WO2009063764A1 - Copper foil including resistive film layer - Google Patents
Copper foil including resistive film layer Download PDFInfo
- Publication number
- WO2009063764A1 WO2009063764A1 PCT/JP2008/070006 JP2008070006W WO2009063764A1 WO 2009063764 A1 WO2009063764 A1 WO 2009063764A1 JP 2008070006 W JP2008070006 W JP 2008070006W WO 2009063764 A1 WO2009063764 A1 WO 2009063764A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- copper foil
- film layer
- resistive film
- layer
- copper
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/321—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
- C23C28/3455—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer with a refractory ceramic layer, e.g. refractory metal oxide, ZrO2, rare earth oxides or a thermal barrier system comprising at least one refractory oxide layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009503343A JP4460026B2 (en) | 2007-11-14 | 2008-11-04 | Copper foil with resistive film layer |
KR1020107001751A KR101188146B1 (en) | 2007-11-14 | 2008-11-04 | Copper foil including resistive film layer |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-295117 | 2007-11-14 | ||
JP2007295117 | 2007-11-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009063764A1 true WO2009063764A1 (en) | 2009-05-22 |
Family
ID=40638616
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/070006 WO2009063764A1 (en) | 2007-11-14 | 2008-11-04 | Copper foil including resistive film layer |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4460026B2 (en) |
KR (2) | KR20120084784A (en) |
TW (1) | TWI443226B (en) |
WO (1) | WO2009063764A1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012132593A1 (en) * | 2011-03-31 | 2012-10-04 | Jx日鉱日石金属株式会社 | Metal foil provided with electrically resistive layer, and board for printed circuit using said metal foil |
WO2012132592A1 (en) * | 2011-03-28 | 2012-10-04 | Jx日鉱日石金属株式会社 | Metal foil provided with electrically resistive film, and method for producing same |
JP2013004236A (en) * | 2011-06-14 | 2013-01-07 | Dainippon Printing Co Ltd | Conductive base material for forming wring pattern of current collection sheet for solar cell |
JP2014146544A (en) * | 2013-01-30 | 2014-08-14 | Hitachi Metals Ltd | Conductor for high speed transmission cable, method for producing the same, and high speed transmission cable |
US9666746B2 (en) | 2011-06-14 | 2017-05-30 | Dai Nippon Printing Co., Ltd. | Conductive base for forming wiring pattern of collector sheet for solar cells, and method for producing collector sheet for solar cells |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9138964B2 (en) | 2010-11-22 | 2015-09-22 | Mitsui Mining & Smelting Co., Ltd | Surface-treated copper foil |
TWI596220B (en) * | 2012-05-22 | 2017-08-21 | 三井金屬鑛業股份有限公司 | Copper film, negative electrode collector and negative electrode material of nonaqueous secondary cell |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5925297A (en) * | 1982-08-03 | 1984-02-09 | 日本電解株式会社 | Copper foil for printed circuit |
JPH07233497A (en) * | 1994-02-24 | 1995-09-05 | Nippon Denkai Kk | Non-cyan copper-zinc electroplating bath, surface treatment of copper foil for printed circuit board using the bath, and the copper foil for printed circuit board |
JP2002319407A (en) * | 2001-04-23 | 2002-10-31 | Sanyo Electric Co Ltd | Lithium secondary battery electrode and lithium secondary battery |
JP3452557B2 (en) * | 2000-07-31 | 2003-09-29 | グールド エレクトロニクス インコーポレイテッド | Method of forming resistive material on copper layer used in printed circuit board and sheet material |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6489034B1 (en) * | 2000-02-08 | 2002-12-03 | Gould Electronics Inc. | Method of forming chromium coated copper for printed circuit boards |
-
2008
- 2008-11-04 WO PCT/JP2008/070006 patent/WO2009063764A1/en active Application Filing
- 2008-11-04 JP JP2009503343A patent/JP4460026B2/en active Active
- 2008-11-04 KR KR1020127015060A patent/KR20120084784A/en not_active Application Discontinuation
- 2008-11-04 KR KR1020107001751A patent/KR101188146B1/en active IP Right Grant
- 2008-11-10 TW TW097143314A patent/TWI443226B/en active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5925297A (en) * | 1982-08-03 | 1984-02-09 | 日本電解株式会社 | Copper foil for printed circuit |
JPH07233497A (en) * | 1994-02-24 | 1995-09-05 | Nippon Denkai Kk | Non-cyan copper-zinc electroplating bath, surface treatment of copper foil for printed circuit board using the bath, and the copper foil for printed circuit board |
JP3452557B2 (en) * | 2000-07-31 | 2003-09-29 | グールド エレクトロニクス インコーポレイテッド | Method of forming resistive material on copper layer used in printed circuit board and sheet material |
