JP2009115524A - Process for producing intermediate structure, and inspection apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To produce an intermediate substrate by forming a conducting path simply and properly on a thick glass substrate, in an inspection device. <P>SOLUTION: First, a plurality of conductive pins 31 are provided upright on a board 170 for standing pins. The glass substrate A is housed in a vessel 90 in a producing apparatus. The board 170, on which the pins have been stood is placed opposite to the glass substrate A in the vessel 90 so that the conductive pins 31 on the board 170 for erecting the pins face the glass substrate A side. The glass substrate A in the vessel 90 is heated and melted. The board on which the pins have been erected is moved toward the glass substrate A side, to allow the conductive pins on the board 170 for erecting the pins to be inserted into the molten glass substrate A. In such a state where the conductive pins 31 are inserted into the glass substrate A, the glass substrate A is cooled and solidified. The board 170 for making the pins stand erect is removed from the conductive pins 31. The obverse and reverse surfaces of the glass substrate A are polished. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an intermediate structure manufacturing method and an inspection apparatus in an inspection apparatus.

  For example, inspection of electrical characteristics of electronic circuits such as IC and LSI formed on a semiconductor wafer is performed by an inspection apparatus. The inspection apparatus is usually arranged between a plurality of probe pins having elasticity in the vertical direction, a circuit board for sending an electrical signal for inspection of electrical characteristics to each probe pin, and between the probe pins and the circuit board. And an interposer that electrically connects the probe pin and the circuit board. The inspection of the electrical characteristics by the inspection apparatus is performed by bringing the probe pin into contact with the electrode of the wafer that is the object to be inspected (see Patent Document 1).

  Incidentally, in recent years, according to the miniaturization of electronic circuits on the wafer, the pitch between the contacts such as probe pins has been reduced. Thereby, in order to prevent collision between adjacent contacts, for example, a contact having a short vertical dimension may be used. In this case, for example, when the contact is brought into contact with the wafer during inspection, the distance between the upper circuit board and the wafer is shortened. For this reason, for example, when the wafer is inclined with respect to the circuit board or the circuit board is distorted by heat or force, the outer edge of the wafer may come into contact with the circuit board. Accordingly, it is conceivable to increase the thickness of the interposer between the circuit board and the wafer to prevent contact between the circuit board and the wafer.

  Further, when the contact is shortened and the vertical movable range of the contact is reduced, the distortion of the interposer greatly affects the contact state between the contact and the wafer. For this reason, it is necessary to ensure sufficient strength and flatness of the interposer. From this point, it is required to increase the thickness of the interposer.

  The interposer can also be formed on the silicon substrate using a lithography technique. However, the silicon substrate is usually about 800 μm and thin, and it is difficult to increase the thickness technically or costly.

JP 2007-155553 A

  Therefore, it can be proposed to use a glass substrate that can ensure the thickness for the interposer. However, a technique for forming a conductive path inside a thick glass substrate and processing it into an interposer has not yet been realized and has not been realized. As a method of providing a conductive path that penetrates the glass substrate in the thickness direction, for example, a through hole may be formed by machining such as drilling, and a conductive material may be embedded in the through hole by electroforming. It is technically difficult to embed a conductive material in a thicker glass substrate without gaps, and this method is not practical.

  This invention is made | formed in view of this point, The objective is to form an intermediate structure body, such as an interposer, by forming a conductive path simply and appropriately on a thick glass substrate.

