WO2009051093A1 - Module électroluminescent semi-conducteur - Google Patents

Module électroluminescent semi-conducteur Download PDF

Info

Publication number
WO2009051093A1
WO2009051093A1 PCT/JP2008/068554 JP2008068554W WO2009051093A1 WO 2009051093 A1 WO2009051093 A1 WO 2009051093A1 JP 2008068554 W JP2008068554 W JP 2008068554W WO 2009051093 A1 WO2009051093 A1 WO 2009051093A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
semiconductor light
emitting element
leads
emitting module
Prior art date
Application number
PCT/JP2008/068554
Other languages
English (en)
Japanese (ja)
Inventor
Tomokazu Okazaki
Original Assignee
Rohm Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co., Ltd. filed Critical Rohm Co., Ltd.
Publication of WO2009051093A1 publication Critical patent/WO2009051093A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

La présente invention concerne un module électroluminescent semi-conducteur (A1) comprenant un élément électroluminescent semi-conducteur (2), un boîtier (3), une paire de broches (1A, 1B), une résine d'étanchéité (4) et des caches pour les broches (31, 32). Le boîtier (3) possède une surface interne évasée (3a) qui entoure l'élément électroluminescent semi-conducteur (2). Chacune des broches (1A, 1B) possède une section d'extrémité interne comprenant une surface plate électriquement continue vers l'élément électroluminescent semi-conducteur (2). La résine d'étanchéité (4) est appliquée dans un espace entouré par une surface interne (3a) du boîtier (3) et couvre l'élément électroluminescent semi-conducteur (2). Les caches des broches (31, 32) couvrent la surface plate de chacune des broches (1A, 1B) et ont chacun une surface réfléchissante plate qui réfléchit la lumière émise par l'élément électroluminescent semi-conducteur (2).
PCT/JP2008/068554 2007-10-17 2008-10-14 Module électroluminescent semi-conducteur WO2009051093A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-269984 2007-10-17
JP2007269984A JP2009099771A (ja) 2007-10-17 2007-10-17 半導体発光モジュール

Publications (1)

Publication Number Publication Date
WO2009051093A1 true WO2009051093A1 (fr) 2009-04-23

Family

ID=40567357

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068554 WO2009051093A1 (fr) 2007-10-17 2008-10-14 Module électroluminescent semi-conducteur

Country Status (2)

Country Link
JP (1) JP2009099771A (fr)
WO (1) WO2009051093A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011136357A1 (fr) * 2010-04-30 2011-11-03 ローム株式会社 Module de diode électroluminescente
WO2011136358A1 (fr) * 2010-04-30 2011-11-03 ローム株式会社 Module de diode électroluminescente
WO2011136356A1 (fr) * 2010-04-30 2011-11-03 ローム株式会社 Module à diodes électroluminescentes
EP2402993A3 (fr) * 2010-07-01 2014-06-04 LG Innotek Co., Ltd. Grille de connexion utilisée dans un emballage de dispositif électroluminescent

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5358104B2 (ja) * 2008-02-25 2013-12-04 豊田合成株式会社 発光装置
JP2012195430A (ja) * 2011-03-16 2012-10-11 Sanken Electric Co Ltd 発光ダイオード及びその製造方法
KR101908656B1 (ko) * 2012-04-09 2018-10-16 엘지이노텍 주식회사 발광 소자 패키지
WO2013179623A1 (fr) * 2012-05-31 2013-12-05 パナソニック株式会社 Module de diode électroluminescente

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001024228A (ja) * 1999-07-06 2001-01-26 Nichia Chem Ind Ltd 発光装置
JP2001177160A (ja) * 1999-10-07 2001-06-29 Denso Corp 表面実装型発光ダイオード
JP2002520823A (ja) * 1998-06-30 2002-07-09 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー オッフェネ ハンデルスゲゼルシャフト ビーム放射および／または受信素子
JP2007109915A (ja) * 2005-10-14 2007-04-26 Stanley Electric Co Ltd 発光ダイオード
JP2007201405A (ja) * 2005-07-22 2007-08-09 Toshiba Lighting & Technology Corp 発光ダイオード装置
JP2008218763A (ja) * 2007-03-06 2008-09-18 Toyoda Gosei Co Ltd 発光装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002520823A (ja) * 1998-06-30 2002-07-09 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー オッフェネ ハンデルスゲゼルシャフト ビーム放射および／または受信素子
JP2001024228A (ja) * 1999-07-06 2001-01-26 Nichia Chem Ind Ltd 発光装置
JP2001177160A (ja) * 1999-10-07 2001-06-29 Denso Corp 表面実装型発光ダイオード
JP2007201405A (ja) * 2005-07-22 2007-08-09 Toshiba Lighting & Technology Corp 発光ダイオード装置
JP2007109915A (ja) * 2005-10-14 2007-04-26 Stanley Electric Co Ltd 発光ダイオード
JP2008218763A (ja) * 2007-03-06 2008-09-18 Toyoda Gosei Co Ltd 発光装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011136357A1 (fr) * 2010-04-30 2011-11-03 ローム株式会社 Module de diode électroluminescente
WO2011136358A1 (fr) * 2010-04-30 2011-11-03 ローム株式会社 Module de diode électroluminescente
WO2011136356A1 (fr) * 2010-04-30 2011-11-03 ローム株式会社 Module à diodes électroluminescentes
JP2011233801A (ja) * 2010-04-30 2011-11-17 Rohm Co Ltd 発光素子モジュール
US8890203B2 (en) 2010-04-30 2014-11-18 Rohm Co., Ltd. LED module
US9312462B2 (en) 2010-04-30 2016-04-12 Rohm Co., Ltd. LED module
US9748448B2 (en) 2010-04-30 2017-08-29 Rohm Co., Ltd. LED module
EP2402993A3 (fr) * 2010-07-01 2014-06-04 LG Innotek Co., Ltd. Grille de connexion utilisée dans un emballage de dispositif électroluminescent
US9059385B2 (en) 2010-07-01 2015-06-16 Lg Innotek Co., Ltd. Light emitting device package

Also Published As

Publication number Publication date
JP2009099771A (ja) 2009-05-07

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