WO2009052649A1

WO2009052649A1 - Self-alignment apparatus and method for self-alignment during chip package process by using magnetic field

Info

Publication number: WO2009052649A1
Application number: PCT/CN2007/003042
Authority: WO
Inventors: Jack Zezhong Peng; Yipeng Shuai
Original assignee: Jack Zezhong Peng; Yipeng Shuai
Priority date: 2007-10-26
Filing date: 2007-10-26
Publication date: 2009-04-30

Abstract

A magnetic self-alignment apparatus and a method for self-alignment between a chip (9) and a substrate (7) during chip packaging are provided to reduce the cost of self-alignment. The magnetic self-alignment apparatus includes a magnetic device (1), a substrate conveyor (3) and a chip conveyor (8). The magnetic device (1) includes one or several set of magnetic poles (2) arranged in one-dimension or two-dimensions. Each of the set of magnetic poles (2) comprises two or three poles, so as to the magnetic field is provided for self-aligning the bonding points of the chip (9) and the corresponding bonding points of the substrate (7). The substrate conveyor (3) includes two roll shafts (6), a conveyor belt (5) and a stepping controller (4). The chip conveyor (8) is located under the substrate conveyor (3).

Description

Device and method for realizing self-alignment by using magnetic field in chip package

Technical field

The invention relates to the field of microchip packaging, in particular to a method for encapsulating a microchip (such as an RFID tag, a diode, a triode, an LED, etc.), which can be used to realize a bonding point on each chip and a bonding point on each substrate. Quasi-device. To this end, the invention also relates to a method of self-aligning a chip with a substrate using the apparatus.

Background technique

In the prior art, a commonly used device for aligning a chip (such as an RFID tag, a diode, a triode, an LED, etc.) with a substrate is a flip-chip bonding device, which requires a mechanical arm to be grasped. The chip is taken, and then the robot arm is reversed so that the bonding point of the chip faces the bonding point on the substrate, and then the alignment position is recognized, and the moving direction of the arm is controlled, thereby finally achieving accurate connection between the chip and the substrate. Since such a device requires a robot arm and a corresponding control device, the implementation cost is high. Currently, such a device on the market needs about 1-2 million US dollars; and because of the steps of identification, control, and each Only one chip can be self-aligned, so the efficiency is relatively low.

Alien has proposed the use of FSA (Fluidic Self Assembly) technology to achieve chip-to-substrate self-alignment, but because this method requires the formation of openings in the substrate, and also has certain requirements on the shape and size of the chip, It is difficult to implement, especially for RFID tags, since the thickness of the antenna substrate is very small, it is basically impossible to achieve self-alignment using this FSA method. Summary of the invention

The technical problem to be solved by the present invention is to provide a device for realizing self-alignment by using a magnetic field in a chip package, which can greatly reduce the packaging cost of the chip, and can improve the packaging efficiency, and has a simple structure and is easy to implement. To this end, the invention also relates to a method of self-aligning a chip with a substrate using the apparatus.

In order to solve the above technical problems, in one embodiment, the present invention provides a device for realizing self-alignment using a magnetic field in a chip package, comprising: a magnetic device, a substrate transfer device, and a chip transfer guide;

The magnetic device is for generating a self-aligning magnetic field, fixed directly above the substrate transfer device, having two or three magnetic poles;

The substrate transfer device includes two rollers wound around a substrate, and a substrate transfer belt composed of a row of substrates is wound on the roller; the substrate transfer device further includes a step controller For controlling the rotation of the roller to ensure that each time the roller rotates, the substrate conveyor has a bonding point on the substrate and the magnetic device Each magnetic pole is aligned;

The chip transfer guide is located directly below the substrate transfer device for transferring a plurality of chips.

In another embodiment, the present invention also provides a device for realizing self-alignment by using a magnetic field in a chip package, comprising: a magnetic device, a substrate transfer device, and a chip transfer guide;

The magnetic device is configured to generate a self-aligning magnetic field, fixed directly above the substrate transfer device, and having n sets of magnetic pole groups in the form of a one-dimensional array of 1 η η;

The substrate transfer device includes two rollers wound around a substrate, and a substrate transfer belt composed of a row of substrates is wound on the roller; the substrate transfer device further includes a step controller For controlling the rotation of the roller to ensure that each time the roller rotates, the substrate transfer belt has a bonding point on the n-substrate substrate aligned with the n-group magnetic pole group of the magnetic device;

In still another embodiment, the present invention also provides a device for realizing self-alignment by using a magnetic field in a chip package, comprising: a magnetic device, a substrate transfer device, and a plurality of chip transfer guides;

The magnetic device is configured to generate a self-aligning magnetic field, fixed directly above the substrate transfer device, having a magnetic pole group in the form of a two-dimensional array of mX n groups arranged in mX n;

The substrate transfer device includes two rollers wound around a substrate, and a substrate transfer belt composed of a substrate of m rows is wound on the roller; the substrate transfer device further includes a step a controller for controlling the rotation of the roller to ensure that each time the roller rotates, the substrate transfer belt has a bonding point on the mX n substrate aligned with the mX n group of magnetic poles of the magnetic device ;

The chip transfer guide is located directly below the substrate transfer device for transferring a plurality of chips; and the plurality of chip transfer guides are placed in the form of m rows.

