CN115831851A - LED chip mass transfer device and method - Google Patents
LED chip mass transfer device and method Download PDFInfo
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- CN115831851A CN115831851A CN202211493359.8A CN202211493359A CN115831851A CN 115831851 A CN115831851 A CN 115831851A CN 202211493359 A CN202211493359 A CN 202211493359A CN 115831851 A CN115831851 A CN 115831851A
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Abstract
The application relates to a device and a method for transferring LED chips in large quantities, wherein the device comprises a first substrate, a second substrate and an elastic matrix, wherein the first substrate is provided with a plurality of through holes; the second substrate and the first substrate are arranged at intervals, an elastic base body is arranged between the second substrate and the first substrate, and a viscous layer is arranged at the position of the elastic base body corresponding to the through hole; when the second substrate is electrified, the second substrate magnetically attracts the first substrate, and the elastic base body is extruded from the through hole to form a protrusion for adhering the LED chip. This application chip quantity of adhesion at every turn can be very much, and shift simultaneously, shift to corresponding position after, the outage of second base plate, then first base plate is not inhaled by magnetism, the elastic base body resets, the arch retracts from the through-hole, keep off at first base plate and hold down and realize the chip separation, thereby realize the huge volume of chip and shift, owing to need not to do special shape to chip and pad, a large amount of time has been saved, therefore, can improve transfer efficiency, reduce the cost on the processing procedure.
Description
Technical Field
The present disclosure relates to semiconductor technologies, and in particular, to a device and a method for transferring a large amount of LED chips.
Background
The current Mini/Micro LED is concerned before, and due to the advantages of self-luminescence, simple structure, small size and the like of an LED chip, an LED display technology becomes a next-generation revolutionary technology. However, the miniaturization of the chip promotes the transfer difficulty of the chip.
Because the chips are smaller and smaller, and the number of the chips of the LED display screen is greatly required, the traditional single transfer mode cannot be adopted, and a huge transfer mode is required.
In the related technology, a fluid transfer mode is adopted, specifically, a chip is made into a special shape, a bonding pad is made into a special shape at the same time, the chip flows through liquid similar to fluidity, when the chip reaches the position of the bonding pad, the chip can accurately fall into the bonding pad due to the special design of the chip, the mode is high in precision, but the chip and the bonding pad are made into the special shape due to the time needed, the cost in the manufacturing process is high, and the transfer efficiency is low.
Disclosure of Invention
The embodiment of the application provides a device and a method for transferring LED chips in large quantities, which are used for solving the problems of low efficiency and high cost of a transfer mode in the related technology.
In a first aspect, an LED chip bulk transfer device is provided, which includes:
the first substrate is provided with a plurality of through holes;
the second substrate and the first substrate are arranged at intervals, an elastic base body is arranged between the second substrate and the first substrate, and a viscous layer is arranged at the position of the elastic base body corresponding to the through hole;
when the second substrate is electrified, the second substrate magnetically attracts the first substrate and extrudes the elastic base body from the through hole to form a bulge for adhering the LED chip.
In some embodiments, an elastic buffer is further disposed between the second substrate and the first substrate, and the elastic buffer is disposed through the elastic base.
In some embodiments, two ends of at least one of the elastic base and the elastic buffer are fixedly connected to the second substrate and the first substrate, respectively.
In some embodiments, the elastomeric matrix further has an air cavity formed therein, the apparatus further comprising:
the air pipe of the negative pressure mechanism is communicated with the air cavity;
the pressure sensor is arranged on the elastic buffer piece;
and the controller is connected with the pressure sensor and the negative pressure mechanism and used for comparing the pressure value detected by the pressure sensor with a preset range, and controlling the negative pressure mechanism to work until the negative pressure mechanism is located in the preset range when the pressure value exceeds the preset range.
In some embodiments, the device further comprises a third substrate connected to the second substrate by a connector, the second substrate being located between the first substrate and the third substrate;
and an air pipe of the negative pressure mechanism penetrates through the connecting cylinder and the second substrate and then extends into the air cavity.
In some embodiments, the elastic buffer is a spring.
In some embodiments, the device further comprises a third substrate connected to the second substrate by a connector, the second substrate being located between the first substrate and the third substrate;
the device also comprises a power supply, and a conducting wire of the power supply is connected to the second substrate after penetrating through the connecting cylinder.
In some embodiments, the opening size of the through hole is larger than the size of the LED chip.
In a second aspect, a method for transferring LED chips in bulk is provided, which includes the following steps:
etching the LED chips to enable the bottoms of the LED chips to be suspended relative to the substrate, and forming connecting arms between the adjacent LED chips;
electrifying the second substrate to make the second substrate magnetically attract the first substrate, and extruding the elastic base body from the through hole of the first substrate to form a bulge;
enabling the bumps to be adhered with the LED chips and pressing down to enable the connecting arms to be disconnected;
and transferring the LED chip to a bonding pad of a target substrate.
