Inventor
Lars Hoffmann
Manfred Dotzler
Original Assignee
Giesecke & Devrient Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke & Devrient Gmbh filed Critical Giesecke & Devrient Gmbh
Priority to DE112008003134T priority Critical patent/DE112008003134A5/de
Publication of WO2009083148A2 publication Critical patent/WO2009083148A2/fr
Publication of WO2009083148A3 publication Critical patent/WO2009083148A3/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/14—Security printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/20—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose
    • B42D25/29—Securities; Bank notes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/405—Marking
    • B42D25/425—Marking by deformation, e.g. embossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44B—MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
    • B44B5/00—Machines or apparatus for embossing decorations or marks, e.g. embossing coins
    • B44B5/02—Dies; Accessories
    • B44B5/026—Dies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44B—MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
    • B44B5/00—Machines or apparatus for embossing decorations or marks, e.g. embossing coins
    • B44B5/02—Dies; Accessories
    • B44B5/028—Heated dies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/24—Pressing or stamping ornamental designs on surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/324—Reliefs

Definitions

  • the invention relates to a tool mold for producing a microstructure, a master foil for producing a stamping mold for producing a microstructure and a method for producing a tool mold for producing a microstructure and a method for producing a master foil for producing a stamping mold.
  • the invention further relates to a method for producing a stamping mold for producing a microstructure, to a stamping mold produced by such a method and to a security element having a microstructure and to a method for producing such a security element.
  • Data carriers such as securities and identity documents, or other valuables, such as branded articles, are often provided with security elements for the purpose of protection, which permit a verification of the authenticity of the data carriers and at the same time serve as protection against unauthorized reproduction.
  • the security elements may, for example, be in the form of a security thread embedded in a banknote, a tearing thread for packaging, an applied security strip, a cover sheet for a banknote with a through opening or a self-supporting transfer element, such as a patch for a label after its manufacture is applied to a document of value.
  • Security elements with viewing-angle-dependent effects play a special role in the field of security since they can not be reproduced even with the most modern copiers.
  • the security elements are equipped with microstructures that give the viewer a different image impression at different viewing angles and, for example, depending on the viewing angle. angle of view show a different color or brightness impression and / or another graphic motif.
  • Optically variable security elements with microstructures are described, for example, in the as yet unpublished application PCT / EP2007 / 008953.
  • Moire enlargement arrangements have also recently been used as security elements with microstructures, as described, for example, in the as yet unpublished application PCT / EP2007 / 005200.
  • the object of the present invention is to avoid the disadvantages of the prior art, in particular to provide a mold for producing a microstructure, which can be produced with reasonable technical effort and enables the generation of microstructures with high resolution. It is also an object to specify a master foil for producing a stamping mold, an embossing mold and a security element, each of which has a microstructure with improved resolution compared with the prior art and can be produced with reasonable technical effort.
  • a further object is to specify methods for producing a tool mold, a master foil, a stamping mold and a security element with which the respective products can be produced with reasonable technical complexity and high resolution of the microstructures.
  • the mold for producing a microstructure is characterized in that it comprises a carrier foil and an embossing lacquer arranged on the carrier foil, wherein the surface of the embossing lacquer has an arrangement of elevations and depressions in the form of the desired microstructure, and which Arrangement of elevations and depressions microstructure formed by microstructure tureimplantation having a pitch of 1 micron or more and a structure depth between about 1 micron and about 20 microns are formed.
  • microstructures are understood to mean structures which have an arrangement of elevations and depressions for the formation of microstructure elements, wherein the microstructure tureimplantation are characterized by a structure spacing of 1 micron or more.
  • a pitch also referred to as a feature size of 1 micron or more, z.
  • structure spacing means, for example, the distance between two adjacent lines (microstructure elements) of a microstructure of a tool mold according to the invention.
  • the tool mold according to the invention reflects the surprising finding that microstructures in an embossing lacquer arranged on a carrier foil can be produced with technically justifiable expense and very high resolution.
  • known embossing techniques can be used for the embossing of the microstructures in the embossing lacquer of the mold.
  • the irregularities and irregularities present on the embossing tool intended for embossing, in particular welds, so-called recombination seams between a plurality of embossing tool areas and other imperfections on the surface of the embossing tool, are embossed into the embossing lacquer
  • the damping of unevenness of the embossing tool intended for embossing means that the unevenness is found to a much lesser extent in the embossed lacquer than is the case on the embossing tool reduce a present on the embossing tool weld during molding in the embossing lacquer of the mold according to the invention so much that the molded weld low height / depth represents no or only a minor impairment for the likewise molded microstructure.