The present invention also provides a method of self-aligning a chip with a substrate using the self-aligning device mentioned in the preceding three embodiments, comprising the steps of:

Having a bonding point on the substrate in the substrate transfer belt toward a direction of the chip transfer guide;

Place the plurality of chips on the transfer rail, and ensure that the bonding points on the chip face upward, and apply a layer of magnetic conductive material on each bonding point or between the bonding points;

The forward movement of the substrate transfer belt and the chip transfer guide is controlled to achieve self-alignment of the bonding points on the substrate and the chip bonding points by the magnetic field generated by each set of magnetic poles.

The invention adopts the above technical solution, and has the beneficial effect that the magnetic device is utilized, the magnetic The device has one or more sets of magnetic poles arranged in a one-dimensional array form or a two-dimensional matrix form, wherein each set of magnetic pole sets contains two or three magnetic poles to generate each bonding point on the chip and the substrate. Self-aligned magnetic field of the bonding point; the device of the invention has a simple structure and is easy to implement, thereby greatly reducing the cost of self-alignment, improving the packaging efficiency and productivity of the chip; and since the chip and the base are not used The film is changed in any shape, so the principle is relatively simple, providing greater possibilities for popularization and application.

DRAWINGS

The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

The present invention will be further described in detail with reference to the accompanying drawings and specific embodiments. FIG. 1 is a schematic structural view of an embodiment of the self-aligning device of the present invention;

2a is a schematic structural view of an embodiment of an electromagnetic device having a pair of magnetic poles according to the present invention; FIG. 2b is a schematic structural view of an embodiment of an electromagnetic device having three magnetic poles according to the present invention; FIG. 3 is a schematic view of an embodiment of an electromagnetic device having three magnetic poles according to the present invention; A schematic structural view of an embodiment of a substrate transfer device;

4a-4b are schematic diagrams showing the self-alignment of bond points of a chip with bond points on a substrate using an embodiment of the self-aligned device of the present invention;

5a is a schematic structural view of an embodiment of an electromagnetic device having a plurality of magnetic pole groups arranged in a one-dimensional array and each magnetic pole group including two magnetic poles according to the present invention;

Figure 5b is a block diagram showing an embodiment of an electromagnetic device having a plurality of sets of magnetic pole groups arranged in a one-dimensional array form and each magnetic pole set including three magnetic poles according to the present invention;

6a is a schematic structural view of another embodiment of an electromagnetic device having a plurality of sets of magnetic pole groups arranged in a one-dimensional array and each magnetic pole group including two magnetic poles according to the present invention;

6b is a schematic structural view of another embodiment of an electromagnetic device having a plurality of sets of magnetic pole groups arranged in a one-dimensional array form, and each magnetic pole group including three magnetic poles according to the present invention;

7a is a schematic structural view of an embodiment of an electromagnetic device having a plurality of sets of magnetic pole groups arranged in a two-dimensional matrix form, and each magnetic pole set including two magnetic poles according to the present invention;

Figure 7b is a block diagram showing an embodiment of an electromagnetic device having a plurality of sets of magnetic pole groups arranged in a two-dimensional matrix form, and each magnetic pole set including three magnetic poles according to the present invention;

Figure 8 is a schematic view showing the structure of another embodiment of the substrate transfer device according to the present invention;

9a is a schematic structural view of an embodiment of a permanent magnet device having a pair of magnetic poles according to the present invention; and FIG. 9b is a schematic structural view of an embodiment of a permanent magnet device having three magnetic poles according to the present invention; Fig. 10a is a schematic structural view of another embodiment of a permanent magnet device having a pair of magnetic poles according to the present invention; and Fig. 10b is a schematic structural view of another embodiment of a permanent magnet device having three magnetic poles according to the present invention. detailed description

The self-aligned device of the present invention mainly utilizes the principle of magnetic to realize the bonding points on the chip (such as an RFID chip, a diode, a triode, an LED, etc.) and the respective substrates (such as an antenna bonded thereto) in the chip packaging process. Self-alignment and connection of bond points on the RFID antenna substrate). In one embodiment, as shown in Figure 1, the self-aligning device includes a magnetic device, a substrate transfer device, and one or more chip transfer tracks.