  In order to achieve the above object, the present invention is directed to an inspection having a contact body that comes into contact with an object to be inspected for electrical characteristics, and a circuit board that sends an electrical signal to the contact body for inspection of electrical characteristics. An apparatus for manufacturing an intermediate structure that is disposed between the contact body and the circuit board, supports the contact body, and electrically connects the contact body and the circuit board. A step of erecting conductive pins in a plurality of pin stand holes formed in the substrate, a step of accommodating a glass substrate serving as a base material of an intermediate structure in a container whose upper surface is opened, and A step of disposing the pin stand substrate facing the glass substrate in the container so that the conductive pins face the glass substrate side, a step of heating the glass substrate in the container, and melting the glass substrate; The pin stand substrate is Close to the substrate side, inserting the conductive pins of the pin stand substrate into the molten glass substrate, and cooling the glass substrate with the conductive pins inserted into the glass substrate. The method includes a step of solidifying the substrate, a step of removing the pin stand substrate from the conductive pins, and a step of polishing the front and back surfaces of the glass substrate.

  According to the present invention, since the conductive path can be formed by inserting the conductive pin into the glass substrate, the conductive path can be easily and appropriately formed on the thick glass substrate. Moreover, since the intermediate structure is manufactured by polishing the front and back surfaces of the glass substrate, an intermediate structure with high flatness can be manufactured. As a result, the contact between the contact body supported by the intermediate structure and the object to be inspected can be stabilized, and the electrical characteristics can be inspected stably.

  The method for manufacturing the intermediate structure may further include a step of forming electrodes that are electrically connected to the conductive pins on the front and back surfaces of the glass substrate.

  The electrodes of the glass substrate may have different pitches on the front surface and the back surface.

  The sheet-like contact body is attached to the surface of the glass substrate on the side to be inspected, and the sheet-like contact body includes a plurality of conductive portions that are electrically connected to the conductive pins and the conductive portions. It is comprised by the insulating part to connect, The said electroconductive part has elasticity, may penetrate the sheet | seat in the thickness direction, and may protrude to the to-be-inspected object side.

  In addition, a sheet-like connection body is attached to the surface of the glass substrate on the circuit board side, and the sheet-like connection body includes a plurality of conductive portions electrically connected to the conductive pins and the conductive portions. The conductive portion may have elasticity, penetrate the sheet in the thickness direction, and protrude toward the circuit board side.

  When forming the contact body and the connection body, a pair of molds having a surface adapted to a predetermined surface shape of each of the contact body and the connection body are arranged opposite to each other with the glass substrate interposed therebetween, and An insulating molding material containing conductive particles is filled between a pair of molds and the glass substrate, and then a magnetic field is applied to the molding material in the thickness direction of the molding material. The molding material may be cured by moving to a predetermined position. The predetermined position where the conductive particles move is a position where the respective conductive portions of the contact body and the connection body are finally formed.

  According to another aspect of the present invention, there is provided an inspection apparatus for inspecting electrical characteristics, a contact body that contacts an object to be inspected, and a circuit board that sends an electrical signal for inspection of electrical characteristics to the contact body. An intermediate structure disposed between the contact body and the circuit board, supporting the contact body, and electrically connecting the contact body and the circuit board, wherein the intermediate structure is Formed of a glass substrate and having a plurality of conductive paths leading from the front surface to the back surface of the glass substrate, wherein the plurality of conductive paths are formed by inserting a plurality of conductive pins in the thickness direction of the glass substrate. It is characterized by being.

  Electrodes that are electrically connected to the conductive pins are formed on the front and back surfaces of the intermediate structure in the inspection apparatus, and the pitch of the electrodes may be different between the front surface and the back surface.

  The contact body is formed in a sheet shape, is attached to a surface of the intermediate structure on the inspected object side, and a plurality of conductive portions that are electrically connected to the conductive pins and an insulating portion that connects the conductive portions to each other The conductive portion may have elasticity, penetrate the sheet in the thickness direction, and protrude toward the object to be inspected.

  The inspection apparatus further includes a connection body that is attached to a surface on the circuit board side of the intermediate structure, and electrically connects the intermediate structure and the circuit board, and the connection body is formed in a sheet shape. And a plurality of conductive portions that are electrically connected to the conductive pins and insulating portions that connect the conductive portions to each other. The conductive portions have elasticity, penetrate the sheet in the thickness direction, and the circuit. You may protrude to the substrate side.