  • the attenuation of the unevennesses of the embossing mold in the tool mold according to the invention can be optimized by a suitable choice of parameters so that the microstructures can be produced with the desired resolution in the embossing lacquer and at the same time the transmission of unevenness is largely prevented .
  • adjusting parameters are according to the invention z.
  • the temperature of the embossing tool the strength of the pre-curing of the embossing lacquer and the residence time of the embossing tool on the embossing lacquer available.
  • the tool mold according to the invention with a carrier foil and an embossing lacquer arranged on the carrier foil with elevations and depressions in the form of the desired microstructures introduced into the surface of the embossing lacquer leads to an improvement in the resolution of the microstructures produced or elimination of the abovementioned disadvantages in connection with the tool molds of FIG State of the art.
  • the colorless or colored lacquers required for the microtief printing process already described can be exactly doctored off on the tool mold according to the invention so that the transferred microstructure is very good high resolution can be made.
  • the problems described in connection with known tool molds are avoided by the mechanical loading of the tool mold and the doctor blade by the tool mold according to the invention.
  • microstructure microstructure elements with a pitch of 1 micron or more and a structural depth between about 1 micron and 20 microns, which is a significant improvement in terms of structure spacing and represents the structural depth of known tool shapes.
  • the embossing lacquer according to the invention arranged on the carrier foil is preferably an embossing lacquer which can be crosslinked by radiation, in particular by UV radiation or electron radiation.
  • a thermoplastically deformable embossing lacquer can also be used. Both radiation-crosslinkable and thermoplastically deformable embossing lacquers can be provided with embossments and depressions in the form of the desired microstructures using embossing techniques known per se.
  • the embossing lacquer advantageously has a layer with a thickness of about 1 ⁇ m to about 25 ⁇ m, preferably of 4 ⁇ m to 8 ⁇ m, so that the structure depth required according to the invention for the microstructures can be realized without problem between about 1 ⁇ m and about 20 ⁇ m ,
  • microstructure elements of the microstructure of the tool mold advantageously have a structure depth of 1 ⁇ m to 10 ⁇ m, preferably from 2 ⁇ m to 6 ⁇ m.
  • the microstructured surface of the embossing lacquer is hardened according to a preferred embodiment.
  • the hardened surface thus protects the microstructure elements of the tool mold from mechanical wear, especially abrasion.
  • An abrasion protection is z.
  • a good abrasion protection is achieved for example by a subsequently applied, in particular vapor-deposited layer of TiN.
  • abrasion protection by electrodeposition a metal, in particular of chromium or a metallic compound to achieve.
  • a galvanic impression of the surface of the embossing is first made by a thin metal layer, in particular a nickel, copper, silver or chromium layer, electrically conductive and in the following electroplating bath with a thin layer of z. B. chrome plated.
  • the chromium layer serving as actual abrasion protection advantageously has a layer thickness of from 1 ⁇ m to 20 ⁇ m, more preferably from 2 ⁇ m to 4 ⁇ m.
  • the surface of the embossing lacquer may further be provided with a non-stick coating.
  • a non-stick coating With such a coating, it is advantageous to use a CrN coating.
  • the non-stick coating allows for easy removal of the mold from the carrier or substrate provided by the mold with a microstructure according to the invention.
  • the carrier foil of the tool mold is preferably a plastic foil, in particular a plastic foil of PET, PP, PE, PC, ABS, PVC.
  • the carrier films used here preferably have a thickness of from 5 ⁇ m to about 40 ⁇ m, more preferably from 12 ⁇ m to 23 ⁇ m.
  • the carrier film is web-shaped.
  • the tool shape provided by the web-shaped design of the carrier film has the advantage that it can be rolled up, stored and unwound, for example, in the form of a roll and used to produce microstructure security elements according to the invention.
  • Such a web-shaped tool mold can be used with particular advantage in the gravure printing method described in the application PCT / EP2007 / 005200.
  • the carrier foil of the tool mold (of a suitable size) can also be arranged on a substantially cylindrical body in order to form a stamping cylinder.
  • the carrier foil with the mold may be formed as a (cylindrical) sleeve for use with a tensioning cylinder.
  • the basic operation of a clamping cylinder for clamping cylindrical embossing shapes (sleeves) is z. As described in EP 1 442883 Al, the disclosure of which is included in the present application in this respect.
  • the tool molds arranged on a cylindrical body can advantageously also be used in the microfill printing method described in PCT / EP2007 / 005200.
  • the invention further comprises a method for producing a mold for producing a microstructure, the method being characterized by the steps:
  • the method according to the invention for the production of tool molds has, in comparison with known methods for producing tool molds, in particular the advantages described at the beginning of the tool mold according to the invention.
  • embossing lacquer on the carrier film can be effected by various coating methods known per se from the prior art. In addition to a few printing methods, eg. As gravure printing, flexographic printing, offset printing, all classic methods for film casting and coating process come into question. So the application with z. Roller Coating, Cleavage Coating, Wire Bar Coating, Slot Coating, Dip Coating, Spray Coating, Curtain Coating and Airknife Coating.
  • an embossing lacquer crosslinkable by radiation preferably by UV radiation or electron beam radiation
  • step b an embossing lacquer crosslinkable by radiation, preferably by UV radiation or electron beam radiation