Wherein the magnetic device is fixed directly above the substrate transfer device, and has one or more sets of magnetic poles arranged in a one-dimensional array form or a two-dimensional matrix form for generating a self-aligned magnetic field to realize one or more The self-alignment of the chip bonding point and the substrate bonding point during the chip label packaging process, wherein each group of magnetic poles includes two or three magnetic poles (according to the actual application). In one embodiment, if there are two bonding points on each of the chip and the substrate to be aligned, each of the sets of magnetic poles includes two magnetic poles, and the polarities of the two magnetic poles should be opposite. In another embodiment, if there are three or more bonding points on each of the chip and the substrate to be aligned, each of the magnetic pole groups includes three magnetic poles, and one of the magnetic poles has the same polarity as the other two. The polarity of the magnetic poles is opposite. Of course, those skilled in the art can also design an embodiment in which each group of magnetic poles includes more than three magnetic poles according to the technical solution of the present invention, but according to the principle of determining a plane according to three points, each group of magnetic poles includes three The magnetic poles are sufficient, and the situation of more than three magnetic poles increases the complexity of using the magnetic field to achieve self-alignment.

The substrate transfer device includes two rollers, and a substrate transfer belt composed of one or more rows of substrates is wound on the roller; the substrate transfer device further includes a step controller for controlling Rotation of the roller to ensure that each time the roller rotates, the substrate transfer belt has a bonding point on one or more substrates aligned with the magnetic poles of one or more sets of magnetic poles of the magnetic device . It should be noted that when the substrate tape is transported forward, the bonding points on the respective substrates should be downward toward the chip transfer guide.

The chip transfer guide is located directly below the substrate transfer device for transporting a plurality of chips. It is worth noting that when the chip is placed on the rail, it should be ensured that the bonding point thereon is upward (i.e., facing the substrate conveyor). In one embodiment, each bonding point on each chip is coated with a magnetic conductive film made of a magnetically permeable material. Preferably, the magnetic conductive film is an iron film having a thickness of about 5 microns; It can also be other magnetically permeable materials. Further, the magnetic conductive film can be realized by a method of various metal plating such as deposition, sputtering, or the like. In another preferred embodiment, a strip of magnetically permeable strip is realized with a magnetically permeable material between the bonding points, and the width of the strip of magnetic permeable strip should be similar to that of the self-aligning device of the present invention. The maximum diameter of the magnetic pole cuts included in each of the magnetic pole sets, and Its length should be similar to the spacing between the corresponding two poles in the set of poles. Preferably, the magnetic conductive film strip may be an iron film having a thickness of about 5 to 15 μm; of course, other magnetic conductive materials may also be used. The magnetically conductive film strip can be realized by conventional photolithography, etching (including various wet etching and dry etching) in a semiconductor process.

In one embodiment, the magnetic device can be designed as an electromagnetic device. The electromagnetic device is mainly composed of one or more electromagnetic circuits and one or more non-magnetically conductive objects, in which one or more electromagnetic coils are connected in series or in parallel, and each of the electromagnetic coils is worn by An iron pin made of a magnetically permeable material, thereby forming one or more sets of magnetic poles arranged in a one-dimensional array form or a two-dimensional matrix form. And the magnetic field strength can be adjusted by adjusting the current passing through each electromagnetic coil. In one embodiment, in order to be able to adjust the strength of the magnetic field, either the main circuit of each electromagnetic circuit or each of the parallel branches (if there are multiple parallel branches, if only one electromagnetic coil or multiple electromagnetic coils are Parallel to the electromagnetic circuit, it means that only one parallel branch) is connected in series with a variable resistor. By adjusting the strength of the magnetic field, it is possible to prevent the magnetic field generated from being too small to effectively achieve self-alignment, and to avoid the case where a magnetic field is too large to attract more than one chip on the same substrate. At the same time, in order to control the on and off of the magnetic field, a switch can be connected in series on each main circuit and/or each parallel branch of each electromagnetic circuit.

The non-magnetically permeable object is placed under the electromagnetic coil, and has one or more sets of through holes, wherein each set of through holes contains a number of through holes and a magnetic pole contained in each set of magnetic poles The same amount. And the diameter of each of the through holes should be slightly larger than the diameter of the iron needle, and the iron needles respectively pass through the through holes, thereby achieving the action of concentrating the magnetic lines of force. The non-magnetically permeable object should be solid and can be made of any non-magnetic material such as plastic, glass, ceramic, etc., and the lower surface of the non-magnetically conductive object (ie, the side of the non-aligned electromagnetic coil) should be a Plane to ensure that the chip that is attracted to the substrate does not tilt.

In the electromagnetic device, by using different numbers of electromagnetic circuits and different numbers of non-magnetically permeable objects, or by using different numbers of electromagnetic coils in each electromagnetic circuit, and by connecting the above components in different ways or Arranging, thereby realizing an electromagnetic device having only one set of magnetic poles; or, implementing an electromagnetic device having a plurality of sets of magnetic poles arranged in a one-dimensional array, or implementing a plurality of sets of magnetic poles, and said The magnetic pole group is arranged in an electromagnetic device in a two-dimensional matrix; thereby functioning to improve efficiency and productivity in the chip label packaging process.