  According to the present invention, a conductive path can be easily and appropriately formed on a thick glass substrate. Thereby, the thickness of the intermediate structure can be increased, and contact between the device under test and the circuit board can be prevented. In addition, the strength and flatness of the intermediate structure can be ensured, and the electrical contact between the contact body supported by the intermediate structure and the object to be inspected can be stabilized.

  Hereinafter, preferred embodiments of the present invention will be described. FIG. 1 is a longitudinal sectional view showing an outline of a configuration of an inspection apparatus 1 according to the present embodiment.

  The inspection apparatus 1 is provided with, for example, a probe card 2 and a mounting table 3 on which a wafer W as an object to be inspected is mounted. The probe card 2 is disposed above the mounting table 3. The probe card 2 is mounted on a lower surface side of the circuit board 10, for example, a circuit board 10 for sending an electrical signal for inspection to a lower elastic sheet 22, which will be described later, a holder 11 that holds the outer periphery of the circuit board 10. The inspection contact structure 12 is provided to contact the electrode pad U on the wafer W to achieve electrical conduction between the circuit board 10 and the wafer W.

  The circuit board 10 is electrically connected to a tester (not shown), and an electrical signal for inspection from the tester can be transmitted to and received from the lower connection structure 12 for inspection. The circuit board 10 is formed in a substantially disk shape, for example. An electronic circuit is formed inside the circuit board 10, and a plurality of connection terminals 10 a of the electronic circuit are formed on the lower surface of the circuit board 10.

  FIG. 2 is a longitudinal sectional view showing an outline of the configuration of the inspection contact structure 12. The inspection contact structure 12 is attached to the lower surface of the intermediate substrate 20, the intermediate substrate 20 as a flat intermediate structure, the upper elastic sheet 21 as a connection body attached to the upper surface of the intermediate substrate 20, for example. A bottom elastic sheet 22 as a contact body is provided and has a three-layer structure.

  The intermediate substrate 20 is formed in a square shape as shown in FIG. 3, for example. The intermediate substrate 20 is formed of a thick glass substrate of about 3 mm to 15 mm, for example. Thereby, the intermediate substrate 20 has a thermal expansion coefficient comparable to that of the wafer W, and has higher rigidity than the upper elastic sheet 21 and the lower elastic sheet 22. For example, as shown in FIG. 2, the intermediate substrate 20 is formed with a plurality of conductive paths 30 that communicate from the lower surface to the upper surface in the vertical direction. Each conductive path 30 is formed, for example, by inserting conductive pins 31 in the thickness direction of the intermediate substrate 20. The conductive path 30 is formed at a position corresponding to the electrode pad U of the wafer W, for example. An upper electrode 30 a is formed at the upper end of each conductive path 30, and a lower electrode 30 b is formed at the lower end of each conductive path 30. A method for manufacturing the intermediate substrate 20 will be described later.

  The lower elastic sheet 22 is formed in a square shape, for example, and is attached to the lower surface of the intermediate substrate 20. The bottom elastic sheet 22 is formed of, for example, a rubber sheet that is an insulating material having elasticity as a whole. A plurality of conductive portions 40 having conductivity are formed on the bottom elastic sheet 22. The conductive part 40 is formed by densely filling conductive particles in a part of a rubber sheet. The conductive part 40 is formed at a position corresponding to the lower electrode 30b of the conductive path 30 of the intermediate substrate 20, for example, and is connected to the lower electrode 30b. Each conductive part 40 penetrates the lower elastic sheet 22 in the vertical direction, for example, and protrudes in a convex shape from the lower surface of the lower elastic sheet 22. A portion of the lower elastic sheet 22 other than the conductive portion 40, that is, a portion connecting the conductive portions 40 is an insulating portion 41 made of only a rubber sheet.