  • hardening of the embossing lacquer by exposure to radiation preferably UV radiation or electron radiation
  • the embossing lacquer after step b) and before step c) is precured by exposure to radiation, preferably with UV radiation.
  • the pre-hardening of the embossing lacquer has the advantage of being able to adjust the attenuation properties of the embossing lacquer described above in relation to unevenness of the surface of the embossing tool to a certain extent.
  • a pre-cure has proven to be suitable in which between about 40% and 100% of the embossing lacquer are pre-cured.
  • step b) a thermoplastically deformable embossing lacquer can be applied and in step d) the embossing lacquer is cured by cooling below the glass transition temperature (glass point) of the embossing lacquer and / or by exposure to radiation, in particular UV radiation or ion radiation.
  • the elevations and depressions in step c) of the method according to the invention are produced by an embossing tool, in particular by an embossing punch, an embossing plate or an embossing cylinder.
  • the temperature of the embossing tool is adjustable.
  • the above-mentioned damping property of the embossing lacquer for unevennesses of the embossing tool can be adjusted to a certain extent via the temperature of the embossing tool.
  • the temperature range of about 100 ° C to 250 0 C, preferably 170 0 C to 190 0 C, is suitable for a stamping tool to introduce the desired microstructures in a thermoplastic embossing lacquer.
  • the embossing lacquer is applied in step b) of the method according to the invention with a layer thickness of about 1 .mu.m to about 25 .mu.m, preferably from 4 .mu.m to 8 .mu.m, on the carrier film and the microstructure elements in step c) with a structural thickness of about 1 .mu.m to 10 .mu.m, preferably from 2 .mu.m to 6 .mu.m produced.
  • the carrier film can advantageously be web-shaped and wound up into a roll in order to provide a rollable, sheet-like mold.
  • the carrier film can also be clamped, glued and / or shrunk onto a substantially cylindrical body in a suitable size.
  • the end regions of the carrier film on the essentially cylindrical body can also be arranged overlapping, without the mold losing its suitability for producing microstructures according to the invention.
  • the overlapping arranged end regions can also be replaced by z. B. cutting away.
  • a filling in particular a radiation-crosslinkable lacquer, can be applied in the mentioned regions according to a preferred embodiment.
  • the carrier film may also be formed as a (cylindrical) sleeve to fix it on a clamping cylinder.
  • the surface of the embossing lacquer can be coated with an abrasion protection layer, for example by a coating with TiN, so-called DLC (Diamond Like Carbon) or metallic chromium.
  • an abrasion protection layer for example by a coating with TiN, so-called DLC (Diamond Like Carbon) or metallic chromium.
  • embossing lacquer with an anti-adhesive coating, such as a CrN coating.
  • the surface coating is advantageously carried out by means of a CVD (Chemical Vapor Deposition), PVD (Physical Vapor Deposition) or sputtering process and / or by means of a process for electrodeposition. It is understood that a surface coating in the event that the carrier film is formed web-shaped and wound into a roll before rolling up. In the case of the arrangement of the carrier film on a substantially cylindrical body, the surface coating, however, can be applied both before and after the arrangement on the cylindrical body on the surface of the embossing lacquer.
  • the invention further comprises a master foil for producing a stamping mold for producing a microstructure, wherein the master foil is characterized by a carrier foil and an embossing lacquer arranged on the carrier foil, wherein the surface of the embossing lacquer has an arrangement of elevations and depressions in the form of the desired microstructure, and wherein the microstructure of the master foil formed by the arrangement of elevations and depressions is formed by microstructure elements having a pitch of 1 ⁇ m or more and a texture depth of between about 1 ⁇ m and about 20 ⁇ m.
  • the master foil according to the invention accordingly has the same features as the tool mold according to the invention.
  • the master film does not directly serve to create a microstructure, but initially to produce a stamping mold with which a microstructure is then produced.
  • the master foil described in the cited document is a metal foil and is referred to as a so-called “master shim” metal foil
  • the "master foil” is always the combina- on a carrier film and arranged on the carrier film and provided with microstructure elements embossing lacquer, as set forth in the independent claim 28.
  • EP 1 369 262 A2 are designed to produce diffraction structures, that is, according to the nomenclature used in the present application, have a structure spacing of less than 1 ⁇ m.
  • the surfaces according to the invention of the master foil have an electrically conductive coating, in particular a metallic coating.
  • a coating which is electrically conductive to a certain extent is a prerequisite for a galvanic deposition of further metal layers.
  • the electrically conductive coating advantageously comprises nickel, silver, chromium, copper or aluminum, very particularly preferably chromium or nickel.
  • the optionally coated carrier film can in turn be advantageously web-shaped or be present in such a size that it can be arranged in a hollow cylinder, in particular in a slotted hollow cylinder, without overlapping.
  • the master film for producing a (seamless) embossing mold after the z. B. in EP 1 369262 A2 Rundgalvanik- method can be used.
  • the invention further comprises a method for producing a master foil for producing a stamping mold, characterized by the following steps:
  • the inventive method for producing the master foil has the advantages described in connection with the method for producing the tool mold or in connection with the master foil, and reference is therefore made to avoid repetition to the corresponding text passages.
  • the preferred process variants according to the dependent claims 40 to 50 have also been substantially explained in connection with the master film according to the invention, for which reason reference is made to the corresponding statements in order to avoid repetition.
