WO2009051001A1 - One-way fluid moving device - Google Patents

One-way fluid moving device Download PDF

Info

Publication number
WO2009051001A1
WO2009051001A1 PCT/JP2008/067547 JP2008067547W WO2009051001A1 WO 2009051001 A1 WO2009051001 A1 WO 2009051001A1 JP 2008067547 W JP2008067547 W JP 2008067547W WO 2009051001 A1 WO2009051001 A1 WO 2009051001A1
Authority
WO
WIPO (PCT)
Prior art keywords
loop
fluid moving
moving route
shaped fluid
moving device
Prior art date
Application number
PCT/JP2008/067547
Other languages
French (fr)
Japanese (ja)
Inventor
Shoichi Tanaka
Original Assignee
Three Eye Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Three Eye Co., Ltd. filed Critical Three Eye Co., Ltd.
Priority to JP2009538031A priority Critical patent/JPWO2009051001A1/en
Publication of WO2009051001A1 publication Critical patent/WO2009051001A1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01P—COOLING OF MACHINES OR ENGINES IN GENERAL; COOLING OF INTERNAL-COMBUSTION ENGINES
    • F01P3/00—Liquid cooling
    • F01P3/22—Liquid cooling characterised by evaporation and condensation of coolant in closed cycles; characterised by the coolant reaching higher temperatures than normal atmospheric boiling-point
    • F01P2003/2278—Heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01P—COOLING OF MACHINES OR ENGINES IN GENERAL; COOLING OF INTERNAL-COMBUSTION ENGINES
    • F01P2060/00—Cooling circuits using auxiliaries
    • F01P2060/02—Intercooler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Provided is a heat pipe, which has a simple construction but an excellent heat transfer performance. A loop-type heat pipe (1) has a loop-shaped fluid moving route, in which an evaporation portion (2), a vapor-rich pipe portion (4), a condensation portion (3) and a liquid-rich pipe portion (5) are sequentially connected. A nozzle portion (6) and a diffuser portion (7) are formed in that loop-shaped fluid moving route. As a result, a difference is made between the forward fluid resistance and the backward fluid resistance of the loop-shaped fluid moving route, thereby to form a one-directional steam flow in the loop-shaped fluid moving route.
PCT/JP2008/067547 2007-10-19 2008-09-26 One-way fluid moving device WO2009051001A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009538031A JPWO2009051001A1 (en) 2007-10-19 2008-09-26 Unidirectional fluid transfer device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-272804 2007-10-19
JP2007272804 2007-10-19

Publications (1)

Publication Number Publication Date
WO2009051001A1 true WO2009051001A1 (en) 2009-04-23

Family

ID=40567274

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067547 WO2009051001A1 (en) 2007-10-19 2008-09-26 One-way fluid moving device

Country Status (2)

Country Link
JP (1) JPWO2009051001A1 (en)
WO (1) WO2009051001A1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010117092A1 (en) * 2009-04-10 2010-10-14 Three Eye Co., Ltd. Loop heat pipe with nozzle and diffuser
CN107084569A (en) * 2017-05-12 2017-08-22 威海职业学院 High efficiency refrigeratig freezer
JP2020034185A (en) * 2018-08-27 2020-03-05 新光電気工業株式会社 Cooler
CN111578756A (en) * 2020-04-02 2020-08-25 南方科技大学 Gradient wettability loop heat pipe
EP3958432A1 (en) * 2020-08-19 2022-02-23 Nokia Technologies Oy Cooling apparatus
CN114838606A (en) * 2022-03-28 2022-08-02 华北电力大学 Diode phase separation evaporator
CN115087295A (en) * 2021-03-12 2022-09-20 北京小米移动软件有限公司 Middle frame assembly, manufacturing method of middle frame assembly and mobile terminal
CN116518761A (en) * 2023-05-09 2023-08-01 广州大学 Multi-stage partial pressure type thermal diode with unidirectional airflow and processing method thereof
EP4317888A1 (en) * 2022-08-02 2024-02-07 Vast Glory Electronic & Hardware & Plastic (Hui Zhou) Ltd Heat dissipating device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112556468A (en) * 2020-11-20 2021-03-26 广州大学 One-way heat transfer pipe and processing method thereof

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5447162A (en) * 1977-09-02 1979-04-13 Euratom Heat pump
JPS6069493A (en) * 1983-09-27 1985-04-20 Toshiba Corp Heat transfer pipe
JPH01127895A (en) * 1987-11-04 1989-05-19 Akutoronikusu Kk Closed loop pipe type heat transfer device
JPH01189496A (en) * 1988-01-21 1989-07-28 Akutoronikusu Kk Loop tube heat transfer device
JPH07332881A (en) * 1994-06-09 1995-12-22 Akutoronikusu Kk Loop type zigzag capillary heat pipe
JPH11201592A (en) * 1998-01-17 1999-07-30 Tsuneo Arii Method of recovering refrigerant and device and tool therefor
JP2002349975A (en) * 2001-02-28 2002-12-04 Sony Corp Heat transport system
JP2004308948A (en) * 2003-04-03 2004-11-04 Mitsubishi Electric Corp Heat pipe and cooling device using the heat pipe

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5447162A (en) * 1977-09-02 1979-04-13 Euratom Heat pump
JPS6069493A (en) * 1983-09-27 1985-04-20 Toshiba Corp Heat transfer pipe
JPH01127895A (en) * 1987-11-04 1989-05-19 Akutoronikusu Kk Closed loop pipe type heat transfer device
JPH01189496A (en) * 1988-01-21 1989-07-28 Akutoronikusu Kk Loop tube heat transfer device
JPH07332881A (en) * 1994-06-09 1995-12-22 Akutoronikusu Kk Loop type zigzag capillary heat pipe
JPH11201592A (en) * 1998-01-17 1999-07-30 Tsuneo Arii Method of recovering refrigerant and device and tool therefor
JP2002349975A (en) * 2001-02-28 2002-12-04 Sony Corp Heat transport system
JP2004308948A (en) * 2003-04-03 2004-11-04 Mitsubishi Electric Corp Heat pipe and cooling device using the heat pipe

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010117092A1 (en) * 2009-04-10 2010-10-14 Three Eye Co., Ltd. Loop heat pipe with nozzle and diffuser
CN107084569A (en) * 2017-05-12 2017-08-22 威海职业学院 High efficiency refrigeratig freezer
JP2020034185A (en) * 2018-08-27 2020-03-05 新光電気工業株式会社 Cooler
JP7161343B2 (en) 2018-08-27 2022-10-26 新光電気工業株式会社 Cooler
CN111578756A (en) * 2020-04-02 2020-08-25 南方科技大学 Gradient wettability loop heat pipe
EP3958432A1 (en) * 2020-08-19 2022-02-23 Nokia Technologies Oy Cooling apparatus
CN115087295A (en) * 2021-03-12 2022-09-20 北京小米移动软件有限公司 Middle frame assembly, manufacturing method of middle frame assembly and mobile terminal
CN114838606A (en) * 2022-03-28 2022-08-02 华北电力大学 Diode phase separation evaporator
EP4317888A1 (en) * 2022-08-02 2024-02-07 Vast Glory Electronic & Hardware & Plastic (Hui Zhou) Ltd Heat dissipating device
CN116518761A (en) * 2023-05-09 2023-08-01 广州大学 Multi-stage partial pressure type thermal diode with unidirectional airflow and processing method thereof

Also Published As

Publication number Publication date
JPWO2009051001A1 (en) 2011-03-03

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