The following further describes by way of specific embodiments:

In one embodiment, for a chip and a substrate that require self-alignment, each has a pair of bonding points, as shown in FIG. 2a: the electromagnetic device includes an electromagnetic circuit and a non-magnetically permeable object, and Electromagnetic Only one electromagnetic coil wearing an iron needle is arranged in series in the road, wherein the iron needle is made of a magnetic conductive material; and the non-magnetic magnetic object has a pair of through holes, and the two ends of the iron needle are respectively worn Through the through hole; thereby achieving an electromagnetic device having only a pair of magnetic poles that can be used to achieve self-alignment. For the case where there are three or more bonding points on the chip and the substrate which need to be self-aligned, as shown in FIG. 2b: the electromagnetic device also includes an electromagnetic circuit and a non-magnetic magnetic object, and In the electromagnetic circuit, only one electromagnetic coil is worn in series with two iron needles, wherein the iron needle is made of a magnetic conductive material; and the non-magnetic magnetic object has three through holes, and the two iron needles are Both ends of the same magnetic pole pass through one of the through holes, and the other two ends of the two iron needles having the same magnetic pole pass through the other two through holes respectively; thereby achieving only three magnetic poles for self-alignment Electromagnetic device. For the above two cases, correspondingly, the substrate transfer device should be as shown in FIG. 3, the substrate tape wound on the roller is composed of a row of substrates, and in order to enable the step controller to be accurate Controlling the stepping position of the line substrate strip such that each of the rollers has a bonding point on one of the substrates aligned with the position of two or three magnetic poles in the electromagnetic device, preferably Each of the substrates on the substrate strip is provided with an inductive identifier, such as a capacitor, which is sensed by the step controller. Thus, whenever one of the chips conveyed by the chip transfer guide is attracted by the magnetic field, it automatically flies to the substrate, and ensures that the positions of the respective bonding points on the chip and the positions of the bonding points on the substrate are aligned. . From Figures 4a and 4b, it can be clearly seen that self-alignment can be achieved very well by the device.

In practical use, since the efficiency of self-alignment of the chip and the substrate is not very high using only two or three magnetic poles, the electromagnetic device needs to be designed to have a plurality of sets of magnetic poles, and the plurality of groups The pole sets are arranged in the form of a one-dimensional array. Alternatively, optimally, the electromagnetic device may also be designed to have a plurality of sets of magnetic poles, and the plurality of sets of magnetic poles are arranged in the form of a two-dimensional matrix. Wherein each set of magnetic poles includes two or three magnetic poles.

Therefore, in one embodiment, for a chip and a substrate that need to be self-aligned, each having a pair of bonding points, as shown in FIG. 5a, the electromagnetic device includes an electromagnetic circuit and a non-magnetically conductive object, and There are n electromagnetic coils connected in series in the electromagnetic circuit, and each of the electromagnetic coils is provided with an iron needle made of a magnetically permeable material; and on the non-magnetically conductive object, n groups are arranged in a one-dimensional array form. a through hole group, each set of through holes has two through holes, and two ends of each of the iron pins respectively pass through the corresponding through holes, thereby realizing a magnetic pole group having n sets of one-dimensional arrays arranged in Ι Χη, and each The group pole group contains two magnetic poles. Correspondingly, for the case where there are three or more bonding points on the chip and the substrate which need to be self-aligned, as shown in FIG. 5b, the electromagnetic device comprises an electromagnetic circuit and a non-magnetically conductive object. And the electromagnetic circuit has n electromagnetic coils connected in series, and each of the electromagnetic coils is provided with two iron needles made of a magnetically permeable material; and the non-magnetically conductive objects are arranged with n groups arranged in one dimension. a through hole group in the form of an array, each set of through holes includes three through holes, and the two ends of each of the iron pins respectively pass through the corresponding The through hole (refer to the embodiment having only three magnetic poles in the foregoing), thereby realizing a magnetic pole group in the form of a one-dimensional array in which n groups are arranged in Ι η η, and each of the magnetic pole groups has three magnetic poles. Of course, for the above two cases, those skilled in the art should also be able to make other alternatives without departing from the scope of protection defined by the claims of the present invention. For example, n electromagnetic circuits and a non-magnetic magnetic object are used, and only one electromagnetic coil is connected in series in each electromagnetic circuit; then, by arranging the n electromagnetic circuits in a row at a certain distance, multiple groups can also be realized. An electromagnetic device arranged in a one-dimensional array of magnetic pole groups; this implementation has the following advantages: that is, the electromagnetic coils do not interfere with each other, and the distance between each other is easy to adjust, and is relatively flexible. For another example, a non-magnetic magnetic object in FIG. 5a and 5b may be replaced by a plurality of non-magnetic magnetic objects, for example, each magnetic pole group is provided with a non-magnetic magnetic object, which can reduce each to some extent. Electromagnetic interference between the electromagnetic coils also facilitates flexibility. Or, as shown in FIGS. 6a and 6b, it is also realized by connecting n electromagnetic coils in parallel in the electromagnetic circuit, which has the advantage that when one of the electromagnetic coils fails, the other electromagnetic coils are not affected. , thus improving reliability. Moreover, in order to be able to adjust the magnetic field strength of each electromagnetic coil, a variable resistor may be connected in series in the main circuit of the electromagnetic circuit and/or in each of the parallel branches. For the above two cases, correspondingly, the substrate transfer device is also in the form of one row of the substrate tape wound on the roller as shown in FIG. 3, and in order to enable the step controller to be accurately Controlling the stepping position of the substrate strip such that the roller has a bonding point of n substrates for each front and 2n of the electromagnetic device respectively (for each chip and substrate that need to be self-aligned) a pair of bonding points) or _3η (for the case where the chip requiring self-alignment and the substrate each have three or more bonding points) the positional alignment of the magnetic poles, preferably on the substrate strip A sensing identifier that can be sensed by the step controller is disposed every n-th substrate, for example, the sensing identifier can be implemented by a capacitor or the like.