  • the surface coatings on the embossing lacquer of the master foil are preferably applied by means of the electrodeposition process.
  • the invention further comprises a method for producing a stamping mold for producing a microstructure, the method being characterized by the following steps:
  • a master sheet according to the invention is used to mold the microstructure of the master sheet into a stamping mold by means of a galvanic process.
  • weld seams or recombi- nation seams also apply to the stamping mold or the microstructures produced in the stamping mold due to the galvanic molding process. That is, unevennesses and irregularities found in embossing dies of the prior art are not or only to a much lesser extent present in the embossing mold.
  • the embossing mold according to the present application thus has the same advantages over stamping molds of the state of the art as the tool mold according to the invention over known tool molds. While both the embossing mold according to the invention and the tool mold according to the invention are used to produce a microstructure of a security element, the essential difference between embossing and tool shape is that the embossing mold was obtained from the master foil by a galvanic molding process, whereas the tool mold according to the invention without the intermediate step via a master foil is used directly for generating a microstructure.
  • the master foil is introduced after step a) into a hollow cylinder slotted in the longitudinal axis direction such that the surface with the microstructures faces the hollow cylinder and two colored side edges of the master foil are adjacent to one another and the width of the slot of the hollow cylinder is reduced until the two side edges of the master foil abut each other.
  • the step of providing the master foil by cutting, in particular by laser beam cutting, of the master foil from a larger, in particular web-shaped master foil takes place.
  • the embossing mold is designed as a self-supporting, seamless sleeve, in particular for use with a clamping cylinder.
  • the self-supporting sleeve can therefore basically be used with a clamping cylinder described, for example, in EP 1 442 883 A1.
  • the surface of the master foil may be provided with a release agent prior to the molding step.
  • the galvanic molding in step d) is carried out by depositing a metal, in particular by depositing chromium, nickel or copper.
  • the above-described two-layer deposition has the advantage that with the first layer the conductivity of the embossing lacquer required for the galvanic impression is provided, while with the second coating a sufficient stability and bendability of the produced embossing mold is ensured.
  • the first layer forms the outer layer of the microstructure of the embossing mold after detachment of the embossing mold from the master film, it can also simultaneously serve as an abrasion protective layer.
  • the embossing molds obtained by the two-layer galvanic impression are accordingly z. B. by a very high Abrasion and scratch resistance and are at the same time sufficiently stable and bendable. Furthermore, such a relatively thin embossing mold can be manufactured faster compared to a likewise conceivable, significantly thicker embossing mold (higher throughput in the case of galvanic deposition). Also, a fixture, z. B. on a cylindrical body, even without welding the end portions of the stamping mold by adhesive or magnetic attachment possible.
  • the embossing mold can in principle also be produced as a web-shaped, flat embossing mold with the process according to the invention.
  • a stamping mold can then be cut to such a size by a cutting method, in particular a laser beam cutting method, that it can be arranged on a substantially cylindrical body without overlapping areas.
  • the embossing mold can be fixed to the substantially cylindrical body, in particular by welding the joints of two end regions of the embossing mold.
  • the embossing mold is fixed to the substantially cylindrical body by gluing, clamping and / or by a magnetic holder.
  • the embossing die mounted on the substantially cylindrical body constitutes an embossing cylinder which can be used to create very high resolution microstructures.
  • the embossing molds produced according to the invention can be used both in web form and in the form of an embossing cylinder described above for the microfill printing process described in the application PCT / EP2007 / 005200.
  • the invention further relates to a stamping mold for producing a microstructure, which is produced by the method according to the invention.
  • the invention also encompasses a method for producing a security element having a microstructure, the method being characterized in that the microstructure is produced with a tool mold according to the invention or with an embossing mold according to the invention.
  • the tool mold or embossing mold is provided such that its surface has an arrangement of elevations and depressions in the form of the desired microstructure
  • the surface of the mold or embossing mold is brought into contact with the carrier, e) cured in contact with the carrier paint in the recesses of the mold or embossing mold, thereby being connected to the carrier, and
  • the invention also includes a security element with a microstructure, which is produced by a method according to the invention.
  • FIG. 1 is a schematic representation of a tool mold according to the invention for producing a microstructure
  • FIG. 2 shows a cross section through the tool mold according to the invention in the region of the line II-II shown in FIG. 1, FIG.
  • FIG. 3 shows a schematic view of a tool mold according to the invention, which is arranged on a cylindrical body for forming an embossing tool
  • 4 shows a cross section through an embossing mold according to the invention which has been formed by galvanic molding on a master foil according to the invention
  • FIG. 5 shows a slotted hollow cylinder with an inventive master foil arranged therein during the galvanization process for forming a stamping mold according to the invention
