WO2009071159A3 - Thermodenvorrichtung - Google Patents

Thermodenvorrichtung Download PDF

Info

Publication number
WO2009071159A3
WO2009071159A3 PCT/EP2008/009174 EP2008009174W WO2009071159A3 WO 2009071159 A3 WO2009071159 A3 WO 2009071159A3 EP 2008009174 W EP2008009174 W EP 2008009174W WO 2009071159 A3 WO2009071159 A3 WO 2009071159A3
Authority
WO
WIPO (PCT)
Prior art keywords
moved
pivoting
thermode device
arm
thermode
Prior art date
Application number
PCT/EP2008/009174
Other languages
English (en)
French (fr)
Other versions
WO2009071159A2 (de
Inventor
Thomas Boettger
Stephan Martin
Original Assignee
Datacon Technology Gmbh
Thomas Boettger
Stephan Martin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Datacon Technology Gmbh, Thomas Boettger, Stephan Martin filed Critical Datacon Technology Gmbh
Publication of WO2009071159A2 publication Critical patent/WO2009071159A2/de
Publication of WO2009071159A3 publication Critical patent/WO2009071159A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/90—Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connecting Device With Holders (AREA)

Abstract

Eine Thermodenvorrichtung zum Verbinden von elektronischen Bauelementen, insbesondere Halbleiterbauelementen, mit einem Substrat (11) unter Aufbringung von Druck und Temperatur weist zwei Druckstempel (3, 5) auf, von denen mindestens einer an einem als zangenartig bewegbarer Schwenkarm ausgebildeten Tragarm (2) befestigt und durch eine Schwenkbewegung des Schwenkarms relativ zum gegenüberliegenden Druckstempel (5) bewegbar ist.
PCT/EP2008/009174 2007-12-06 2008-10-30 Thermodenvorrichtung WO2009071159A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007058802A DE102007058802B3 (de) 2007-12-06 2007-12-06 Thermodenvorrichtung
DE102007058802.1 2007-12-06

Publications (2)

Publication Number Publication Date
WO2009071159A2 WO2009071159A2 (de) 2009-06-11
WO2009071159A3 true WO2009071159A3 (de) 2009-08-13

Family

ID=40344925

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/009174 WO2009071159A2 (de) 2007-12-06 2008-10-30 Thermodenvorrichtung

Country Status (2)

Country Link
DE (1) DE102007058802B3 (de)
WO (1) WO2009071159A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010024523B4 (de) 2010-06-21 2017-03-23 Leonhard Kurz Stiftung & Co. Kg Mehrschichtiges Folienelement
DE102015006981B4 (de) * 2015-05-29 2018-09-27 Mühlbauer Gmbh & Co. Kg Thermokompressionsvorrichtung und Verfahren zum Verbinden von elektrischen Bauteilen mit einem Substrat

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3628716A (en) * 1968-02-16 1971-12-21 Philips Corp Ultrasonic welding device with a suction rod for treating microsemiconductor blocks
JPS63200541A (ja) * 1987-02-17 1988-08-18 Toshiba Corp ボンデイングツ−ルの傾き調整機構
EP0424061A2 (de) * 1989-10-16 1991-04-24 Xerox Corporation Herstellungsverfahren von langen Matrizen aus kurzen Bauelementen
US5169050A (en) * 1991-06-03 1992-12-08 General Scanning, Inc. Wire bonder with improved actuator
US5439161A (en) * 1993-09-08 1995-08-08 Sony Corporation Thermocompression bonding apparatus, thermocompression bonding method and process of manufacturing liquid crystal display device
JP2003197686A (ja) * 2001-10-18 2003-07-11 Nec Corp 電子部品実装装置及び電子部品実装方法
US20040261261A1 (en) * 2003-06-27 2004-12-30 International Business Machines Corporation Flexible die removal device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3941297A (en) * 1975-06-02 1976-03-02 Western Electric Company, Inc. Method and apparatus for simultaneously bonding a plurality of lead frames to a plurality of planar articles
US4013209A (en) * 1976-03-24 1977-03-22 Angelucci Thomas L High force flexible lead bonding apparatus
DE4119401C2 (de) * 1991-06-10 1998-07-23 Finetech Ges Fuer Elektronik T Vorrichtung zum Bestücken eines Schaltungsträgers mit elektronischen Bauelementen
US5150827A (en) * 1991-11-22 1992-09-29 Hughes Aircraft Company Self-leveling reflow solder head with double pivot
DE19524475C1 (de) * 1995-07-10 1996-11-14 Fraunhofer Ges Forschung Optische Zentriervorrichtung zum lagegenauen Bestücken eines Bauelements in Oberflächenmontagetechnik sowie deren Verwendung zur Montage von Laserdioden
ATE361549T1 (de) * 1997-12-07 2007-05-15 Oerlikon Assembly Equipment Ag Halbleiter-montageeinrichtung mit einem hin und her geführten chipgreifer

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3628716A (en) * 1968-02-16 1971-12-21 Philips Corp Ultrasonic welding device with a suction rod for treating microsemiconductor blocks
JPS63200541A (ja) * 1987-02-17 1988-08-18 Toshiba Corp ボンデイングツ−ルの傾き調整機構
EP0424061A2 (de) * 1989-10-16 1991-04-24 Xerox Corporation Herstellungsverfahren von langen Matrizen aus kurzen Bauelementen
US5169050A (en) * 1991-06-03 1992-12-08 General Scanning, Inc. Wire bonder with improved actuator
US5439161A (en) * 1993-09-08 1995-08-08 Sony Corporation Thermocompression bonding apparatus, thermocompression bonding method and process of manufacturing liquid crystal display device
JP2003197686A (ja) * 2001-10-18 2003-07-11 Nec Corp 電子部品実装装置及び電子部品実装方法
US20040261261A1 (en) * 2003-06-27 2004-12-30 International Business Machines Corporation Flexible die removal device

Also Published As

Publication number Publication date
WO2009071159A2 (de) 2009-06-11
DE102007058802B3 (de) 2009-06-10

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