WO2009069204A1 - 誘電体バリア放電装置 - Google Patents

誘電体バリア放電装置 Download PDF

Info

Publication number
WO2009069204A1
WO2009069204A1 PCT/JP2007/072962 JP2007072962W WO2009069204A1 WO 2009069204 A1 WO2009069204 A1 WO 2009069204A1 JP 2007072962 W JP2007072962 W JP 2007072962W WO 2009069204 A1 WO2009069204 A1 WO 2009069204A1
Authority
WO
WIPO (PCT)
Prior art keywords
gas
dielectric
discharging device
dielectric barrier
shielded
Prior art date
Application number
PCT/JP2007/072962
Other languages
English (en)
French (fr)
Inventor
Yoichiro Tabata
Kensuke Watanabe
Akio Yoshida
Original Assignee
Toshiba Mitsubishi-Electric Industrial Systems Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Mitsubishi-Electric Industrial Systems Corporation filed Critical Toshiba Mitsubishi-Electric Industrial Systems Corporation
Priority to JP2009543609A priority Critical patent/JP5088375B2/ja
Priority to PCT/JP2007/072962 priority patent/WO2009069204A1/ja
Publication of WO2009069204A1 publication Critical patent/WO2009069204A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H01J37/32825—Working under atmospheric pressure or higher
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32348—Dielectric barrier discharge

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

　エッチング処理／クリーニング処理において、原料ガス及び活性化ガスによる内部部材の腐食を確実に防止することができ、長寿命で信頼性の高い誘電体バリア放電装置を提供する。このため、平板状の接地電極と高圧電極との間に誘電体を配置するとともに、この誘電体と接地電極との間に、四方がガスシールドされた放電空間部を形成するスペーサを配置する。そして、放電セルを覆う発生器カバーの内部空間に対してガスシールドされるように、原料ガス供給部と活性化ガス排出部とを設置する。また、上記内部空間に、原料ガスとは異なるパージガスを供給する。
PCT/JP2007/072962 2007-11-28 2007-11-28 誘電体バリア放電装置 WO2009069204A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009543609A JP5088375B2 (ja) 2007-11-28 2007-11-28 誘電体バリア放電装置
PCT/JP2007/072962 WO2009069204A1 (ja) 2007-11-28 2007-11-28 誘電体バリア放電装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/072962 WO2009069204A1 (ja) 2007-11-28 2007-11-28 誘電体バリア放電装置

Publications (1)

Publication Number Publication Date
WO2009069204A1 true WO2009069204A1 (ja) 2009-06-04

Family

ID=40678121

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/072962 WO2009069204A1 (ja) 2007-11-28 2007-11-28 誘電体バリア放電装置

Country Status (2)

Country Link
JP (1) JP5088375B2 (ja)
WO (1) WO2009069204A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012002478A1 (ja) * 2010-06-30 2012-01-05 国立大学法人名古屋大学 反応種供給装置および表面等処理装置
CN103442509A (zh) * 2013-08-24 2013-12-11 大连海事大学 一种往复式多电离腔大气压非平衡等离子体反应器
JP2015522901A (ja) * 2012-05-04 2015-08-06 ラインハウゼン プラズマ ゲーエムベーハー プラズマ発生機
WO2019138456A1 (ja) * 2018-01-10 2019-07-18 東芝三菱電機産業システム株式会社 活性ガス生成装置
EP3407684A4 (en) * 2016-01-18 2019-08-21 Toshiba Mitsubishi-Electric Industrial Systems Corporation AN ACTIVATED GAS GENERATION DEVICE AND A FILM FORMATION PROCESSING DEVICE
WO2021181879A1 (ja) * 2020-03-13 2021-09-16 ウシオ電機株式会社 誘電体バリア式プラズマ発生装置、及び、誘電体バリア式プラズマ発生装置のプラズマ放電開始方法
WO2023037583A1 (ja) * 2021-09-10 2023-03-16 ウシオ電機株式会社 誘電体バリア放電式プラズマ発生装置
JP7448625B2 (ja) 2016-01-13 2024-03-12 エムケイエス インストゥルメンツ， インコーポレイテッド ポンピング・ラインでの堆積クリーニングのための方法及び装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6651652B2 (ja) * 2016-12-05 2020-02-19 東芝三菱電機産業システム株式会社 活性ガス生成装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10212106A (ja) * 1997-01-28 1998-08-11 Nippon Alum Co Ltd オゾン発生器
JPH11345772A (ja) * 1998-06-01 1999-12-14 Sony Corp 化学気相蒸着装置および半導体装置の汚染防止方法
JP3513134B2 (ja) * 2001-11-22 2004-03-31 三菱電機株式会社 オゾン発生器
JP3607890B2 (ja) * 2001-11-22 2005-01-05 東芝三菱電機産業システム株式会社 オゾン発生器
JP2005076063A (ja) * 2003-08-29 2005-03-24 Konica Minolta Opto Inc プラズマ放電処理装置、プラズマ放電処理方法及びそれを用いて薄膜形成された光学フィルム
JP3641608B2 (ja) * 2001-11-22 2005-04-27 東芝三菱電機産業システム株式会社 オゾン発生器