  • Fig. 6 is a mounted on a clamping cylinder inventive seamless embossing mold
  • FIG. 7 shows an embossing mold according to the invention arranged on a cylinder, in which the two end regions of the embossing mold adjoin one another in an abutment region.
  • FIG. 1 shows a tool mold 1, which consists of a web-shaped carrier film 2 and an embossing lacquer arranged on the carrier film.
  • a tool mold 1 which consists of a web-shaped carrier film 2 and an embossing lacquer arranged on the carrier film.
  • it is a film of PET with a thickness of about 16 microns.
  • the UV-curable embossing lacquer was applied by means of a suitable coating method in a thickness of about 4 microns to 8 microns on the carrier film.
  • microstructures 4 were generated in the embossing lacquer, which consist of a plurality of elevations and depressions in the shape of the desired microstructure.
  • the embossing lacquer was before the embossing of the Microstructures by exposure to radiation, preferably with UV radiation, precured and fully cured after embossing.
  • Another parameter for adjusting the damping properties is the residence time of the embossing tool in the embossing lacquer.
  • a residence time of about 0.1 sec. To 2 sec. Has generally been found suitable for the microstructures of the tool mold according to the invention with good attenuation of the unevennesses of the embossing tool to produce.
  • FIG. 1 a dotted line is further shown in the embossing lacquer, which is a welding or recombining seam which has been shaped into the embossing lacquer 3 of the tool mold 1 by the embossing tool, in particular embossing cylinder, used.
  • the embossing tool in particular embossing cylinder, used.
  • the dotted line 5 is for all irregularities or bumps of the embossing tool, which is ideally not or by the invention to a much lesser extent than in the prior art was possible, are molded into the embossing lacquer of the mold according to the invention.
  • FIG. 2 now shows a cross section through a microstructure 4 of the embossing lacquer 3 of the tool mold 1 along the line II-II.
  • the microstructure 4 is formed from an arrangement of elevations and depressions in the form of the desired microstructure.
  • the microstructure is formed by a large number of microstructure elements, in the present example the microstructure elements coinciding with the elevations 6, which are separated from one another by recesses 7 in the embossing lacquer 3.
  • the structure distance Sa in the present example by the distance between two z. B. is defined as lines formed microstructure elements 6.
  • the structure spacing according to the invention is greater than 1 ⁇ m and in the present example is about 4 ⁇ m.
  • the microstructure elements 6 and the depressions 7 of the microstructure each have a width of approximately 2 ⁇ m.
  • the microstructure shown in FIG. 2 furthermore has microstructure elements 6 with a structure depth St of approximately 4 ⁇ m.
  • the web-shaped tool mold shown in FIG. 1 can now be used directly for producing a microstructure in a deformable substrate, for example, in a deformable substrate.
  • the surface of the embossing lacquer at least in the area of the microstructure.
  • This can be done, for example, by a vapor-deposited layer, for example of TiN, with the vapor deposition preferably being particularly suitable by physical vapor deposition (PVD).
  • PVD physical vapor deposition
  • the surface of the embossing lacquer can also be provided with an abrasion protection layer, which may be, for example, an electrodeposited chromium layer.
  • a thin conductive layer is generally first to be formed on the surface of the embossing lacquer in order to provide the conductivity required for the electrodeposition.
  • chromium layers as abrasion protective layer with a layer thickness of about 2 microns to 4 microns proved sufficient.
  • the microstructure may be further provided with a non-stick coating, for example, to facilitate the detachment of the mold from a microstructure embossed by the mold in an embossing lacquer.
  • the completely finished tool shape can basically be used immediately as a web-shaped tool shape for the production of microstructures. However, it is expedient to first disguise it to a roll in order to provide a rollable, sheet-like tool shape. The present in the form of a roll mold can then be stored until the time when the mold is to be used for the production of microstructures.
  • a web-shaped tool mold according to FIG. 1 can be used as a tool mold for the microtray printing method described in the application PCT / EP2007 / 005200 in order to produce colored or colorless microstructures.
  • the tool mold according to the invention can also be arranged on a body, in particular a substantially cylindrical body, as shown in FIG. 3, according to an alternative embodiment.
  • a body in particular a substantially cylindrical body, as shown in FIG. 3, according to an alternative embodiment.
  • the tool mold 1 can be arranged on the substantially cylindrical body 11, in particular those regions of the web-shaped Mold provided, which lie between the punctured marked impressions 5 of the bumps of a stamping tool (see Fig. 1).
  • the tool shape can be cut to the required size by means of a cutting method, in particular a laser cutting method, and then arranged on the cylinder 11.
  • the tool mold 1 can be clamped, glued and / or shrunk onto the cylinder 11, wherein all fastening measures are known per se to those skilled in the art.
  • the tool shape is not to be brought to the required size by a cutting method, as described above, it is basically also conceivable to arrange the end regions of the carrier film on the cylinder 11 in an overlapping manner, although this is not shown in FIG.
  • the embossing cylinder 12 formed by such a tool mold 1 and the cylinder 11 can be used with a defined running direction.
  • the running direction must be chosen in the direction of the overlap so that a hooking of the substrate to be embossed or a doctor blade is not possible.
  • a filling 10 in the present case, a UV-crosslinkable paint, smoothed.
  • the embossing cylinder 12 formed by the tool mold 1 and the cylinder 11 can now be used as a pressure tool for the production of microstructures, for example in embossable paint. Moreover, it is also possible to use the embossing cylinder 12 as a tool mold in the micro-deep-drawing method described in the application PCT / EP / 2007/005200.
