WO2009071313A3 - Substrat für ein led-submount und led-submount - Google Patents

Substrat für ein led-submount und led-submount Download PDF

Info

Publication number
WO2009071313A3
WO2009071313A3 PCT/EP2008/010342 EP2008010342W WO2009071313A3 WO 2009071313 A3 WO2009071313 A3 WO 2009071313A3 EP 2008010342 W EP2008010342 W EP 2008010342W WO 2009071313 A3 WO2009071313 A3 WO 2009071313A3
Authority
WO
WIPO (PCT)
Prior art keywords
led submount
substrate
connection
substrate surface
electric
Prior art date
Application number
PCT/EP2008/010342
Other languages
English (en)
French (fr)
Other versions
WO2009071313A2 (de
Inventor
Jan Marfeld
Steffen Strauss
Original Assignee
Osram Gmbh
Jan Marfeld
Steffen Strauss
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Gmbh, Jan Marfeld, Steffen Strauss filed Critical Osram Gmbh
Priority to EP08856214A priority Critical patent/EP2227826A2/de
Priority to US12/746,535 priority patent/US20100258819A1/en
Priority to CN2008801199104A priority patent/CN101889345B/zh
Publication of WO2009071313A2 publication Critical patent/WO2009071313A2/de
Publication of WO2009071313A3 publication Critical patent/WO2009071313A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)

Abstract

Das Substrat (2) für ein LED-Submount (1) weist mehrere Bestückplätze an seiner Substratoberseite und mehrere Paare aus jeweils einem elektrischen Anodenanschluss (12) und einem elektrischen Kathodenanschluss (13) auf, wobei die Anodenanschlüsse an einem ersten Seitenabschnitt der Substratoberseite angeordnet sind und die Kathodenanschlüsse an einem zweiten Seitenabschnitt der Substratoberseite angeordnet sind, aufweisend mindestens eine Anschlussauf teilungsleiterbahn (14, 15), welche von einem Bestückplatz an mindestens zwei anderen Bestückplätzen vorbei zu einem elektrischen Anschluss führt.
PCT/EP2008/010342 2007-12-07 2008-12-05 Substrat für ein led-submount und led-submount WO2009071313A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP08856214A EP2227826A2 (de) 2007-12-07 2008-12-05 Substrat für ein led-submount und led-submount
US12/746,535 US20100258819A1 (en) 2007-12-07 2008-12-05 Substrate for an led submount, and led submount
CN2008801199104A CN101889345B (zh) 2007-12-07 2008-12-05 用于发光二极管底座的衬底以及发光二极管底座

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007059133.2 2007-12-07
DE102007059133.2A DE102007059133B4 (de) 2007-12-07 2007-12-07 Substrat für ein LED-Submount, LED-Submount und LED-Lichtquelle

Publications (2)

Publication Number Publication Date
WO2009071313A2 WO2009071313A2 (de) 2009-06-11
WO2009071313A3 true WO2009071313A3 (de) 2009-08-13

Family

ID=40428095

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/010342 WO2009071313A2 (de) 2007-12-07 2008-12-05 Substrat für ein led-submount und led-submount

Country Status (5)

Country Link
US (1) US20100258819A1 (de)
EP (1) EP2227826A2 (de)
CN (1) CN101889345B (de)
DE (1) DE102007059133B4 (de)
WO (1) WO2009071313A2 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
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US9666762B2 (en) 2007-10-31 2017-05-30 Cree, Inc. Multi-chip light emitter packages and related methods
US9082921B2 (en) * 2007-10-31 2015-07-14 Cree, Inc. Multi-die LED package
US9172012B2 (en) 2007-10-31 2015-10-27 Cree, Inc. Multi-chip light emitter packages and related methods
US7985970B2 (en) 2009-04-06 2011-07-26 Cree, Inc. High voltage low current surface-emitting LED
US8476668B2 (en) * 2009-04-06 2013-07-02 Cree, Inc. High voltage low current surface emitting LED
US9093293B2 (en) 2009-04-06 2015-07-28 Cree, Inc. High voltage low current surface emitting light emitting diode
US9743521B2 (en) * 2009-09-17 2017-08-22 Philips Lighting Holding B.V. Light-source module and light-emitting device
JP5010716B2 (ja) * 2010-01-29 2012-08-29 株式会社東芝 Ｌｅｄパッケージ
DE102010001893A1 (de) * 2010-02-12 2011-08-18 Osram Gesellschaft mit beschränkter Haftung, 81543 Substrat für ein Leuchtmodul und Leuchtmodul
US20120074432A1 (en) * 2010-09-29 2012-03-29 Amtran Technology Co., Ltd Led package module and manufacturing method thereof
CN103782400A (zh) * 2011-07-25 2014-05-07 克里公司 包括多组发光二极管的单片多结发光装置
US10043960B2 (en) * 2011-11-15 2018-08-07 Cree, Inc. Light emitting diode (LED) packages and related methods
EP2626901A1 (de) 2012-02-10 2013-08-14 Oki Data Corporation Lichtemittierende Halbleitervorrichtung, Bildanzeigevorrichtung, mobiles Endgerät, Blickfeldanzeigevorrichtung, Bildprojektor, Datenhelm und Bilderzeugungsvorrichtung
DE102012219144A1 (de) 2012-10-19 2014-04-24 Osram Gmbh Leuchtvorrichtung mit wenigstens einer halbleiter-lichtquelle
CN203258423U (zh) * 2013-04-11 2013-10-30 深圳市绎立锐光科技开发有限公司 Led单元模组、发光装置以及光源系统
US8928023B1 (en) * 2013-08-08 2015-01-06 Osram Sylvania Inc. Arrangement of solid state light sources and lamp using same
WO2020148113A1 (en) * 2019-01-16 2020-07-23 Lumileds Holding B.V. Lighting device for frequency-modulated emission
EP4182970A1 (de) * 2020-07-15 2023-05-24 Lumileds LLC Led-array-gehäuse mit niedriger z-höhe und tsv-trägerstruktur