In another embodiment, for a chip and a substrate that need to be self-aligned, each has a pair of bonding points. As shown in FIG. 7a, the electromagnetic device includes m electromagnetic circuits and a non-magnetic magnetic object, each of which There are n electromagnetic coils connected in series in the electromagnetic circuit, and each of the electromagnetic coils is provided with an iron needle made of a magnetically permeable material; and the electromagnetic circuits are completely identical, and are arranged in a matrix in parallel with each other at a certain distance; The non-magnetically-conducting object has n sets of through-hole groups arranged in a two-dimensional matrix form, each through-hole group has two through-holes, and two ends of each of the iron needles respectively pass through the corresponding through-holes, thereby realizing A magnetic pole group having a two-dimensional matrix in which mX ri groups are arranged in mX n , and each magnetic pole group contains two magnetic poles. Correspondingly, for the case where there are three or more bonding points on the chip and the substrate which need to be self-aligned, as shown in FIG. 7b, the electromagnetic device includes m electromagnetic circuits and a non-magnetic magnetic object. There are n electromagnetic coils connected in series in each electromagnetic circuit, and each of the electromagnetic coils is provided with two iron needles made of a magnetically permeable material; and the electromagnetic circuits are completely identical, and are arranged in parallel with each other at a certain distance. Forming a plurality of through-hole groups arranged in a two-dimensional matrix on the non-magnetically-conductive object, each set of through-hole groups including three through-holes, and two ends of each of the iron needles respectively pass through corresponding passages Holes (specifically, reference may be made to an embodiment having only three magnetic poles in the front), thereby realizing a magnetic pole group having a two-dimensional matrix in which mXn groups are arranged in mX n and having three magnetic poles in each magnetic pole group. Of course, other alternatives will be apparent to those skilled in the art without departing from the scope of the invention as defined by the appended claims. For example, the m electromagnetic circuits of Figures 7a and 7b can be implemented by an electromagnetic circuit, each electromagnetic circuit being formed by m paralleling branches of n electromagnetic coils in series. For another example, each of the electromagnetic circuits in FIGS. 7a and 7b can be replaced by n electromagnetic circuits having only one electromagnetic coil connected in series, and these electromagnetic circuits are arranged in a two-dimensional matrix to reduce interference and Increase the role of flexibility. In addition, the non-magnetically-conductive object may be replaced by a group of through-holes in which n groups are arranged in a one-dimensional array (each group of through-hole groups shall have two or three through-holes according to actual conditions) Non-conducting magnetic objects are arranged in a row, or non-magnetic objects with a set of through-hole groups (each group of through-holes should have two or three through-holes according to actual conditions) are arranged in a two-dimensional matrix. The form of the electromagnetic interference between the electromagnetic coils is reduced to increase the flexibility. Alternatively, it can also be realized by connecting the electromagnetic coils in parallel and in series in one or more electromagnetic circuits. For the above two cases, correspondingly, the substrate transfer device should be in the form of m rows of the substrate tape wound on the roller as shown in FIG. 8, and in order to enable the step controller to be accurate Controlling the stepping position of the substrate strip such that the roller has a bonding point of the raX n-sheet substrate for each position and a position of a magnetic pole included in the mX n-group magnetic pole group in the electromagnetic device Preferably, a sensing identifier that can be sensed by the step controller can be respectively disposed at two opposite corners or four corners of each mX n substrate on the substrate strip, for example, The sensing flag can be implemented by a capacitor or the like. At this time, a plurality of chip transfer guides should be included, and these chip transfer guides should be placed in the form of m rows.

In still another embodiment, the magnetic device may also be configured as a permanent magnet device having one or more sets of magnetic poles arranged in a one-dimensional array form or a two-dimensional matrix form to generate a magnetic field with a helium to realize a piece or The chip is self-aligned with the chip during the multi-chip package process. Among them, each group of magnetic poles contains two or three magnetic poles.