JP2002319407A (en) * | 2001-04-23 | 2002-10-31 | Sanyo Electric Co Ltd | Lithium secondary battery electrode and lithium secondary battery |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012132592A1 (en) * | 2011-03-28 | 2012-10-04 | Jx日鉱日石金属株式会社 | Metal foil provided with electrically resistive film, and method for producing same |
JP5346408B2 (en) * | 2011-03-28 | 2013-11-20 | Jx日鉱日石金属株式会社 | Metal foil provided with electric resistance film and method for manufacturing the same |
CN103429788A (en) * | 2011-03-28 | 2013-12-04 | 吉坤日矿日石金属株式会社 | Metal foil provided with electrically resistive film, and method for producing same |
WO2012132593A1 (en) * | 2011-03-31 | 2012-10-04 | Jx日鉱日石金属株式会社 | Metal foil provided with electrically resistive layer, and board for printed circuit using said metal foil |
US20140041910A1 (en) * | 2011-03-31 | 2014-02-13 | Jx Nippon Mining & Metals Corporation | Metal Foil Provided with Electrically Resistive Layer, and Board for Printed Circuit Using Said Metal Foil |
US9578739B2 (en) | 2011-03-31 | 2017-02-21 | Jx Nippon Mining & Metals Corporation | Metal foil provided with electrically resistive layer, and board for printed circuit using said metal foil |
JP2013004236A (en) * | 2011-06-14 | 2013-01-07 | Dainippon Printing Co Ltd | Conductive base material for forming wring pattern of current collection sheet for solar cell |
US9666746B2 (en) | 2011-06-14 | 2017-05-30 | Dai Nippon Printing Co., Ltd. | Conductive base for forming wiring pattern of collector sheet for solar cells, and method for producing collector sheet for solar cells |
JP2014146544A (en) * | 2013-01-30 | 2014-08-14 | Hitachi Metals Ltd | Conductor for high speed transmission cable, method for producing the same, and high speed transmission cable |
Also Published As
Publication number | Publication date |
---|---|
TWI443226B (en) | 2014-07-01 |
JPWO2009063764A1 (en) | 2011-03-31 |
KR20120084784A (en) | 2012-07-30 |
KR101188146B1 (en) | 2012-10-05 |
JP4460026B2 (en) | 2010-05-12 |
TW200927993A (en) | 2009-07-01 |
KR20100030654A (en) | 2010-03-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2009063764A1 (en) | Copper foil including resistive film layer | |
WO2009057707A1 (en) | Tin-plated material for electronic part | |
TW200746204A (en) | Material for electric contact and method of producing the same | |
WO2008108255A1 (en) | Transparent conductive film with adhesive layer and method for producing the same | |
HK1109493A1 (en) | Transparent conductive multilayer body and transparent touch panel | |
TW200920589A (en) | Mold release film | |
WO2009069086A3 (en) | Composite materials including an intrinsically conducting polymer, and methods and devices | |
TW200604001A (en) | Surface treated copper foil, flexible copper-clad laminated manufactured using the same, and film carrier tape | |
TW200616143A (en) | Atomic layer deposited tantalum containing adhesion layer | |
WO2008053109A3 (en) | High electric conductivity transparent layer with a metallic grid having an optimised electrochemical resistance | |
WO2006088709A3 (en) | Thin film resistors with current density enhancing layer (cdel) | |
EP1990020A3 (en) | Temperature monitoring return electrode | |
WO2008084858A1 (en) | Electrical contact member, method for producing the same, and electrical contact | |
MY139858A (en) | Fishing component | |
WO2008123259A1 (en) | Silver-coated material for movable contact component and method for manufacturing such silver-coated material | |
EP1950036A4 (en) | Matte multilayer polyester film | |
WO2008087972A1 (en) | Insulating resin sheet multilayer body, multilayer printed wiring board obtained by laminating the insulating resin sheet multilayer bodies | |
EP1462925A3 (en) | Resistive touch screen with variable resistivity layer | |
UA90699C2 (en) | multilayered board | |
EP1180917A3 (en) | Copper-alloy foil to be used for laminate sheet | |
EP2412520A4 (en) | Metal foil with electric resistance film and production method therefor | |
WO2006083997A3 (en) | Water resistant switch mat having activation across its entire surface | |
EP1191550A3 (en) | Resistor component with multiple layers of resistive material | |
TW200706365A (en) | Polyimide thin film, polyimide metal laminate and method of manufacturing thereof | |
WO2008099596A1 (en) | Interlayer insulating film having carrier material, and multilayer printed circuit board using the interlayer insulating film |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ENP | Entry into the national phase |
Ref document number: 2009503343 Country of ref document: JP Kind code of ref document: A |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08850954 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20107001751 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 08850954 Country of ref document: EP Kind code of ref document: A1 |