WO2009060755A1 - Process for producing intermediate structure and inspection apparatus - Google Patents

Process for producing intermediate structure and inspection apparatus Download PDF

Info

Publication number
WO2009060755A1
WO2009060755A1 PCT/JP2008/069516 JP2008069516W WO2009060755A1 WO 2009060755 A1 WO2009060755 A1 WO 2009060755A1 JP 2008069516 W JP2008069516 W JP 2008069516W WO 2009060755 A1 WO2009060755 A1 WO 2009060755A1
Authority
WO
WIPO (PCT)
Prior art keywords
glass substrate
pins
board
electroconductive
vessel
Prior art date
Application number
PCT/JP2008/069516
Other languages
French (fr)
Japanese (ja)
Inventor
Shigekazu Komatsu
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Publication of WO2009060755A1 publication Critical patent/WO2009060755A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B23/00—Re-forming shaped glass
    • C03B23/26—Punching reheated glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/02—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing by fusing glass directly to metal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A plurality of electroconductive pins are provided upright on a board for standing pins. A glass substrate is housed in a vessel in a production apparatus. The board on which the pins have been stood is placed so that the electroconductive pins face the glass substrate within the vessel. The glass substrate within the vessel is heated and melted. The board on which the pins have been stood is moved towards the glass substrate side to allow the electroconductive pins on the board to be inserted into the melted glass substrate. In such a state that the electroconductive pins are inserted into the glass substrate, the glass substrate is cooled and solidified. The board for standing pins is removed from the electroconductive pins. The obverse and reverse surfaces of the glass substrate are polished.
PCT/JP2008/069516 2007-11-05 2008-10-28 Process for producing intermediate structure and inspection apparatus WO2009060755A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007286929A JP2009115524A (en) 2007-11-05 2007-11-05 Process for producing intermediate structure, and inspection apparatus
JP2007-286929 2007-11-05

Publications (1)

Publication Number Publication Date
WO2009060755A1 true WO2009060755A1 (en) 2009-05-14

Family

ID=40625649

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069516 WO2009060755A1 (en) 2007-11-05 2008-10-28 Process for producing intermediate structure and inspection apparatus

Country Status (2)

Country Link
JP (1) JP2009115524A (en)
WO (1) WO2009060755A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020095656A1 (en) * 2018-11-05 2020-05-14 Nok株式会社 Method for manufacturing conductive member

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5550373B2 (en) * 2010-02-05 2014-07-16 セイコーインスツル株式会社 Package manufacturing method
JP5432077B2 (en) * 2010-07-08 2014-03-05 セイコーインスツル株式会社 Manufacturing method of glass substrate with through electrode and manufacturing method of electronic component
JP5466102B2 (en) 2010-07-08 2014-04-09 セイコーインスツル株式会社 Manufacturing method of glass substrate with through electrode and manufacturing method of electronic component

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151184A (en) * 2000-11-08 2002-05-24 Jsr Corp Anisotropic conductive sheet and electrical inspection device for circuit device
JP2005317944A (en) * 2004-03-31 2005-11-10 Jsr Corp Probe apparatus, wafer-inspecting apparatus provided with the probe apparatus, and the wafer-inspecting method
JP2006194620A (en) * 2005-01-11 2006-07-27 Tokyo Electron Ltd Probe card and contact structure for inspection
JP2007067387A (en) * 2005-08-02 2007-03-15 Nec Schott Components Corp Insulating substrate and its manufacturing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151184A (en) * 2000-11-08 2002-05-24 Jsr Corp Anisotropic conductive sheet and electrical inspection device for circuit device
JP2005317944A (en) * 2004-03-31 2005-11-10 Jsr Corp Probe apparatus, wafer-inspecting apparatus provided with the probe apparatus, and the wafer-inspecting method
JP2006194620A (en) * 2005-01-11 2006-07-27 Tokyo Electron Ltd Probe card and contact structure for inspection
JP2007067387A (en) * 2005-08-02 2007-03-15 Nec Schott Components Corp Insulating substrate and its manufacturing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020095656A1 (en) * 2018-11-05 2020-05-14 Nok株式会社 Method for manufacturing conductive member
TWI721629B (en) * 2018-11-05 2021-03-11 日商Ｎｏｋ股份有限公司 Manufacturing method of conductive member
CN112585748A (en) * 2018-11-05 2021-03-30 Nok株式会社 Method for manufacturing conductive member

Also Published As

Publication number Publication date
JP2009115524A (en) 2009-05-28

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