  The upper elastic sheet 21 has substantially the same configuration as the lower elastic sheet 22 described above. The upper surface elastic sheet 21 is formed in, for example, a square shape and is attached to the upper surface of the intermediate substrate 20. The upper surface elastic sheet 21 is formed of, for example, the same rubber sheet as the lower surface elastic sheet 22 which is an insulating material having elasticity as a whole. The upper surface elastic sheet 21 has a plurality of conductive portions 50 having conductivity. The conductive part 50 is formed by densely filling conductive particles in a part of a rubber sheet. For example, the conductive portion 50 is formed at a position corresponding to the upper electrode 30a of the conduction path 30 of the intermediate substrate 20, and is connected to the upper electrode 30a. Each conductive part 50 penetrates the upper surface elastic sheet 21 in the vertical direction, for example, and protrudes in a convex shape from the upper surface of the upper surface elastic sheet 21. A portion other than the conductive portion 50 of the top elastic sheet 21 is an insulating portion 51.

  For example, as shown in FIG. 1, the outer peripheral portion of the intermediate substrate 20 is bonded to the lower surface of the circuit board 10 by, for example, an adhesive 60 made of silicone, and the entire inspection structure 12 is fixed to the circuit board 10.

  The mounting table 3 is configured to be movable in the horizontal direction and the vertical direction, for example, and can move the mounted wafer W three-dimensionally.

  When inspection is performed by the inspection apparatus 1 configured as described above, the wafer W is first mounted on the mounting table 3, and then the mounting table 3 is raised so that each electrode U of the wafer W is used for inspection. The contact structure 12 is pressed against each conductive portion 40 of the bottom elastic sheet 22. Thereafter, an electrical signal is sent from the tester to the wafer W through the circuit board 10 and the inspection contact structure 12, and the electrical characteristics of the wafer W are inspected.

  Next, a method for manufacturing the intermediate substrate 20 will be described. FIG. 4 schematically shows the configuration of a manufacturing apparatus 80 used in the method for manufacturing the intermediate substrate 20.

  The manufacturing apparatus 80 includes a container 90 that houses a glass substrate A that is a base material of the intermediate substrate 20. The container 90 is formed in a box shape whose upper surface is open and whose longitudinal section is concave. The container 90 is made of a material having a smaller linear expansion coefficient than that of the glass substrate A and having a good thermal conductivity and not fused to the glass substrate A, for example, carbon.

  For example, the container 90 is supported by the support member 100 and is accommodated in the heating container 101. For example, the heating container 101 is formed in a substantially cylindrical shape having an upper surface opened and a bottom surface closed. The heating container 101 is made of, for example, quartz glass. The upper surface opening of the heating container 101 is hermetically closed by a lid 102.

  Around the heating container 101, a heater 103 that generates heat by power feeding is provided. The heater 103 is arrange | positioned at the side surface and lower surface of the heating container 101, for example.

  The heating container 101 is covered with an outer cover 104 formed of a heat insulating material. The heater 103 is interposed between the outer cover 104 and the heating container 101.

  A through hole 102 a penetrating in the vertical direction is formed at the center of the lid 102. A shaft 110 extending vertically from the top of the lid 102 to the inside of the heating container 101 is inserted through the through hole 102a.

  A substantially disc-shaped holding member 111 is attached to the lower end of the shaft 110, for example. The lower surface of the holding member 111 is formed horizontally, and a suction port (not shown) is formed on the lower surface. By the suction from the suction port, a pin stand substrate 170 described later can be sucked and held on the lower surface of the holding member 111.

  The upper end portion of the shaft 110 is connected to an elevating drive unit 120 such as a motor disposed above the lid body 102. The elevating drive unit 120 is supported on a support base 121 installed on the upper surface of the lid 102, for example. The raising / lowering drive part 120 can raise / lower the holding member 111 by moving the shaft 110 up and down.

  For example, a disc-shaped flange 130 is attached to the shaft 110 between the lid 102 and the elevating drive unit 120, for example. An expandable / contractible bellows 131 is interposed between the flange 130 and the lid 102. The bellows 131 is provided with a cooling mechanism (not shown) to suppress the heat on the heating container 101 side from being transmitted to the lifting drive unit 120 side.