For a chip and a substrate that need to be self-aligned, each has a pair of bonding points. In one embodiment, as shown in FIG. 9a, the permanent magnet device includes a non-magnetically conductive object having a pair of through holes thereon. A permanent magnet is inserted into each of the through holes to form a pair of magnetic poles. In addition, in this embodiment, the adjustment of the magnetic field strength can be achieved by adjusting the distance between the permanent magnets or selecting permanent magnets having different cross-sectional area sizes. In another embodiment, as shown in FIG. 10a, the permanent magnet device includes a non-magnetically conductive object having a pair of through holes formed therein; the permanent magnet device further includes a permanent magnet, and the permanent magnet may be any Shaped, such as a cylinder, a cuboid, a U shape, etc.; An iron needle made of a magnetically permeable material is respectively attracted to the two magnetic poles of the permanent magnet and passed through the through holes, respectively, thereby forming a pair of magnetic poles of the permanent magnet device. Further, in this embodiment, the adjustment of the magnetic field strength can be realized by adjusting the distance between each of the iron needles and the corresponding permanent magnet or the size of the contact surface. ,

For the case where the chip and the substrate which need to be self-aligned have three or more bonding points, respectively, correspondingly, in one embodiment, as shown in FIG. 9b, the permanent magnet device includes a non-magnetic magnetic field. The object has three through holes formed therein, and a permanent magnet is inserted into each of the through holes to form three magnetic poles, and it is ensured that one of the magnetic poles has the opposite polarity to the other two magnetic poles. Further, in this embodiment, the adjustment of the magnetic field strength can be realized by adjusting the distance between the permanent magnets or selecting permanent magnets having different cross-sectional area sizes. In another embodiment, as shown in FIG. 10b, the permanent magnet device includes a non-magnetic magnetic object having three through holes formed therein; the permanent magnet device further includes a permanent magnet, and the permanent magnet may be any Shaped, such as a cylinder, a cuboid, a U-shape, etc.; three iron needles made of a magnetically permeable material, respectively, are attracted to the two magnetic poles of the permanent magnet, and respectively pass through the three through holes, To form the three magnetic poles of the permanent magnet device, and to ensure that one of the magnetic poles has a polarity opposite to that of the other two magnetic poles. Further, in this embodiment, the adjustment of the magnetic field strength can be realized by adjusting the distance between each of the iron needles and the corresponding permanent magnet or the size of the contact surface.

For both cases, the corresponding substrate transfer device is now the same as the substrate transfer device corresponding to an electromagnetic device having only two or three magnetic poles. '

For those of ordinary skill in the art, based on the foregoing description of the electromagnetic device and the permanent magnet device having two or three magnetic poles, it should be possible to achieve a plurality of sets of arrays in a one-dimensional array or by various embodiments. A permanent magnet device in the form of a two-dimensional matrix of poles (each set of poles containing two or three poles). For example, in one embodiment the permanent magnet device includes one or more non-magnetically permeable objects and a plurality of permanent magnets, wherein each non-magnetically permeable object has one or more sets of through-hole groups open therein, and each set of passes Each of the through holes included in the hole group is respectively inserted with a permanent magnet to form a magnetic pole group in the form of a one-dimensional array arranged in a Ι Χη, wherein each set of through hole groups includes two or three through holes according to actual conditions. . In another embodiment, the permanent magnet device includes one or more non-magnetically permeable objects, one or more permanent magnets, and a plurality of iron pins made of a magnetically permeable material, wherein each non-magnetically permeable object is opened There are one or more sets of through holes, and each of the through holes included in each set of through holes is inserted with an iron pin to form a magnetic pole group in the form of a one-dimensional array arranged in IX n , wherein each group passes The hole group includes two or three through holes depending on the actual situation. For another example, in one embodiment, the permanent magnet device includes one or more non-magnetically permeable objects and a plurality of permanent magnets, wherein each non-magnetically permeable object has one or more sets of through holes, and each Each of the through holes included in the group of through holes is respectively inserted with a permanent magnet to form a magnetic pole group in the form of a two-dimensional matrix of mX n , wherein each group of through holes is packaged according to actual conditions. Includes two or three through holes. In another embodiment, the permanent magnet device includes one or more non-magnetically permeable objects, one or more permanent magnets, and a plurality of iron pins made of a magnetically permeable material, wherein each non-magnetically permeable object is opened There are one or more sets of through holes, and each of the through holes included in each set of through holes is inserted with an iron pin to form a magnetic pole group of a two-dimensional matrix of mX n , wherein each set of through holes Depending on the actual situation, there are two or three through holes. At this time, the corresponding substrate transfer device and chip transfer guide should be identical to the substrate transfer device and the chip transfer guide respectively having a plurality of pairs of electromagnetic devices arranged in a one-dimensional array form or a two-dimensional matrix.

Note that both m and n mentioned above are integers greater than one.

In order to finally realize the connection between the substrate and the chip, in one embodiment, a unidirectional conductive paste may be applied to each bonding point on the substrate, so that when the chip and the substrate are self-aligned, they are attached to each other. Together, the subsequent connection between the chip and the substrate can be achieved by subsequent heating and curing. In another embodiment, a dedicated pressure device can also be used to directly bond the bonding points under pressure when the chip and substrate are self-aligned. Of course, other connections known to those skilled in the art can also be used. These are all within the scope of protection as defined by the claims of the present invention.