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10212106A (ja) * 1997-01-28 1998-08-11 Nippon Alum Co Ltd オゾン発生器
JPH11345772A (ja) * 1998-06-01 1999-12-14 Sony Corp 化学気相蒸着装置および半導体装置の汚染防止方法
JP3513134B2 (ja) * 2001-11-22 2004-03-31 三菱電機株式会社 オゾン発生器
JP3607890B2 (ja) * 2001-11-22 2005-01-05 東芝三菱電機産業システム株式会社 オゾン発生器
JP3641608B2 (ja) * 2001-11-22 2005-04-27 東芝三菱電機産業システム株式会社 オゾン発生器
JP2005076063A (ja) * 2003-08-29 2005-03-24 Konica Minolta Opto Inc プラズマ放電処理装置、プラズマ放電処理方法及びそれを用いて薄膜形成された光学フィルム

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012002478A1 (ja) * 2010-06-30 2012-01-05 国立大学法人名古屋大学 反応種供給装置および表面等処理装置
JP2012014926A (ja) * 2010-06-30 2012-01-19 Nagoya Univ 反応種供給装置および表面等処理装置
CN103120031A (zh) * 2010-06-30 2013-05-22 富士机械制造株式会社 活性种供给装置以及表面等处理装置
US9713241B2 (en) 2010-06-30 2017-07-18 Fuji Machine Mfg. Co., Ltd. Reactive-species supply device and surface treatment apparatus
JP2015522901A (ja) * 2012-05-04 2015-08-06 ラインハウゼン プラズマ ゲーエムベーハー プラズマ発生機
CN103442509A (zh) * 2013-08-24 2013-12-11 大连海事大学 一种往复式多电离腔大气压非平衡等离子体反应器
JP7448625B2 (ja) 2016-01-13 2024-03-12 エムケイエス インストゥルメンツ， インコーポレイテッド ポンピング・ラインでの堆積クリーニングのための方法及び装置
US10793953B2 (en) 2016-01-18 2020-10-06 Toshiba Mitsubishi-Electric Industrial Systems Corporation Activated gas generation apparatus and film-formation treatment apparatus
EP3407684A4 (en) * 2016-01-18 2019-08-21 Toshiba Mitsubishi-Electric Industrial Systems Corporation AN ACTIVATED GAS GENERATION DEVICE AND A FILM FORMATION PROCESSING DEVICE
JPWO2019138456A1 (ja) * 2018-01-10 2020-10-01 東芝三菱電機産業システム株式会社 活性ガス生成装置
WO2019138456A1 (ja) * 2018-01-10 2019-07-18 東芝三菱電機産業システム株式会社 活性ガス生成装置
WO2021181879A1 (ja) * 2020-03-13 2021-09-16 ウシオ電機株式会社 誘電体バリア式プラズマ発生装置、及び、誘電体バリア式プラズマ発生装置のプラズマ放電開始方法
JP2021144890A (ja) * 2020-03-13 2021-09-24 ウシオ電機株式会社 誘電体バリア式プラズマ発生装置、及び、誘電体バリア式プラズマ発生装置のプラズマ放電開始方法
JP7351245B2 (ja) 2020-03-13 2023-09-27 ウシオ電機株式会社 誘電体バリア式プラズマ発生装置、及び、誘電体バリア式プラズマ発生装置のプラズマ放電開始方法
WO2023037583A1 (ja) * 2021-09-10 2023-03-16 ウシオ電機株式会社 誘電体バリア放電式プラズマ発生装置

Also Published As

Publication number Publication date
JP5088375B2 (ja) 2012-12-05
JPWO2009069204A1 (ja) 2011-04-07

Similar Documents

Publication Publication Date Title
WO2009069204A1 (ja) 誘電体バリア放電装置
WO2008117832A1 (ja) 真空処理装置
WO2010039883A3 (en) Multi-electrode pecvd source
GB2453886A (en) Buried circumferential electrode microcavity plasma device arrays, electrical interconnects, and formation method
WO2010088685A3 (en) Capacitors using preformed electrode
WO2010071785A3 (en) Plasma confinement structures in plasma processing systems
WO2009054671A3 (en) Capacitively coupled plasma reactor
WO2012033922A3 (en) High conductivity electrostatic chuck
TWI348334B (en) Plasma reactor overhead source power electrode with low arcing tendency, cylindrical gas outlets and shaped surface
WO2010011057A3 (ko) 반도체 발광소자 및 그 제조방법
WO2007095388A3 (en) Plasma processing reactor with multiple capacitive and inductive power sources
TW200705497A (en) Arc suppression arrangement
MX346478B (es) Disposicion de electrodos para una descarga de gas con barrera dielectrica.
WO2009104868A3 (en) Deodorization device of cooking apparatus and cooking apparatus including the deodorization device
GB201110117D0 (en) method and device for manufacturing a barrie layer on a flexible substrate
WO2010081151A3 (en) Memory cell having dielectric memory element
WO2013009661A3 (en) Overvoltage protection component
MX2015007911A (es) Dispositivo para proporcionar un flujo de plasma.
ATE550816T1 (de) Vorrichtung und modul zum schutz vor blitzen und überspannungen
WO2011080679A3 (en) Dielectric barrier discharge lamp
WO2012126992A3 (en) Measuring device and method for the detection of an approach to a hand -held device
WO2007087285A3 (en) Addressable microplasma devices and arrays with buried electrodes in ceramic
MX2010002320A (es) Elemento de descarga con electrodo de control de descarga y el circuito de control para lo anterior.
SI2532060T1 (sl) Odvodnik toka strele rogljatega iskrila z deionizacijsko komoro
WO2012031963A3 (de) Widerstandsbauelement und verfahren zur herstellung eines widerstandsbauelements

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07832684

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009543609

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 07832684

Country of ref document: EP

Kind code of ref document: A1