Citations (4)

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Publication number Priority date Publication date Assignee Title
US20040188700A1 (en) * 1999-06-23 2004-09-30 Citizen Electronics Co., Ltd. Light emitting diode
US20040208210A1 (en) * 2003-04-01 2004-10-21 Sharp Kabushiki Kaisha Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus
EP1732132A1 (de) * 2005-06-06 2006-12-13 Ching-Fu Tsou Matrixartige modularisierte LED-Struktur und Verfahren zu deren Verpackung
US20070253209A1 (en) * 2006-04-27 2007-11-01 Cree, Inc. Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same

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US5184114A (en) * 1982-11-04 1993-02-02 Integrated Systems Engineering, Inc. Solid state color display system and light emitting diode pixels therefor
JPH1126333A (ja) * 1997-06-27 1999-01-29 Oki Electric Ind Co Ltd 半導体装置及びその情報管理システム
DE10051159C2 (de) 2000-10-16 2002-09-19 Osram Opto Semiconductors Gmbh LED-Modul, z.B. Weißlichtquelle
DE10212495B4 (de) 2002-03-21 2004-02-26 Schulz-Harder, Jürgen, Dr.-Ing. Verfahren zum Herstellen eines Metall-Keramik-Substrats, vorzugsweise eines Kupfer-Keramik-Substrats
US6998594B2 (en) * 2002-06-25 2006-02-14 Koninklijke Philips Electronics N.V. Method for maintaining light characteristics from a multi-chip LED package
JP2004140185A (ja) 2002-10-17 2004-05-13 Matsushita Electric Ind Co Ltd 発光装置
JP4048164B2 (ja) 2003-01-10 2008-02-13 シャープ株式会社 発光装置
US6995355B2 (en) 2003-06-23 2006-02-07 Advanced Optical Technologies, Llc Optical integrating chamber lighting using multiple color sources
JP2005203200A (ja) 2004-01-14 2005-07-28 Seisai Kagi Kofun Yugenkoshi 発光ダイオードを用いた光源装置
TWI244535B (en) * 2004-03-24 2005-12-01 Yuan Lin A full color and flexible illuminating strap device
KR100663906B1 (ko) * 2005-03-14 2007-01-02 서울반도체 주식회사 발광 장치
US8622578B2 (en) * 2005-03-30 2014-01-07 Koninklijke Philips N.V. Flexible LED array
JP2006294898A (ja) 2005-04-12 2006-10-26 Sumitomo Metal Electronics Devices Inc 発光素子収納用パッケージ
US7230222B2 (en) * 2005-08-15 2007-06-12 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Calibrated LED light module
JP4805026B2 (ja) 2006-05-29 2011-11-02 シャープ株式会社 発光装置、表示装置及び発光装置の制御方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040188700A1 (en) * 1999-06-23 2004-09-30 Citizen Electronics Co., Ltd. Light emitting diode
US20040208210A1 (en) * 2003-04-01 2004-10-21 Sharp Kabushiki Kaisha Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus
EP1732132A1 (de) * 2005-06-06 2006-12-13 Ching-Fu Tsou Matrixartige modularisierte LED-Struktur und Verfahren zu deren Verpackung
US20070253209A1 (en) * 2006-04-27 2007-11-01 Cree, Inc. Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same

Also Published As

Publication number Publication date
CN101889345A (zh) 2010-11-17
DE102007059133B4 (de) 2023-04-06
WO2009071313A2 (de) 2009-06-11
DE102007059133A1 (de) 2009-06-10
CN101889345B (zh) 2012-06-13
US20100258819A1 (en) 2010-10-14
EP2227826A2 (de) 2010-09-15

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