Claims

Rights request

A device for realizing self-alignment by using a magnetic field in a chip package, comprising: a magnetic device, a substrate transfer device, and a chip transfer guide;

The substrate transfer device includes two rollers wound around a substrate, and a substrate transfer belt composed of a row of substrates is wound on the roller; the substrate transfer device further includes a step controller For controlling the rotation of the disk to ensure that each time the roller rotates, the substrate transfer belt has a bonding point on a substrate aligned with each magnetic pole in the magnetic device;

2. A device for self-alignment using a magnetic field in a chip package according to claim 1, wherein every other substrate on said substrate strip is provided with a sensor that can be sensed by said step controller Induction logo.

3. A device for self-alignment using a magnetic field in a chip package according to claim 1 or 2, wherein the magnetic device is designed as an electromagnetic device comprising an electromagnetic circuit and a non-magnetically permeable object, and An electromagnetic coil is connected in series in the electromagnetic circuit, and an iron needle made of a magnetic conductive material is bored in the electromagnetic coil; two or three through holes are opened in the non-magnetic conductive object, and the iron The two ends of the needle respectively pass through the corresponding through holes to form two or three magnetic poles; and, the non-magnetic magnetic object is solid, and the lower bottom surface thereof should be a flat surface. .

A device for realizing self-alignment by a magnetic field in a chip package according to claim 3, wherein a variable resistor is further connected in series in said electromagnetic circuit.

5. A device for self-alignment using a magnetic field in a chip package according to claim 3 or 4, wherein a switch is also connected in series in the electromagnetic circuit.

6. A device for self-alignment using a magnetic field in a chip package according to claim 1 or 2, wherein the magnetic device is designed as a permanent magnet device comprising a non-magnetically permeable object and a permanent magnet, Two or three through holes are formed in the magnetically permeable body, and permanent magnets are respectively inserted in each of the through holes to form two or three magnetic poles.

7. A device for self-alignment using a magnetic field in a chip package according to claim 1 or 2, wherein the magnetic device is designed as a permanent magnet device comprising a non-magnetically permeable object, a permanent magnet, and a magnetically permeable material. The iron needle is formed; the non-magnetic magnetic object has two or three through holes, and the iron pins are respectively attracted to the two magnetic poles of the permanent magnet, and respectively pass through the corresponding through holes , thereby forming two or three magnetic poles.

8. A device for self-aligning using a magnetic field in a chip package, comprising: a magnetic device, a substrate transfer device and a chip transfer guide;

The magnetic device is configured to generate a self-aligned magnetic field, fixed directly above the substrate transfer device, having a magnetic pole set in the form of a one-dimensional array of n sets of I X n ;

The substrate transfer device includes two rollers wound around a substrate, and a substrate transfer belt composed of a row of substrates is wound on the roller; the substrate transfer device further includes a step controller For controlling the rotation of the roller to ensure that each time the roller rotates, the substrate conveyor has a bonding point on the n substrates aligned with the n sets of magnetic poles of the magnetic device;

9. Apparatus for self-alignment using a magnetic field in a chip package according to claim 8, wherein each set of magnetic poles comprises two or three magnetic poles.

10. The device of claim 9, wherein the device is self-aligned by a magnetic field, wherein each of the n-substrate strips is provided with a stepper controller. Inductive identification.

11. Apparatus for self-alignment using a magnetic field in a chip package according to claim 9 or 10, characterized in that the magnetic device is designed as an electromagnetic device comprising one or more electromagnetic circuits and one or more non-conductive a magnetic object, and one or more electromagnetic coils are connected in series or in parallel in each of the electromagnetic circuits, and an iron needle made of a magnetically permeable material is bored in the electromagnetic coil; the non-magnetically permeable objects are One or more sets of through holes are opened, and all the through hole groups are arranged in a 1 X array of 1 Xn, and the number of through holes included in each set of through holes is the same as the number of magnetic poles included in each set of magnetic poles; The two ends of each of the iron needles respectively pass through the corresponding through holes to form n sets of magnetic pole groups arranged in a one-dimensional array of IX n; the non-magnetically conductive objects are solid, and the lower bottom surface thereof should be a flat surface.

12. A device for self-alignment using a magnetic field in a chip package according to claim 11, wherein a variable resistor is connected in series in the main circuit of the electromagnetic circuit and/or in each of the parallel branches.

13. A device for self-alignment using a magnetic field in a chip package according to claim 12, wherein a switch is connected in series in the main circuit of the electromagnetic circuit and/or in each of the parallel branches.

14. A device for self-alignment using a magnetic field in a chip package according to claim 9 or 10, characterized in that the magnetic device is designed as a permanent magnet device comprising one or more non-magnetically permeable objects and a plurality of permanent a magnet, wherein each non-magnetically conductive object has one or more sets of through holes, and each set of through holes has the same number of through holes as the number of magnetic poles in each set of magnetic poles; Permanent magnets are respectively inserted therein to form n sets of magnetic pole groups arranged in a one-dimensional array of IX n .

