WO2009073165A1 - Echangeur à eau à base de carbone avec échange de chaleur relié pour refroidir des dispositifs électroniques - Google Patents

Echangeur à eau à base de carbone avec échange de chaleur relié pour refroidir des dispositifs électroniques Download PDF

Info

Publication number
WO2009073165A1
WO2009073165A1 PCT/US2008/013265 US2008013265W WO2009073165A1 WO 2009073165 A1 WO2009073165 A1 WO 2009073165A1 US 2008013265 W US2008013265 W US 2008013265W WO 2009073165 A1 WO2009073165 A1 WO 2009073165A1
Authority
WO
WIPO (PCT)
Prior art keywords
coolant
heat
combination
carbon
block
Prior art date
Application number
PCT/US2008/013265
Other languages
English (en)
Inventor
Stanley Robinson
Original Assignee
Waytronx, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Waytronx, Inc. filed Critical Waytronx, Inc.
Publication of WO2009073165A1 publication Critical patent/WO2009073165A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • a cooling device utilizing the thermal transfer characteristics of pyrolytic carbon for enhanced heat removal from a semiconductor.
  • the high thermal conductivity along the X and Y axes of the sheets can be used to expand the initial contact area towards the heat source (heat absorption area) at least in one dimension. That is, the cleavage plane is typically positioned in normal orientation to the chip interface surface whereas optimal conductance is found in any direction within the sheets parallel to the cleavage plane. This orientation allows for expanding the "release" interface surface area for thermal energy depending on the thickness of the carbon interface block.
  • thermal inertia on the release surface, a layer of thermally conductive material is bonded to the carbon block, which also allows for standard processes of machining of any surface increasing structures such as micro or macro channels into the metal layer.
  • the metal layer itself serves as an interface to the liquid coolant that is pumped across its surface.
  • the coolant may then be ducted into a system of pipes that are thermally connected to a cooling fin array.
  • a pump moves the fluid through the channel and pipe system.
  • the entire system may be hermetically sealed, and typically contains a diaphragm to allow for expansion of the fluid as it increases in temperature.
  • a squirrel cage type fan moves air through the fin array to take up heat and dissipate it into the environment.
  • these satellite coolers can then be ported to the coolant and serve for thermal management of additional components such as chipsets, voltage regulators, power supply transistors or even discrete graphics processors.
  • the present invention provides a self-contained cooling system having extreme efficiency.
  • the self contained, hermetically sealed configuration ensures ease of installation, along with a maintenance free use for the lifespan of the cooling device.
  • the efficiency of the cooling performance stems from a variety of features, each of which is important by itself and which, in combination, work synergistically to remove heat from high power density devices and dissipate it at a high rate . into the environment.
  • Pyrolytic carbon has a thermal conductance of approximately 1400 W/m/C along the
  • the pyrolytic carbon interface is oriented with the cleavage plane or planes substantially normal to the front and back faces of the carbon block. The expansion of the back face compared to the front face depends on the thickness of the carbon block used and will typically have a 3: 1 or greater ratio.
  • Pyrolytic carbon has very low thermal capacitance or buffering capability, therefore, fast thermal transients are propagated through the block without much attenuation. In the case of fluid cooling, this can result in boiling of the coolant or else insufficient dissipation into the coolant and either situation can cause transient temperature spikes on the heat source.
  • a buffer in the form of, for example, copper or aluminum to the back face of the carbon block, thereby forming a hybrid interface block.
  • the increased thermal capacitance results in thermal inertia of the hybrid block, which greatly reduces the thermal fluctuations at the heat source.
  • the cooling apparatus disclosed is typically a single, self contained structure that is mounted onto a standard processor, examples being central processing units as currently manufactured by Advanced Micro Devices (AMD) or Intel, or else graphics processors as manufactured by AMD or nVidia.
  • AMD Advanced Micro Devices
  • Intel or else graphics processors as manufactured by AMD or nVidia.
  • Those processors have standard mounting brackets associated with each design to allow interchangeable equipment with original and after market cooling devices.
  • it is a clip that is engaged, alternatively, pegs or screws are commonly employed.
  • a back plate serves to reinforce the printed circuit board in order to avoid flexing of the board caused by the weight of the cooler in situations where the system is transported and possibly subjected to bumps or impacts.
  • a flexible expansion reservoir can be used with unusual advantage.
  • a variation of this type of reservoir is a concave diaphragm that can flip in or out, depending on the pressure of the coolant in the system. Such a flexible diaphragm is easy to manufacture and implement into the wall of any coolant container.