  The manufacturing apparatus 80 is provided with a gas supply pipe 150 that supplies a predetermined gas into the heating container 101. The gas supply pipe 150 is connected to the side surface of the heating container 101, for example. The gas supply pipe 150 communicates with a gas supply source (not shown). In the present embodiment, nitrogen gas is sealed in the gas supply source, and nitrogen gas is supplied into the heating container 101 through the gas supply pipe 150.

  Next, a method for manufacturing the intermediate substrate 20 performed using the manufacturing apparatus 80 will be described.

  First, a pin stand substrate 170 as shown in FIG. 5 is prepared. The pin stand substrate 170 has a plurality of circular pin stand holes 170a formed at predetermined positions on the surface. The arrangement and number of the pin standing holes 170a are appropriately set according to the position of the conductive path 30 finally formed in the intermediate substrate 20. Note that the pin standing hole 170a is formed by, for example, dry etching using a photolithography technique.

  Then, the cylindrical conductive pins 31 are inserted and fixed in the pin standing holes 170a of the pin standing substrate 170. For example, tungsten is used as the material of the conductive pin 31. In this way, the plurality of conductive pins 31 are raised on the pin stand substrate 170.

  Next, as shown in FIG. 4, the glass substrate A is accommodated in the container 90 of the manufacturing apparatus 80. In the present embodiment, borosilicate glass such as Pyrex glass (registered trademark of Corning) is used for the glass substrate A, for example.

  Further, the pin stand substrate 170 is sucked and held on the lower surface of the holding member 111 of the manufacturing apparatus 80 with the conductive pins 31 facing downward. Thereby, the pin stand substrate 170 is disposed to face the glass substrate A in the container 90. Thereafter, nitrogen gas is supplied from the gas supply pipe 150 into the heating container 101, and the inside of the heating container 101 is replaced with an inert nitrogen atmosphere.

  Next, as shown in FIG. 6A, the temperature inside the heating container 101 is raised by the heater 103 in a state where the pin stand substrate 170 and the glass substrate A are arranged to face each other. Thereby, as shown in FIG.6 (b), the glass substrate A is heated to the temperature higher than a softening point, and is fuse | melted.

  Thereafter, the raising / lowering drive unit 120 lowers the holding member 111, and the conductive pins 31 of the pin stand substrate 170 are inserted into the glass substrate A as shown in FIG. Thereafter, the heater 103 is stopped, and the glass substrate A is cooled and solidified in a state where the conductive pins 31 are inserted into the glass substrate A as shown in FIG.

  Thereafter, as shown in FIG. 7, the holding member 111 is raised by the elevating drive unit 120, and the pin stand substrate 170 is removed from the conductive pins 31.

  Next, for example, as shown in FIG. 8A, the glass substrate A is taken out from the container 90.

  Next, the upper and lower surfaces of the glass substrate A are polished. Thereby, as shown in FIG. 8B, the conductive pins 31 are exposed on the upper and lower surfaces of the glass substrate A, and the conductive paths 30 by the conductive pins 31 are formed on the glass substrate A. Thereafter, the outer surface of the glass substrate A is vertically processed as necessary.

  Thereafter, an upper electrode 30a and a lower electrode 30b communicating with the respective conductive pins 31 are formed on the upper and lower surfaces of the glass substrate A by, for example, a plating technique as shown in FIG. Thus, the intermediate substrate 20 of the glass substrate A is manufactured.

  According to the above embodiment, since the conductive pin 31 is inserted into the glass substrate A and the conductive path 30 is formed, the conductive path 30 can be easily and appropriately formed on the thick glass substrate A. As a result, since the processing of the intermediate substrate 20 of the thick glass substrate A can be realized, the contact between the circuit substrate 10 and the wafer W or the like can be achieved even if a short contactor such as the conductive portion 40 of the bottom elastic sheet 22 is used. Can be prevented. Further, the strength and flatness of the intermediate substrate 20 are ensured, and the contact between the lower elastic sheet 22 and the wafer W can be stabilized.