  • the master foil 21 may have the same features and properties as the die mold described with reference to FIGS. 1, 2 and 3. Since the master foil 21 but not directly for the production of microstructures z. B. a security element is used, but as a semi-finished product for producing a stamping mold according to the invention for the production of such microstructures should always be maintained to avoid conceptual ambiguity in the present application, the distinction between mold and master foil.
  • the carrier foil 22 and the embossing lacquer 23 of the master foil reference should be made to the above explanations regarding the corresponding microstructure 4, carrier foil 2 and embossing lacquer 3 of the tool mold 1 ,
  • the master foil 21 has an embossing lacquer 23 arranged on a carrier foil 22 with a multiplicity of elevations 26 and depressions 27, which form a microstructure 24.
  • the microstructural elements have a pitch of about 6 .mu.m, this according to the explanations on the structure distance Sa in Fig. 2 also for the shown in Fig. 4 master foil 21 as a distance between two microstructure elements 26, z. B. two line-shaped elements defined.
  • the structure depth of the microstructure elements 26 is about 6 ⁇ m.
  • the microstructure 24 of the master film 21 is formed by a galvanic process.
  • the galvanic impression requires a conductive layer on the surface of the embossed lacquer 23.
  • a conductive layer in particular metallic coatings of chromium, silver, copper or aluminum into consideration. Chromium is preferred, inter alia, because the chromium layer deposited on the microstructure 24 of the embossing lacquer 23 of the master foil 21 can later serve as the uppermost layer and thus as the abrasion protective layer of an embossing mold according to the invention.
  • a chromium layer 32 was applied in a thickness of about 3 microns. Over the chromium layer 32 was then another metal coating, in the present case a nickel Layer 33, deposited by a galvanic process. The nickel layer 33 later acts as a carrier layer and therefore has a greater layer thickness of about 20 microns to 60 microns. It should be noted that the recesses 27 present in the master foil 21 are later shaped as elevations of the embossing mold 31 and the elevations 26 of the master foil 21 in the embossing mold 31 as depressions. In this respect, unlike in Fig. 4, the metallic coating, in particular the possibly thicker nickel layer 33, fill the entire recesses 27 of the master foil.
  • the microstructure of the embossing mold 31 thus relates to the microstructure of the master foil 21 as a positive structure to a negative structure.
  • the electrodeposited embossing mold 31 can now be detached from the master foil 21 (not shown) and is available as a self-supporting metallic embossing mold.
  • the galvanic impression can, as described with reference to FIG. 4, be made starting from a strip-shaped master foil 21 in order to obtain a likewise web-shaped embossing mold.
  • FIG. 5 An alternative production of the embossing mold is shown in FIG. 5.
  • the master foil is inserted in a suitable size, optionally after cutting a strip-shaped master foil, into a slotted hollow cylinder 40 such that the surface with the microstructures 24 of the master foil 21 faces the hollow cylinder interior, and two remote side edges of the master foil are adjacent to one another.
  • the two side edges of the master foil abut one another in the abutting region 25.
  • the width of the slot 42 of the hollow cylinder 40 is now reduced so far until the two Side edges of the master foil, as shown in Fig. 5, abut flush in the joint area 25.
  • the master foil 21 arranged in the interior of the hollow cylinder 40 according to FIG. 5 is then subjected to a galvanic molding process, as described in connection with FIG. 4. This is symbolized in FIG. 5 by the voltage supply 50.
  • the seamless embossing mold obtained by galvanic molding represents a self-supporting, seamless sleeve and can be used with a cylinder, in particular with a clamping cylinder.
  • FIG. 1 The arrangement of such a seamless embossing mold 31 with microstructures 34 on a clamping cylinder 51 for forming a stamping cylinder 52 is shown in FIG. Further details on the production of a seamless cylindrical embossing mold (sleeve) starting from a master film and for arranging the embossing mold produced on a cylinder to form a stamping cylinder can be found in the application EP 1 369 262 A2.
  • an embossing mold 31 obtained by electroplating may also be obtained other than by the method described with reference to FIGS. 5 and 6.
  • the embossing mold 31, as generally described with reference to FIG. 4 is detached from the master foil 21 and arranged in a suitable size, optionally after cutting, on a substantially cylindrical body.
  • this can be done without overlap on a cylinder 61.
  • the end regions of the embossing mold 31 directly adjoin one another in the abutment region 35.
  • the attachment of the stamping mold can basically by welding, in particular by welding in the joint area 35 done.
  • the embossing mold can be made on the cylindrical body by gluing, clamping and / or by a magnetic holder.
  • the stamping mold 31 is fixed by a magnet holder on the cylinder 61, so that a stamping cylinder 62 is formed with a stamping mold 31 without outer welds.
  • a magnet holder is shown in FIG. 7 in particular possible because the stamping mold 31 is relatively thin and flexible.
  • the embossing molds 31 shown in FIGS. 4, 6 and 7 can also be used to produce microstructures, in particular according to the gravure printing method described in the application PCT / EP2007 / 005200.
  • microstructures produced with the stamping molds of FIGS. 4, 6 and 7 or the tool mold of FIGS. 1, 2 and 3 can advantageously form a security element, which is not shown in more detail and which, in accordance with the concept according to the invention, is characterized in particular by a very high resolution of the molded microstructure and thus allows increased protection against counterfeiting for the objects secured with the security element.