In some embodiments, transferring the LED chip onto a pad of a target substrate comprises:
transferring the LED chip to the upper part of a target substrate;
aligning the LED chip with a bonding pad on the target substrate, and enabling the LED chip to fall on the corresponding bonding pad;
the second substrate is de-energized and removed.
The beneficial effect that technical scheme that this application provided brought includes:
the embodiment of the application provides a huge transfer device and a method for LED chips, the shape of an elastic matrix extruded by the shape of a through hole is set, under the action of electromagnetic compression force, the elastic matrix deforms to be extruded out of the through hole to form a protrusion, the surface of the protrusion is adhered with adhesive or is coated with adhesive materials to form an adhesive layer, the LED chips are adhered by the adhesive layer on the surface of the elastic matrix, then the LED chips are put down after being transferred to corresponding positions, and the LED chips are adhered and transferred.
This application chip quantity of adhesion at every turn can be very much, and shift simultaneously, shift to corresponding position after, the outage of second base plate, then first base plate is not inhaled by magnetism, the elastic base body resets, the arch retracts from the through-hole, keep off at first base plate and hold down and realize the chip separation, thereby realize the huge volume of chip and shift, owing to need not to do special shape to chip and pad, a large amount of time has been saved, therefore, can improve transfer efficiency, reduce the cost on the processing procedure.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic view (not powered) of an LED chip bulk transfer apparatus according to an embodiment of the present application;
fig. 2 is a plan view of a first substrate provided in an embodiment of the present application;
FIG. 3 is a schematic view of an LED chip bulk transfer device provided in the present embodiment (powered on);
fig. 4 is a schematic diagram after an LED chip is etched according to an embodiment of the present application;
fig. 5 is a schematic view illustrating the LED chip mass transfer device according to the embodiment of the present application adsorbing an LED chip;
FIG. 6 is a schematic diagram illustrating an LED chip bulk transfer apparatus according to an embodiment of the present disclosure;
fig. 7 is a schematic diagram of an LED chip mass transfer device according to an embodiment of the present disclosure when the LED chip is placed on a bonding pad.
In the figure: 1. a first substrate; 10. a through hole; 2. a second substrate; 3. an elastic base; 30. a protrusion; 4. an LED chip; 5. an elastic buffer member; 6. a third substrate; 60. a connecting cylinder; 7. a substrate; 70. a connecting arm; 8. a target substrate.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, 2, 3, 4 and 5, an embodiment of the present application provides a large amount of LED chips transfer device, the device includes a first substrate 1, a second substrate 2 and an elastic base 3, the first substrate 1 is provided with a plurality of through holes 10, the through holes 10 are distributed in an array pattern, the arrangement sequence of the LED chips 4 is matched, according to the arrangement structure of the LED chips 4, the apertures and the positions of the corresponding through holes 10 are designed, generally, the opening size of the through holes 10 is larger than the size of the LED chips 4, for example, the through holes 10 are opened according to a proportion of 105% of the size of the LED chips 4, a certain tolerance is left, the opening positions correspond to the central positions of the LED chips 4, and the position accuracy after transfer is ensured.
The first substrate 1 is a metal substrate, the second substrate 2 is an electromagnet substrate which is not magnetic, magnetized and magnetized after being electrified and has magnetism after being powered off, and the magnetism disappears after being powered off, the second substrate 2 and the first substrate 1 are arranged at intervals, an elastic base body 3 is arranged between the second substrate 2 and the first substrate 1, and a viscous layer is arranged at the position of the elastic base body 3 corresponding to the through hole 10; when the second substrate 2 is powered on, the second substrate 2 magnetically attracts the first substrate 1, the first substrate 1 moves towards the second substrate 2, so as to press the elastic base 3, the elastic base 3 deforms, and the elastic base 3 is extruded from the through hole 10, so as to form a protrusion 30 for adhering the LED chip 4, and since the elastic base 3 is provided with an adhesive layer at a position corresponding to the through hole 10, when the elastic base 3 at the position is extruded into the protrusion 30, the protrusion 30 is provided with the adhesive layer, so as to adhere the LED chip 4.
This application utilizes the through-hole shape to set for the form that the elastic matrix extrudes, and under the effect of electromagnetic compression power, the elastic matrix takes place deformation, makes it extrude from the through-hole and form the arch, and protruding surface is with viscidity or surface coating have sticky material to form the viscous layer, glues the LED chip through the viscous layer on elastic matrix surface, then puts down the LED chip after shifting to corresponding position, realizes the adhesion transfer to the LED chip.
