WO2009044667A1 - 感放射線性組成物 - Google Patents
感放射線性組成物 Download PDFInfo
- Publication number
- WO2009044667A1 WO2009044667A1 PCT/JP2008/067390 JP2008067390W WO2009044667A1 WO 2009044667 A1 WO2009044667 A1 WO 2009044667A1 JP 2008067390 W JP2008067390 W JP 2008067390W WO 2009044667 A1 WO2009044667 A1 WO 2009044667A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- radiation
- sensitive composition
- repeating unit
- group
- represented
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Materials For Photolithography (AREA)
Abstract
本発明の感放射線性組成物は、下記一般式(a-1)で表される繰り返し単位(a-1)、下記一般式(a-2)で表される繰り返し単位(a-2)、及び酸解離性基を有する繰り返し単位(a-3)を含む重合体(A)と、感放射線性酸発生剤(B)とを含有するものであり、解像性能に優れるだけでなく、LWRが小さく、パターン倒れ耐性に優れ、且つ、欠陥性にも優れたレジスト膜を形成可能な感放射線性組成物である。
(一般式(a-1)及び(a-2)中、R1はメチル基等を示し、R2は炭素数1~12の直鎖状又は分岐状のアルキル基等を示し、R3は、ヒドロキシル基等を示す。)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009536025A JP5077354B2 (ja) | 2007-10-01 | 2008-09-26 | 感放射線性組成物 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-257633 | 2007-10-01 | ||
JP2007257633 | 2007-10-01 | ||
JP2007324529 | 2007-12-17 | ||
JP2007-324529 | 2007-12-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009044667A1 true WO2009044667A1 (ja) | 2009-04-09 |
Family
ID=40526096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/067390 WO2009044667A1 (ja) | 2007-10-01 | 2008-09-26 | 感放射線性組成物 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5077354B2 (ja) |
TW (1) | TW200919090A (ja) |
WO (1) | WO2009044667A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5655781B2 (ja) * | 2009-06-16 | 2015-01-21 | Jsr株式会社 | 感放射線性樹脂組成物 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003270787A (ja) * | 2002-03-15 | 2003-09-25 | Jsr Corp | 感放射線性樹脂組成物 |
JP2003342323A (ja) * | 2002-05-28 | 2003-12-03 | Everlight Usa Inc | 化学増幅型ホトレジスト組成物の樹脂 |
JP2003345025A (ja) * | 2002-05-28 | 2003-12-03 | Everlight Usa Inc | 化学増幅型ホトレジスト組成物 |
JP2005060638A (ja) * | 2003-08-20 | 2005-03-10 | Mitsubishi Rayon Co Ltd | 重合体、製造方法、レジスト組成物およびパターン形成法 |
JP2006349940A (ja) * | 2005-06-15 | 2006-12-28 | Tokyo Ohka Kogyo Co Ltd | ポジ型レジスト組成物およびレジストパターン形成方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4801328B2 (ja) * | 2004-06-04 | 2011-10-26 | 出光ユニテック株式会社 | チャックテープ、チャックテープ付き包装袋及びチャックテープ付き包装袋の製造方法 |
-
2008
- 2008-09-26 WO PCT/JP2008/067390 patent/WO2009044667A1/ja active Application Filing
- 2008-09-26 JP JP2009536025A patent/JP5077354B2/ja not_active Expired - Fee Related
- 2008-09-26 TW TW97137306A patent/TW200919090A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003270787A (ja) * | 2002-03-15 | 2003-09-25 | Jsr Corp | 感放射線性樹脂組成物 |
JP2003342323A (ja) * | 2002-05-28 | 2003-12-03 | Everlight Usa Inc | 化学増幅型ホトレジスト組成物の樹脂 |
JP2003345025A (ja) * | 2002-05-28 | 2003-12-03 | Everlight Usa Inc | 化学増幅型ホトレジスト組成物 |
JP2005060638A (ja) * | 2003-08-20 | 2005-03-10 | Mitsubishi Rayon Co Ltd | 重合体、製造方法、レジスト組成物およびパターン形成法 |
JP2006349940A (ja) * | 2005-06-15 | 2006-12-28 | Tokyo Ohka Kogyo Co Ltd | ポジ型レジスト組成物およびレジストパターン形成方法 |
Also Published As
Publication number | Publication date |
---|---|
TW200919090A (en) | 2009-05-01 |
JP5077354B2 (ja) | 2012-11-21 |
JPWO2009044667A1 (ja) | 2011-02-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW201144944A (en) | Positive type resist composition and method for producing microlens | |
TW200834240A (en) | Positive photosensitive resin composition | |
WO2009028646A1 (ja) | 架橋剤、架橋高分子、およびそれらの用途 | |
WO2009044668A1 (ja) | 感放射線性組成物 | |
WO2009034998A1 (ja) | 窒素含有シリル基を含むポリマーを含有するレジスト下層膜形成組成物 | |
TW201144934A (en) | Radiation-sensitive resin composition, resist pattern formation method, polymer and compound | |
WO2008078699A1 (ja) | 印刷版用樹脂組成物 | |
TW200801818A (en) | Composition for forming under film and method for forming pattern | |
TW200504152A (en) | Photosensitive resin precursor composition | |
TW200632553A (en) | Negative resist composition and patterning process | |
TW200834234A (en) | Radiation-sensitive resin compositions | |
TW200745757A (en) | Positive resist composition for thick-film resist film forming, thick-film resist laminated product, and method for forming resist pattern | |
WO2009057484A1 (ja) | 感放射線性樹脂組成物及び重合体 | |
WO2008102822A1 (ja) | 紫外線吸収剤を含む高分子材料 | |
TW200700921A (en) | Positive photoresist composition, thick-film photoresist layer laminate, method for forming thick-film resist pattern and method for forming connection terminal | |
TW200619239A (en) | Positive resist composition and method for forming resist pattern | |
WO2008081768A1 (ja) | 脂環構造含有クロロメチルエーテル類、フォトレジスト用重合性モノマーおよびその製造方法 | |
TW200634432A (en) | Photosensitive resin composition for interplayer insulating film | |
TW201129582A (en) | Radiation-sensitive resin composition, polymer and resist pattern formation method | |
WO2009041556A1 (ja) | 感放射線性組成物 | |
WO2009028392A1 (ja) | 共重合体 | |
TW200636390A (en) | Photosensitive resin composition and color filter using the same | |
WO2008123237A1 (ja) | エポキシ樹脂組成物 | |
WO2009075308A1 (ja) | 環状化合物、フォトレジスト基材、フォトレジスト組成物、微細加工方法及び半導体装置 | |
WO2009005135A1 (ja) | エポキシ樹脂用硬化剤及びエポキシ樹脂用硬化剤組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08835298 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2009536025 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 08835298 Country of ref document: EP Kind code of ref document: A1 |