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  • Business, Economics & Management (AREA)
  • Accounting & Taxation (AREA)
  • Finance (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

L'invention concerne une matrice-outil permettant de réaliser une microstructure, laquelle matrice-outil présente une feuille support et un vernis d'estampage placé sur ladite feuille support, la surface du vernis d'estampage présentant un ensemble de saillies et d'évidements qui correspond à la microstructure souhaitée et la microstructure de la matrice-outil, constituée par cet ensemble de saillies et d'évidements, étant constituée par des éléments de microstructure écartés d'1 μm ou plus les uns des autres et d'une profondeur comprise entre environ 1 μm et 20 μm. L'invention concerne également une feuille mère pour la fabrication d'une matrice d'estampage, une matrice d'estampage permettant de réaliser une microstructure, un élément de sécurité pourvu d'une microstructure et des procédés correspondants permettant la fabrication de la matrice-outil, de la feuille mère, de la matrice d'estampage et de l'élément de sécurité.
PCT/EP2008/010744 2007-12-21 2008-12-17 Matrice-outil permettant de réaliser une microstructure WO2009083148A2 (fr)

Priority Applications (1)

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DE112008003134T DE112008003134A5 (de) 2007-12-21 2008-12-17 Werkzeugform zum Erzeugen einer Mikrostruktur

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DE200710062123 DE102007062123A1 (de) 2007-12-21 2007-12-21 Werkzeugform zum Erzeugen einer Mikrostruktur
DE102007062123.1 2007-12-21

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Cited By (4)

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EP3418066A1 (fr) * 2017-06-21 2018-12-26 Giesecke+Devrient Currency Technology GmbH Procédé de fabrication d'un outil d'estampage pour structures détectables de manière tactile
CN111041482A (zh) * 2019-12-25 2020-04-21 苏州涂冠镀膜科技有限公司 一种用于半导体封装模具内腔的复合涂层及其制备方法
CN111065487A (zh) * 2017-09-11 2020-04-24 美国奥拉福有限公司 制造具有多边形光阑的回射器棱镜的方法及其装置
DE102020000104A1 (de) 2020-01-10 2021-07-15 Giesecke+Devrient Currency Technology Gmbh Herstellung eines Prägewerkzeugs und von geprägten Sicherheitselementen

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US11142830B2 (en) 2019-02-08 2021-10-12 The Boeing Company Method of surface micro-texturing with a subtractive agent
US11136673B2 (en) 2019-02-08 2021-10-05 The Boeing Company Method of surface micro-texturing with a subtractive agent
FI4034368T3 (fi) 2019-09-25 2024-02-08 Basf Coatings Gmbh Menetelmä kohokuvioidun rakenteen siirtämiseksi pinnoitteen pinnalle ja kohokuviointimuottina käyttökelpoinen komposiitti
WO2022015465A1 (fr) * 2020-07-16 2022-01-20 Bixby International Corporation Micro-gaufrage
US20240220759A1 (en) * 2023-01-03 2024-07-04 Giesecke+Devrient Mobile Security Gmbh Method of manufacturing a card-shaped data carrier and lamination plate therefor