This application chip quantity of adhesion at every turn can be very many, and shift simultaneously, shift to after the position that corresponds, the outage of second base plate, then first base plate is not inhaled by magnetism, elastic matrix resets, the arch retracts from the through-hole, keep off at first base plate and keep down the realization chip separation, realize the huge volume of chip and shift, owing to need not to do special shape to chip and pad, a large amount of time has been saved, therefore, transfer efficiency can be improved, the cost on the processing procedure is reduced.
The elastic body 3 may be made of polyurethane, polypropylene, polyolefin, polyamide, or the like.
When the second substrate 2 is powered on and the first substrate 1 is attracted, in order to avoid that the elastic base 3 is extruded too fast, and in order to avoid that the LED chip 4 is damaged when the first substrate 1 moves down when the second substrate 2 is powered off, as shown in fig. 1, an elastic buffer member 5 is further arranged between the second substrate 2 and the first substrate 1, the elastic buffer member 5 penetrates through the elastic base 3, and the elastic buffer member 5 can adopt a spring.
Due to the elastic buffer part 5, the LED chip 4 can be protected to a certain degree, so that the chip is not easy to damage, the transfer yield is increased, and the cost is further reduced.
In the present application, there are various connection methods of the first substrate 1 and the second substrate 2, for example, when only the elastic base 3 is provided, one wall surface of the elastic base 3 is fixedly connected to the first substrate 1, and the other wall surface is fixedly connected to the second substrate 2.
For another example, when both the elastic base 3 and the elastic buffer 5 exist, at least one of both ends is fixedly connected to the second substrate 2 and the first substrate 1, respectively.
In order to further control the extrusion effect of the elastic base body 3 and realize pressure fine adjustment, in some preferred embodiments, an air cavity is further formed in the elastic base body 3, the device further comprises a negative pressure mechanism, a pressure sensor and a controller, the negative pressure mechanism can adopt a vacuum pump, an air pipe of the negative pressure mechanism is communicated with the air cavity, the pressure sensor is arranged on the elastic buffer piece 5 so as to measure the stress of the elastic buffer piece 5, the controller is connected with the pressure sensor and the negative pressure mechanism and is used for comparing the pressure value detected by the pressure sensor with a preset range, when the pressure value exceeds the preset range, the negative pressure mechanism is controlled to work, the air content in the elastic base body 3 is adjusted until the pressure is within the preset range.
The above manner is electromagnetically controlled and matched with the second substrate 2, so that double stable control is realized.
In order to facilitate the wiring of the negative pressure mechanism, referring to fig. 1, the apparatus further includes a third substrate 6, the third substrate 6 is connected to the second substrate 2 through a connecting tube 60, and the second substrate 2 is located between the first substrate 1 and the third substrate 6; the air pipe of the negative pressure mechanism penetrates through the connecting cylinder 60 and the second substrate 2 and then extends into the air cavity.
The third substrate 6 is a hard substrate, can stably support the whole structure, can adopt materials such as gold, platinum, aluminum, silver, alloy and the like, and the connecting cylinder 60 is a rigid material and plays a role in protecting the air pipe.
Further, the device further comprises a power source, and a conductive wire of the power source is connected to the second substrate 2 after passing through the connecting cylinder 60.
Referring to fig. 4, 5, 6 and 7, an embodiment of the present application further provides a LED chip bulk transfer method, which may use the LED chip bulk transfer apparatus provided in any of the above embodiments, and the method includes the following steps:
101: after the LED chips 4 grow on the substrate 7, the LED chips 4 are etched in a selective photoetching mode, the bottoms of the LED chips 4 are removed, so that the bottoms of the LED chips 4 are suspended relative to the substrate 7, and connecting arms 70 are formed between the adjacent LED chips 4; the adjacent LED chips 4 are connected in a weak supporting mode, and can be disconnected under the condition of smaller pressure.
It should be noted that, obviously, a connecting arm 70 is also formed between the LED chip 4 at the edge and the substrate 7, as shown in fig. 4, to ensure that the LED chip 4 at the edge can be transferred smoothly.
102: the second substrate 2 is energized to make the second substrate 2 magnetically attract the first substrate 1, and the elastic base 3 is extruded from the through hole 10 of the first substrate 1 to form the protrusion 30.
103: the bumps 30 are made to adhere to the LED chip 4 and are pressed down by applying a downward force to break the connection arms 70.
104: the LED chip 4 is transferred onto a pad of a target substrate 8.
The step 104 of transferring the LED chip 4 to the pad of the target substrate 8 includes the following steps:
201: after the LED chip 4 is adsorbed, the LED chip 4 is transferred to a position above the target substrate 8.
202: the LED chip 4 is aligned with the pads on the target substrate 8 and the LED chip 4 is dropped onto the corresponding pads.
203: the second substrate 2 is powered off and removed, and the mass transfer of the LED chips 4 can be completed.