  • the cooler disclosed herein is extremely powerful and scales with size, meaning that any increase of the radiators will increase the amount of heat that can be dissipated into the environment. This allows extension of the cooling apparatus beyond the central processor, and the use of satellite attachments that are ported to the same coolant circulation system to provide thermal management of the voltage regulator modules, the chipset and potentially of discrete graphics as well. None of the mentioned components require any further cooling devices beyond the satellites.
  • centrifugal fan Most coolers currently used employ axial fans, primarily because of high efficiency and low cost. Axial fans, however, are usually noisier than centrifugal fans also known as squirrel cage fans of similar rating. In the case of the cooling device at hand, a further advantage of the centrifugal fan provided is that there is very little back pressure and the air passes through the cooling fins without being redirected. The combination of the centrifugal fan with a radiator surrounding it results in ultra-quiet operation at very high levels of air movements.
  • FIG. 1 shows a schematic drawing of the integrated liquid cooler including the carbon interface with the metal overlay for increased thermal inertia, a pump, water pipes with radiator fins, a centrifugal fan and the diaphragm for thermal expansion compensation;
  • Figure 2 is a tilted top view for illustration of the fan arrangement compared to the radiator fins and water pipes;
  • Figure 3 shows a tilted bottom view for illustration of the carbon block interface
  • Figure 4 shows a functional illustration of the action of a thermal expansion compensation diaphragm
  • Figure 5 schematically shows additional satellite coolers for thermal management of e.g. chipset and voltage regulators connected to the main cooler;
  • Figure 6 shows an alternate heat radiator and liquid cooler configuration
  • Figure 7 is like Figure 6, but shows a remote radiator
  • Figure 8 is a view like Figure 1, showing a modification.
  • a housing 10 defining first and second laterally extending liquid coolant flow chambers 11 and 12, in flow communication via a central passage 13. That passage may be formed by a pump 14 in the housing and operating to pump fluid centrally from chamber 12 to chamber 11, as shown by arrows 15. The flow is directed toward the irregular top surface 16 of a layer 17 to remove or transfer heat from that surface to the coolant flowing in opposite directions in passages 18 and 19 in the housing. From those passages, the coolant flows via pipes 20 and 21 to means indicated generally at 40, such as fins 41 operating to remove heat from the coolant, and to return the coolant via pipe 42 and 43 to upper chamber 12, in a highly compact configuration.
  • Upper wall 22 of chamber 12 comprises a diaphragm peripherally mounted at 23 to the housing ring 10a, so as to allow upward flexing of the diaphragm in response to coolant fluid expansion.
  • a housing cover plate 23' extends over the diaphragm and is attached to housing surface 24, whereby the chambers 11 and 12 and the diaphragm are hermetically sealed.
  • An electrical component 124 engages the underside 25a of pyrolytic carbon block 25 fitted peripherally in the bounded space formed by housing wall 26, layer 17 also peripherally fitting in that space.
  • Heat received by block 25, by conduction from the electrical component, is transferred by conduction to the layer 17 comprising a metal interface block (between water and carbon block 25).
  • Its upper surface has irregularity, as for example is provided by recesses 28 in the layer, that increase the surface area in contact with coolant in chamber 12, for enhanced heat transfer.
  • the planes 30 indicative of molecular cleavage planes in block 25 are directed toward layer 17, for most efficient heat transfer operation.
  • a centrifugal fan 32 is shown as located in the space 33 between banks 41a of fins 41, to displace cooling air radially in passages 41b between fins, for removing heat from the fins.
  • Pyrolytic carbon is a material similar to graphite, but with some covalent bonding between its graphene sheets. Generally it is produced by heating a hydrocarbon nearly to its decomposition temperature, and permitting the graphite to crystallize (pyrolysis).
  • Fig. 5 shows flow ducts 50 and 51 to circulate coolant from 12 to and from a chips at cooler 54; and ducts 55 and 56 to circulate coolant from 22 to and from a voltage regulator cooler 57.
  • Fig. 6 incorporates plate 23 and all the structure of Fig. 1 below that plate.
  • a cover 70 is provided above plate 23 and incorporate passages that connect chamber 12 with a hose or duct 71, and passages 18 and 19 with a hose or duct 72.
  • Hoses or ducts 71 and 72 extend to a heat radiator 73. Fan 32 and fins 41 are eliminated, and the remaining apparatus is simplified.
  • Fig. 7 is like Fig. 6, excepting that the radiator is remotely located, as is made by the breaks at 71a and 72a in the hoses or ducts 71 and 72.
  • Cooling fans 74 may be provided to displace air through the radiator.
  • Fig. 8 the arrangement of elements is generally like that in Fig. 1 , the same numerals being applied to those elements.
  • Carbon block 25 extends directly beneath and in surface to surface contact with block 17. Electrical component 124 engages the underside face of block 25, to transfer heat thereto.
  • Block 17 is in the form of a layer that consists primarily of a material selected from the group that includes aluminum, copper, silver and gold. Carbon block 25 has molecular cleavage planes that extend toward layer 17. The Fig. 8 apparatus is preferred.
  • Additional compactly arranged elements include: - an enclosure 1OA extending about the pump and forming passage 13 through which coolant flow is delivered by the pump 14 toward and against the upper irregular surface of block 17,