15. A device for self-alignment using a magnetic field in a chip package according to claim 9 or 10, characterized in that The magnetic device is designed as a permanent magnet device and includes one or more non-magnetically permeable objects, one or more permanent magnets, and a plurality of iron needles made of a magnetically permeable material, wherein each non-magnetically permeable object has one One or more sets of through holes, and the number of through holes included in each set of through holes is the same as the number of magnetic poles in each set of magnetic poles; iron needles are inserted into each through hole, and n groups are arranged to form A magnetic pole set in the form of a one-dimensional array of IX n.

16. A device for self-aligning using a magnetic field in a chip package, comprising: a magnetic device, a substrate transfer device, and a plurality of chip transfer guides;

The magnetic device is configured to generate a self-aligned magnetic field, fixed directly above the substrate transfer device, having a magnetic pole set in the form of a two-dimensional array of mXn groups arranged in mXn;

The substrate transfer device includes two rollers wound around a substrate, and a substrate transfer belt composed of m rows of substrates is wound on the roller; the substrate transfer device further includes a step controller For controlling the rotation of the roller to ensure that each time the roller rotates, the substrate transfer belt has a bonding point on the mX n substrate aligned with the mX n group of magnetic poles of the magnetic device;

17. Apparatus for self-alignment using a magnetic field in a chip package according to claim 16, wherein each set of magnetic poles comprises two or three magnetic poles.

18. The device of claim 17, wherein the device is self-aligned by a magnetic field, wherein each of the two or four corners of each mX n substrate is respectively on the substrate strip. An inductive identification that can be sensed by the step controller is provided.

19. Apparatus for self-alignment using a magnetic field in a chip package according to claim 17 or 18, wherein the magnetic device is designed as an electromagnetic device comprising one or more electromagnetic circuits and one or more non-conductive a magnetic object, and one or more electromagnetic coils are connected in series or in parallel in each of the electromagnetic circuits, and an iron needle made of a magnetically permeable material is bored in the electromagnetic coil; the non-magnetically permeable objects are One or more pairs of through hole groups are arranged, the through hole groups are arranged in a two-dimensional matrix form of mXn, and the number of through holes included in each set of through hole groups is the same as the number of magnetic poles included in each set of magnetic pole groups; The two ends of the root iron needle respectively pass through the corresponding through holes to form a magnetic pole group in the form of a two-dimensional matrix of mXn arranged in the mX n group; the non-magnetic conductive objects are solid, and the lower bottom surface thereof should be a plane.

20. A device for self-alignment using a magnetic field in a chip package according to claim 19, wherein a variable resistor is connected in series with the main circuit of the electromagnetic circuit and/or each of the parallel branches.

21. A device for self-alignment using a magnetic field in a chip package according to claim 19 or 20, characterized in that A switch is connected in series in the main circuit of the electromagnetic circuit and/or in each parallel branch.

22. Apparatus for self-alignment using a magnetic field in a chip package according to claim 17 or 18, wherein the magnetic device is designed as a permanent magnet device comprising one or more non-magnetically permeable objects and a plurality of permanent a magnet, wherein each of the non-magnetically-conducting objects has one or more sets of through-holes, and each of the sets of through-holes has the same number of through-holes as the number of magnetic poles in each set of magnetic poles; Permanent magnets are inserted therein to form a magnetic pole group in the form of a two-dimensional matrix in which mX n is arranged in mX n .

23. Apparatus for self-alignment using a magnetic field in a chip package according to claim 17 or 18, wherein the magnetic device is designed as a permanent magnet device comprising one or more non-magnetically conductive objects, one or more a permanent magnet and a plurality of iron needles made of a magnetically permeable material, wherein each non-magnetically permeable object has one or more sets of through holes, and each set of through holes comprises a number of through holes and each set of magnetic poles The number of magnetic poles included in the group is the same; iron needles are inserted in each of the through holes to form a magnetic pole group in the form of a two-dimensional matrix in which mX n groups are arranged in mX n .

24. A method of self-aligning a chip to a substrate using the apparatus of claim 1, 8 or 16, characterized in that it comprises the steps of:

Having the bonding points on the substrates in the substrate transfer belt toward the direction of the chip transfer guide;

The forward movement of the substrate transfer belt and the chip transfer guide is controlled to achieve self-alignment of bonding points on the substrate and chip bonding points under the action of magnetic fields generated by the respective sets of magnetic poles.

A method of self-aligning a chip with a substrate according to claim 24, wherein a bonding film is coated on each bonding point of each of the chips.

The method for self-aligning a chip and a substrate according to claim 24, wherein a strip of magnetically permeable film is realized by a magnetically permeable material between each bonding point of each chip, and The width of the magnetically conductive film strip approximates the maximum diameter of the magnetic pole cut surface in each of the magnetic pole groups, and the length approximates the spacing between the two magnetic poles in the magnetic pole group.

The method of self-aligning a chip and a substrate according to claim 25 or 26, wherein the magnetic conductive film and the magnetic conductive film strip are realized by a magnetic conductive material.