  Further, according to the above embodiment, since the upper and lower surfaces of the glass substrate A are polished, the flatness of the intermediate substrate 20 is improved. For example, even if a contact having a narrow pitch and a small movable range is used, it contacts with the wafer W. The contact of the child can be stabilized.

  In the above embodiment, the upper elastic sheet 21 and the lower elastic sheet 22 are formed by being attached to the intermediate substrate 20, respectively, but may be formed by the following method.

  First, as shown in FIG. 9A, a pair of molds 190 and 191 which are opposed to each other with the intermediate substrate 20 in between are arranged. At this time, the vertical positions of the molds 190 and 191 are determined according to the respective thicknesses of the upper elastic sheet 21 and the lower elastic sheet 22 that are finally formed on the upper and lower surfaces of the intermediate substrate 20. The mold 190 on the circuit board 10 side has a plurality of indentations 190a formed on the lower surface thereof, and the plurality of indentations 190a are respectively formed at positions corresponding to the upper electrode 30a. The lower surface of the mold 190 conforms to the surface shape of the upper elastic sheet 21 that is finally formed on the upper surface of the intermediate substrate 20. Further, the mold 191 on the wafer W side has a plurality of indentations 191a formed on the lower surface thereof, and the plurality of indentations 190a are respectively formed at positions corresponding to the lower electrodes 30b. The lower surface of the mold 191 conforms to the surface shape of the lower elastic sheet 22 finally formed on the lower surface of the intermediate substrate 20.

  When arranging the pair of molds 190 and 191, the conductive particles 192 are disposed between the mold 190 on the circuit board 10 side and the upper surface of the intermediate substrate 20, and between the mold 191 on the wafer W side and the lower surface of the intermediate substrate 20. A liquid insulating molding material 194 made of a mixture of a polymer material 193 is filled. For the conductive particles 192, magnetic metal particles are used, and for example, metal particles such as nickel, iron, cobalt, or alloys thereof are used. For the polymer material 193, an insulating and elastic material such as silicone rubber or natural rubber is used.

  Next, as shown in FIG. 9B, a magnetic field is applied to the molding material 194 filled between the mold 190 and the upper surface of the intermediate substrate 20 in the thickness direction of the molding material 194 from above. At the same time, a magnetic field is applied to the molding material 194 filled between the mold 191 and the lower surface of the intermediate substrate 20 in the thickness direction of the molding material 194 from below. By this magnetic field, the conductive particles 192 in the molding material 194 are formed between the recessed portions 190 a and 191 a and the intermediate substrate 20, that is, finally the conductive portions 50 and 40 of the upper surface elastic sheet 21 and the lower surface elastic sheet 22. Move to the respective position.

  Then, for example, the molds 190 and 191 are respectively reduced in the direction of the intermediate substrate 20 to cure the polymer material 193 in the molding material 194.

  Thereafter, the molds 190 and 191 are removed as shown in FIG. As described above, the conductive portions 50 and 40 are filled with the conductive particles 192 and the polymer material 193 is hardened to form the upper surface elastic sheet 21 and the lower surface elastic sheet 22 on the upper and lower surfaces of the intermediate substrate 20. .

  According to such a method, the upper surface elastic sheet 21 and the lower surface elastic sheet 22 are formed by putting the molding material 194 between the molds 190, 191 and the intermediate substrate 20, so that the positions of the molds 190, 191 in the vertical direction are set. By adjusting, the upper surface elastic sheet 21 and the lower surface elastic sheet 22 to be formed can be formed in a desired thickness. Further, since the lower surface of the mold 190 and the upper surface of the mold 191 are adapted to the surface shapes of the upper elastic sheet 21 and the lower elastic sheet 22, respectively, the surface accuracy of the formed upper elastic sheet 21 and lower elastic sheet 22 is improved. Can be made.