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention porte sur un dispositif de refroidissement pour un composant électrique ou des composants électriques, lequel dispositif de refroidissement comprend un système de circulation de liquide de refroidissement, un bloc d'admission de chaleur à base de carbone pour transférer de la chaleur à partir dudit composant électrique ou desdits composants électriques, une couche supérieure sur le bloc de carbone pour augmenter l'inertie thermique durant le transfert de chaleur par l'intermédiaire de ladite couche par le liquide de refroidissement de système, et un moyen par lequel le liquide de refroidissement chauffé transfère de la chaleur à un évacuateur de chaleur.
PCT/US2008/013265 2007-12-03 2008-12-02 Echangeur à eau à base de carbone avec échange de chaleur relié pour refroidir des dispositifs électroniques WO2009073165A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US501207P 2007-12-03 2007-12-03
US61/005,012 2007-12-03

Publications (1)

Publication Number Publication Date
WO2009073165A1 true WO2009073165A1 (fr) 2009-06-11

Family

ID=40674553

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/013265 WO2009073165A1 (fr) 2007-12-03 2008-12-02 Echangeur à eau à base de carbone avec échange de chaleur relié pour refroidir des dispositifs électroniques

Country Status (2)

Country Link
US (1) US20090139698A1 (fr)
WO (1) WO2009073165A1 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9453691B2 (en) * 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
CA2816063A1 (fr) * 2010-10-29 2012-05-03 Baker Hughes Incorporated Particules de diamant a revetement de graphene, compositions et structures intermediaires les incluant et procede de formation de particules de diamants a revetement de graphene et de structures polycristallines compactes
US8840693B2 (en) 2010-10-29 2014-09-23 Baker Hughes Incorporated Coated particles and related methods
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
TWI531795B (zh) 2013-03-15 2016-05-01 水冷系統公司 感測器、多工通信技術及相關系統
US20160108301A1 (en) * 2014-10-16 2016-04-21 Hudson Gencheng Shou High-efficiency coolant for electronic systems
US10415597B2 (en) 2014-10-27 2019-09-17 Coolit Systems, Inc. Fluid heat exchange systems
CN105263301B (zh) * 2015-11-12 2017-12-19 深圳市研派科技有限公司 一种液冷散热系统及其液体散热排
US11452243B2 (en) 2017-10-12 2022-09-20 Coolit Systems, Inc. Cooling system, controllers and methods
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
WO2021229365A1 (fr) 2020-05-11 2021-11-18 Coolit Systems, Inc. Unités de pompage de liquide, et systèmes et procédés associés
US11725886B2 (en) 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020094315A1 (en) * 2001-01-16 2002-07-18 Mengel R. William Pyrolytic conversion of scrap tires to carbon products
US20020146092A1 (en) * 2001-04-09 2002-10-10 Varian Medical Systems, Inc. Dual fluid cooling system for high power x-ray tubes
US20040063312A1 (en) * 2001-03-02 2004-04-01 Tokyo Electron Limited Method and apparatus for active temperature control of susceptors
US20050205241A1 (en) * 2001-09-28 2005-09-22 The Board Of Trustees Of The Leland Stanford Junior University Closed-loop microchannel cooling system
US20070037109A1 (en) * 2005-07-28 2007-02-15 Lange Erik A Self-cooled high-temperature fan apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4072188A (en) * 1975-07-02 1978-02-07 Honeywell Information Systems Inc. Fluid cooling systems for electronic systems
US6075701A (en) * 1999-05-14 2000-06-13 Hughes Electronics Corporation Electronic structure having an embedded pyrolytic graphite heat sink material
US6758263B2 (en) * 2001-12-13 2004-07-06 Advanced Energy Technology Inc. Heat dissipating component using high conducting inserts
US20050175838A1 (en) * 2001-12-26 2005-08-11 Greinke Ronald A. Thermal interface material
US20040052048A1 (en) * 2002-09-13 2004-03-18 Wu Bo Jiu Integrated fluid cooling system for electronic components
KR100766109B1 (ko) * 2004-10-20 2007-10-11 엘지전자 주식회사 방열장치
US7506682B2 (en) * 2005-01-21 2009-03-24 Delphi Technologies, Inc. Liquid cooled thermosiphon for electronic components
US7477517B2 (en) * 2007-01-29 2009-01-13 International Business Machines Corporation Integrated heat spreader and exchanger

