WO2009060676A1 - 半導体発光装置、その半導体発光装置を並べた複合発光装置、及びその複合発光装置を用いた面状発光源 - Google Patents

半導体発光装置、その半導体発光装置を並べた複合発光装置、及びその複合発光装置を用いた面状発光源 Download PDF

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Publication number
WO2009060676A1
WO2009060676A1 PCT/JP2008/067704 JP2008067704W WO2009060676A1 WO 2009060676 A1 WO2009060676 A1 WO 2009060676A1 JP 2008067704 W JP2008067704 W JP 2008067704W WO 2009060676 A1 WO2009060676 A1 WO 2009060676A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
side wall
emitting device
composite
wall sections
Prior art date
Application number
PCT/JP2008/067704
Other languages
English (en)
French (fr)
Inventor
Takeshi Sano
Original Assignee
Sanken Electric Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co., Ltd. filed Critical Sanken Electric Co., Ltd.
Priority to CN2008801117301A priority Critical patent/CN101828272B/zh
Priority to US12/741,664 priority patent/US8641256B2/en
Publication of WO2009060676A1 publication Critical patent/WO2009060676A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)

Abstract

　半導体発光装置には、対向する一対の第１の側壁部と、第１の側壁部よりも短く、対向するように第１の側壁部の間にわたって設けられた一対の第２の側壁部とによる凹部が形成されている。凹部の底面には、第１の側壁部の方向に並べられた複数の発光素子が配置されている。複数の発光素子は、第１の色を発光する第１の発光素子と、複数の発光素子の中で最も前記第２の側壁部の側に配置された第２の発光素子とを含む。第２の色の光の一部を第２の色の光の補色に波長変換させる蛍光体を含む樹脂部が、前記凹部に充填される。
PCT/JP2008/067704 2007-11-06 2008-09-30 半導体発光装置、その半導体発光装置を並べた複合発光装置、及びその複合発光装置を用いた面状発光源 WO2009060676A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008801117301A CN101828272B (zh) 2007-11-06 2008-09-30 半导体发光装置、排列有该半导体发光装置的复合发光装置、以及使用该复合发光装置的平面状光源
US12/741,664 US8641256B2 (en) 2007-11-06 2008-09-30 Semiconductor light emitting device, composite light emitting device with arrangement of semiconductor light emitting devices, and planar light source using composite light emitting device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007008595U JP3138907U (ja) 2007-11-06 2007-11-06 半導体発光装置、その半導体発光装置を並べた複合発光装置、及びその複合発光装置を用いた面状発光源
JP2007-008595U 2007-11-06

Publications (1)

Publication Number Publication Date
WO2009060676A1 true WO2009060676A1 (ja) 2009-05-14

Family

ID=40625577

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067704 WO2009060676A1 (ja) 2007-11-06 2008-09-30 半導体発光装置、その半導体発光装置を並べた複合発光装置、及びその複合発光装置を用いた面状発光源

Country Status (2)

Country Link
JP (1) JP3138907U (ja)
WO (1) WO2009060676A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009302339A (ja) * 2008-06-13 2009-12-24 Sanken Electric Co Ltd 半導体発光装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06177430A (ja) * 1992-12-08 1994-06-24 Rohm Co Ltd 多色発光素子
JP2002050797A (ja) * 2000-07-31 2002-02-15 Toshiba Corp 半導体励起蛍光体発光装置およびその製造方法
JP2004296882A (ja) * 2003-03-27 2004-10-21 Sanken Electric Co Ltd 半導体発光装置
JP2005353507A (ja) * 2004-06-14 2005-12-22 Toyoda Gosei Co Ltd バックライト装置
JP2007200974A (ja) * 2006-01-24 2007-08-09 Sanken Electric Co Ltd 半導体発光ユニット及びその製法並びに線状光源
JP2008147189A (ja) * 2006-12-05 2008-06-26 Samsung Electronics Co Ltd Ｌｅｄパッケージ、及びそのｌｅｄパッケージを含むｌｅｄ光源ユニット並びにバックライトユニット

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06177430A (ja) * 1992-12-08 1994-06-24 Rohm Co Ltd 多色発光素子
JP2002050797A (ja) * 2000-07-31 2002-02-15 Toshiba Corp 半導体励起蛍光体発光装置およびその製造方法
JP2004296882A (ja) * 2003-03-27 2004-10-21 Sanken Electric Co Ltd 半導体発光装置
JP2005353507A (ja) * 2004-06-14 2005-12-22 Toyoda Gosei Co Ltd バックライト装置
JP2007200974A (ja) * 2006-01-24 2007-08-09 Sanken Electric Co Ltd 半導体発光ユニット及びその製法並びに線状光源
JP2008147189A (ja) * 2006-12-05 2008-06-26 Samsung Electronics Co Ltd Ｌｅｄパッケージ、及びそのｌｅｄパッケージを含むｌｅｄ光源ユニット並びにバックライトユニット

Also Published As

Publication number Publication date
JP3138907U (ja) 2008-01-24

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