  In the above embodiment, the pitch of the upper electrode 30a and the lower electrode 30b of the intermediate substrate 20 is the same, but this may be changed.

  For example, as shown in FIG. 10, the pitch of the upper electrodes 30a may be formed wider than that of the lower electrodes 30b. In this case, for example, a wiring 180 that connects the upper end portion of the conductive path 30 and the upper electrode 30a is formed on the upper surface of the glass substrate A. The pitch of the conductive portions 50 of the upper elastic sheet 21 is also formed wider than the pitch of the conductive portions 40 of the lower elastic sheet 22. In this case, the pitch can be converted between the lower terminal 10a of the circuit board 10 and the conductive portion 40 of the lower elastic sheet 22, and the electrical characteristics of the narrower pitch wafer electrodes can be inspected.

  The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It will be apparent to those skilled in the art that various changes and modifications can be made within the scope of the ideas described in the claims, and these are naturally within the technical scope of the present invention. It is understood that it belongs.

  For example, the intermediate substrate 20 described in the above embodiment is a square, but may be another shape such as a circle. In addition, the conductive pin 31 has a cylindrical shape, but may have a prismatic shape. Further, the configuration of the upper surface elastic sheet 21, the lower surface elastic sheet 22, and the like of the contact structure 12 for inspection is not limited to the above example, and may be other configurations. Instead of the bottom elastic sheet 22 as a contact body, a probe pin such as a cantilever type may be supported on the intermediate substrate 20. Furthermore, the present invention can also be applied to the case where the object to be inspected is another substrate such as an FPD (flat panel display) other than the wafer W.

  INDUSTRIAL APPLICABILITY The present invention is useful when an intermediate structure is manufactured by forming a conductive path simply and appropriately on a thick glass substrate in an inspection apparatus.

It is explanatory drawing of the longitudinal cross-section which shows the outline of a structure of a test | inspection apparatus. It is explanatory drawing of the longitudinal cross-section which shows the structure of the contact structure for a test | inspection. It is a top view of an intermediate board. It is a longitudinal cross-sectional view which shows the outline of a structure of a manufacturing apparatus. It is a perspective view of a pin stand substrate. (A) is explanatory drawing which shows the state which arranged the pin stand board | substrate facing the glass substrate. (B) is explanatory drawing which shows the state which fuse | melted the glass substrate. (C) is explanatory drawing which shows the state which inserted the electroconductive pin in the glass substrate. (D) is explanatory drawing which shows the state which solidified the glass substrate. It is explanatory drawing which shows the state which removed the pin stand board | substrate from the electroconductive pin. (A) is explanatory drawing which shows the state which took out the glass substrate from the container. (B) is explanatory drawing which shows the state which grind | polished the upper and lower surfaces of the glass substrate. (C) is explanatory drawing which shows the state which formed the electrode in the upper and lower surfaces of a glass substrate. (A) is explanatory drawing which shows the state with which the molding material was filled between the type | mold and the intermediate | middle board | substrate. (B) is explanatory drawing which shows the mode of the molding material at the time of applying a magnetic field to a molding material. (C) is explanatory drawing which shows a mode that the upper surface elastic sheet and the lower surface elastic sheet were formed. It is a longitudinal cross-sectional view of a part of the contact structure for inspection when the pitch between the upper electrode and the lower electrode is changed.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Inspection apparatus 10 Circuit board 12 Contact structure for inspection 20 Intermediate board 21 Upper surface elastic sheet 22 Lower surface elastic sheet 30 Conductive path 31 Conductive pin 80 Manufacturing apparatus 90 Container 170 Pin stand substrate A Glass substrate

Claims (10)