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2250237A (en) * 1990-11-30 1992-06-03 Folders Galore Ltd Printing
EP1369262A2 (fr) * 2002-06-07 2003-12-10 Giesecke & Devrient GmbH Cylindre d'estampage pour la production des feuilles d'estampage
EP1442883A1 (fr) * 2003-01-31 2004-08-04 Giesecke & Devrient GmbH Cylindre de serrage pour tendre un cliché de gaufrage sur un rouleau de gaufrage
WO2005030472A1 (fr) * 2003-10-01 2005-04-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Outil pour produire une surface microstructuree
WO2005047019A2 (fr) * 2003-11-12 2005-05-26 Leonhard Kurz Gmbh & Co. Kg Poste d'estampage pour un dispositif d'estampage
WO2006005374A1 (fr) * 2004-07-08 2006-01-19 Kronospan Technical Company Ltd. Feuille support pour feuille d'estampage
WO2006087138A1 (fr) * 2005-02-18 2006-08-24 Giesecke & Devrient Gmbh Element de securite et procede de production de cet element
WO2006095161A2 (fr) * 2005-03-10 2006-09-14 De La Rue International Limited Dispositif de securite fonde sur un film a microprisme personnalise
WO2006108611A2 (fr) * 2005-04-13 2006-10-19 Ovd Kinegram Ag Feuille de transfert
WO2008000350A1 (fr) * 2006-06-27 2008-01-03 Giesecke & Devrient Gmbh procédé pour appliquer une microstructure, moule d'outil et objet doté d'une mircrostructure
WO2008049533A2 (fr) * 2006-10-24 2008-05-02 Giesecke & Devrient Gmbh Elément de sécurité transparent doté de microstructures

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2250237A (en) * 1990-11-30 1992-06-03 Folders Galore Ltd Printing
EP1369262A2 (fr) * 2002-06-07 2003-12-10 Giesecke & Devrient GmbH Cylindre d'estampage pour la production des feuilles d'estampage
EP1442883A1 (fr) * 2003-01-31 2004-08-04 Giesecke & Devrient GmbH Cylindre de serrage pour tendre un cliché de gaufrage sur un rouleau de gaufrage
WO2005030472A1 (fr) * 2003-10-01 2005-04-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Outil pour produire une surface microstructuree
WO2005047019A2 (fr) * 2003-11-12 2005-05-26 Leonhard Kurz Gmbh & Co. Kg Poste d'estampage pour un dispositif d'estampage
WO2006005374A1 (fr) * 2004-07-08 2006-01-19 Kronospan Technical Company Ltd. Feuille support pour feuille d'estampage
WO2006087138A1 (fr) * 2005-02-18 2006-08-24 Giesecke & Devrient Gmbh Element de securite et procede de production de cet element
WO2006095161A2 (fr) * 2005-03-10 2006-09-14 De La Rue International Limited Dispositif de securite fonde sur un film a microprisme personnalise
WO2006108611A2 (fr) * 2005-04-13 2006-10-19 Ovd Kinegram Ag Feuille de transfert
WO2008000350A1 (fr) * 2006-06-27 2008-01-03 Giesecke & Devrient Gmbh procédé pour appliquer une microstructure, moule d'outil et objet doté d'une mircrostructure
WO2008049533A2 (fr) * 2006-10-24 2008-05-02 Giesecke & Devrient Gmbh Elément de sécurité transparent doté de microstructures

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3418066A1 (fr) * 2017-06-21 2018-12-26 Giesecke+Devrient Currency Technology GmbH Procédé de fabrication d'un outil d'estampage pour structures détectables de manière tactile
CN111065487A (zh) * 2017-09-11 2020-04-24 美国奥拉福有限公司 制造具有多边形光阑的回射器棱镜的方法及其装置
CN111065487B (zh) * 2017-09-11 2022-08-19 美国奥拉福有限公司 制造具有多边形光阑的回射器棱镜的方法及其装置
CN111041482A (zh) * 2019-12-25 2020-04-21 苏州涂冠镀膜科技有限公司 一种用于半导体封装模具内腔的复合涂层及其制备方法
DE102020000104A1 (de) 2020-01-10 2021-07-15 Giesecke+Devrient Currency Technology Gmbh Herstellung eines Prägewerkzeugs und von geprägten Sicherheitselementen

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DE102007062123A1 (de) 2009-06-25
WO2009083148A3 (fr) 2010-01-21

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