In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
It is noted that, in the present application, relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.
The above description is merely exemplary of the present application and is presented to enable those skilled in the art to understand and practice the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. An LED chip bulk transfer apparatus, comprising:
the device comprises a first substrate (1), wherein a plurality of through holes (10) are formed in the first substrate (1);
the second substrate (2) and the first substrate (1) are arranged at intervals, an elastic base body (3) is arranged between the second substrate (2) and the first substrate (1), and a viscous layer is arranged at the position, corresponding to the through hole (10), of the elastic base body (3);
when the second substrate (2) is electrified, the second substrate (2) magnetically attracts the first substrate (1) and extrudes the elastic base body (3) from the through hole (10) to form a bump (30) for adhering the LED chip (4).
2. The LED chip bulk transfer apparatus of claim 1, wherein:
an elastic buffer part (5) is further arranged between the second substrate (2) and the first substrate (1), and the elastic buffer part (5) penetrates through the elastic base body (3).
3. The LED chip bulk transfer apparatus of claim 2, wherein:
and two ends of at least one of the elastic base body (3) and the elastic buffer piece (5) are respectively and fixedly connected with the second substrate (2) and the first substrate (1).
4. The LED chip bulk transfer apparatus of claim 2, wherein:
an air cavity is further formed in the elastic matrix (3), and the device further comprises:
the air pipe of the negative pressure mechanism is communicated with the air cavity;
the pressure sensor is arranged on the elastic buffer piece (5);
and the controller is connected with the pressure sensor and the negative pressure mechanism and used for comparing the pressure value detected by the pressure sensor with a preset range, and controlling the negative pressure mechanism to work until the negative pressure mechanism is located in the preset range when the pressure value exceeds the preset range.
5. The LED chip bulk transfer apparatus of claim 4, wherein:
the device further comprises a third substrate (6), wherein the third substrate (6) is connected with the second substrate (2) through a connecting cylinder (60), and the second substrate (2) is positioned between the first substrate (1) and the third substrate (6);
and an air pipe of the negative pressure mechanism penetrates through the connecting cylinder (60) and the second substrate (2) and then extends into the air cavity.
6. The LED chip bulk transfer apparatus of claim 2, wherein:
the elastic buffer piece (5) adopts a spring.
7. The LED chip bulk transfer device of claim 1, wherein:
the device further comprises a third substrate (6), wherein the third substrate (6) is connected with the second substrate (2) through a connecting cylinder (60), and the second substrate (2) is positioned between the first substrate (1) and the third substrate (6);
the device also comprises a power supply, and a conducting wire of the power supply is connected to the second substrate (2) after passing through the connecting cylinder (60).
8. The LED chip bulk transfer apparatus of claim 1, wherein:
the size of the opening of the through hole (10) is larger than that of the LED chip (4).
9. A method for transferring LED chips in bulk is characterized by comprising the following steps:
etching the LED chips (4) to enable the bottoms of the LED chips (4) to be suspended relative to the substrate (7), and forming connecting arms (70) between the adjacent LED chips (4);
electrifying the second substrate (2) to enable the second substrate (2) to magnetically attract the first substrate (1), and extruding the elastic base body (3) from the through hole (10) of the first substrate (1) to form a protrusion (30);
adhering the bump (30) to the LED chip (4) and pressing down to disconnect the connection arm (70);
and transferring the LED chip (4) to a bonding pad of a target substrate (8).
10. The LED chip bulk transfer method according to claim 9, wherein transferring the LED chip (4) onto a pad of a target substrate (8) comprises the steps of:
transferring the LED chip (4) above a target substrate (8);
aligning the LED chip (4) with a bonding pad on the target substrate (8), and enabling the LED chip (4) to fall on the corresponding bonding pad;
the second substrate (2) is de-energized and removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211493359.8A CN115831851A (en) | 2022-11-25 | 2022-11-25 | LED chip mass transfer device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211493359.8A CN115831851A (en) | 2022-11-25 | 2022-11-25 | LED chip mass transfer device and method |
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| Publication Number | Publication Date |
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| CN115831851A true CN115831851A (en) | 2023-03-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211493359.8A Pending CN115831851A (en) | 2022-11-25 | 2022-11-25 | LED chip mass transfer device and method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116312280A (en) * | 2023-05-24 | 2023-06-23 | 惠科股份有限公司 | Lamp panel, manufacturing method and display device |
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- 2022-11-25 CN CN202211493359.8A patent/CN115831851A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116312280A (en) * | 2023-05-24 | 2023-06-23 | 惠科股份有限公司 | Lamp panel, manufacturing method and display device |
| CN116312280B (en) * | 2023-05-24 | 2023-08-25 | 惠科股份有限公司 | Lamp panel, manufacturing method of lamp panel and display device |
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