An inspection apparatus comprising: a contact body that contacts an object to be inspected for electrical property inspection; and a circuit board that sends an electrical signal for electrical property inspection to the contact body. A method of manufacturing an intermediate structure that is disposed between and supports the contact body and electrically connects the contact body and the circuit board,
A step of standing conductive pins in a plurality of pin stand holes formed on the pin stand substrate;
A step of accommodating a glass substrate serving as a base material of the intermediate structure in a container having an upper surface opened;
A step of disposing the pin stand substrate so as to face the glass substrate in the container so that the conductive pins of the pin stand substrate face the glass substrate side;
Heating the glass substrate in the container and melting the glass substrate;
Bringing the pin stand substrate closer to the glass substrate side and inserting the conductive pins of the pin stand substrate into the molten glass substrate;
In the state where the conductive pins are inserted into the glass substrate, the step of cooling the glass substrate and solidifying the glass substrate;
Removing the pin stand substrate from the conductive pins;
And a step of polishing the front and back surfaces of the glass substrate. The method for producing an intermediate structure according to claim 1, further comprising a step of forming electrodes that are electrically connected to the conductive pins on the front and back surfaces of the glass substrate. The method for manufacturing an intermediate structure according to claim 2, wherein the electrodes of the glass substrate have different pitches on the front surface and the back surface. The sheet-like contact body is attached to the surface of the glass substrate on the side to be inspected, and the sheet-like contact body includes a plurality of conductive portions that are electrically connected to the conductive pins and the conductive portions. It is comprised by the insulation part to connect, The said electroconductive part has elasticity, penetrates a sheet | seat in the thickness direction, and protrudes in the to-be-inspected object side, The one in any one of Claims 1-3 characterized by the above-mentioned. A method for producing an intermediate structure. A sheet-like connection body is attached to the surface of the glass substrate on the circuit board side, and the sheet-like connection body connects a plurality of conductive portions electrically connected to the conductive pins and the conductive portions. The intermediate structure according to claim 4, wherein the conductive portion has elasticity, penetrates the sheet in a thickness direction, and protrudes toward the circuit board. Method. In forming the contact body and the connection body,
A pair of molds having a surface adapted to a predetermined surface shape of each of the contact body and the connection body are arranged opposite to each other with the glass substrate interposed therebetween,
Filling an insulating molding material containing conductive particles between the pair of molds and the glass substrate,
Thereafter, a magnetic field is applied to the molding material in the thickness direction of the molding material, and the conductive particles are moved to a predetermined position by the magnetic field,
The method for manufacturing an intermediate structure according to claim 5, wherein the molding material is cured. An inspection device for inspecting electrical characteristics,
A contact body that contacts the object to be inspected;
A circuit board for sending an electrical signal for inspection of electrical characteristics to the contact body;
An intermediate structure that is disposed between the contact body and the circuit board, supports the contact body, and electrically connects the contact body and the circuit board;
The intermediate structure is formed of a glass substrate, and has a plurality of conductive paths leading from the front surface to the back surface of the glass substrate,
The inspection apparatus, wherein the plurality of conductive paths are formed by inserting a plurality of conductive pins in a thickness direction of the glass substrate. The front surface and the back surface of the intermediate structure are respectively formed with electrodes that are electrically connected to the conductive pins, and the electrodes have different pitches on the front surface and the back surface. The inspection device described. The contact body is formed in a sheet shape, is attached to a surface of the intermediate structure on the inspected object side, and a plurality of conductive portions that are electrically connected to the conductive pins and an insulating portion that connects the conductive portions to each other Consisting of
The inspection apparatus according to claim 7, wherein the conductive portion has elasticity, penetrates the sheet in the thickness direction, and protrudes toward the object to be inspected. It is attached to the surface of the intermediate structure on the circuit board side, and further includes a connection body that electrically connects the intermediate structure and the circuit board,
The connection body is formed in a sheet shape and includes a plurality of conductive portions that are electrically connected to the conductive pins and an insulating portion that connects the conductive portions.
The inspection apparatus according to claim 9, wherein the conductive portion has elasticity, penetrates a sheet in a thickness direction, and protrudes toward the circuit board.

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