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020094315A1 (en) * 2001-01-16 2002-07-18 Mengel R. William Pyrolytic conversion of scrap tires to carbon products
US20040063312A1 (en) * 2001-03-02 2004-04-01 Tokyo Electron Limited Method and apparatus for active temperature control of susceptors
US20020146092A1 (en) * 2001-04-09 2002-10-10 Varian Medical Systems, Inc. Dual fluid cooling system for high power x-ray tubes
US20050205241A1 (en) * 2001-09-28 2005-09-22 The Board Of Trustees Of The Leland Stanford Junior University Closed-loop microchannel cooling system
US20070037109A1 (en) * 2005-07-28 2007-02-15 Lange Erik A Self-cooled high-temperature fan apparatus

Also Published As

Publication number Publication date
US20090139698A1 (en) 2009-06-04

Similar Documents

Publication Publication Date Title
US20090139698A1 (en) Carbon-based waterlock with attached heat-exchanger for cooling of electronic devices
US8934245B2 (en) Heat conveying structure for electronic device
US7327570B2 (en) Fluid cooled integrated circuit module
US8713957B2 (en) Thermoelectric-enhanced, vapor-condenser facilitating immersion-cooling of electronic component(s)
US20080273303A1 (en) Electronic circuit modules cooling
US20080225489A1 (en) Heat spreader with high heat flux and high thermal conductivity
CN1296671C (zh) 传热装置和电子装置
US6658861B1 (en) Cooling of high power density devices by electrically conducting fluids
US8528628B2 (en) Carbon-based apparatus for cooling of electronic devices
CN101179920B (zh) 冷却发热设备的装置和方法
WO2011122332A1 (fr) Refroidisseur à changement de phase et équipement électronique le comprenant
US20130105122A1 (en) Wicking vapor-condenser facilitating immersion-cooling of electronic component(s)
JP2009532871A (ja) 冷却装置
BR102012015581A2 (pt) Dispositivo de resfriamento, módulo de energia e método
EP4190137A1 (fr) Dispositif de refroidissement pour refroidir des composants d'une carte de circuit imprimé
CN110494018B (zh) 一种光模块
US10874034B1 (en) Pump driven liquid cooling module with tower fins
TWM545361U (zh) 氣冷液冷複合式散熱器
US6760222B1 (en) Dissipating heat using a heat conduit
US20080041480A1 (en) Buffering means for water-cooling system
JP5874935B2 (ja) 平板型冷却装置及びその使用方法
WO2005060370A2 (fr) Refroidissement de dispositifs de densite a haute puissance a l'aide de fluides electroconducteurs
Galins et al. Review of cooling solutions for compact electronic devices
JPH08213526A (ja) 回路パック
US20060225870A1 (en) Cooling apparatus, system, and associated method

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08857018

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08857018

Country of ref document: EP

Kind code of ref document: A1